2016 Electrical Insulation Conference (EIC), Montréal, Qc, Canada, 19 - 22 June 2016

Experiences with Resin Rich Mica Taping Materials

Nancy E. Frost, Ph.D. and Miles Williamson G. Harold “Hal” Miller
Gerome Technologies Consultant
Menands, NY Clifton Park, NY
drnancyfrost@gmail.com ghalmiller@nycap.rr.com

Abstract—Resin rich mica tapes are used in the high voltage TABLE 1: RESIN RICH MICA TAPE OPTIONS
rotating equipment industry in a variety of applications, from
stator bar insulation to repair work to high voltage connections. Property A B C D E F
There are several types, and manufacturers, of these mica tapes ply 3 3 3 2 2 2
available in the market. The purpose of this paper is to share ply ply ply ply ply ply
experiences in the application and processing of common construction gmg gmg gmg gm gm gm
materials, focusing on the critical taping parameters to provide thickness, 0.29 0.19 0.18 0.18 0.25 0.25
consistent performance of the insulation material, specifically for mm mm mm mm mm mm mm
jumpers and connections. Comparisons will be made of several thickness, 11.5 7.5 7.0 7.0 10.0 10.0
products regarding base properties such as thickness, mica and mil mil mil mil mil mil mil
resin content, lay-down, cure schedule, flow and functional glass, g/m2 91 23 23 33 23 49
properties and critical processing parameters of these mica tapes mica, g/m2 150 120 120 120 250 180
will be discussed. glass, g/m2 33 23 23
resin content 40% 38% 42% 40% 30% 37%
Keywords—mica tape, resin rich, RR, groundwall, insulation,
jumpers, connection bars, high voltage.
jumpers and connection bars. In this table, “ply” means the
number of layers, “gm” means glass-mica construction and
I. INTRODUCTION
“gmg” means glass-mica-glass. One can see that there are a
Groundwall insulation serves to electrically isolate the variety of constructions available, and each has unique binder
stator bar copper from the magnetic stator core. There are two resin chemistries. Three of these products were investigated
main methods of curing the applied mica tape that comprises for this study, and those differences in binder chemistry
the groundwall: vacuum pressure impregnation (VPI) or resin proved to be critical to processing for jumper and connections.
rich (RR). These two processing techniques differ in methods
to obtain compaction and fill of the mica groundwall. For the In general, these tapes are produced with epoxy resin.
VPI process, the resin is pushed into the mica tape and cured, Since the tapes are resin rich, or pre-impregnated, there is no
whereas the RR system has excess resin in the mica tape, requirement for impregnation tanks or use of large quantities
which is squeezed out and cured. Both systems end up with of resin on the manufacturing shop floor. This is a benefit for
well-consolidated groundwall insulation when properly locations that perform only periodic processing of mica tape
processed. Utilization of the resin rich material and processing insulated copper. Resin tanks take space and also age
is said to produce a denser structure with higher mica content regardless of how often they are used. Due to the high resin
and superior electrical performance and mechanical strength. content in the mica tapes, sometime interleaving material is
This paper will discuss details about resin rich mica tapes, used to keep the layers of the mica tape from blocking, but
both materials and processing, as well as sharing experiences this is not always necessary, as some of the resin rich tapes in
with taping high voltage connection bars. the market are processed in such a manner as to have low
chance of blocking.
II. MATERIALS
There are several major mica tape manufacturers in the III. PROCESSING
industry, with their own resin rich mica tapes [1-3], each of The goal of methods of processing mica tape is
which have unique chemistry and process parameters. Yet reproducible, well-consolidated groundwall insulation
they have common parameters as well, having a mica paper, a systems. This can be achieved by applying pressure to the
reinforcing material such as glass, polyester non-woven or mica tape along with heat to cure the resin. This can be in a
polyester film backing as well as an excess amount of resin heated press, or by applying pressure to the sample while
(also known as binder or binder resin). heating it in an oven.

Table 1 is a summary of typical resin rich mica tape The basic processing steps [4] are:
materials with glass carrier. There are film-backed options, but
these were not investigated for the use as insulation of copper 1. Apply half-lapped layers of mica tape to the copper.

