PCB Protection

Conformal Coating, Potting, &

Encapsulation

Dr. Brian Toleno

Henkel
Irvine, CA
 Agenda
• Reasons for using PCB Protection

• Conformal Coating

• Low Pressure Molding (Macromelt®)

• Potting
 PCB Protection Agenda

• Why?
• What Environments?
• What Method?
• What Chemistry?
Purpose
• Environmental
– Moisture
– Harmful fluids
– Dirt
– Ultraviolet light
• Mechanical
– Shock and Vibration
• Radio Frequency
– Faraday cage
• Electrical Insulation
• Proprietary Design
 Possible Environments
• Automotive
– Underhood
– In Cabin
– External
• Telecom
– Proprietary Programming
• Utilities
– UV protection
– Moisture protection
• Military
• Marine
Environments
 Considerations
• Type of protection
needed
• Size of board/part
• Weight
requirements
• Rework required?
• Protection from
aftermarket
modification/repair
• Design status
Options – Types of Protection
• Conformal Coating
– Thin layer of material to cover all or part of circuit board
• Module sealing
– Bonding or sealing two part external case
• Low Pressure Molding (Macromelt®)
– Thermoplastic overmolding of entire product except for
connector
• Potting
– Completely covering circuit board inside external case
except for connectors
• Microencapsulation
– Expoy overmolding of specific areas or components
 Conformal Coating
• Various chemistries
– Acrylics – One component, highly abrasion resistant, easily
repairable. Temps to 110°C.
– Urethanes – Softer systems, thermal shock resistant, somewhat
repairable. Temps to 110 or 125°C
– Epoxies – Superb chemical and abrasion resistance. When
reworkability is not needed. Temps to 125°C.
– Silicones – Highest temperature environments, reworkable, zero
VOC’s, otherwise protected from abrasion.
 Why?

“Hey Frank…better have engineering include

a conformal coating on that next batch.”
Www.plasmasystems.com/guide.html
 Conformal Coating Applications

• Traditionally, conformal coatings were

only used in high reliability applications

– military
– aerospace
 Conformal Coating Applications

• Many Fine Pitch SMT designs will not operate

or perform adequately in humid environments
without the use of a Conformal Coating
 Conformal Coating Chemistry

ctive

p °C
en"

ork
P rot e
" G re

R ew
T em

$
• Acrylics (AR)
AR - + 150 0 +
• Urethanes(UR)
UR - 0 125 + +
• Epoxies (ER)
ER - + 150 - +
• Silicones (SI)
SI + 0 200 + -
• Paraxylenes
 Conformal Coating
Chemistry - Acrylic (AR)
Thermoplastic Lacquer that Cures by
Solvent Evaporation

• Advantages • Disadvantages
– Easy to apply – Contain solvents
– Desirable physical and – High modulus
electrical properties – Solvent resistance
– Easy to repair
 Conformal Coating
Chemistry - Polyurethane (UR)
A thermoplastic polymer (which can be made
thermosetting) produced by the condensation
reaction of a polyisocyanate and a hydroxyl-
containing material

• Advantages • Disadvantages
– Solvent resistance – Contain isocyantes
– Electrical properties – Hard to repair
– High modulus
– Two-part pot life
 Conformal Coating
Chemistry - Epoxy (ER)
Thermosetting Resins Based on the
Reactivity of the Epoxide Group

• Advantages • Disadvantages
– Desirable physical and – High modulus
Electrical properties – Hard to repair
– Solvent resistance – Two-part short pot life
– Solvent free – Shrink during cure
 Conformal Coating
Chemistry - Silicone (SR)

Based on Polydimethylsiloxane

• Advantages • Disadvantages
– Low modulus
– High CTE
– Electrical properties
– Low modulus
– Wide temperature range
– Cost
– Easy repair
 Conformal Coating Chemistry -
Paraxylenes (XY)
Chemical Vapor Deposition Process
(Di-p-para-di-p-xylene)

• Advantages • Disadvantages
– Coating applied in – Batch process
ambient state – Air tight seals required
– True conformability for masking
around all parts – Microblast for repair
– Excellent dielectric – Expensive
strength
– Chemical resistance
 Conformal Coating Process

(Clean) (Mask) (Cure)

Coat Cure (Demask)

 Conformal Coating Process Cleaning

• Water Soluble (water washable) Fluxes

– Thorough cleaning required
• No Clean Fluxes
– All flux must be activated in reflow
– No Washing
• Mold releases and marking inks
– May cause dewetting
 Applying the Coating

• Dip
• Spray (Dispense)
• Brush
Conformal Coating - Coating Thickness

• Coating thickness recommendations -

IPC2221 and J-STD-001
• See also IPC - HDBK - 830
Type AR Acrylic 1.18 - 5.12 mil
Type ER Epoxy 1.18 - 5.12 mil
Type UR Urethane 1.18 - 5.12 mil
Type Si Silicone 1.97 - 8.27 mil
Type XY Paraxylylene 0.394 - 1.97 mil

