Attachment 0

Ref.
Ares(2020)1287558 - 02/03/2020
Work Package 3:
Heat pump and underfloor
heating/cooling
Deliverable 3.3, ITES-MES numerical model
Project Details
Program Horizon 2020
Call H2020-LC-SC3-2018-2019-2020
Theme Building A Low-Carbon, Climate Resilient Future: Secure, Clean
and Efficient Energy
Project Title Novel Building Integration Designs for Increased Efficiencies in
Advanced Climatically Tunable Renewable Energy Systems
Project Acronym IDEAS
Project No. 815271
Coordinator Trinity College Dublin (Dublin University)
Timeframe 01/05/2019 - 31/04/2022
Deliverable Details
Title of Deliverable D3.3 - ITES-MES numerical model
Work Package WP3: Heat pump and underfloor heating/cooling
Partner Responsible UNIFE
Partners Involved TCD, UU, PCMP, MCC, LNEG, CFR
Due Date M4 - 31/01/2020
Stage Final
Dissemination Level
PU Public, to be freely disseminated
CO Confidential, only for members of the consortium including the Commission X
WP 3 Deliverable 3.3 Issue date: 31/01/2020 Page |i
Contents
PART A - TRNSYS types for the ITES-MES numerical model .................................................... 1

1 Introduction ....................................................................................................................... 1
2 TRNSYS types for flat-panel ground heat exchangers ....................................................... 3
2.1 Type 207: development of TRNSYS type based on MATLAB code.............................. 3
2.1.1 Analysis and simplification of the MATLAB model .............................................. 3
2.1.2 Power set as input ............................................................................................... 6
2.1.3 Inputs, outputs and parameters .......................................................................... 7
2.1.4 Comparison between MATLAB code and TRNSYS type ....................................... 8
2.2 Type 206: improving Type 207 for more compliant boundary conditions ............... 10
2.2.1 Inputs and outputs ............................................................................................. 11
2.2.2 Comparison between Type 206 and TESS Type 997 .......................................... 12
2.2.3 Behaviour in a full plant ..................................................................................... 16
2.3 Type 209: improving of Type 206 by adding of PCM functionality ........................... 17
2.3.1 Model description .............................................................................................. 17
2.3.2 Inputs, outputs and parameters ........................................................................ 18
2.3.3 Increasing the computational speed ................................................................. 21
2.3.4 Validation ........................................................................................................... 21
2.3.5 Behaviour in a full plant ..................................................................................... 22
3 TRNSYS type for the PV/T panel ...................................................................................... 23
3.1 Model description ..................................................................................................... 23
3.2 Inputs, outputs and parameters ............................................................................... 24
4 TRNSYS type for the radiant floor .................................................................................... 28
4.1 Model description ..................................................................................................... 28
4.1.1 Modelling the floor construction ....................................................................... 28
4.1.2 Modelling the PCM ............................................................................................ 28
4.1.3 Modelling the piping .......................................................................................... 29
4.2 Inputs, outputs and parameters ............................................................................... 29
4.3 Model validation ....................................................................................................... 32
4.3.1 Setting PCM properties in Type 399 and in COMSOL ........................................ 32
4.3.2 Setting RF configuration in Type 399 and in COMSOL ....................................... 34
4.3.3 Setting environmental and boundary conditions in Type 399 and in COMSOL 36
4.3.4 Comparison of TRNSYS and COMSOL simulation results .................................. 37
4.3.5 Comparison of TRSNSYS simulation results of the RF with and without PCM .. 38
5 References ....................................................................................................................... 43
PART B - ITES-MES numerical model ........................................................................................ 1

1 Introduction ....................................................................................................................... 1
2 Mock-Up layout ................................................................................................................. 3
WP 3 Deliverable 3.3 Issue date: 31/01/2020 P a g e | ii
3 Small-scale system layout .................................................................................................. 4

