Solid State Drive HG6 Series 3 Generation: Key Features

Stable Writing Version
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Solid State Drive HG6 Series 3 Generation
Key Features
• Hot-Plug/OS-Aware Hot Removal HG6 Series 3rd Generation

• ClickConnect (a latch solution for internal cabled system application)
supported (2.5-inch only)
• Deterministic Zeroing TRIM supported
• SED model supports TCG OPAL ver. 2.0 and Wipe Technology based
on AES 256 hardware
• WWN (World Wide Name) supported
• Strong & highly-efficient ECC named QSBCTM *1
• Serial ATA DIPM (Device Initiated Power Management), HIPM (Host
Initiated Power Management) and Device Sleep are supported for
reduced power consumption
• Read only mode supported for emergency M.2
2.5-inch case
NOTE:*1) QSBC is a trademark of Toshiba Corporation
(7.0mm)
Applications
• PC applications and others
Specifications and Features
Form Factor 2.5-inch M.2 2280-D2
(7.0 mmH) (Double-sided)
Connector Type Standard SATA M.2 B-M
Memory TOSHIBA MLC NAND Flash Memory
*1
Interface ACS-2, SATA revision 3.1 1.5/3/6 Gbit/s
*1
Capacity 128/256/512/1024 GB 128/256/512 GB
*1*2
Performance Sequential Read: up to 534 MB/s{510 MiB/s}
Sequential Write: up to 482 MB/s{460 MiB/s}
Supply Voltage 5.0 V ±5 % 3.3 V ±5 %
Power Active: 3.0 W typ. Active: 3.0 W typ.
Consumption Idle: 125 mW typ. (128/256/512 GB) Idle: 65 mW typ.
Idle: 260 mW typ. (1024 GB)
Temperature Operating: 0 °C - 70 °C Operating: 0 °C - 80 °C
(case temperature) (components temperature)
Non-operating: -40 °C – 85 °C Non-operating: -40 °C – 85 °C
2
Shock 14.7 km/s {1500 G} at 0.5 ms
2
Vibration Operating / Non-operating: 196 m/s {20 G} at 10-2,000 Hz
Reliability Mean Time to Failure (MTTF): 1,500,000 hours
Product Life: Approximately 5 years
Size 100.0 mm x 69.85 mm x 7.0 mm 80.0 mm x 22.0 mm x 3.58 mm
Weight 49 - 54 g typ. 7.0 - 7.6 g typ.
More Features ・ Translation mode which enables any drive configuration
・ 28-bit LBA mode commands and 48-bit LBA mode commands support
・ Automatic retries and corrections for read errors
・ NCQ (Native Command Queuing) function supported
Compliance UL, CSA, TÜV, KC, BSMI, CE, RCM
*1) 1 MB = 1,000,000 bytes, 1 GB = 1,000,000,000 bytes, 1 Gbit = 1,000,000,000 bits
*2) 1 MiB (mebibytes) = 220 bytes = 1,048,576 bytes
Products and specifications discussed herein are for reference purposes

only and are subject to change without notice. All information discussed
herein is provided on an “as is” basis, without warranties of any kind. Copyright © 2015 Toshiba Corporation. All rights reserved.
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Before creating and producing designs and using, customers must refer to Solid State Drive HG6 Series 3 Generation Product
and comply with the latest versions of the product specifications. Brochure Rev. 1.0.0
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Solid State Drive HG6 Series 3 Generation Product Brochure Rev.1.0.0
Ordering Information
THN SX X XXXX X X X
1 2 3 4 5 6 7
1. Model Name THN: Toshiba NAND drive

2. Model Type SN: Non-SED, SF: SED
3. Controller Type J: Type J
4. Capacity 128G / 256G / 512G / 1T02 …
128G is 128 GB, 256G is 256 GB, 512G is 512 GB and 1T02 is 1024 GB
(1 GB = 1,000,000,000 bytes)
5. Form Factor C: 2.5-inch case (7.0 mm height),
8: M.2 2280 Module type
6. Host I/F Type S: Standard SATA, N: M.2 B-M SATA type
7. NAND Type Y: MLC
Copyright © 2015 Toshiba Corporation. All rights reserved.

