1

Smoke Detector
Sardar

Nimisha Sankhe , Nisarg Vinod and Ekta Vira Patel Institute of Technology, Mumbai-400058, India, nimisha.sankhe@yahoo.com Sardar Patel Institute of Technology, Mumbai-400058, India, naughty.nisarg@yahoo.co.in Sardar Patel Institute of Technology, Mumbai-400058, India, ekta vira@ymail.com

Abstract Most of the smoke alarms available in the market use one or another kind of smoke sensor which increases the cost and also require complicated interfacing circuitry around it. But this smoke alarm circuit uses readily available photon-coupled interrupter module as smoke detector. The functioning of this smoke alarm is to continuously detect smoke and automatically activate the alarm in case of dense smoke. Loud sound is heard continuously indicating the presence of smoke till smoke clears. After this, the circuit is automatically reset for further detection of smoke provided it is kept in power ON condition.

I. I NTRODUCTION A smoke detector is a device that contains a physical mechanism or electronic sensor that quanties smoke that can be integrated with or connected to other devices that detect the presence of smoke within an enclosed space. 1) Theory : Smoke detection technology was developed from a very primitive times by use of chemicals but the electronic way of its implementation had a profound effect on efciency in detecting smoke. The basic idea is to detect the change in air density due to smoke and give out an alarm. The rst home smoke detectors were invented by Duane D. Pearsall in 1967. 2) Methods of Implementation : a) Chemical Detectors : Most of the times, smoke is caused by re or ignition. Hence by detecting gases in particular environment we can predict about presence of smoke. These detectors use Carbon Monoxide (CO) or Carbon Dioxide (CO2 ) sensors which sense level of these gases in atmosphere and activate alarm accordingly. But these detectors are not accurate enough to be implemented. b) Ionisation Detectors : This type of detector is cheaper than the optical detector, however it is sometimes rejected for environmental reasons. It can detect particles of smoke that are too small to be visible. It includes a tiny mass of radioactive Americium-241 (Am241 ), which is a source of alpha radiation. The radiation passes through an ionization chamber, which is an air-lled space between two electrodes, and permits a small, constant current to ow between the electrodes. Any smoke that enters the chamber absorbs the alpha particles, which reduces the ionization and interrupts this ow of current, setting off the alarm. c) Light Intensity Based Detectors : i) Using Light Dependent Resistor (L.D.R.) : L.D.R. has property of changing its resistance depending upon incident light. Hence when smoke cloud is formed over L.D.R., light intensity reduces and subsequently alarm gets activated. ii) Using Photon coupled Interrupter Module : This consists of an infra-red L.E.D. and phototransistor. When smoke comes in between slot, infra-red light beam, gets obstructed and transistor goes off i.e. it acts as open switch. Hence by using transistor ON-OFF conditions we can activate the alarm when smoke is present. [1]

3) Applications : Photoelectric smoke alarms are designed for residential and commercial purpose such as homes, apartments, hospitals, hotels and most importantly industries. They are engineered to virtually eliminate nuisance alarms and deliver outstanding performance wherever reliable re and smoke protection is required. The smoke detection and warning system has never ending application in re safety department. The smoke detection circuit has wide range of industrial application not only for the sake of re safety but also in the eld of development articial sensory systems in future technologies. II. P ROPOSED C IRCUIT 1) Circuit Diagram :

Fig. 1: Smoke Detector using Photocoupler - Schematic Diagram 2) Working of Circuit : The basic idea behind circuit operation is to turn ON the alarm in case of dense smoke. A smoke detector working in tandem with oscillator is needed for this purpose. Here, photon-coupled interrupter module works as smoke detector while IC NE 555 timer working as oscillator generates loud alarm sound. Resistor R1 and preset VR1 provide current path to light up internal LED in normal condition, internal LED of photon interrupter emits photons which continuously keep internal phototransistor in saturation region, owing to which its collector and Reset input (Pin No.4) of IC 555 are pulled towards ground. As Reset pin of IC 555 timer is active low, it continuously reset the timer and it does not produce any kind of output in such a situation. Now, consider second scenario, when a room is lled by smoke, slot of photon interrupter module gets engulfed in smoke which obstructs the path of light rays from LED to phototransistor. Phototransistors base-emitter junction being reverse biased causes it to cut-off and as a result its collector