• Every design should be tested

 Conformal Coating Process Curing

• Solvent Evaporation
• Heat
• RT Moisture Two-Part
• UV Light Combinations
– UV/Heat
– UV/Moisture
– UV/Two-Part
 Coating Performance Qualifications

• Qualification Standards:
– MIL-I-46058C (not to be used on new
procurement)
– IPC-CC-830B
– UL 746C includes flammability
– Telcordia formerly Bellcore TR-NWT-000078
– Individual company standards
 Module Sealing
• Silicones
– Flexible for high temp thermal cycling
– Adhesion to numerous substrates
– Substrates are usually not functional
electronics
– Most protection provided by external
hardware (case)
– Three types
• Cure in place – Apply, Cure, Assemble
• Form in place – Apply, Assemble, Cure
• Post assembly – Assemble, Apply, Cure
• May use material to complete faraday
cage too
Low Pressure Molding
 Low Pressure Molding
• What is Low Pressure Molding Molding?
An innovative
encapsulation process
positioned between
Traditional Injection
Molding traditional potting and
pressure

injection molding
technologies. It is a
Macromelt
complimentary
Molding technology. Does not
Potting replace all potting
cycle time applications and typically
doesn‘t compete with
traditional injection
molding.
PCB Protection: Low Pressure Molding
• Injection process
whereby PCB is
completely over-molded
and encapsulated with
liquid material, which
forms the body of the
device.
• Eliminates waste
• Eliminates need for cup
or housing associated
with potting
• Environmentally friendly
 Process Flow Advantage

Traditional potting process flow

Insert
Mold Case Palletize Pre-heat
Electronics

Settle or
Encapsulate Cure Test
Vacuum

Low Pressure molding process flow

Insert
Overmold Test
Electronics
 Low-Pressure Molding
What is Low Pressure Molding?
• Developed initially in Europe for the automotive industry in
1988.
• The technology broadened out into telecommunications,
computer, white goods and general wiring harness industries
• Emerging industries include medical and LED lighting.
• Molds grommets and true strain relief on wires & cables due to
the adhesive nature of the molding compound
• Encapsulates electronic devices, providing a water tight seal
 Polyamide Molding Resins
• Thermoplastic materials, U/L 94 V-0
• Based on natural raw materials
• Cure by cooling - no toxic fumes
• Application viscosity from 1,000 to 10,000 cP
• Application pressure from 20 to 500 psi
• Performance temperatures from -40C to 140C
continuous operation based on material
choice.
• Excellent adhesive properties
• Amber and Black
 Polyamide Hot Melt Resins

• Polyamide Resin is a reaction product of a

polybasic functional group and a polyamine.

• There are two different polyamide resin families

– linear family: widely known as the nylon family
• high viscosity, fiber forming, high molecular weight

– non-linear family: non-fiber forming types based on

vegetable oil based fatty molecules.
• low viscosity, lower molecular weight
 Traditional Polyamide Resin
• Linear polyamide: (ex. nylon)
-R Amine

…. ….

will continue as long as reactants are available

linear PA’s exhibit great strength, toughness,

flexibility, relatively high MW and have excellent
self-lubricating features
 Macromelt® Polyamide Resin

• Concept of unbalancing used

• Introduction of mono and tri-functional reactional

groups

• Introduction of non-functional additives

– adhesion promoters
– UV stabilizers
– pigments
– anti-oxidants
 Macromelt® Polyamide resin

• Non-Linear Molecule

-R Amine

Non-linear exhibit good

flexibility, low MW and
most importantly, low
viscosity
 Low Pressure Molding
The Materials – Overview
Properties A B C D E
Color Amber / Amber / Amber / Amber / Amber /
black black black black black
Chemical Polyamide Polyamide Polyamide Polyamide Patented
Base Polyamide
Operating -40/+100°C -40/+130°C -40/+140°C -20/+140°C -40/+140°C
Temperature
Cold -40°C -40 °C -40 °C -40 °C -40°C
flexibility
Applicating 180-220°C 200-230 °C 210-230 °C 200-230 °C 220-240 °C
Temperature
Shore A 77 A 90 A 90 D 40 A 88
hardness
Elongation at 400 % 400 % 400 % 800 % 600 %
rupture
Flammability UL94-V0 UL94-V0 UL94-V0 UL94-V0 UL94-V0
Telecom Applications
Mobile Phone Applications

Li-Ion
batteries

Macromelt Antennas
Automotive Applications
 The Equipment
• High capacity
• Small foot print
• Simple to operate
• User friendly & safe
• Easy set-up with
touch screen
• Injection profiles
available
• Made in the USA
 Tooling
• Lower cost aluminum
used instead of
hardened steel
• Macromelt® materials
are non-abrasive,
allowing softer metal
tooling
• Aluminum tooling helps
facilitate heat transfer
away from PCB quicker.
• Cross-drilling of mold-
set not necessary as
mold-station platens are
chilled.
Potting
 Potting Materials
• Chemistries
– Epoxy: one and two component compounds
– Urethanes: two component compounds
– Silicones: one component systems
• Applications
– Adhesives
– Biomedical
– Filters (Air, Oil, and Water)
– General potting and encapsulation
– Telecommunications Encapsulants
– LED Lighting
– Doming
• Packages
– Range from less than one ounce per part to over 300lbs per
part
 Epoxy Systems
• Room Temperature Cure
– Aliphatic Amine/ Polyamide/ Amidoamines Cures
– Good for wide variety of general use systems
• Heat Cure
– Cycloaliphatic Amine/ Anhydride
– Used in applications where higher heat resistance is required
• One Component
– Dicyandiamide, BCl3/Anhydride, Mod. Aliphatic Amine
– Used in applications where quick cure is preferred or no mixing
is required
• UV Precure/Cure
 Epoxies
RESINS HARDENERS
• Diglycidyl Ether of Bisphenol A
• Amines
• Most common • Aromatic-elevated temp cure
• Low cost • Aliphatic-room temp cure

