The University of Western Ontario

Faculty of Engineering
Mechatronic Systems Engineering Program

MSE 2202 — Introduction to Mechatronic Design

FINAL EXAMINATION—April 12, 2017

Name:
Student Number:

CLOSED BOOK 3 HOURS INTRAMURAL

CHEATING: University policy states that cheating is a scholastic offence. The commission of a scholastic offence
is attended by academic penalties that might include expulsion from the program. If you are caught
cheating, there will be no second warning.
AIDS: You are permitted the use of a nonprogrammed calculator in this examination. No other aids are
permitted (i.e., NO books, notes, wireless devices, or other information processing devices). All
sheets (including rough work) must be handed in; no part of the examination may be taken from
the room.
GRADING: Marks will be assigned on the basis of correctness of solution, and thoroughness and clarity of pre-
sentation. All sketches must be properly labelled. Be sure to clearly state any assumptions.

NOTE: It is recommended that you start the examination by first reviewing ALL questions and then schedul-
ing your time appropriately.

There are 18 pages in this examination (the last 3 pages are blank). It is your
responsibility to ensure that no pages are missing.
Record your answers to all questions in this booklet.

Question Earned Mark Total Marks

1 /12

2 /24

3 /20

4 /24

5 /10

6 /10

Total /100
MSE 2202b—Final Exam 2017 Page 2 of 18

S TANDARD A RDUINO F UNCTIONS

abs() char() loop() setup()

analogReference() constrain() lowByte() shiftIn()
analogRead() cos() map() shiftOut()
analogWrite() delay() max() sin()
byte() delayMicroseconds() micros() sizeof()
bit() digitalRead() millis() sqrt()
bitClear() digitalWrite() min() tan()
bitRead() float() noTone() tone()
bitSet() highByte() pinMode() word()
bitWrite() int() pow()
byte() long() pulseIn()

U SEFUL F ORMULAS

00 dT T2 − T1 T1 − T2 ∆T
Heat flux (conduction) [W/m2 ]: qcond = −k = −k =k , T1 > T2 = k
dx L L L
00
Heat flux (convection) [W/m2 ]: qconv = h(Ts − T∞ ), Ts > T∞
Heat flux (radiation)† [W/m2 ]: 00
qrad = εEb (Ts ) − αG = εσ(Ts4 − Tsur
4
)
Heat rate (radiation)† [W/m]: qrad = hr A(Ts − Tsur )
† 2
Radiation heat transfer coefficient [W/m ·K]: hr = εσ(Ts + Tsur )(Ts2 + Tsur
2
)
Stefan-Boltzmann constant: σ = 5.67 × 10−8 W/m · K4
First law of thermodynamics for closed system: ∆Esttot = Q − W
Thermal and mechanical energy over interval, ∆t: ∆Est = Ein − Eout + Eg
Thermal and mechanical energy at an instant, t: Ėst = Ėin − Ėout + Ėg
∆T
Heat rate [W]: q = q 00 A =
Rt
L
Thermal resistance (conduction) [m2 ·K/m]: Rt,cond =
kA
1
Thermal resistance (convection) [m2 ·K/m]: Rt,conv =
hA
1
Thermal resistance (radiation) [m2 ·K/m]: Rt,rad =
hr A
00
Rt,c
Thermal resistance (contact) [m2 ·K/m]: Rt,c =
Ac
∆T 1
Total thermal resistance [m2 ·K/m]: Rtot = ΣRt = =
q UA
1 1 1
Thermal resistance with parallel conductors: = +
Rtot R1 R2

†
Assumes radiation exchange between a small surface at Ts and a much larger, isothermal surface that completely surrounds
the smaller one. It is also assumed that α = ε for the surface.
MSE 2202b—Final Exam 2017 Page 3 of 18

1. Compare and Constrast (12 marks)

In less than 50 words per item, compare and contrast four (out of five) of the following:
(a) Firmware and software

(b) PDS and QFD

(c) Sensor hysteresis and nonlinearity

(d) Milling and broaching

(e) Isothermal and adiabatic surfaces

 MSE 2202b—Final Exam 2017 Page 4 of 18

2. Short Answer Questions (24 marks)

(4) (a) What is meant by the term “Design for X”? Provide at least 3 concrete examples.

(4) (b) Describe 3 methods that may be used to measure the distance to an object. How would you decide which is
most suitable?
 MSE 2202b—Final Exam 2017 Page 5 of 18

(4) (c) For the activities shown in the figure below, determine the most time critical series of events. Which event
offers the most slack? All times represent weeks.

G (1)
4 8
H N
(5 (1

)
)

(3
)

A (4) D E (2) I (3) L (5)

1 2 5 7 10

M (2)
B
C (2)

)
(4
)
(3

(3

O
)
J
3 6 9
F (1) K (2)

(4) (d) Describe how to communicate information between two MSEduino boards using a wired connection.
 MSE 2202b—Final Exam 2017 Page 6 of 18

(4) (e) Why is version control important? Using specific commands, describe how a user typically interacts with a
distributed version control system.