978-1-4673-8706-4/16/$31.00 ©2016 IEEE 1

Authorized licensed use limited to: Universidad del Valle. Downloaded on August 10,2023 at 15:17:33 UTC from IEEE Xplore. Restrictions apply.
 (The number of layers depends on the voltage of the
copper.)
2. Use ¼ indexing between mica layers. (This means
the next layer is shifted ¼ from the layer beneath it.)
3. Apply one layer of half-lapped shrink release film
over the mica layers.
4. Place copper with mica and release film into a hot
press at the prescribed temperature and apply
pressure and additional heating for the scheduled
time. (Use Tedlar® or other release layer in the press
as needed.) Pressure needs to be uniformly applied
across the piece and over the length of the part. In
addition, uniform pressure needs to be applied from
run to run for consistency.
5. After removal from the press, post cure the bar in an
oven at the required temperature, for the specified
time. If possible, leaving the part in the press for the
full cure, including post-cure time is optimal. Simply
not always economically feasible.
6. Remove bar from the oven and allow it to cool.
7. Remove the shrink release film.
Note: Some people remove the film before the post cure
Figure 1: Example of resin rich cure schedule
2
Authorized licensed use limited to: Universidad del Valle. Downloaded on August 10,2023 at 15:17:33 UTC from IEEE Xplore. Restrictions apply.
operation. This depends on the degree of cure of the system
after press.
Fig. 1 is a graphical depiction of the resin rich mica tape
curing process as process temperature versus time in the press.
The key parameters are proper heating time as well as
appropriate cooling ramp down.
For example, the copper is placed into the press when it
comes to temperature “A” at time 0, the start of the graph. The
resin is allowed to warm and begin flowing in the insulation.
Then the temperature is allowed to increase until temperature
“B” is reached, and the full pressure is applied at Time 1. The
resin is soft and able to move, so the pressure fills the voids,
and excess is squeezed out.
Further increase to temperature “C”, typically 160C or
170C, at Time 2 is the next stage, where the binder resin
begins to gel. This temperature (160-170C) is held until Time
3, during which the resin is begins to gel and cross link,
becoming more solid.
At Time 3, the system is allowed to cool until it gets below
a critical temperature (often 60C) at which point the resin
should be sufficiently cured so that no voids will form upon
the release of pressure. The part is then post cured. This post
cure temperature is at least 10C less than the press temperature
used. Post cure, for several hours, allows stronger cross-
linking of the binder in the groundwall.
 IV. CRITICAL PARAMETERS
The resin rich mica tape material and processing appears to
be quite simple. But this is not the case, as there are many
subtleties to the processing. These will be reviewed in this
section.
A. Type of mica tape
The type of mica tape should be matched to the application.
There are resin rich tapes that are tacky and sticky, which hold
their position well when taping. And there are drier tapes that
process differently since they are not as tacky, yet the binder
chemistry is such that the resin flows at initial processing
temperature.
Depending on the application, the glass-mica-glass resin
rich tape can be utilized, as the resin moves between layers
more readily through the mica and glass. Other applications
are served better through the use of film-mica resin rich tape,
where the binder serves to glue the system together. The mica
gives the long term electrical performance, while the film
provides green coil breakdown strength. This type of tape was
not part of this program.
B. Mica tape storage
These resin rich mica tapes are heavy with resin, which is
b-staged, or partially reacted. They should be stored in a
freezer for the best shelf life, as this inhibits the continued
chemical reaction. Most of the tapes on the market are viable
for 12 months when stored 4C, but only 4-6 months if kept at
room temperature. One should be sure to use a first in, first out
stock management program, so as to avoid having “old” tape
on the shelf. Tape that is outside the shelf life might be re-
certified for use, but while the reactivity may be suitable for
application and cure, the tape may be stiff and board-like and
hard to apply to the copper part. Some of the tapes in the
industry can also separate on application if they are too old.
C. Mica tape application
Care needs to be taken that the mica tape is applied to the
copper in such a manner at to have the consistent half-lapping
during the application of the layers of tape, as well as quarter
indexing between mica layers. Taping in the corners of a bar
with bends requires careful attention to be sure both the inner
and outer radii of the curves get adequate coverage. In
addition, the layering of the mica, without excessive
wrinkling, is critical to avoid the formation of voids and
pockets of resin pools.
D. Mica tape temperature
Generally, resin rich mica tape should be cold stored to
extend its shelf life. Care must be taken to allow the tape to
uniformly come to room temperature in the original packaging
prior to application. This is not only to have softer tape for
application, but to avoid condensation on the tape as it warms.
3
Authorized licensed use limited to: Universidad del Valle. Downloaded on August 10,2023 at 15:17:33 UTC from IEEE Xplore. Restrictions apply.
