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STGW 25 H 120 DF 2
STGW 25 H 120 DF 2
Datasheet
Features
• Maximum junction temperature: TJ = 175 °C
• High speed switching series
• Minimized tail current
2
3 • VCE(sat) = 2.1 V (typ.) @ IC = 25 A
3 1
1
2
• 5 μs minimum short circuit withstand time at TJ = 150 °C
TO-247 TO-247 long leads
• Safe paralleling
• Low thermal resistance
• Very fast recovery antiparallel diode
Applications
• Photovoltaic inverters
• Uninterruptible power supply
• Welding
• Power factor correction
• High frequency converters
Description
This device is an IGBT developed using an advanced proprietary trench gate field-
stop structure. The device is part of the H series of IGBTs, which represents an
optimum compromise between conduction and switching losses to maximize the
efficiency of high-switching frequency converters. Furthermore, a slightly positive
VCE(sat) temperature coefficient and very tight parameter distribution result in safer
paralleling operation.
STGW25H120DF2
STGWA25H120DF2
Product summary
1 Electrical ratings
2 Electrical characteristics
Collector-emitter breakdown
V(BR)CES VGE = 0 V, IC = 2 mA 1200 V
voltage
VGE = 15 V, IC = 25 A 2.1 2.6
Collector-emitter saturation
VCE(sat) VGE = 15 V, IC = 25 A, TJ = 125 °C 2.4 V
voltage
VGE = 15 V, IC = 25 A, TJ = 175 °C 2.5
IF = 25 A 3.8 4.9
IF = 25 A, TJ = 175 °C 2.8
Peak rate of fall of reverse (see Figure 27. Test circuit for inductive
dIrr/dt - 400 - A/μs
recovery current during tb load switching)
Figure 1. Power dissipation vs case temperature Figure 2. Collector current vs case temperature
GIPG240420141525FSR
IC GIPG240420141537FSR
Ptot
(A)
(W)
VGE ≥ 15V, T J ≤ 175 °C
350 VGE ≥ 15V, T J ≤ 175 °C 50
300
40
250
200 30
150
20
100
50 10
0 0
0 25 50 75 100 125 150 175 TC(°C)
0 25 50 75 100 125 150 175 TC(°C)
Figure 3. Output characteristics (TJ = 25 °C) Figure 4. Output characteristics (TJ = 175 °C)
IC GIPG240420141543FSR IC GIPG260420141136FSR
(A) 11V (A) 13V
VGE=15V
13V 11V
80 80
VGE=15V
9V
60 60
9V
40 40
20 20
7V
7V
0 0
0 1 2 3 4 5 VCE(V) 0 1 2 3 4 5 VCE(V)
3.2
3.0 TJ= 175°C
2.8
2.6 IC= 25A
2.4 TJ= -40°C
2.2
2.0
IC= 12.5A
1.8
1.6
1.4 1.2
-50 0 50 100 150 TJ(°C) 0 20 40 60 80 IC(A)
70 Tc=80°C
100
1 µs
60
50 Tc=100 °C
10 µs
10
40
100 µs
30 1 ms
Single pulse
20 1 Tc= 25°C, T J ≤ 175°C
rectangular current shape,
(duty cycle=0.5, VCC = 600V, RG=10 Ω, VGE= 15V
10 VGE = 0/15 V, TJ =175°C)
0 0.1
1 10 f (kHz) 1 10 100 1000 VCE(V)
60
0.9
TJ=175°C
40
0.8
20 0.7
0 0.6
5 6 7 8 9 10 11 VGE(V) -50 0 50 100 150 TJ(°C)
Figure 11. Normalized V(BR)CES vs junction temperature Figure 12. Capacitance variations
(norm) (pF)
1.10 Cies
IC= 2mA 1000
1.05
1.00 100
Coes
0.95
10 Cres
0.90
f = 1 MHz, VGE = 0
0.85 1
-50 0 50 100 150 TJ(°C) 0.1 1 10 100 VCE(V)
Figure 13. Gate charge vs gate-emitter voltage Figure 14. Switching energy vs collector current
VGE GIPG270420141015FSR E GIPG270420141036FSR
(V) (µJ)
VCC = 600V, V GE = 15V,
3000 RG = 10Ω, TJ = 175°C
16 IC= 25A
IGE= 1mA
VCC= 960V 2500
12 EOFF
2000
EON
8 1500
1000
4
500
0 0
0 20 40 60 80 100 Qg(nC) 0 10 20 30 40 50 IC(A)
Figure 15. Switching energy vs gate resistance Figure 16. Switching energy vs junction temperature
E GIPG270420141049FSR E GIPG270420141146FSR
(µJ) (µJ)
VCC = 600 V, V GE = 15 V, VCC= 600V, V GE= 15V,
IC = 25 A, TJ = 175 °C 1700 RG= 10Ω, IC= 25A
2000
1500
EOFF
1500 EOFF 1300
EON
EON
1100
1000
900
500
700
0 500
0 10 20 30 40 RG(Ω) 0 50 100 150 TJ(°C)
Figure 17. Switching energy vs collector-emitter voltage Figure 18. Switching times vs collector current
E GIPG270420141152FSR t GIPG270420141157FSR
(µJ) (ns)
TJ= 175°C, VGE= 15V, TJ= 175°C, VGE= 15V,
2500 RG= 10Ω, IC= 25A RG= 10Ω, VCC= 600V
tf
2200
700 tr
400
100 1
250 450 650 850 VCE(V) 0 10 20 30 40 50 IC(A)
100 30
tdon 25
tr 20
10
15
TJ= 175°C, VGE= 15V,
IC= 25A, VCC= 600V 10
1
0 10 20 30 40 RG(Ω) 5
300 700 1100 1500 di/dt(A/µs)
3000
500
2500
300
2000
100
300 700 1100 1500 di/dt(A/µs) 1500
300 700 1100 1500 di/dt(A/µs)
5
1600
4 TJ= 175°C
1400
3
1200 2
1000 1
di/dt(A/µs) 0 20 40 60 80 IF(A)
300 700 1100 1500
0.2
0.1
10-1 0.05
0.02
0.01
Single pulse
10-2
10-5 10-4 10-3 10-2 10-1 tp (s )
3 Test circuits
Figure 27. Test circuit for inductive load switching Figure 28. Gate charge test circuit
A A
C
L=100 µH k
G k
E B
B
C 3.3 1000 VCC
µF µF
k
G D.U.T
k
+ RG E
k
-
k
AM01504v1 AM01505v1
Figure 29. Switching waveform Figure 30. Diode reverse recovery waveform
90%
VG 10%
90%
VCE 10%
tr(Voff)
tcross
25
90%
IC td(off)
10%
td(on) tf
tr(Ion)
ton toff
AM01506v1
4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
0075325_9
mm
Dim.
Min. Typ. Max.
A 4.85 5.15
A1 2.20 2.60
b 1.0 1.40
b1 2.0 2.40
b2 3.0 3.40
c 0.40 0.80
D 19.85 20.15
E 15.45 15.75
e 5.30 5.45 5.60
L 14.20 14.80
L1 3.70 4.30
L2 18.50
ØP 3.55 3.65
ØR 4.50 5.50
S 5.30 5.50 5.70
8463846_2_F
mm
Dim.
Min. Typ. Max.
Revision history
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5