Description

HP655 ls a toughened BMI structura adhes ve des gned for meta to metal, composite to composlte and
honeycomb sandwich bonding for both co cured and precured corf]poslte skins. HP655 comb nes high
fracture toughness and h gh shear w¡th good peel strengths. Recomrnended service temperature rs up to
T Bo'C wet and 240"C dry. HP655 was deve oped to be compat b e with Hcxce 's ent re BN4l prepreg

product llne.

Featules
r Good co-cure potentia wth Hexcel's BN/l prepreg range
r r\, éllón hot ,r,q"¡ pe/o'-r d1. e
"p
r Good fracture toughness
r Low volatile content and low out gassing properties
r Ar¿rl"b p lr th o' wrlhouL d $/o.-1 g ¿. . cd'r Fr

Appl¡cations
r l,,4etal to meta bond ng
r Composite to aomposite bond ng
r Sandwichconstructrons

Form

Product Descr¡ption Areal Weights g/m' Support Roll Width mm Standard Roll m'z

Redux HP655 200-600 Yes 1000 50

Redux HP655U 200-600 No 1000 50

lnstructions For Use

Pretreatment
It s essent a that
all substrates to be used are free of contarfrnat on and are in as ideal a state for bonding
as poss ble. As pretreatment varies s gnificantly depending on the subst¡ates used, please refer to the
Hexcel Composites publication Redux Bonding Technology for op¡rnum procedures.

lf there s to be a delay between the pretreatment and bond ng of a um nrum, the pretreated surface should
be protected wlth Redux HP655P, a tough. solvent-based adhes ve primer for improved bond ng to
Aluminium and T tan um substrates. to conserve the opt mum bonding surface. Th s will enable bonding to
be delayed lor up to 2 weeks without deteriorat¡on of the pretreated surface. The correct app icat on of
Redux HP655P shouLd not alter the bond ng performance of Redux HP655 (for fu I app cat on details
consult the re evanl data sheel).

Redux HP655PP is a BMll-based peel p y which prov des a superior surface lor pre-cured cornposite
facings for secondary bonding applicat ons lt can be used at temperatures up to 250'C.

F'E<cEL§§
Appl¡cation
1 Allow sufl c ent time for the adhesive to warrn to room temFerature (15"C to 27"C) before removtng the protect ve polythcne
2. Cut the f m to the shape and s ze requ red
3. Remove the re ease paper and poslt on the adheslve on tne preoared bonding surface.
4. Remove the poilhene backing sheet
5. Complete the jointassemby and apply prcssure while lhe odhesve s llelng cured at T40-700kN/m, For Sandwich structures
the pressure app cation shou d be selected to su t the type of core used Afte¡ the adhesive has cured ¡t s advisab e to
ma ntain pressure on the bonded asser¡ bly until t has coo ed suflic ently to be handied w thout discomfod.

Cur¡ng
Redux HP655 shou d be cured accord ng to the schedules on pages 5 and 6 to obtain optimum properties Enough t me shou¡d
be a owed for heat to penetrate through the assembled parts to ensure that the adhesive reaches that temperature before t ming
starts

Mechanical Propefties
All the performance values glven in th s data sheet are based on exper¡menta resu ts obta ned dur ng testing under laboratory
condltions. They are typ cal va ues expected for Redux HP655 prepared and cured as recommended and under the conditions
ind cated. They do not and should not constitute speciiicat on m nlma.

Tensile Lap Shear Strength (Press Cure Cycle)

Tested per ASTI!4 D1002. Adherents were 2024 T3 bare Alurnin um keated with phosphor c ac d anodise (PAA) surface
preparatiof, or plain weave carbon fabric Blvll lam nate with 1581 glass pee ply suriace preparation prior to bonding.

Test Test Alum¡nium Aluminium Composite T¡tanium

Temperature rc Primer HP655P No Primer with HP655P

Lap Shear -55 234 17.0

Strength 25.1 19.3 19.3 24.8
NlPa 205 276 24.8 26.9 21.8

Aluminium Honeycomb Sandwich Sandwich Performance (Press Cure Cycle)

Adherents were 2024 T3 bare Aluminium treated with PAA surface preparation prior to bonding.
Honeycomb core was 5052, 1.59cm thick.

