Professional Documents
Culture Documents
1.001
MR WDI I/O
0.998
GND GND
0.997
0.996
0.995
−40 −15 10 35 60 85
TA − Free-Air Temperature − °C
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS3820, TPS3823, TPS3823A, TPS3824, TPS3825, TPS3828
SLVS165M – APRIL 1998 – REVISED JULY 2020 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.3 Feature Description................................................. 14
2 Applications ........................................................... 1 8.4 Device Functional Modes........................................ 15
3 Description ............................................................. 1 9 Application and Implementation ........................ 16
4 Revision History..................................................... 2 9.1 Application Information............................................ 16
9.2 Typical Applications ................................................ 16
5 Device Comparison Table..................................... 4
6 Pin Configuration and Functions ......................... 4 10 Power Supply Recommendations ..................... 19
7 Specifications......................................................... 5 11 Layout................................................................... 19
11.1 Layout Guidelines ................................................. 19
7.1 Absolute Maximum Ratings ...................................... 5
11.2 Layout Example .................................................... 19
7.2 ESD Ratings ............................................................ 5
7.3 Recommended Operating Conditions....................... 5 12 Device and Documentation Support ................. 20
7.4 Thermal Information .................................................. 5 12.1 Device Support...................................................... 20
7.5 Electrical Characteristics........................................... 6 12.2 Documentation Support ........................................ 20
7.6 Electrical Characteristics for TPS3823A-33 only ..... 7 12.3 Related Links ........................................................ 21
7.7 Timing Requirements ................................................ 7 12.4 Community Resources.......................................... 21
7.8 Switching Characteristics .......................................... 7 12.5 Trademarks ........................................................... 21
7.9 Typical Characteristics .............................................. 9 12.6 Electrostatic Discharge Caution ............................ 21
12.7 Glossary ................................................................ 21
8 Detailed Description ............................................ 14
8.1 Overview ................................................................. 14 13 Mechanical, Packaging, and Orderable
8.2 Functional Block Diagram ....................................... 14
Information ........................................................... 21
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Changed the RESET columns for the TPS3824 and TPS3828 devices................................................................................ 4
• Removed 'Open-drain' from the RESET column for the TPS3828 device ............................................................................. 4
• Changed text in the MR pin description from: RESET to: RESET ........................................................................................ 4
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
• Changed front-page figure...................................................................................................................................................... 1
• Changed Pin Configuration and Functions section; updated table format ............................................................................. 4
• Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement ................... 5
• Deleted Soldering temperature specification from Absolute Maximum Ratings table............................................................ 5
• Changed clamp current to current specifications in Absolute Maximum Ratings table ......................................................... 5
• Changed Removed VI from Absolute Maximum Ratings table .............................................................................................. 5
• Changed Removed VSENSE from Recommended Operating Conditions table........................................................................ 5
• Changed free-air temperature to junction temperature in Electrical Characteristics condition statement.............................. 6
• Changed "TA" to "TJ" in Timing Requirements condition statement ...................................................................................... 7
• Changed "TA" to "TJ" in Switching Characteristics condition statement ................................................................................ 7
• Added TPS382xA-33 to second RESET row of VOH parameter in Electrical Characteristics table ....................................... 6
• Added TPS382xA-33 to third RESET row of VOL parameter in Electrical Characteristics table ............................................ 6
• Corrected typo in VOL RESET parameter test conditions ....................................................................................................... 6
• Added TPS382xA-33 to third and seventh rows of VIT– parameter in Electrical Characteristics table................................... 6
• Added TPS382xA-33 to third row of Vhys parameter in Electrical Characteristics table......................................................... 6
• Added TPS382xA-33 to third row of IOS parameter in Electrical Characteristics table........................................................... 7
• Added TPS3823A to second row of ttout parameter in Switching Characteristics table.......................................................... 7
• Added TPS3823A to second row of td parameter in Switching Characteristics table ............................................................ 7
• Added TPS3823A to first row of tPHL parameter in Switching Characteristics table............................................................... 8
• Added last row of Terminal Functions table to Package Information table ............................................................................ 4
RESET 1 5 VDD
RESET 1 5 VDD
GND 2
GND 2
MR 3 4 WDI
RESET 3 4 WDI
RESET 1 5 VDD
GND 2
RESET 3 4 MR
Pin Functions
PIN
TPS3820,
TPS3823, I/O DESCRIPTION
NAME TPS3824 TPS3825
TPS3823A,
TPS3828
GND 2 2 2 — Ground connection
Manual-reset input. Pull low to force a reset. RESET remains low as long
MR 3 — 4 I as MR is low and for the time-out period after MR goes high. Leave
unconnected or connect to VDD when unused.