Figure 2: Mica taped jumper
Some locations gently heat the mica tape before or as it is
applied as this softens the tape and allows it to more readily
conform to the bar. For the taping of connection jumpers,
heating the copper prior to tape application can make it easier
to apply the tape, especially to angles on the jumper or
connection bar.
E. Chemistry of binder
The cure schedule to be used for the mica tape depends
primarily on the chemistry of the binder. There is a delicate
balance between the reactivity of the binder at temperature
and the viscosity of the resin at that temperature. One wants to
get the binder to soften and flow sufficiently to fill the voids in
the system, but not flow out of the insulation excessively. And
one wants the resin to crosslink quickly enough to stay in
place, but not so quickly that it gels and locks out the resin in
adjacent layers from flowing and filling the groundwall. This
is why experiments must be performed to confirm that the
cure schedule parameters (temperature, pressure and time) are
correct for the tape and the part, as well as for the
manufacturing capabilities. Remember the copper cross-
section serves as a heat sink, cooling the part during the cure
schedule, so the mass (and cross-section) of the copper can
influence the degree of cure significantly.
V. EXPERIENCE ON JUMPERS
The use of resin rich mica tapes as electrical insulation for
jumpers was the purpose of these experiments. This section
will discuss our observations.
Fig. 2 is a photograph of an angled jumper with multiple
layers of mica tape applied. This figure shows that the half-lap
application was generally maintained around the corner. Once
the mica tape has been applied, shrink release tape, a process
aid, is placed over the mica, as shown in Fig. 3.
Fig. 4 and 5 are photographs of fully cured angled jumpers
with two different mica tape candidates, noted as mica tape
 Figure 3: Mica taped jumper with shrink release tape
“x” and “y”. It is interesting to note that the type of mica used
cannot be determined by visual inspection of the fully cured
component. These two images also show different
configurations of the copper base for jumpers and connection
bars. Some configurations also have three dimensional bends
in the copper, which are challenging for applying the mica
tape.
Four of the candidate tapes were assessed for application as
jumper and connector insulation for hand taping operations.
These tapes ranged from sticky and gooey to dry to the touch.
In application, the gooey tape actually came apart, in part due
Figure 4: Mica tape type “x” on copper jumper
to the operator pulling too hard on the tape. When less tension
was used for application, it laid down nicely, even in the
corners. Unfortunately the stickier tapes had excessive flow on
cure, whereas the dry tape had less flow on cure, as expected.
Selection of tape for application is operator and end use
dependent. For some, the extra flow of the sticky tape is an
acceptable trade-off for ease of application, whereas others
prefer a drier tape for precision application. There are a couple
tapes on the market that lie between these extremes in
tackiness and flow on cure. It is the recommendation of the
4
Authorized licensed use limited to: Universidad del Valle. Downloaded on August 10,2023 at 15:17:33 UTC from IEEE Xplore. Restrictions apply.
Figure 5: Mica tape type “y” on copper connection bar
authors to experiment with the tapes to determine which
works best in the users manufacturing and operational
environments. Additional studies, as to the electrical
performance differences in these tapes, are planned.
VI. CONCLUSION
The use of resin rich mica tapes as groundwall insulation
on stator bars has been used for decades. This technique is
also similar for insulation on connections and jumpers for high
voltage applications. There are several different types of resin
rich tapes available in the market, each with their own unique
chemistry and handling characteristics. These unique
chemistries require careful attention to their specific cure
schedule, so as to properly cure the resin binder in place
without gelling too early, but also without gelling to slowly
and running out of the insulation. The timing and pressures
for the cure schedule are a delicate balance. Add the unique
structure of a jumper, with tight radius bends, it can be seen
that it requires careful attention to the taping process as well,
to obtain adequate coverage of the entire copper. The goal of
the application of the resin rich mica tape to the jumper or
connection copper is to provide a well-consolidated
groundwall insulation system. Selection of the correct type of
resin rich mica tape and the processing (cure) conditions of
the mica tape are critical to achieving this goal.
REFERENCES
[1] Data pages for IsoVolta resin rich mica tapes
[2] Data pages for Krempel resin rich mica tapes
[3] Data pages for Von Roll resin rich mica tapes
[4] AC Insulation Systems Handbook, IMF-228B 1-87, GE/Von Roll
[5]Helgeson, A., Gafvert, U., “Dielectric response during curing of a resin-
rich insulation system for rotating machines,” 1999 Annual Report
Conference on Electrical Insulation and Dielectric Phenomena, pp. 289-292.
[6] Wacker, T. P., Miller, G. H., Cousins, D. L., “Solventless mica tapes for
press cure,” 1995 Electrical Insulation Conference and Electrical
Manufacturing & Coil Winding Conference, pp. 589-591.