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Carbon­Carbon 

Ultracapacitor 
Equivalent Circuit Model, Parameter 
Extraction, and Application
John M. Miller Uday Deshpande Marius Rosu

Maxwell Technologies, Inc Ansoft Corp.

San Diego, CA Pittsburg, PA

Ansoft Ansoft First Pass Workshop


Irvine, CA 16 Oct. 2007
Southfield, MI 18 Oct. 2007

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  18 Oct, 2007 


Ultracapacitors in the News
• More “electric everything” is indeed becoming pervasive.
• Headline: Toyota Supra Hybrid Racing Car Wins at Tokachi 24 Hours
Race (616 laps, 24:01.32.7)
• Toyota uses GT racing car chassis with purpose designed electric drives:
• 10 kW in wheel front
• 150 kW rear axle

Ultracapacitor pack energy storage system.


Rating: (?)

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  2 


Outline
• Introduction to Maxwell
• Facilities and Business Units

• Nonlinear Model for Ultracapacitor


• Model Derivation
• Parasitic Extraction

• Model Validation
• Constant Current – Six Step Method
• Constant Power

• Applications
• Recuperator Systems
• Micro-hybrid
• Transit bus

• Conclusions
Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  3 
Production Facilities 

§ San Diego, CA

§ Rossens, Switzerland

§ Out source Manufacturing Partner


China

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  4 


Available Market 
§  Value today is in transportation, industrial and consumer 

Market  Application 
Transportation Trains, trams 
Buses 
Aerospace 
Industry  Pitch systems 
Robotics 
Telecom 
Fork lift, ship yard cranes 
Elevators 
UPS/Power quality 
AMR 
Consumer  Digital cameras, PDA’s, laptop, mobile phones 

§  Target is the automotive market 
§  Board net stabilization, distributed power, Hybrid drive trains, PHEV 
Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  5 
Ultracapacitor Cells
• Ultracapacitor cell design: Minimize ESR!
• Trends are for ESR*C = t <1s and PML > 10 kW/kg

C= 650 1200 1500 2000 2600 3000 F


ESRac = 0.6 0.44 0.35 0.26 0.21 0.20 mW
ESRdc = 0.8 0.58 0.47 0.35 0.31 0.30 mW
t= 0.52 0.696 0.705 0.700 0.806 0.900 s
Irms = 105 110 115 125 130 150+ Arms

Micro-Hybrid Industrial Applications Heavy Transportation

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  6 


Heavy Transportation Products
• Illustrations of heavy transportation modules
• Thermally: 15oC rise at 150A and 600 scfm 

BMOD0165-E048 (165F, 48V, 150A, 8.5mW)

Heavy Transportation Module, HTM: BMOD0018-P390


(17.8F, 390V, 150A, 65mW ESR)

Attribute  BMOD0165­E048  BMOD0063­P125  BMOD0018­P390 


Energy, useable  40 Wh  102 Wh  282 Wh 
Umx à Umx/2, 
Cont. Amps  150  150  150 
Peak Amps  750, 5s  950, 5s 
Mass, kg  14.2  58  165 
Power, (kW/kg)  6.6  4  3.5 
Cycles  1,000,000  1,000,000  1,000,000 
Cells/module  18  48  146 

BMOD0063-P125 (63F, 125V, 150A, 17mW ESR)

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  7 


Module Thermal Parameters & Response

• The18 x 3000F cell module BMOD0165-E048 


• Thermal resistance qR=0.436 oC/W in still air and 
• Thermal capacity, qC=18.7 kJ/oC. 
• With thermal time constant, qt=2.26 hours. 
• For160 cfm forced air: qR = 0.14 oC/W and qC=24.5 kJ/oC. 
• First order thermal response fits data very well.
T (t ) = T a  + P d qR  (
  1 - e - t / qt )  )  55.727
60 
BMOD0165­P048 Meas Temp. Mod1Case vs Modeled 

50 

Temperature, C  Te mp 
40 
T .mod ( x ) 

30 

24 
20 
3 4 4
0  5 ´ 10  1 ´ 10  1.5 ´ 10 
0  time , x 4
1.44 ´ 10 

Time, s 

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  8 


Energy Storage Technologies
• Side-by-side energy storage technology comparison
• Attributes of components to store 1MJ (278 Wh)
• Polymer film type used in pulse magnetizers and inverters
• Ceramics used in coupling and high frequency bypass 