and Reset pin of IC 555 are held high via resistor R2. Thus Reset condition of timer is disabled by smoke. IC 555 working here in Astable mode generates square wave output at its Pin No.3 . The frequency of this wave should be in the range of 20 Hz-20 kHz and is dependent upon the values of resistors R3, R4 and capacitor C1. For the values shown in the circuit (Refer Fig. 1), it is about 380 Hz. Capacitor C3 effectively passes the output from IC 555 to loudspeaker which then converts electrical signal into sound. Capacitor C2 connected at Pin No.2 provides immunity from any kind of false triggering. [2], [3] III. S IMULATION R ESULTS 1. Simulation circuit for IC 555 in Astable Mode using SEQUEL :

Fig. 2: IC 555 in Astable Mode 2. Output of IC 555 working in Astable Mode :

Fig. 3: Equivalent output waveform at Pin No.3

IV. PCB D ESIGN Printed Circuit Board (PCB) is a component made of one or more layers of insulating material with electrical conductors. The insulator is typically made on the base of bre reinforced resins, ceramics, plastic, or some other dielectric materials. For this project, we are using Copper Clad Universal PCB of size 4X4 sq.inches with single layer. 1) Design Rules : a) Keep nets as short as possible. The longer total track length, the greater is resistance, capacitance and inductance. All of which can be undesirable factors. b) Tracks should only have angles of 450 . Avoid the use of right angles, and under no circumstances use an angle greater than 900 . This is important to give a professional and neat appearance to board. Contrary to popular belief, sharp right angle corners on tracks do not produce measurable EMI or other problems, the reasons to avoid right angles are much simpler - it just does not look good, and it may have some manufacturing implications. c) Neck down 1 between pads where possible. Eg, a 10 thou 2 track through two 60 thou pads gives a generous 15 thou clearance between track and pad. d) If power and ground tracks are deemed to be critical, then lay them down rst. Also, make power and ground tracks as BIG as possible. e) Make sure tracks go right through the exact center of pads and components, and not off to one side. Use of the correct snap grid will ensure this right every time. It makes board neater and more symmetrical, and it gives the most clearance. f) Only take one track between 100 thou pads unless absolutely necessary. [4] 2) Layout : The connections on the PCB should be identical to the circuit diagram, but while the circuit diagram is arranged in readable form, the PCB layout is arranged to be functional, so there is not much correlation between the circuit and the layout. After making the schematic according to the circuit using Eagle software, option Switch to board is selected. This opens the window to create layout. The layout can be made by manual routing or Auto routing. Auto routing is usually done for complicated circuits. Generally manual routing is preferred as how smart an auto router is, it simply cannot replace a good human PCB designer. The PCB layout has several layers to illustrate holes, outline, and components etc. Before taking the actual printout with laser printer, few layers are deselected as they are not required for the actual PCB.

Fig. 4: Layout of Smoke Detector

1 Changing 2A

track from large to small and then back to large again is known as necking or necking down. thou is 1/1000th of an inch, and is universally used and recognised by PCB designers and manufacturers everywhere.

3) Mounting and Troubleshooting Rules : a) Check that every track on your board matches the connectivity of your schematic. There may be discontinuity due to improper etching. b) Check the electrical clearance between tracks, pads, and components. c) Check manufacturing tolerances like min/max hole sizes, track widths, via widths, annulus sizes, and short circuits. V. C ONCLUSION

Uniqueness of our Smoke Detector : 1) Working of circuit depends upon interruption of lights rays by smoke giving the advantage of adjustable sensitivity. 2) Can be used without any complex circuitry. 3) It possesses wide range for smoke detection. Any particular less smoke as well as very dense smoke can be detected using this circuit. 4) It is very efcient for advanced applications. Future Scope : Future developments of this circuit have great applications if it is merged with advanced technology. Some of the future possible and plausible applications are given below : 1) It can be used in advanced robotics that can detect smoke like humans do. 2) Various industries can use this device to detect smoke at a range of sensitivity, at various locations using the same device. 3) Smoke detection can be used in space exploration to detect sand storms on planets where visual input is not obtainable. 4) Further the circuit can be developed as a part of device with advance physical sensing capabilities.