4 TRNSYS model .................................................................................................................... 6
4.1 TRNSYS components ................................................................................................... 6
4.2 Climatic condition........................................................................................................ 8
4.3 Control rules ................................................................................................................ 8
4.3.1 Heat Pump controller........................................................................................... 8
4.3.2 Fan Coil controller ................................................................................................ 8
4.3.3 Radiant Floor controller ....................................................................................... 9
4.3.4 Source controller................................................................................................ 10
4.4 Valves correspondence ............................................................................................. 11
5 Preliminary energy balance ............................................................................................. 12
5.1 Modelling cases ......................................................................................................... 12
5.2 Comparison between reference case ASHP and DSHPs ........................................... 13
5.2.1 ASHP vs DSHP with 6 meters of GHX ................................................................. 13
5.2.2 ASHP vs DSHP with 6 meters of GHX and PVT panel ......................................... 14
5.2.3 ASHP vs DSHP with 6 meters of GHX coupled with PCM................................... 14
5.2.4 ASHP vs DSHP with 12 meters of GHX ............................................................... 15
5.2.5 ASHP vs DSHP with 24 meters of GHX ............................................................... 15
5.2.6 Different GHX lengths for a standard ground-source heat pump ..................... 15
5.2.7 DSHP with 6 meters of GHX, with and without PCM ......................................... 16
5.2.8 Energy comparison ............................................................................................ 16
PART C – Preliminary MES state configurations ...................................................................... 1

1 Introduction ....................................................................................................................... 1
2 Monitoring system ............................................................................................................. 1
3 Proportional diverting valves ............................................................................................. 5
4 User-side system states configurations ............................................................................. 5
5 Sources-side system states configurations ........................................................................ 7
WP 3 Deliverable 3.3 Issue date: 31/01/2020 Page |1
PART A - TRNSYS types for the

ITES-MES numerical model
1 Introduction
Within deliverable D3.3: ITES-MES numerical model, a preliminary layout of a parametrised
MES plant is numerically implemented in the commercial software TRNSYS, a dynamic
building energy simulation program, according to the main needs (PV/T-PCMs cooling, space
heating/cooling, energy storage) and functionalities identified in deliverable D3.2.
The aim is testing how different conditions like building loads, climate zones, and different
phase change materials (PCMs) can affect system performance. Furthermore, the model
proposes and checks preliminary control rules to manage the full thermal system that will be
then evaluated and improved in WP4.
The activity is part of Task 3.2: MES functionality design and numerical implementation of the
ITES- MES model, as outlined in the following scheme.
Figure 1.1 – Tasks included in WP3
As mentioned in WP2 and Task 3.1, behaviour and performance of different PCM installations
will be numerically implemented in the PV/T, radiant floor and flat-panel systems,
respectively to analyse the impact and to maximize the overall performance. Therefore, the
model needs the development, modification and validation of routines (called “types” in
TRNSYS) to represent the following PCM-integrated components of the parametrised MES
plant in TRNSYS:
- Flat panel-PCM system;
- PV/T-PCM system;
- PCM integrated in underfloor heating/cooling system;
whereas the building energy model and the water-to-water heat pump are already available
in the numerical suite.
In order to solve the Flat-panel heat transfer in the ground a new routine was implemented
by means of Green Functions methodology, already programmed in FORTRAN that is
compatible with TRNSYS. A second routine was modified to characterise the new PV/T-PCM
system. It was implemented with modules already available in TRNSYS for standard
application, as partially modified and adapted to represent the new PV/T behaviour in terms
of energy and thermal performance. Taking into consideration the PCM integrated in radiant
floor, a nonstandard routine was firstly validated and then used to simulate the system.
The development of the three Types is reported in the following sections.
2 TRNSYS types for flat-panel ground heat exchangers

In order to have a representation of the performance and behaviour of a Flat-panel that
simulates a ground heat exchanger (GHE), different customised TRNSYS types are developed.
The evolution of the types starts from the creation of Type 207, passing through Type 206 and
ending with Type 209. The first Type implementation is based on a MATLAB model developed
by Bortoloni and Bottarelli [1]. The Types 206 and 207 represent both the behaviour of a flat-
panel ground heat exchanger, and the difference between them is due to the different kind
of inputs that they require. After these two types, Type 209 is developed. Like the previous
types, it also simulates the behaviour of flat-panel but takes into account the addition of PCM.
The core idea of all flat-panel types is the same developed in the MATLAB model, described
and validated in [1]. Starting from the MATLAB model some modifications and improvements
were made in the TRNSYS types, which allow a real-time simulation of the flat-panel
connected to a heating/cooling plant. The validation of the TRNSYS types is made by
comparison with the MATLAB model of [1] and with the Tess Type 997 (horizontal GHE). In
fact, the behaviour of a flat-panel (GHE) is in some cases the same as the one modelled by
Type 997, as described [2]. The Type was developed and tested in TRNSYS18.
2.1 Type 207: development of TRNSYS type based on MATLAB code