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Product Line up
Product Number Capacity Form Factor Note
THNSNJ128GCSY 128 GB Non-SED
2.5-inch 7.0 mm case
THNSNJ1T02CSY 1024 GB Non-SED
THNSNJ128G8NY 128 GB Non-SED
THNSNJ256G8NY 256 GB M.2 2280 module Non-SED
THNSNJ512G8NY 512 GB Non-SED
THNSFJ128GCSY 128 GB SED
2.5-inch 7.0 mm case
THNSFJ1T02CSY 1024 GB SED
THNSFJ128G8NY 128 GB SED
THNSFJ256G8NY 256 GB M.2 2280 module SED
THNSFJ512G8NY 512 GB SED

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Contents
Ordering Information ................................................................................................................................................. 2
Product Line up .......................................................................................................................................................... 3
Contents..................................................................................................................................................................... 4
1. General Description ........................................................................................................................................... 5
2. Product Specifications ....................................................................................................................................... 5
2.1. Capacity ..................................................................................................................................................... 5
2.2. Performance .............................................................................................................................................. 5
3. Electrical Characteristics .................................................................................................................................... 6
3.1. Supply Voltage ........................................................................................................................................... 6
3.2. Power Consumption .................................................................................................................................. 6
4. Environmental Conditions ................................................................................................................................. 7
4.1. Temperature and Humidity ........................................................................................................................ 7
4.2. Shock and Vibration ................................................................................................................................... 7
5. Compliance ........................................................................................................................................................ 8
6. Reliability ........................................................................................................................................................... 8
7. Mechanical Specifications.................................................................................................................................. 9
7.1. 2.5-inch Case (7.0 mm) .............................................................................................................................. 9
7.2. M.2 2280 Module .................................................................................................................................... 11
8. Interface Connector ......................................................................................................................................... 12
8.1. 2.5-inch Case (7.0 mm) ............................................................................................................................ 12
8.2. M.2 2280 Module .................................................................................................................................... 13
9. Command Descriptions.................................................................................................................................... 15
10. Revision History ........................................................................................................................................... 19
RESTRICTIONS ON PRODUCT USE ............................................................................................................................ 20

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1. General Description
The TOSHIBA SSD HG series is a memory storage device using NAND Flash Memories, which has no mechanical
moving parts and provides high performance and reliability compare to Hard Disk Drive.
The drive features an ACS-2 and Serial ATA revision 3.1 interface embedded controller that requires a simplified
adapter board for interfacing to a Serial ATA or Serial ATA compatible bus. The drive is distinctive for its small and
light body.
2. Product Specifications
2.1. Capacity
Table 2-1. User Addressable Sectors in LBA Mode
Capacity Total Number of User Addressable Sectors in LBA Mode
128 GB 250,069,680
256 GB 500,118,192
512 GB 1,000,215,216
1024 GB 2,000,409,264
NOTE: 1 GB (Gigabyte) = 1,000,000,000 bytes
Bytes per sector: 512 bytes
2.2. Performance
Table 2-2. Interface Speed and Data Transfer Rate in Read/Write
Parameter Transfer Rate
THNSNJ128GCSY THNSNJ256GCSY THNSNJ512GCSY
THNSNJ128G8NY THNSNJ256G8NY THNSNJ1T02CSY
THNSNJ512G8NY
Interface Speed 6 Gbit/s Max.
*1
Sequential Read up to 534 MB/s {510 MiB/s}
*1
Sequential Write up to 178 MB/s up to 335 MB/s up to 482 MB/s
{170 MiB/s} {320 MiB/s} {460 MiB/s}
NOTE: *1) Under the condition of measurement with 128 KiB unit sequential access
(1 KiB = 1024 bytes)

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3. Electrical Characteristics
3.1. Supply Voltage
Table 3-1. Supply Voltage
2.5-inch Case(7.0 mm) M.2 2280 Module
Allowable voltage 5.0 V ±5 % 3.3 V ±5 %
Allowable noise/ripple 100 mV p-p or less
Allowable supply rise time 2 –100 ms
NOTE: These drive have over current protection circuit. (Rated current: 3.15A)
3.2. Power Consumption