Current  Response 
Voltage  Energy  Energy  Mass 
Capacitor Type (pk/rms)  Time 
(V)  (Wh/liter)  (Wh/kg)  1 MJ  (kg) 
(A)  (seconds) 

Electrostatic 
Polymer Film  200,000/300  900  0.03  0.024  12,000  10 ­9 
Ceramic MLCC 
Electrolytic 
?/40  450  0.087  0.019  15,000  10 ­4 
Aluminum electrolytic 

Electrochemical 
4,800/150  2.7  6.4  5.5  51  1 
Carbon ultracapacitor 

Electrochemical 
2,000/150  3.8  286  123  2  10 3 
Lithium­Ion 

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  9 


Seque

Modeling

• Nonlinear Model of Ultracapacitor

• Parasitic Parameter Extraction

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  10 


Ultracapacitor Energy Storage Mechanism
• On cost of ultracapacitors is dominated
by carbon.
• Raw material – coconut shells =>
• Carbon is the cost driver
• Resin based – high purity, high mat’l costs
• Natural product based – (coconut, wood,
coal, peat, etc.) lower cost, higher
impurities

Electrode
Grind  fabrication

Activation Coating
Rolling/Kneading/Pasting

Activated carbon powder 

Source: Prof. Katsuhiko Naoi, Institute of Symbiotic Science and Technology, Tokyo University of Agriculture and Technology,
Recent Advances in Capacitors and Hybrid Power Sources in Japan, presented to DOE Basic Energy Sciences Wkshp, 3-4 March 2007

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  11 


Ultracapacitor Cell Construction

• Jelly roll assembly of two carbon electrodes with


paper separator.
• Connections needed:
• Foil tab ends to aluminum collector plates
• Plates to can and terminal ends

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  12 


Ultracapacitor Energy Storage Mechanism

• Energy storage in the carbon-carbon


ultracapacitor is a surface phenomena:
• Adsorption of solvated ions in solution to highly porous
carbon
• [Et4N+] cations diffuse to the anode

• [BF4-] anions diffuse to the cathode

• Acetonitrile solvent [CH3CN]

Graphic depiction of salt dissolving in


Water. Solvated sodium cations and
solvated chlorine anions

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  13 


Ultracapacitor Energy Storage Mechanism
• Ultracapacitor remains under charge balance:
• Solvated ions in solution accumulate under an applied
electric field to their respective electrodes.
• Non-Faradaic means no electron transfer.
• Accumulator action.
+ -

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  14 


Capacitance at the Compact Layer

• Double layer capacitance consists of adsorption layer and


diffuse layer contributions – Stern’s model. 

1 1  1 
= +
C eff  C Helm  C Diffuse 

electrode, black; solvent, blue;cation, orange, anion, red)
electrode, black; solvent, blue;cation, orange, anion, red) 

Source: B. Scrosati, M. Armand, W. Henderson, K. Lian, Capacitive Storage Science,” Basic Research Needs for
Energy Storage, meeting of the American Chemical Society, ACS, Aug. 2007. 

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  15 


Maxwell’s Ultracapacitor Cell Model
• Electrical equivalent circuit model- Maxwell’s moment matched x-line
• The three time constant model accounts for the highly distributed
effects of electrode “macro”, “meso” and “micro” pores. 

Rtran1  0.3R  Rtran2  0.2R  Rtran3  0.5R 

0.0008 Ohm 
0.4C(v)  0.44C(v)  0.16C(v)  Rsd 
560 Ohm
#  # 

C  XY_LINT2  C1  XY_LINT3 



XY_LINT1  C2 
X Y  X Y  X Y 

Macro Meso Micro

Model is available from Maxwell and will


be posted on Ansoft website for download
Simplorer V.8 library model
Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  16 
Parasitic Parameter Extraction

• Application of Ansoft Q3D to module bus bar


interconnect system
• Additional ESR and ESL component added to library
model.
• Bus bar 18 cell module