Test Test 0.64cm cell 0.32cm cell

Temperature rc (MPa) (MPa)

Flatwise Tensile -55 5.1

Strength tested per 5.1 8.5
ASTI\il C 297 205 5.4

C mblng Drum Pee

tested per 75 32.5 44.0
ASII\¡ D1781

Na<ee§§
Compos¡te Honeycomb Sand!v¡ch Fetjormance
F atwise tens e strength us ng precured pla n weave carbon f lbre Bl\I I aminates with '1581 g ass pee -ply surf ace preparation pr or
tobondlng Honeycomb core was HFT-G 327 3/16'cell s ze (3 6 kg). Tested per ASTM C 297.

Test Test Tens¡le Strength

Temperature 'C (MPa)

Flatw se Tens Ie 23 7.2

Strength tested per 205 7.0
ASTN,4 C 297

After 500 hours 23 5.0

at 205'C 20s > 5.1
(Weight oss:075%)

Thermal Cycl¡ng
Flatw se tensile strength us ng 6p es co'cu Ted plain weave carbon f abric BII I prepreg. Honeycomb core was H FT-G 327 3/1 6
cell slze, 3.6 kg. Adhesrve was 106/HP655 at a fi r¡ we ghi of 300gsm.

Test Test Control '15 Cycles 60 Cycles

Temperature 'C

FLatwise tens e 23 65 63 6.3

strength (MPa) 't6s 8.0 7.1 7.0

Thermal cycle = 8"C/minute heat/cool rates with l0 minute hold at temperature

Drum Peel Torque at RT and 180'C Wet

The wet pee spec mens had perforated a um n um backup fac¡ngs and were aondltioned to equilibrium ln a 71'C 100% relatve
humidity chamber for 24 days with peel face up.

Test Test Cl¡mb¡ng Drum Peel torque

Temperature'C (N-m/m)

Drum Peel Torque RT Dry 36.6

RT Wet 457
180'C Wet 3t 0

Neat Resin Propert¡es

Tens le strength RT BO 7 N,4PA

Tens le modu us 3.62 GPa

Uli mate strain % 2.35
FractureProperties RT
G,c, in b/in'? (Jir¡'?) 693.5
Krc, ksillin, (MPa [m) 1.68
C,oef f ic entof Thermá Expansion

CTE,mrn/mnry''C
Temperature Range: -43 B to '163'C 35.0 x 106
163 to 250'C 39.3 x 106
250 to 302'C 11.4 x 10s
Densty g/cm3 1 249
T, Ory 2BO'C
T Wet 215'C
(DMTA,s"C/min E peak)
Storage
Red ux H P655 has been iormulated for maxlmum storage ife consistent w th ls high pelormance. Certain precautions,
however, w I heLp to enhance that storage fe as follows.

1. When stored at room te¡¡perature ( ess than 27'C) it should be kept on a hor zontal mandrel passed through the lube
core on which the rollis wound. This avoids the r sk of loca th nning ofthefilm underthewe ght ofthe ro

When stonng under refrigerat on the or glna packaging should be reta ned f poss ble When returnlng to the reir¡gerator
after use it is essentia to protect the lilm w th a water vapour barr er packaglng materlal such as polythene

On w thdrawal from the refrigerator the water vapour barr er packaglng should not be rer¡oved unt the roll of adhes ve
has reached room temperature This may take up to 24 hours depend ng on lhe size of the roll and the temperature
involved (f a ure to observe this will result in the f ilm becom ng damp).

Thef nr should be handled w th care whrist n thefrozen states¡nce twl be brittleandeas lycracked

On rece pt, Redux HP655willhave astorage fe of at leasl 6 months at -18'C plus an addlt ona shop life of 2 weeks at be ow
23r

Volatile content
Red ux H P655 has a very low volat le contenl, usually well below 1 % ln practice, the oss in weight when cured is neglig b e
and erniss on of vo atiLe products s nol of practicajs gn flcance.