R EFERENCES
[1] [2] [3] [4] http://en.wikipedia.org/wiki/Smoke detector http://www.electronicsforu.com/electronicsforu/lab/ http://en.wikipedia.org/wiki/555 timer IC http://alternatezone.com/electronics/les/PCBDesignTutorialRevA.pdf

Appendix
List of Components and Specications :
Name of Component Specication of Component

IC 555

DIP package 8 Pin Timer IC, [1-Ground, 2-Trigger, 3-Output, 4-Reset, 5-Control Voltage, 6-Threshold, 7-Discharge, 8-(+Vcc )] Supply Voltage Range : 3-18 V Power Dissipation : 600mW

R1

470 , 1/4 Watt

R2

4.7 k, 1/4 Watt

R3

1 k, 1/4 Watt

R4

47 k, 1/4 Watt

C1

0.04 f, Ceramic

C2

0.01 f, Ceramic

C3

100 f / 25 V, Electrolytic

Speaker

8 , 0.5 Watt

MOC 7811

4 Pin Photon-Interrupter Module (Anode, Cathode, Collector, Emitter)

MOC 7811 DATASHEET

PACKAGE DIMENSIONS
0.510 [12.95]

DESCRIPTION
The MOC70PX consists of an infrared light emitting diode coupled to an NPN silicon phototransistor packaged into an injection molded housing. The housing is designed for wide gap, non contact sensing.

0.250 [6.35]

0.506 [12.85] 0.200 [5.08] NOM 0.153 [3.89] 2X C L 0.080 [2.03] NOM

FEATURES
0.270 [6.86]

No contact sensing 5 mm gap

SCHEMATIC
1 4

0.050 [1.27] 0.140 [3.56] 0.105 [2.67] 0.380 [9.65] PIN 2 CATHODE PIN 3 (COLLECTOR) SEATING PLANE 0.020 [0.51] 4 X

.040 aperture Low profile PCB mount Transistor output

0.100 [2.54]

NOTES
PIN 1 (ANODE) PIN 4 (EMITTER)

NOTES: 1. Dimensions for all drawings are in inches (millimeters). 2. Tolerance of .010 (.25) on all non-nominal dimensions unless otherwise specified.

1. Derate power dissipation linearly, on each component, 1.67 mW/C above 25C. 2. RMA flux is recommended. 3. Methanol or isopropyl alcohols are recommended as cleaning agents. 4. Soldering iron tip 1/16 (1.6mm) from housing. 5. As long as leads are not under any stress or spring tension.

ABSOLUTE MAXIMUM RATINGS

Parameter Operating Temperature Storage Temperature Soldering Temperature (Iron) EMITTER Continuous Forward Current Reverse Voltage Power Dissipation(1) SENSOR Collector-Emitter Voltage Emitter-Collector Voltage Collector Current Power Dissipation(1)
(2,3,4,5)

(TA = 25C unless otherwise specified) Symbol TOPR TSTG TSOL-I TSOL-F IF VR PD VCEO VECO IC PD Rating -55 to +100 -55 to +100 240 for 5 sec 260 for 10 sec 50 6 100 30 4.5 20 150 Units C C C C mA V mW V V mA mW

Soldering Temperature (Flow)(2,3,5)

Philips Semiconductors

Product data

Timer

NE/SA/SE555/SE555C

DESCRIPTION
The 555 monolithic timing circuit is a highly stable controller capable of producing accurate time delays, or oscillation. In the time delay mode of operation, the time is precisely controlled by one external resistor and capacitor. For a stable operation as an oscillator, the free running frequency and the duty cycle are both accurately controlled with two external resistors and one capacitor. The circuit may be triggered and reset on falling waveforms, and the output structure can source or sink up to 200 mA.