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  17 


Parasitic Parameter Extraction

• Results for Q3D parasitic extraction


Current distribution ESR and ESL versus frequency 
Ansoft Corporation  XY Plot 2  Q3DDesign_Strap 
350.00 
Curve Inf o 
ACR(Strap:Source,Strap:Source) 
300.00  Setup1 : Sw eep1 

ACR(Strap:Source,Strap:Source) [uOhm] 
250.00 

200.00 

150.00 

100.00 

50.00 

0.00 
1.00  10.00  100.00  1000.00 
Freq [kHz] 

Ansoft Corporation  XY Plot 1  Q3DDesign_Strap 


22.00 
Curve Inf o 
ACL(Strap:Source,Strap:Source) 
Setup1 : Sw eep1
21.50 
ACL(Strap:Source,Strap:Source) [nH] 

21.00 

20.50 

20.00 

19.50 

19.00 
1.00  10.00  100.00  1000.00 
Freq [kHz] 

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  18 


Seque

Model Validation

• Constant Current
• Maxwell’s Six Step Method

• Constant Power

• Simplorer v.8 Model

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  19 


Ultracapacitor Validation
• Constant current
characterization:

• Linear voltage
changes (approx)

• Constant internal
power dissipation

• Available energy is
total stored minus
dissipated energy

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  20 


Ultracapacitor Validation

• Efficiency under charge and discharge is


dependent on total pulse time (T) to fully
charge/discharge and capacitor time constant (t).
• Therefore, efficiency is SOC dependent.

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  21 


BCAP2000P MXWL Test
• Illustration of Maxwell 6-step laboratory evaluation test @ 250A
• For parameter extraction. 
Interconnect & Inductance  BCAP2000P­Cell Moment Matched X­Line Model 

R1  L_cell  Rtran1  0.3R  Rtran2  0.2R  Rtran3  0.5R 

22 nH  0.213 mOhm  0.142 mOhm  0.355 mOhm 


I1 
DAT A P AIRS1 
0.035 mOhm  0.16C(v) 
0.4C(v)  0.44C(v)  Rsd 
t  Y  #  #  # 
+  X Y1  X Y3  675 Ohm 
C  XY2  C1 
V  X Y  X Y 
C2 
X Y 
0.05 V  0.051 V 
V M1  0.051 V 

Test Profile of Bitrode


Applied to model
2000P scaled to module 

TerminalVolts 
Probe4  2.98 
250.00 
200.00 

2.00 

VM1.V...
0  DATA... 

1.00 

­250.00  ­20.00m 

0  50.00  80.00  0  50.00  80.00 

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  22 


BCAP2000P Performance Test

• Comparison of laboratory data with Simplorer model data


• BCAP2000P in 6-step test @ 250A 

Lab vs. Simulated BCAP2000P 

Simulated
Measured
2.5 
Cell Voltage

1.5 

0.5 


0  10  20  30  40  50  60  70  80  90 
time (s) 

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  23 


Constant Power Op. vs. Temperature

• Example of ultracapacitor cell under constant power


loading over temperature range -40oC to +60oC.
• BCAP2600F cell tested at 200W Constant Power

Vexp (V) ­40°C  250  I (A) ­40°C 

2.5  Vexp (V) ­30°C  I(A) ­30°C 


200 
Vexp (V) 20°C  I(A) 20°C 
V o lta g e  (V ) 

C u rre n t (A ) 
2.1  150 
Vexp (V) 60°C  I(A) 60°C
1.7  100 

1.3  50 

0.9  0 
0  10  20  30  40  0  10  20  30  40 
Time (s)  Time (s) 

Source: G. Alcicek*, H. Gualous*, R. Gallay**, J. M. Miller**, A. Miraoui*, “Supercapacitor constant power discharge and
thermal behavior,” * L2ES Laboratory UTBM-UFC, Bat F-UTBM Rue Thierry-Mieg 90010 Belfort, France,
Hamid.gualous@univ-fcomte.fr, ** Maxwell Technologies Rgallay@maxwell.com , Jmiller@maxwell.com 

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  24 


Constant Power Operation
• Analytical versus Experimental results for BCAP2600F at
P=200W 2 
dQ ö Q  dQ  1  & P 0 
• Solution of:  ESR æ 
ç ÷ + = P  & 2
U c +  U c U c  + = 0 
è dt  ø C  dt  t tC 0 