Table 3-2. Power Consumption in 2.5-inch Case Type
Operation 2.5-inch Case7.0 mm)
(Ta *1=25°C) THNSNJ128GCSY THNSNJ256GCSY THNSNJ512GCSY THNSNJ1T02CSY
Read *2
2.1 W typ. 2.5 W typ. 2.9 W typ. 2.8 W typ.
Write *2 2.2 W typ. 2.6 W typ. 3.0 W typ. 3.0 W typ.
Idle *3 *4 125 mW typ. 125 mW typ. 125 mW typ. 260 mW typ.
Standby *3 *4 120 mW typ. 120 mW typ. 120 mW typ 260 mW typ
Sleep *3 120 mW typ 120 mW typ. 120 mW typ 260 mW typ
DevSleep 5 mW max. 5 mW max. 5 mW max. -
Table 3-3. Power Consumption in M.2 2280 Module Type

Operation M.2 2280 Module
(Ta *1=25°C) THNSNJ128G8NY THNSNJ256G8NY THNSNJ512G8NY
Read *2
2.1 W typ. 2.5 W typ. 2.9 W typ.
Write *2
2.2 W typ. 2.5 W typ. 3.0 W typ.
Idle *3 *4
65 mW typ. 65 mW typ. 65 mW typ.
Standby *3 *4
Sleep *3
DevSleep 5 mW max. 5 mW max. 5 mW max.
NOTE:
*1) Ambient Temperature.
*2) The values are specified at the condition causing maximum power consumption.
*3) The values are based on using SATA power management features. The Slumber mode is used for the
power consumption measurements.
*4) The drive may internally write to NAND flash memory, while the drive is in idle or standby.
Therefore, drive power consumption may temporally change up to write power.

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4. Environmental Conditions
4.1. Temperature and Humidity
Table 4-1. Temperature
Condition Range Gradient
2.5-inch Case M.2 2280 Module
*1
Operating 0 °C (Tc) – 70 °C (Tc) 0°C (Tc) – 80°C (Tc) 30 °C (Ta)/h Max.
Non-operating -40 °C – 85 °C 30 °C/h Max.
*2
Under Shipment -40 °C – 85 °C 30 °C/h Max.
NOTE: *1) Ta: Ambient Temperature, Tc: Case or Components Temperature
*2) Packaged in Toshiba’s original shipping package
Table 4-2. Humidity

Condition Range
Operating 8 % – 90 % R.H. (No condensation)
Non-operating 8 % – 95 % R.H. (No condensation)
Under Shipment *1 5 % – 95 % R.H.
NOTE: *1) Packaged in Toshiba’s original shipping package
4.2. Shock and Vibration

Table 4-3. Shock
Condition Range
Operating
14.7 km/s2 {1500 G}, 0.5 ms, half sine wave
Non-operating
Under Shipment *1 100 cm free drop
NOTE:
*1) Apply shocks in each direction of the drive’s three mutually perpendicular axes, one axis at a time.
Packaged in Toshiba’s original shipping package.
Table 4-4. Vibration

Condition Range
2
Operating 196 m/s {20 G} Peak, 10 - 2,000 Hz
Non-operating (20 minutes per axis) x 3 axis

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5. Compliance
TOSHIBA SSD HG series complies with the following.
Table 5-1. Compliance

Mark Name Description Region
UL
UL 60950-1 USA
(Underwriters Laboratories)
CSA
(Canadian Standard Association) CSA-C22.2 No.60950-1 Canada
*Included UL logo mark
TÜV
EN 60950-1 Germany
(Technischer Überwachungs Verein)
KC KN22
Korea
KN24
BSMI
(Bureau of Standards, Metrology and CNS13438(CISPR Pub. 22) Class B Taiwan
Inspection)
CE
EN 55022, EN 55024 Europe
RCM Australia,
AS/NZS CISPR Pub. 22 Class B
New Zealand
6. Reliability
Table 6-1. Reliability
Parameter Value
Mean Time to Failure 1,500,000 hours
Product Life Approximately 5 years

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7. Mechanical Specifications
7.1. 2.5-inch Case (7.0 mm)
Table 7-1. Weight and Dimensions
Model Weight Width Height Length
THNSNJ128GCSY 49 g typ.
THNSNJ256GCSY
7.0 mm 53 g typ. 69.85 mm 7.0 mm 100.0 mm
THNSNJ512GCSY
THNSNJ1T02CSY 54 g typ.
Figure 7-1. 2.5-inch Case (7.0 mm) Drive Dimension