RESET — 3 3 O Active-high reset output. Either push-pull or open-drain output stage.
RESET 1 1 1 O Active-low reset output. Either push-pull or open-drain output stage.
VDD 5 5 5 I Supply voltage. Powers the device and monitors its own voltage.
Watchdog timer input. If WDI remains high or low longer than the time-
out period, then reset is triggered. The timer clears when reset is
WDI 4 4 — I asserted or when WDI sees a rising edge or a falling edge. If unused, the
WDI connection must be high impedance to prevent it from causing a
reset event.
7 Specifications
7.1 Absolute Maximum Ratings
over operating junction temperature range (unless otherwise noted) (1) (2)
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
(1) The lowest supply voltage at which RESET becomes active. tr, VDD ≥ 15 μs/V.
(2) To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 μF) must be placed near the supply terminals.
(3) The RESET short-circuit current is the maximum pullup current when RESET is driven low by a microprocessor bidirectional reset pin.
(1) The lowest supply voltage at which RESET becomes active. tr, VDD ≥ 15 μs/V.
(2) To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 μF) must be placed near the supply terminals.
(3) The RESET short-circuit current is the maximum pullup current when RESET is driven low by a microprocessor bidirectional reset pin.
VIT-
VDD
1.1 V
td td tt(out) td
undefined
undefined
RESET
WDI
9
0.998
7
0.997 5
3
0.996
1
0.995 −1
−40 −15 10 35 60 85 −0.5 0.5 1.5 2.5 3.5 4.5 5.5 6.5
TA − Free-Air Temperature − °C VDD − Supply Voltage − V
Figure 2. Normalized Input Threshold Voltage vs Free-Air Figure 3. Supply Current vs Supply Voltage
Temperature at VDD
50 3
VDD = 5.5 V VDD = 2.66 V
WDI = Open WDI = Open
2
−50
−40°C
1.5
85°C
−100
1
85°C
−150 −40°C
0.5
−200 0
−1 0 1 2 3 4 5 6 0 1 2 3 4 5 6 7 8 9 10
VI − Input Voltage at MR − V IOL − Low-Level Output Current − mA
Figure 4. Input Current vs Input Voltage at MR Figure 5. Low-Level Output Voltage vs Low-Level Output
Current
3.5 6
VDD = 3.2 V VDD = 5.5 V
WDI = Open WDI = Open
VOH − High-Level Output Voltage − V
3 MR = Open MR = Open
5
2.5
4
−40°C −40°C
2
3
1.5
85°C
85°C
2
1
1
0.5
0 0
0 −50 −100 −150 −200 −250 0 −100 −200 −300 −400 −500 −600 −700
IOH − High-Level Output Current − µA IOH − High-Level Output Current − µA
Figure 6. High-Level Output Voltage vs High-Level Output Figure 7. High-Level Output Voltage vs High-Level Output
Current Current
MR = Open
7
8
6
5
Count
4
4
2
2
0 1
0 200 400 600 800 1000
VDD − Threshold Overdrive − mV
0
120 150 180 210 240 270 300
Reset Delay td [ms] Rese
Figure 8. Minimum Pulse Duration at VDD vs VDD Threshold Figure 9. Reset Delay Histogram for TPS3823A-33 Devices
Overdrive at -40°C (Unit Count = 20)
8 8
7 7
6 6
5 5
Count
Count
4 4
3 3
2 2
1 1
0 0
120 150 180 210 240 270 300 120 150 180 210 240 270 300
Reset Delay td [ms] Rese Reset Delay td [ms] Rese
Figure 10. Reset Delay Histogram for TPS3823A-33 Devices Figure 11. Reset Delay Histogram for TPS3823A-33 Devices
at 25°C (Unit Count = 20) at 125°C (Unit Count = 20)
8 8
7 7
6 6
5 5
Count
Count
4 4
3 3
2 2
1 1
0 0
0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5
Watchdog Timeout tout [s] Watc Watchdog Timeout tout [s] Watc
Figure 12. Watchdog Timeout Histogram for TPS3823A-33 Figure 13. Watchdog Timeout Histogram for TPS3823A-33
Devices at -40°C (Unit Count = 20) Devices at 25°C (Unit Count = 20)
7 7
6 6
5 5
Count
Count
4 4
3 3
2 2
1 1
0 0
0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 5 7 9 11 13 15 17 19 21 23 25