2.1.1 Analysis and simplification of the MATLAB model
The MATLAB model described and validated in [1] calculates the temperature distribution of
the terrain in which the flat-panel is installed. The problem is bi-dimensional. An example of
the geometrical domain is showed in Fig.2.1, where the flat-panel is represented by the red
line. All MATLAB model inputs are listed in Tab. 2.1.
The model takes into account the main thermo-physical properties of the ground,
homogeneous and isotropic, the position and height of the flat-panel. The position and
geometrical features of the flat-panel can be arbitrarily chosen. The time-discretisation is set
in days, but it is possible to change it with simple adjustments to the code. The domain is
divided into a specified number of nodes in which the temperature is calculated. In Fig.2.1 is
depicted example of the bi-dimensional domain. The x-axis represents the horizontal
direction, i.e. the ground surface, the z-axis represents the downward direction, i.e. towards
the centre of earth. In this representation the flat-panel results to be a line as shown in Fig
2.1(a), in the Fig.2.1(b) an example of a node grid is represented; temperature is calculated in
each node. The blue dots symbolize the nodes corresponding to the position of the flat panel,
while the black crosses symbolised specific positions in the terrain. Fig.2.1(c) shows the nodes
calculated by the TRNSYS model.
(a) (b) (c)
Figure 2.1 – Bi-dimensional domain
Table 2.1– Inputs to the MATLAB Model
Input Input Name Unit Description

Number
1 Average temperature [°C] The average temperature of soil in stable
of soil in stable layer layer, usually equal of the average
temperature of air of that location during
the year
2 Yearly amplitude of [°C] Yearly amplitude of thermal oscillations at
thermal oscillations at the ground surface. Used for the
the ground surface calculation of the natural temperature
distribution of undisturbed soil
3 Annual temperature [1/days] The annual temperature frequency
frequency
4 Coldest day of the year [day] A reference day to set the minimum value
of the temperature varying sinusoidally
throughout the year
5 Soil thermal [W/mK] Soil thermal conductivity of the
conductivity homogeneous layer in which the flat-panel
is buried
6 Soil Density 3
[kg/m ] Soil density of the homogeneous layer in
which the flat-panel is buried
7 Soil Heat Capacity 2
[J/m K] Soil density of the homogeneous layer in
8 Flat Panel Depth [m] The depth at which the flat-panel is buried.
measured from the top of the flat-panel to
the ground surface and in reference to z-
axis
9 Flat-panel position [m] The position of the flat-panel in terms of x-
axis
10 Height of the flat-panel [m] The height of the flat-panel, measured
exchange surface from the bottom to the top of it
11 z-axis vector [m] The vector representing the position of all
the nodes along z-axis
12 x-axis vector [m] The vector representing the position of all

the nodes along x-axis
13 Time vector [days] The vector representing all the time steps
of the simulation
The model takes also into account the power load required by the plant per square meter of
heat exchange’s total surface and per time step unit. The total heat exchange surface is
intended as the sum of the surface area of both sides of the flat-panel (dx & sx). For example,
a flat panel that is 1 meter high and 2 meters long has a total heat exchange surface of 4
square meters.
The model also assumes an external surface temperature varying sinusoidally according to
Eq. (1), which originally refers to [12].
2𝜋
𝑇𝑒𝑥𝑡 = 𝑇𝑚 − 𝐴 ∗ cos⁡( ∗ (𝑡 − 𝑑)) (1)
365
where:
• 𝑇𝑚 : average temperature of soil in stable layer (frequently the yearly average air
temperature) [°C];
• 𝐴 : Yearly amplitude of thermal oscillation at the ground surface [°C];
• 𝑡⁡ : time of the year [days];
• 𝑑⁡ : Coldest day of the year [days];
2𝜋
• : Annual external surface temperature frequency [1/days].
365
The model shows a good capacity of forecasting the temperature distribution in the ground,
as shown in [1] with a comparison with experimental data. A simulation from day 275
(October) up to day 485 (April) is carried out using a square domain grid of about 10 4 nodes
spaced 0.1 meters in both x and z direction.
Looking at the mathematical model of [1], the following features can be found. First, if the
domain grid is kept looser (thus with less nodes) the accuracy of the temperature value in
each node doesn’t change. That means that the same position of the domain, in terms of x
and z, has the exact same temperature profile in a “loose grid” simulation and in a “tight grid”
simulation, as example see Fig.2.2. In Figure 2.2(a) the node highlighted with the red circle
has the exact same temperature value than the node in Figure 2.2 (b). The highlighted nodes
in Figure 2.2(a) and 2.2(b) have the same geometrical position but the domain grid is different.
The domain is also perfectly symmetrical with respect to the axis represented by the flat-
panel, so the temperature value of two symmetric nodes is the same (Fig. 2.2(c)). Moreover,
if domain is restricted, so area of ground investigated is kept smaller, the value of the
temperature in a specific domain position (included in both domains) doesn’t change. Figure
2.2(d) and 2.2(e) are an example.
(a) (b) (c)
(d) (e) (f)
Figure 2.2 – “tight grid” domain (a), “loose grid” domain (b), symmetric domain (c), wider domain (d), narrower domain (e),
nodes into TRNSYS model (f).
The consequence of this “node” feature is that it is possible to limit the domain to only a few
nodes without lowering the accuracy of the simulation. This allows to have a much faster
simulation time. In the original MATLAB model all nodes are needed, since its purpose was to
evaluate the temperature profile in all the terrain and compare with the experimental data,
but the TRNSYS model doesn’t need all the nodes. In fact, it will evaluate the temperature of
the liquid flowing out from the flat-panel and this can be done using only the temperature
values of the flat-panel nodes. Consequently, in the TRNSYS model the domain is limited to
those nodes. However, another node which can be arbitrarily set by the user is added to the
model in case it is needed for any reason. This node can be set in the right part of the bi-
dimensional domain shown in Fig. 2.1, since it is symmetrical. In figure 2.1(c) or in figure 2.2(d)
the domain considered by the TRNSYS model is shown.
The temperature of the liquid leaving the flat-panel can be evaluated using a correlation
among the available node temperatures. The average temperature between the nodes on the
flat-panel is chosen, until more experimental data will suggest to have a different approach.
2.1.2 Power set as input