Assoc¡ated products

Redux HP655P surface pretreatrnent protect¡on so ut¡ons (primers).

HP655P - Pr merfor Ny'eta Bonding w¡th HP655 BMI F m Adhesive

PrimerApp cat on
App y thin, unilorrn coat of prlmer to prepare meta surface using brush or spray (recomr¡end phosphoric acid anod ze
treaimentto rneta prortoprmng) Dry n310i 10"F a r forced oven for 1 5 - 30 m nutes Once plates are cool, apply
HP655 adhesive and assenrble parts to be bonded. Best resu ts will be found with a pr¡mer thickness of approximately 10
micron

r Redux HP655PP peel ply.

H'."EL§§
Handl¡ng and safety precautions
lncornmonwlthal Redux adheslves ¡n fiim for"n. Redux H P655 is pafticularly free from hand nghazardsforthe
fo owrng reasons:

Fllm is covered on both s des by protect vc ¡eLease paperand polythene sheetwh ch are nol removed until
fina cornponent assembly. lt shoulcl be cut to shape before rernoving the ptotect ve coverinOs and v rtually
no handl ngof thefilmts necessary.

Lowtack at normalroom temperature. Thef m ls dependent on elevated temperature forwett ng-outthe

adherend surlaces

Volalile f.é al no,l-d toor] e..lpó.¿ru,e

Splashjree, eak free. sp lagejree

However, ihe usual precautions necessary when handling synthetic resins should beobserved. A lVaterial
Safety Data Sheet for Redux HP655 is available on request.

HP655 Autoclave Co-Cure Procedure

A. App y vacuurn at 33.8 kPa m¡nimum.
B. Heat to 132"C at 1- 2"C/m nute.
C App y414t 34 kPa pressure when part reaches 1 32 I 3"C.
D. Dwellat 132 ! 3'Cfor30a Smnutes
E. Vent bag.
F. Heat to 191'C at 1- 2"C/minute: cure 4 hours
G. Coo to 66'C at < 3'C/minute before re easing pressure

HP655 Press Cure Procedure

Apply contact pressure
B, Heatto 132'C at 1 - 2'Clminute.
C, i
Applv 414 34 kPa pressure when part reaches 132 t 3"C.
D, Dwe at 132 r 3"Cior30a Sminutes.
E, Heat to 191"C at 1- 2'Clminute:cure 4 hours
F. Cool lo 66"C al . l"C..l 'lJle bp'ore'e edsrng o'e ,sure.

Post Cufe Procedure

Post cure 16 hours at 232'C (free stand ng oven)

Raise temperature from ambient to 191'C at a rate of 3 - 6'C/m nute and a rate of 2 - 3'C/m nute above 191'C.
Reloase Certiflcatioñ
The Quality System at Hexcel Composites Duxford has been certified to ISO 9O0l by Lloyd's Reglster
Quality Assurance, and is approved by the UK Civil Aviation Authority and Ministry of Defence. Certificates
of Conformity and Test Reports can be issued for batches of Bedux HP655 on request.

lmporlant
A I nformat on is be ieved to be accurate but s g ven wthoul acceptance of liabil ly Users should make their own
assessment ol the suilabrl¡ty of any producl for the purposes required. All sales are made subjecl to our standard terms
of sale whích include limitations on liability and other rmportant terms.
"'CopyrightHexcc Composiles
Pubiicalion RTA 076b (March 2007)

For Mo?e lnfor,ñation

Hexce s a lead n g wor dw de supplier o1 compos I e rn aterials lo aerospace and oth er d eman dlng rndu stfies Our
comprehensive product range ncludesl
I Carboñ Frbre I Structural Film Adhesives
I RTM Materials I Honeycomb Sandwich Panels
I Honeycomb Cores I Special Process Honeycombs
I Continuous Fibre Feiñforced Thermoplast cs
I Carbon, glass. aramid and hybrid prepregs
I Be nforcement Fabrics

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