Vexp 
2.5 
Vsim
Voltage (V) 

1.5 

0.5 


0  10  20  30  40  50 
Time (s) 

Source: G. Alcicek*, H. Gualous*, R. Gallay**, J. M. Miller**, A. Miraoui*, “Supercapacitor constant power discharge and
thermal behavior,” * L2ES Laboratory UTBM-UFC, Bat F-UTBM Rue Thierry-Mieg 90010 Belfort, France,
Hamid.gualous@univ-fcomte.fr, ** Maxwell Technologies Rgallay@maxwell.com , Jmiller@maxwell.com 

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  25 


Simplorer v.8 Model

• Electronic equivalent circuit library model of the carbon-


carbon ultracapacitor.
Uc 
n(out) 
• Icon n(+) 
Top 

n(­) 
n(out) 
UltracapacitorCell/Module  P 
BoostCAP2600 

• Scalable cell to module model


• V.8 is designed to handle models of this complexity (i.e., scalable) 

Bo ostCAP 2600F Ce ll Mome nt Matche d Mode l 

ExternalTe s t  Inter connects  & Ind uc t 


Apparatus Rwire  L mo d  Rt ran 1  0.3R  Rt ran2  0.2R  0.5R 
Rtran3 

0.0002 O hm  17 nH 


0.4C ( v)  0.414C (v)  0.16C (v) 
#  #  #  Rsd 
­2 50 A  + 
I1  C  X Y_LINT 2  C1  C2 
V  X Y_LINT 1  XY _LINT 3 
X Y  2.85 V  XY  2 .85 V  X Y  2 .85 V  5 50 Ohm 
V M 1 

2600F  Scaled to Module Level 

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  26 


Simplorer v.8 Model
BOOSTCAPxxxx(E,P)  Description 

• User friendly input Ns 

Np 
1.0 

1.0 
#, cells in series string.  This input sets the operating 
voltage for cell (=1.0) or module (= #) 
#, strings in parallel.  Default is (=1.0) 

template for cell or top 


Uco 
Value 
Value 
Hours, operating time (hours or cycles ?) 
V, initial condition on model capacitances =Ns*Umx 
default value.  Sets Umx criteria for cell/module.  Gets 

pack simulation. Ta  20 


applied to each internal nonlinear capacitance element 
C(U).  User specifies or default is =Ns*Umx_cell 

C, ambient temperature used as internal constant. 

Top  Value  C, calculated internally as default or reset by user. 
• User access to non- hc  tbd  Area specific thermal resistance coefficient ( o C/m 2 W). 
Modifies Rth = hc*Sa thermal resistance term where Sa 
shaded parameters = cell area is default setting.  User must input to 
accommodate module. 
AgeR  1.0  Range, 1.0< gR  <2.0 for BOL to EOL age 
• Shaded block characterization for ESR determining parameters 
Rtran1,2,3(T,t).  Need test data applicable to each cell 
type.  Rtran1,2,3(T,t) parameters couple to thermal model. 
parameters are AgeC  1.0  Range, 1.0> gC  >0.8 for BOL to EOL age 
characterization for each C(U) nonlinear table. 
internal to the model. AgeRsd  1.0  Range is TBD for natural decay parameter, Rsd(T,t). 
Parameter Rsd(T,t) couples to internal thermal model 
that runs concurrently with electrical model. 
Rwire_mod  100  uW, nominal for high quality cell interconnect.  This 
value appears in the scaled model when Ns>1.  Value 
to be updated using Q3P parasitic extration tool. 
• Electrical and thermal Rsd  520  Ohm, nominal for 2.7V and 5.2mA natural decay. 
Parameter is temperature (T) and operating time (t) 
dependent.  MXWL team must agree on what 
parameters are constitutes “time”.  Can use operating hours or # cycles. 
Lmod  17  nH, nominal for cell of MC family size.  This is the 
modeled.  parasitic inductance of the interconnects/bus bars. 
Value to be updated using Q3P parasitic extration tool. 
Umx  2.7  V, max cell potential.  Manufacturer specified value. 
Uc_TLU  2.7  V, C(U) table look up scaling according to Ns.
g 0.00173  1/ o C, electronic and ionic temperature coefficient 
R(T)  Value  Moment matched value –specific to component name 
and manufacturer specified. 
C(U)  TLU  Moment matched TLU – specific to component name 
and manufacturer specified. 
Sa  Value  Cell specific area manufacturer specified (m 2 ).  Used 
with hc for internal thermal model to obtain Top. 
Cth  Value  Cell thermal capacity (J/kg­K), composite material 
specific heat used internally by thermal model.