Watchdog Timeout tout [s] Watc
VDD to Reset Delay tPHL [µs] tPHL
Figure 14. Watchdog Timeout Histogram for TPS3823A-33 Figure 15. VDD to Reset Delay Histogram for TPS3823A-33
Devices at 125°C (Unit Count = 20) Devices at -40°C (Unit Count = 20)
8 8
7 7
6 6
5 5
Count
Count
4 4
3 3
2 2
1 1
0 0
5 7 9 11 13 15 17 19 21 23 25 5 7 9 11 13 15 17 19 21 23 25
VDD to Reset Delay tPHL [µs] tPHL VDD to Reset Delay tPHL [µs] tPHL
Figure 16. VDD to Reset Delay Histogram for TPS3823A-33 Figure 17. VDD to Reset Delay Histogram for TPS3823A-33
Devices at 25°C (Unit Count = 20) Devices at 125°C (Unit Count = 20)
10 10
9 9
8 8
7 7
6 6
Count
Count
5 5
4 4
3 3
2 2
1 1
0 0
3 3.5 4 4.5 5 5.5 6 3 3.5 4 4.5 5 5.5 6
tW(VDD) [µs] tw_V tW(VDD) [µs] tw_V
Figure 18. VDD Pulse Width Histogram for TPS3823A-33 Figure 19. VDD Pulse Width Histogram for TPS3823A-33
Devices at -40°C (Unit Count = 20) Devices at 25°C (Unit Count = 20)
9 11
10
8
9
7
8
6 7
Count
Count
5 6
4 5
4
3
3
2
2
1 1
0 0
3 3.5 4 4.5 5 5.5 6 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
tW(VDD) [µs] tw_V tW(MR) [µs] tw_m
Figure 20. VDD Pulse Width Histogram for TPS3823A-33 Figure 21. Manual Reset Pulse Width Histogram for
Devices at 125°C (Unit Count = 20) TPS3823A-33 Devices at -40°C (Unit Count = 20)
12 12
11 11
10 10
9 9
8 8
7 7
Count
Count
6 6
5 5
4 4
3 3
2 2
1 1
0 0
0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
tW(MR) [µs] tw_m tW(MR) [µs] tw_m
Figure 22. Manual Reset Pulse Width Histogram for Figure 23. Manual Reset Pulse Width Histogram for
TPS3823A-33 Devices at 25°C (Unit Count = 20) TPS3823A-33 Devices at 125°C (Unit Count = 20)
15 15
14 14
13 13
12 12
11 11
10 10
9 9
Count
Count
8 8
7 7
6 6
5 5
4 4
3 3
2 2
1 1
0 0
50 55 60 65 70 75 80 85 90 95 100 50 55 60 65 70 75 80 85 90 95 100
tW(WDI) [ns] tw_w tW(WDI) [ns] tw_w
Figure 24. WDI Pulse Width Histogram for TPS3823A-33 Figure 25. WDI Pulse Width Histogram for TPS3823A-33
Devices at -40°C (Unit Count = 20) Devices at 25°C (Unit Count = 20)
Count
9
8
7
6
5
4
3
2
1
0
50 55 60 65 70 75 80 85 90 95 100
tW(WDI) [ns] tw_w
Figure 26. WDI Pulse Width Histogram for TPS3823A-33 Devices at 125°C (Unit Count = 20)
8 Detailed Description
8.1 Overview
The TPS382x family of supervisors provide circuit initialization and timing supervision. Optional configurations
include devices with active-high and active-low output signals (TPS3824/5), devices with a watchdog timer
(TPS3820/3/4/8), and devices with manual reset (MR) pins (TPS3820/3/5/8). RESET asserts when the supply
voltage, VDD, rises above 1.1 V. For devices with active-low output logic, the device monitors VDD and keeps
RESET low as long as VDD remains below the negative threshold voltage, VIT−. For devices with active-high
output logic, RESET remains high as long as VDD remains below VIT−. An internal timer delays the return of the
output to the inactive state (high) to ensure proper system reset. The delay time, td, starts after VDD rises above
the positive threshold voltage (VIT− + VHYS). When the supply voltage drops below VIT−, the output becomes
active (low) again. All the devices of this family have a fixed-sense threshold voltage, VIT–, set by an internal
voltage divider, so no external components are required.
The TPS382x family is designed to monitor supply voltages of 2.5 V, 3 V, 3.3 V, and 5 V. The devices are
available in a 5-pin SOT-23 package and are characterized for operation over a temperature range of −40°C to
85°C. Only TPS3823A-33 is characterized for operation over a temperature range −40°C to 125°C.