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Table 7-2. Dimensions

SFF-8200 Rev2.0 *1
Toshiba SSD
SFF-8201 Rev3.3
Dimension
SFF-8223 Rev2.5 (Differences only)
Millimeters Inches Millimeters Inches
A1 7.00 0.276
A2 0.2 0.007
A3 0.50 0.020
A4 69.85 2.750
A5 0.25 0.010
*2
A6 100.45 * 3.955 * 100.00±0.41 3.937±0.016
A7 3.5 0.138
A8 9.40 0.370 9.40±0.51 0.370±0.020
*3
A10 - - 30.125±0.28 1.186±0.011
A12 0.38 0.015
A23 3.00 0.118 3.00±0.20 0.118±0.007
A26 M3 N/A
4.07
A28 4.07 0.160 0.060 +0.011/-0.012
+0.295/-0.305
A29 61.72 2.430 61.72±0.25 2.430±0.010
A32 M3 N/A
A38 3# 3#
A41 2.5 # 2.5 #
*2
A50 14.00 0.551 14.00±0.25 0.551±0.010
*2
A51 90.60 3.567 90.60±0.30 3.567±0.012
A52 *2 14.00 0.551 14.00±0.25 0.551±0.010
*2
A53 90.60 3.567 90.60±0.30 3.567±0.012
* = maximum
# = minimum number of threads
NOTE:
*1) SFF-8200: Small Form Factor Standard
*2) PCA, Connector not included
*3) Connector Center defined the same as SFF-8223 All

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7.2. M.2 2280 Module

Table 7-3. Weight and Dimensions
Model Weight Width Height Length
THNSNJ128G8NY 7.0 g typ.
THNSNJ256G8NY 7.1 g typ. 22.0 mm 3.58 mm 80.0 mm
THNSNJ512G8NY 7.6 g typ.
Figure 7-3. M.2 2280 Module Drive Dimension
Unit: mm

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8. Interface Connector
8.1. 2.5-inch Case (7.0 mm)
Figure 8-1. 2.5-inch Case Serial ATA Interface Connector
Table 8-1. 2.5-inch Case Drive Connecter Pin Assignment *1

Signal segment key
S1 GND 2nd Mate
S2 A+
Differential Signal Pair A (Device Rx), 3rd Mate
S3 A–
Signal
S4 GND
Segment
S5 B–
Differential Signal Pair B (Device Tx), 3rd Mate
S6 B+
S7 GND 2nd Mate
Signal segment “L”
Central connector polarizer
Power segment “L”
P1 Retired *2
P2 Retired *2
P3 DEVSLP *2 Enter/Exit DevSleep
P4 GND 1st Mate
P5 GND 2nd Mate
P6 GND 2nd Mate
P7 V5 5 V power, pre-charge *4, 2nd Mate
Power
P8 V5 5 V power, 3rd Mate
Segment
P9 V5 5 V power, 3rd Mate
P10 GND 2nd Mate
*3
P11 DAS/DSS Drive Activity Signal, 3rd Mate
P12 GND 1st Mate
P13 V12 12 V power, pre-charge, 2nd Mate (Unused)
P14 V12 12 V power (Unused), 3rd Mate
P15 V12 12 V power (Unused), 3rd Mate
Power segment key
U1 N.C. Not connected

U2 TX For test use, Not connected
U3 UX For test use, Not connected
U4 GND
NOTE: *1) The Mate orders are for backplane usage. Hot-Plug and OS-Aware Hot Removal are supported
when using with a backplane connector. *2) Previously, 3.3 V was assigned to pins P1, P2 and P3
by Serial ATA International Organization. *3) DAS signal is option. DSS signal is not used for this
drive. *4) Direct connect to non pre-charge pins.

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8.2. M.2 2280 Module

Figure 8-2. M.2 2280 Module Interface Connector

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Table 8-2. Pin Assignment on M.2 2280 Module Connector

Pin # Name Description Pin # Name Description
1 CONFIG_3 Defines module type(low) 2 +3.3V 3.3V Source