PIN CONFIGURATION
D and N Packages
GND 1 TRIGGER 2 OUTPUT 3 RESET 4 8 7 6 5 VCC DISCHARGE THRESHOLD CONTROL VOLTAGE

SL00349

FEATURES

Turn-off time less than 2 s Max. operating frequency greater than 500 kHz Timing from microseconds to hours Operates in both astable and monostable modes High output current Adjustable duty cycle TTL compatible Temperature stability of 0.005% per C
APPLICATIONS

Figure 1. Pin configuration

BLOCK DIAGRAM
VCC 8

R 5 THRESHOLD 6
COMPARATOR

CONTROL VOLTAGE

R 2

Precision timing Pulse generation Sequential timing Time delay generation Pulse width modulation

COMPARATOR R

TRIGGER

7 DISCHARGE FLIP FLOP 4 RESET

OUTPUT STAGE

3 OUTPUT

1 GND

SL00350

Figure 2. Block Diagram

ORDERING INFORMATION
DESCRIPTION 8-Pin Plastic Small Outline (SO) Package 8-Pin Plastic Dual In-Line Package (DIP) 8-Pin Plastic Small Outline (SO) Package 8-Pin Plastic Dual In-Line Package (DIP) 8-Pin Plastic Dual In-Line Package (DIP) 8-Pin Plastic Dual In-Line Package (DIP) TEMPERATURE RANGE 0 to +70 C 0 to +70 C 40 C to +85 C 40 C to +85 C 55 C to +125 C 55 C to +125 C ORDER CODE NE555D NE555N SA555D SA555N SE555CN SE555N DWG # SOT96-1 SOT97-1 SOT96-1 SOT97-1 SOT97-1 SOT97-1

Philips Semiconductors

Product data

Timer

NE/SA/SE555/SE555C

EQUIVALENT SCHEMATIC
FM CONTROL VOLTAGE VCC R1 4.7 k R2 330 R3 4.7 k R4 1 k R7 5 k R12 6.8 k Q21 Q5 Q6 Q7 Q8 Q9 Q22 Q19 R13 3.9 k

THRESHOLD

Q1 Q2 Q3

Q4

R10 82 k Q23 C B R8 5 k Q11 Q12 CB Q18 E

R11 4.7 k

OUTPUT

R5 10 k TRIGGER RESET DISCHARGE Q14 GND Q25 R6 100 k R16 100 Q10

Q20 R14 220 Q24 R15 4.7 k

Q13 Q16 Q15 R9 5 k

Q17

NOTE:

Pin numbers are for 8-Pin package

SL00351

Figure 3. Equivalent schematic

ABSOLUTE MAXIMUM RATINGS

SYMBOL VCC PD Supply voltage SE555 NE555, SE555C, SA555 Maximum allowable power dissipation1 Operating ambient temperature range NE555 SA555 SE555, SE555C Storage temperature range Lead soldering temperature (10 sec max) PARAMETER RATING +18 +16 600 0 to +70 40 to +85 55 to +125 65 to +150 +230 UNIT V V mW C C C C C

Tamb

Tstg TSOLD

NOTE: 1. The junction temperature must be kept below 125 C for the D package and below 150C for the N package. At ambient temperatures above 25 C, where this limit would be derated by the following factors: D package 160 C/W N package 100 C/W