VDD
+ (1)
_ RESET RESET
52 kW
Logic
RESET
VREF
(2)
MR
Auto-Reset
Oscillator
40 kW
(1) TPS3824/5
(2) TPS3820/3/5/8
(3) TPS3820/3/4/8
(1) TPS3820/3/5/8
(2) TPS3824/5
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
RESET RESET
TPS3823A-33 MSP430C325
MR WDI I/O
GND GND
10
WDI = Open
t w − Minimum Pulse Duration at VDD − µs
MR = Open
8
0
0 200 400 600 800 1000
VDD − Threshold Overdrive − mV
3.3 V
VDD VDD
RESET RESET
TPS3820-33 Microprocessor
MR WDI I/O
GND GND
10
WDI = Open
t w − Minimum Pulse Duration at VDD − µs
MR = Open
8
0
0 200 400 600 800 1000
VDD − Threshold Overdrive − mV
11 Layout
CVDD
RESET
Flag
TPS3828
1 5
MR WDI
3 4
Signal Signal
(1) For the most current package and ordering information see the Package Option Addendum at the end
of this document, or see the TI website at www.ti.com.
(2) The DBVT package indicates tape and reel of 250 parts.
(3) The DBVR package indicates tape and reel of 3000 parts.
(4) For other threshold voltage versions, contact the local TI sales office.
12.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 13-Aug-2021
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TPS3820-33DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDEI
TPS3820-33DBVRG4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDEI
TPS3820-33DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDEI
TPS3820-33DBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDEI
TPS3820-50DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDDI
TPS3820-50DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDDI
TPS3823-25DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PAPI
TPS3823-25DBVRG4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PAPI
TPS3823-25DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM PAPI
TPS3823-25DBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM PAPI
TPS3823-30DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PAQI
TPS3823-30DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM PAQI
TPS3823-30DBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM PAQI
TPS3823-33DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PARI
TPS3823-33DBVRG4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PARI
TPS3823-33DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM PARI
TPS3823-33DBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM PARI
TPS3823-50DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PASI
TPS3823-50DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM PASI
TPS3823-50DBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM PASI
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 13-Aug-2021
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TPS3823A-33DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 PYPI
TPS3823A-33DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 PYPI
TPS3824-25DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PATI
TPS3824-25DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM PATI
TPS3824-30DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PAUI
TPS3824-30DBVRG4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PAUI
TPS3824-30DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM PAUI
TPS3824-33DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PAVI
TPS3824-33DBVRG4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PAVI
TPS3824-33DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM PAVI
TPS3824-33DBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM PAVI
TPS3824-50DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PAWI
TPS3824-50DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM PAWI
TPS3824-50DBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM PAWI
TPS3825-33DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDGI
TPS3825-33DBVRG4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDGI
TPS3825-33DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDGI
TPS3825-33DBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDGI
TPS3825-50DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDFI
TPS3825-50DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDFI
TPS3825-50DBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDFI
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 13-Aug-2021
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TPS3828-33DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDII
TPS3828-33DBVRG4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDII
TPS3828-33DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDII
TPS3828-33DBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDII
TPS3828-50DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDHI
TPS3828-50DBVRG4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDHI
TPS3828-50DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDHI
TPS3828-50DBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PDHI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com 13-Aug-2021
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
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Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS3824-25DBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TPS3824-25DBVT SOT-23 DBV 5 250 200.0 183.0 25.0
TPS3824-30DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TPS3824-30DBVR SOT-23 DBV 5 3000 200.0 183.0 25.0
TPS3824-30DBVT SOT-23 DBV 5 250 200.0 183.0 25.0
TPS3824-30DBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TPS3824-33DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TPS3824-33DBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TPS3824-50DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TPS3824-50DBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TPS3824-50DBVT SOT-23 DBV 5 250 203.0 203.0 35.0
TPS3825-33DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TPS3825-33DBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TPS3825-50DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TPS3825-50DBVR SOT-23 DBV 5 3000 203.0 203.0 35.0
TPS3825-50DBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TPS3828-33DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TPS3828-33DBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TPS3828-50DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TPS3828-50DBVT SOT-23 DBV 5 250 180.0 180.0 18.0
Pack Materials-Page 4
PACKAGE OUTLINE
DBV0005A SCALE 4.000
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
C
3.0
2.6 0.1 C
1.75 1.45
B A
1.45 0.90
PIN 1
INDEX AREA
1 5
2X 0.95
3.05
2.75
1.9 1.9
2
4
3
0.5
5X
0.3
0.15
0.2 C A B (1.1) TYP
0.00
0.25
GAGE PLANE 0.22
TYP
0.08
8
TYP 0.6
0 TYP SEATING PLANE
0.3
4214839/F 06/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.25 mm per side.
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EXAMPLE BOARD LAYOUT
DBV0005A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
2X (0.95)
3 4
SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK
4214839/F 06/2021
NOTES: (continued)
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EXAMPLE STENCIL DESIGN
DBV0005A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
2 (1.9)
2X(0.95)
3 4
(R0.05) TYP
(2.6)
4214839/F 06/2021
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
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