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  27 


Simplorer v.8 Model

• Output table
• These outputs are sufficient to compute efficiency, SOC and stored
energy.
• All resistive elements couple to companion thermal model via calculated
power dissipation at each time step 

Pdisp  W  Total internal power dissipated = Sum(Ix 2 *Rx), x=1,2,5 

Top  C  Modeled  cell/module  operating  temperature  based  on 
specified  ambient Ta  and  thermal  parameters.    Top is 
directly available as an output 
Q  Coul  Charge at the operating potential Uc and time step 
Uc  V  Terminal voltage 
Ic  A  Terminal current

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  28 


Seque

Applications

• Recuperator System

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  29 


Micro­Hybrid System: Audi 

•  Exemplar for recuperative systems 

14V 
G  Consumer 

DC 
DC 

<2000W 
The advantages in terms of fuel 
Ultracaps  reduction are shown in the following 
~32V / 70F  data, resulting from measurements 
on basis of an Audi A4 with a 2 lit 
12 V  engine: 
Battery  City: 0.56 l/100 km 
Highway:0.23 l/100 km 
BAB:  0.17 l/100 km 
NEFZ:  0.22 l/100 km
Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  30 
Segue

• Future Trends in Ultracapacitor Development


• Improving performance and quality
• Driving cost out

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  31 


New Technology Development
• Ultracapacitor capability improvements
• Increase current collector foil thickness
• Higher conductivity electrolyte
• Increase electrode reactive area
• Researching new materials
• New chemistries 

Ultracapacitor P&E Evolution 
Energy 

Power
Specific Energy, Power 










1996  1998  2000  2002  2004  2006  2008 
Year 

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  32 


On the Horizon

• Ordered structures
• Binder free electrodes
• Higher power & energy

• Carbon Nanotube
From: B. Scrosati, M. Armand, W. Henderson, K. Lian, Capacitive Storage
Electrode structure: Science,” Basic Research Needs for Energy Storage, meeting of the American
Chemical Society, ACS, Aug. 2007.
• Vertically aligned CNTs
• High tube density: 1012 - 1013 CNT/cm2
• Nanometer spacing and diameter
• Tube length: 100 - 300  μm
• Dimensions comparable to chemical
lattice
Carbon nanotube active layer
• Binder free active layer 100 μm
• E~ 30->60 Wh/kg
Source: Joel Schindall, “Concept and Status of Nano-Sculpted Capacitor Battery,” 16th Annual Seminar on
Double Layer Capacitors and Hybrid Energy Storage Devices, Deerfield Beach, FL, 4-6 Dec. 2006

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  33 


Maxwell Ultracapacitor Components 
Elements of the 
BCAP3000 Cell 

Top Current 
Bottom Current  Collector­ weld 
Collector –  to foil tab 
Jelly-roll electrode
weld to foil tab  assembly

Bottom Current Collector  Lid – weld to 
Welds to Inside of Can collector 

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  34 


Active Parallel Configuration

• Ultracapacitor energy flows controlled via energy


management strategy to minimize battery cycling
• Dc-dc converter efficiency at 96%
• Ultracap efficiency must remain >95%
• Converter plus ultracapacitor branch should maintain >92%
• Relative to matched load: 0.4PML for 1s, 0.25PML for 2s, 0.1PML for 8s 

Active Parallel HESS 
CP Efficiency 3000F UC (0.1, 0.25, 0.4Pml) 
1.00 

0.90 
Batt  Power  0.80 
Electronic 
Eff

Converter  0.70 

0.60 

0.50 
DLC 
0.40 
"ultracapacitor" 
0.00  2.00  4.00  6.00  8.00  10.00  12.00  14.00  16.00 
Time, s 

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  35 


Ultracapacitor Model for Active Parallel
• Maxwell ultracapacitor cell model scaled to full pack.
• Parasitic extraction using Ansoft Q3P
• Bus bars contribute to pack ESR and ESL
• Configure for 300V operation as single string:
• 112 cells with over voltage management electronics 