Philips Semiconductors

Product data

Timer

NE/SA/SE555/SE555C

DC AND AC ELECTRICAL CHARACTERISTICS

Tamb = 25 C, VCC = +5 V to +15 V unless otherwise specified. SYMBOL VCC ICC PARAMETER Supply voltage Su ly Supply current (low state)1 Timing error (monostable) Initial accuracy2 Drift with temperature Drift with supply voltage Timing error (astable) Initial accuracy2 Drift with temperature Drift with supply voltage Control voltage level Threshold voltage Threshold current3 Trigger voltage Trigger current Reset voltage4 Reset current Reset current VCC = 15 V VCC = 5 V VTRIG = 0 V VCC = 15 V, VTH = 10.5 V VRESET = 0.4 V VRESET = 0 V VCC = 15 V ISINK = 10 mA ISINK = 50 mA ISINK = 100 mA ISINK = 200 mA VCC = 5 V ISINK = 8 mA ISINK = 5 mA VCC = 15 V ISOURCE = 200 mA ISOURCE = 100 mA VCC = 5 V ISOURCE = 100 mA tOFF tR tF Turn-off time5 Rise time of output Fall time of output Discharge leakage current VRESET = VCC 0.3 0.1 0.4 0.1 0.4 2.0 2.5 0.1 0.05 12.5 13.3 3.3 0.5 100 100 20 2.0 200 200 100 4.8 1.45 VCC = 5 V, RL = VCC = 15 V, RL = RA = 2 k to 100 k C=0.1 F TEST CONDITIONS SE555 Min 4.5 3 10 0.5 30 0.05 4 0.15 VCC = 15 V VCC = 5 V VCC = 15 V VCC = 5 V 9.6 2.9 9.4 2.7 10.0 3.33 10.0 3.33 0.1 5.0 1.67 0.5 Typ Max 18 5 12 2.0 100 0.2 6 500 0.6 10.4 3.8 10.6 4.0 0.25 5.2 1.9 0.9 1.0 0.4 1.0 0.15 0.5 2.2 0.3 0.1 0.4 0.1 0.4 2.0 2.5 0.3 0.25 12.5 13.3 3.3 0.5 100 100 20 2.0 300 300 100 4.5 1.1 9.0 2.6 8.8 2.4 NE555/SA555/SE555C Min 4.5 3 10 1.0 50 0.1 5 0.3 10.0 3.33 10.0 3.33 0.1 5.0 1.67 0.5 Typ Max 16 6 15 3.0 150 0.5 13 500 1 11.0 4.0 11.2 4.2 0.25 5.6 2.2 2.0 1.0 0.4 1.5 0.25 0.75 2.5 UNIT V mA mA % ppm/C %/V % ppm/C %/V V V V V A V V A V mA mA V V V V V V V V V s ns ns nA

tM tM/T tM/VS tA tA/T tA/VS VC VTH ITH VTRIG ITRIG VRESET IRESET

RA, RB = 1 k to 100 k C = 0.1 F VCC = 15 V

VO OL

LOW level output voltage LOW-level

0.25 0.2

0.4 0.35

VOH

HIGH-level output voltage g

13.0 3.0

12.75 2.75

NOTES: 1. Supply current when output high typically 1 mA less. 2. Tested at VCC = 5 V and VCC = 15 V. 3. This will determine the max value of RA+RB, for 15 V operation, the max total R = 10 M, and for 5 V operation, the max. total R = 3.4 M. 4. Specified with trigger input HIGH. 5. Time measured from a positive-going input pulse from 0 to 0.8VCC into the threshold to the drop from HIGH to LOW of the output. Trigger is tied to threshold.

Philips Semiconductors

Product data

Timer

NE/SA/SE555/SE555C

TYPICAL APPLICATIONS
VCC

RA 7 RB CONTROL VOLTAGE 0.01 F THRESHOLD 5 6

555 OR 1/2 556

DISCHARGE

COMP

FLIP FLOP

3 OUTPUT OUTPUT

2 TRIGGER

COMP

C 4 RESET

f+

1.49 (R A ) 2R B)C

Astable Operation
VCC

RA 7

555 OR 1/2 556

DISCHARGE

R CONTROL VOLTAGE 0.01 F THRESHOLD C R FLIP FLOP OUTPUT OUTPUT 5 6 COMP | t |

2 TRIGGER

COMP

1 * V 3 CC

4 RESET

T = 1.1RC

Monostable Operation Figure 5. Typical Applications

SL00353

Philips Semiconductors

Product data

Timer

NE/SA/SE555/SE555C

DIP8: plastic dual in-line package; 8 leads (300 mil)

SOT97-1