3 GND GND 4 +3.3V 3.3V Source
5 Reserved NC 6 Reserved NC
Drive Activity Signal /
9 Reserved NC 10 DAS/DSS
Disable Staggered Spin-up
11 Reserved NC
Notch
Notch
20 Reserved NC
21 CONFIG_0 Defines module type(low) 22 Reserved NC
27 GND GND 28 Reserved NC
37 Reserved NC 38 DEVSLP DEVSLP signal
41 B+ Host Receiver Differential 42 Reserved NC
43 B- Signal Pair 44 Reserved NC
47 A- Host Transmitter 48 Reserved NC
49 A+ Differential Signal Pair 50 Reserved NC
55 Reserved NC 56 MFG1 Manufacturing pin. Must be
a no-connect on the host
57 GND GND 58 MFG2 board.
Notch Notch
69 CONFIG_1 Defines module type(low) 70 +3.3V 3.3V Source
75 CONFIG_2 Defines module type(low)

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9. Command Descriptions
Table 9-1. Supported ATA Command Set
Op-Code Command Description
00h NOP
06h DATA SET MANAGEMENT
10h RECALIBRATE
20h READ SECTOR(S)
21h READ SECTOR(S) without retry
24h READ SECTOR(S) EXT
25h READ DMA EXT
27h READ NATIVE MAX ADDRESS EXT
29h READ MULTIPLE EXT
2Fh READ LOG EXT
30h WRITE SECTOR(S)
31h WRITE SECTOR(S) without retry
34h WRITE SECTOR(S) EXT
35h WRITE DMA EXT
37h SET MAX ADDRESS EXT
39h WRITE MULTIPLE EXT
3Dh WRITE DMA FUA EXT
3Fh WRITE LOG EXT
40h READ VERIFY SECTOR(S)
41h READ VERIFY SECTOR(S) without retry
42h READ VERIFY SECTOR(S) EXT
45h WRITE UNCORRECTABLE EXT
45h 55h Create a pseudo-uncorrectable error with logging
45h AAh Create a flagged error without logging
47h READ LOG DMA EXT
57h WRITE LOG DMA EXT
5Bh TRUSTED NON-DATA (SED model only)
5Ch TRUSTED RECEIVE (SED model only)
5Dh TRUSTED RECEIVE DMA (SED model only)
5Eh TRUSTED SEND (SED model only)
5Fh TRUSTED SEND DMA (SED model only)
60h READ FPDMA QUEUED
61h WRITE FPDMA QUEUED

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70h SEEK
90h EXECUTE DEVICE DIAGNOSTIC
91h INITIALIZE DEVICE PARAMETERS
92h DOWNLOAD MICROCODE
92h 03h Download with offsets and save microcode for immediate and future use.
92h 07h Download and save microcode for immediate and future use.
92h 0Eh Download with offsets and save microcode for future use
92h 0Fh Activate downloaded microcode
93h DOWNLOAD MICROCODE DMA
93h 03h Download with offsets and save microcode for immediate and future use.
93h 07h Download and save microcode for immediate and future use.
93h 0Eh Download with offsets and save microcode for future use
93h 0Fh Activate downloaded microcode
B0h SMART
B0h D0h SMART READ DATA
B0h D1h SMART READ ATTRIBUTE THRESHOLDS
B0h D2h SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE
B0h D3h SMART SAVE ATTRIBUTE VALUES
B0h D4h SMART EXECUTE OFF-LINE IMMEDIATE
B0h D5h SMART READ LOG
B0h D6h SMART WRITE LOG
B0h D8h SMART ENABLE OPERATIONS
B0h D9h SMART DISABLE OPERATIONS
B0h DAh SMART RETURN STATUS
B0h DBh SMART ENABLE/DISABLE AUTOMATIC OFF-LINE
B1h DEVICE CONFIGURATION OVERLAY
B1h C0h DEVICE CONFIGURATION RESTORE
B1h C1h DEVICE CONFIGURATION FREEZE LOCK
B1h C2h DEVICE CONFIGURATION IDENTIFY
B1h C3h DEVICE CONFIGURATION SET
B1h C4h DEVICE CONFIGURATION IDENTIFY DMA
B1h C5h DEVICE CONFIGURATION SET DMA
B4h SANITIZE DEVICE
B4h 00h SANITIZE STATUS EXT
B4h 11h CRYPTO SCRAMBLE EXT (SED model only)
B4h 12h BLOCK ERASE EXT