Interconnects and induct  BoostCAP0650 (New) Cell M oment Matched Cell Model 

Rwi re  Lm od  Rtran1  0.3R  Rtran2  0.2R  Rtran3  0.5R 

15 nH  0.52 mOhm  0.347 m Ohm  0.867 m Ohm


0.15 mOhm  Rsd 
0.16C(v) 
0.4C(v)  0.44C(v) 
­75 A  #  #  # 
+  XY1  XY3 
I1  C  XY2  C1  C2 

X Y 
2.75 V  X Y  2.75 V  X Y  2.7 5 V  560 Ohm 
VM1 

650F Scaled to Module Level 

Illustration of Maxwell cell integration high


voltage pack with over voltage management

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  36 


Lithium Ion Model
• Electronic model scaled from Sony 18650 cell
• Single or two time constant model of double layer and diffusion
kinetics.  Nyquist Plot 
10.50u 

VM1.V (imaginary) [V] 
C dl 
5.00u  VM1.V...

i(t) 
R i (SOC,T)  68.00n 
926.90u  940.00u  950.00u  959.20u 

R e (SOC,T)  U Li (t) 

1s x 21p module of 18650’s 

E(SOC,T,t)  C_dl  84 F 


AM1 
0 V 

R_ionic  DATAPAIRS1
R_elec  1.9 mOhm  + 
VM1  I_10C  Y t 

3.81 mOhm 

E_lithiumIon 

4.2 V 

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  37 


Cell/pack Power Loss Survey
• Pulse characteristics of ultracapacitors and lithium are
significantly different.
• Ultracapacitor ladder network holds internal losses ~ constant
• Lithium voltage source plus RC network losses increase with time.
• Consequently manufacturers specify 200ms/1s and 10s power 

Power Dissipation Comparison 
30000 

25000 
Power (W), Energy (J)

20000 

15000 

10000 

5000 


0.0  0.5  1.0  1.5  2.0  2.5  3.0  3.5 
­5000 

time (s) 

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  38 


Investigation of Hybrid Energy Storage
• Quest for decoupled power and energy components
• High pulse power for short duration (<10s) at high effiicency (>95%)
• High energy for sustained draw (>20s) at low rate (<C/3) for high
efficiency (>92%) à lithium-ion energy optimzied.
• Affordable, compact, bidirectional interface dc-dc converter. 
Cap_Input_V&I 
30.00 

20.00 
R_ESR.I [A] 
C1.V [V] 

C1.V [V] 
R_ES...

10.00 
Ib     U b      I L 
Cdl 

Energy M anagem ent Supervisory 
0  20.00m  35.00m 
Controller 
Ri(SOC,T) 
H1 
Uc         Ic 
Re(SOC,T) 

Ruc3  Ruc2  Ru c1  L bb 

+Uo  E(S OC,T,t) 


+Uo  +Uo 
H2  Ac­Drive 
Cuc3(U)  Cuc2(U)  Cuc1(U)  Bu ck­boost  M otor Load 
Rsd 
dc­dc converter 

Ultracapacitor Pack  Lithium­ion Pack 

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  39 


Maxwell Technologies 
The Ultracapacitor Company

Thank You!

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  40 


References

• John M. Miller, Electrical and Thermal Performance of the Carbon-carbon Ultracapacitor Under
Constant Power Conditions, IEEE Vehicle Power and Propulsion Conference VPPC2007, Arlington,
TX, 9-12 Sept. 2007

• Lijun Gao, Shengyi Lia, Roger A. Dougal, “Dynamic Lithium-ion Battery Model for System Simulation,”
IEEE Transactions on Components and Packaging Technology, Vol. 25, Nr. 3, Sept. 2002

• Marius Rosu, John M. Miller, Uday Deshpande, “Parameter Extraction for ultracapacitor High Power
Modules,” to be presented at Power Electronics Technology Conference, PET2007, Dallas, TX., 30
Oct. 2007

Ultracapacitors  l  Microelectronics  l  High­Voltage Capacitors  Slide  41 

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