(4) (f ) Describe how a light-based remote control is able to wirelessly communicate with a device, such as a televi-
sion. Be sure to describe both the required hardware and how information is conveyed.
 MSE 2202b—Final Exam 2017 Page 7 of 18

3. Microcontroller Design (20 marks)

Consider the development of a simple Arduino-based project that will implement an automatic window shade.
The inputs to the system include sensors to monitor the indoor temperature and the ambient light level, along
with a rotary knob to control the setpoint temperature, two pushbuttons to manually raise and lower the shade,
and a switch to choose between automatic and manual mode. When in automatic mode, the window shade
should automatically raise when it is light outside and the indoor temperature is below the setpoint. It should
close when it is dark outside or the indoor temperature is above the setpoint. In manual mode, the shade should
raise when the ‘Up’ button is press and lower when the ‘Down’ button is pressed.

(4) (a) As described above, the limits of the shade motion are unknown. This could lead to damage to either the
shade or the motor. Outline at least 2 approaches that could be used to rectify this problem. Identify which is
best and justify your choice.
 MSE 2202b—Final Exam 2017 Page 8 of 18

(6) (b) Using the schematic layout in the figure below as a basis, draw a complete schematic that shows how the
required components would be connected to the Arduino. Be sure to include any additional components
(e.g., resistors, capacitors, diodes, switches) that might be necessary for the circuit to operate properly and
also include the components required for your chosen method from Part (a). The motor used to raise and
lower the shade may by shown as a block labelled “Motor.”

5V

3V3 5V Vin
D13
Power
RST D12

AREF D11

IO REF Arduino D10

N/C D9

D8

D7

D6

D5

A0 D4

A1 D3
Analog Input

A2 D2
TX
A3 D1
RX
A4 D0

A5 SCL

SDA
GND
 MSE 2202b—Final Exam 2017 Page 9 of 18

(10) (c) Write a complete Arduino sketch that would implement the required functionality for this system, assuming
that the components are connected as shown in your schematic.
 MSE 2202b—Final Exam 2017 Page 10 of 18

4. CAD Modelling (24 marks)

Consider the part shown below. The base of the part is 40 mm in diameter and 10 mm thick. The total length of
the part is 50 mm. The shaft is 20 mm in diameter and has a 20◦ taper over the last 10 mm. The centre of a 5 mm
diameter through-hole is located 13 mm from the end of the shaft. In all parts of this question, be sure to clearly
state any assumptions.

SolidWorks Student Edition.

For Academic Use Only.

(8) (a) Describe the steps required to model the part using a solid modelling CAD package such as SolidWorks. Aim
to keep the model as parametric as possible.
 MSE 2202b—Final Exam 2017 Page 11 of 18

(10) (b) Using the drawing template provided on the following page, generate a properly laid out and labelled drawing
of the part. Use third-angle projection and include all relevant dimensions and tolerances.
(6) (c) Using design guidelines for manufacturing and assembly, what modifications could be made to improve the
part design? You may use annotated sketches or text in your answer.
 MSE 2202b—Final Exam 2017

UNLESS OTHERWISE SPECIFIED: FINISH: DEBUR AND

DO NOT SCALE DRAWING REVISION
DIMENSIONS ARE IN MILLIMETERS BREAK SHARP
SURFACE FINISH: EDGES
TOLERANCES:
LINEAR: MECHATRONIC SYSTEMS ENGINEERING
ANGULAR:

NAME SIGNATURE DATE TITLE:

DRAWN

CHK'D

APPV'D

MFG

Q.A MATERIAL:
DWG NO.
A

WEIGHT SCALE: SHEET 1 OF 1

Page 12 of 18
 MSE 2202b—Final Exam 2017 Page 13 of 18

5. Heat Transfer (10 marks)

A very thin integrated circuit (chip) is joined to a circuit board at its inner surface and is exposed to a dielectric
liquid on its outer surface. The thermal contact resistance between the chip and the board is 10−4 m2 ·K/W and
the board thickness and thermal conductivity are Lb = 5 mm and kb = 1 W/m·K, respectively. The dielectric side
has a coefficient of ho = 1000 W/m2 ·K and T∞,o = 20 ◦ C. The underside of the board is exposed to ambient air for
which hi = 40 W/m2 ·K and T∞,i = 20 ◦ C .

Coolant

Chip ( )

Thermal contact
resistance ( )
Board ( )

Air

(5) 1. Sketch an equivalent thermal circuit corresponding to steady-state conditions. In variable form, label the
appropriate resistances, temperatures and heat fluxes.
 MSE 2202b—Final Exam 2017 Page 14 of 18

(5) 2. Given that under steady-state conditions the chip heat dissipation is qc00 = 30,000 W/m2 , what is the chip
temperature?
MSE 2202b—Final Exam 2017 Page 15 of 18

6. Design Reflection (10 marks)

Consider the tesseract collecting robot that you designed as part of the course project. Having gone through
the experience, how would you change your approach to ensure that your final design is complete and has been
validated with a fully functional prototype?
MSE 2202b—Final Exam 2017 Page 16 of 18

Additional Work
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