Integrated Circuit Technology

EEL7500

Course Instructor:
Prof. Ajay Agarwal and Dr. Swati Rajput
Department of Electrical Engineering
 Course Contents
• Introduction to Integrated Circuits
• Introduction to fabrication of IC: Details about Cleanroom Facilities
• Substrates and their Preparation
• Diffusion and Ion Implantation for Doping
• Oxidation Process : Thermal Oxidation and PECVD (Plasma Enhanced Chemical Vapor Deposition)
• Growth and Deposition Process ➔ Physical and Chemical Vapor Deposition
• Lithography➔ Photolithography and Electron-beam Lithography➔ Photoresist, E-beam Resists and
Photomasks
• Diffusion and Ion Implantation for Doping
• Etching ➔ Dry and Wet Etching
Hands on Experience will also be
• Metallization provided in AIoT Lab, IIT Jodhpur
• Process flow for Fabrication of MOSFETs
 Capacitor
Resistor

Diode Integrated Circuit

• IC is a miniaturised low-cost electronic circuit consisting of active and passive components fabricated together
on a substrate (Silicon).

• Active components: Diode and Transistor

• Passive components: Resistor, Capacitor, Inductor
• Miniaturization and hence increased equipment density
• Batch processing resulting in cost reduction
• Improved system reliability due to elimination of soldered joints
• Better functional performance
• Matched devices
• Increased operating speeds
• Significant reduction in the power consumption

• Small Scale Integration (SSI): 3 to 30 gates per chip

• Medium Scale Integration (MSI): 130 to 300 gates per chip
• Large Scale Integration (LSI): 300 to 3000 gates per chip
• Very Large-Scale Integration (VLSI): more than 3000 gates/chip
Si Wafer
Linear Integrated Circuits (Op-amps) Digital Integrated Circuits (Computer and
Logic Ckts.

The circuit is either in on-state or off-state

The relationship between the input and
and not in between the two
output of a circuit is linear