• Diglycidyl Ether of Bisphenol F • Polyamides

• More expensive
• Cycloaliphatic
• More expensive
• High performance
• Anhydrides-high temp cure
• Dicyandiamide-typically used in 1
components
 Hardener Type vs. Properties
Amines Amines Polyamides Anhydrides
Aliphatic Aromatic
Appearance Rigid, Brittle Rigid, Tough Slightly to very Rigid to flexible
flexible

Operating 105°C 155 – 180°C 105°C To 200°C

Temperature,°C (221 °F) (302-356 °F) (221 °F) (392 °F)

Potlife, hrs. 0.5 – 0.75 8 2–3 20 hrs +

General Uses Modules, small Solvent resistant Thermal Excellent

castings, apps, thermal cycling, low electricals,
adhesives cycling stress module potting,
adhesive coil potting
 Urethane Systems

• Mix ratios from: 1:1 to 1:7.7

• Mix viscosity from: 400 cP to 25,000 cP
• Hardness from: 60 (OOO) to 85 (D)
• Gel time from: 2 to 360 minutes @ 25°C
• Dielectric Constant from: 3 to 7
• Dissipation Factor from: 0.01 to 0.2
• Dielectric Strength: up to 1200 volts/mil
(20mil thickness)
 Urethane 2 part Systems

• Urethanes are produced through reaction of isocyanates

(R-NCO) with polyol

• (HO-R-OH) or a prepolymer (pre-reacted polyol and

excess Isocyanate) with a polyol
 Urethanes
POLYOLS ISOCYANATES
• Polyethers • Aromatic
– Polyoxypropylene Glycol – Toluene Diisocyanate
(PPG) – 4,4’ Diphenylmethane
– Polytetramethylene Ether Diisocyanate (Pure MDI)
Glycol (PTMEG) – Crude (Polymeric) MDI
• Polybutadiene (Poly BD) • Aliphatic
* restricted for export* – Hexamethylenediisocyante
• Polyesters (HDI)
– Adipates • Cycloaliphatic
– Polycaprolactones – Isophorone Diisocyanate
– Castor Oil (IPDI)
– Methylene Bis (4-
cyclohexylisocyanat4e)
(HMDI)
 Urethane vs. Epoxy
Property Epoxy Urethane

Operating Temperature, <200 <125

°C
Thermal Shock Good Better

Exotherm Varies, can be high Low (<50°C)

Moisture Sensitivity Less sensitive Very sensitive

During Processing and
Storage
Electrical Properties Good Good

Strength Best Good

Elongation <100% >100%

Tg, °C 0 to 160+ -65 to 80

Hardness Shore D >35 Shore A <90

 Fillers
Desired Improved Improved Improved Improved Improved Improved X-Ray
Effects Machinability Thermal Abrasion Impact Electrical Thixotropic Opaque
Conductivity Resistance Strength Conductivity Response
Fillers Calcium Alumina Chopped Mica Metallic fillers Colloidal Silica Barytes
Carbonate Glass

Calcium Flint powder Alumina Silica Alumina Bentonite clay Iron

Silicate

Powdered Carborundum Powdered or Carbon fiber

aluminum or flaked glass
copper
Silica

Molybdenum
dissulfide
 Trade-off: Abrasiveness / Hardness of Fillers

Diamond
Most
A Alumina
B Silicon
R Dioxide
A
S
Silica
I
V ATH
E
N CaCO3
E Talc
S
Least S
1 MOH Hardness 10
 Applications

Voltage regulator (off-road vehicles)

Urethane
Applications

Sprinkler Solenoid
Urethane
Applications

Automotive Light Sockets

Urethane
 Applications

Windshield Washer Camshaft Position

Fluid Heater Sensor
Urethanes
 Applications

Telephone Connector Blocks

Urethane
 Applications

Ignition Coils Automotive Brake

Sensor

Epoxies
Applications

TPMS Remote Transmitter

Urethanes
Applications

Automotive ECM
Urethane
Applications

Automotive LED Tail Light

Epoxy
 Circuit Board Protection

• Potting
• Gasketing
• Conformal Coating
– Epoxy (Hard, Abrasion resistant)
– Acrlylic (low-VOC)
– Urethane (reworkable)
– Silicone (High-temp, UV/dual cure)
• Low Pressure Molding
Solutions Across the Board and Across the Globe
Thank You