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B4h 20h SANITIZE FREEZE LOCK EXT
C4h READ MULTIPLE
C5h WRITE MULTIPLE
C6h SET MULTIPLE MODE
C8h READ DMA
C9h READ DMA without retry
CAh WRITE DMA
CBh WRITE DMA without retry
CEh WRITE MULTIPLE FUA EXT
E0h STANDBY IMMEDIATE
E1h IDLE IMMEDIATE
E2h STANDBY
E3h IDLE
E4h READ BUFFER
E5h CHECK POWER MODE
E6h SLEEP
E7h FLUSH CACHE
E8h WRITE BUFFER
E9h READ BUFFER DMA
EAh FLUSH CACHE EXT
EBh WRITE BUFFER DMA
ECh IDENTIFY DEVICE
EFh SET FEATURES
EFh 02h Enable volatile write cache
EFh 03h Set transfer mode
EFh 05h Enable APM feature set
EFh 10h Enable Serial ATA feature set
EFh 10h 02h Enable DMA Setup FIS Auto-Activate optimization
EFh 10h 03h Enable Device-initiated interface power state (DIPM) transitions
EFh 10h 06h Enable Software Settings Preservation(SSP)
EFh 10h 07h Enable Device Automatic Partial to Slumber transitions
EFh 10h 09h Enable Device Sleep
EFh 55h Disable read look-ahead
EFh 66h Disable reverting to P-On default
EFh 82h Disable volatile write cache
EFh 85h Disable APM feature set

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EFh 90h Disable Serial ATA feature set
EFh 90h 02h Disable DMA Setup FIS Auto-Activate optimization
EFh 90h 03h Disable Device-initiated interface power state (DIPM) transitions
EFh 90h 06h Software Settings Preservation(SSP)
EFh 90h 07h Disable Device Automatic Partial to Slumber transitions
EFh 90h 09h Disable Device Sleep
EFh AAh Enable read look-ahead
EFh CCh Enable reverting to P-On default
F1h SECURITY SET PASSWORD
F2h SECURITY UNLOCK
F3h SECURITY ERASE PREPARE
F4h SECURITY ERASE UNIT
F5h SECURITY FREEZE LOCK
F6h SECURITY DISABLE PASSWORD
F8h READ NATIVE MAX ADDRESS
F9h SET MAX ADDRESS
F9h 01h SET MAX SET PASSWORD
F9h 02h SET MAX LOCK
F9h 03h SET MAX UNLOCK
F9h 04h SET MAX FREEZE LOCK
F9h 05h SET MAX SET PASSWORD DMA
F9h 06h SET MAX UNLOCK DMA

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10. Revision History

Rev. Description Date
1.0.0 Initial Release Nov. 06, 2015

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RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export
laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export
Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in
compliance with all applicable export laws and regulations.
• Product may include products subject to foreign exchange and foreign trade control laws.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS

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Solid State Drive HG6 Series 3 Generation: Key Features

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• Hot-Plug/OS-Aware Hot Removal HG6 Series 3rd Generation

Products and specifications discussed herein are for reference purposes

1. Model Name THN: Toshiba NAND drive

3. Controller Type J: Type J

4. Capacity 128G / 256G / 512G / 1T02 …

5. Form Factor C: 2.5-inch case (7.0 mm height),

8: M.2 2280 Module type

6. Host I/F Type S: Standard SATA, N: M.2 B-M SATA type

7. NAND Type Y: MLC

Copyright © 2015 Toshiba Corporation. All rights reserved.

Copyright © 2015 Toshiba Corporation. All rights reserved.

Copyright © 2015 Toshiba Corporation. All rights reserved.

Copyright © 2015 Toshiba Corporation. All rights reserved.

3.2. Power Consumption

Table 3-3. Power Consumption in M.2 2280 Module Type

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Table 4-2. Humidity

4.2. Shock and Vibration

Table 4-4. Vibration

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Table 5-1. Compliance

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Figure 7-1. 2.5-inch Case (7.0 mm) Drive Dimension

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Table 7-2. Dimensions

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7.2. M.2 2280 Module

Figure 7-3. M.2 2280 Module Drive Dimension

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Table 8-1. 2.5-inch Case Drive Connecter Pin Assignment *1

U1 N.C. Not connected

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8.2. M.2 2280 Module

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Table 8-2. Pin Assignment on M.2 2280 Module Connector

1 CONFIG_3 Defines module type(low) 2 +3.3V 3.3V Source

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Copyright © 2015 Toshiba Corporation. All rights reserved.

Op-Code Command Description

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Op-Code Command Description

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Op-Code Command Description

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10. Revision History

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RESTRICTIONS ON PRODUCT USE

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