The type based on the MATLAB code was identified with the number 207. This model, written
in FORTRAN, mirrors the MATLAB one, with the exception that the time-step can be set in
Simulation Studio and not in the code. Moreover, it saves the value of the power in each
timestep using the Dynamic Storage Array and retrieve the past values directly from the
dynamic array (MATLAB always read it from the txt). This power feature will be useful in the
next developments of the type. The parameters, inputs, outputs of this model are shown in
Table 2.2, 2.3 and 2.4.
2.1.3 Inputs, outputs and parameters

The tables below describe the list of all the inputs, outputs and parameters of Type 207.
Table 2.2 – Description of Parameters of Type 207
Parameter Parameter Name Unit Description

number
1 Average [°C] The average temperature of soil in stable
temperature of soil layer, usually equal of the average
in stable layer temperature of air of that location during
the year
thermal oscillations the ground surface. Used for the
at the ground calculation of the natural temperature
surface distribution of undisturbed soil
3 Specific Heat of [kJ/kgK] The specific heat of the liquid stream
Liquid Stream flowing through the flat-panel
conductivity homogeneous layer in which the flat-panel
is buried
5 Soil Density 3
[kg/m ] Soil density of the homogeneous layer in
6 Soil Heat Capacity [J/m2K] Soil density of the homogeneous layer in
7 Flat Panel Depth [m] The depth at which the flat-panel is buried.
measured from the top of the flat-panel to
the ground surface
8 Height of theflat- [m] The height of the flat-panel, measured
panel exchange from the bottom to the top of it
surface
9 Total length of the [m] The total length of the flat-panel surface
flat-panel exchange exchange. In the case of simulating more
surface flat-panel connected in series, this value is
the sum off all the length of all the flat-
panels.
10 Flat-panel node [m] The distance between the nodes on the
discretization flat-panel where the temperature is
calculated
11 x-coordinate for [m] The x-coordinate of the point in the ground
Temperature of which the user wants to know the
evaluation temperature. The problem is symmetrical
so only positive value are allowed (the flat-

panel is installed on x=0)
12 z-coordinate for [m] The z-coordinate of the point in the ground
Temperature of which the user wants to know the
evaluation temperature. z=0 corresponds to the
ground surface. Only positive values are
allowed. the top of the flat-panel is placed
in z=d while the bottom of the flat-panel is
placed in z=(d+h)
Table 2.3 – Description of Inputs of Type 207

Number
1 Total Power [kJ/h] The total power demand of the flat-panel,
Demand positive if heat is added to the ground and
negative if heat is taken from the ground
2 Inlet Flow Rate [kg/h] Inlet flow rate of liquid entering the flat-
panel
Table 2.4- Description of Outputs of Type 207
Output Output Name Unit Description

Number
1 Outlet Liquid [°C] The temperature of the liquid exiting the
Temperature flat-panel
2 Outlet Flow Rate [kg/h] Outlet flow rate of liquid entering the flat-
panel
3 Temperature [°C] The value of temperature in the point
evaluated in point specified in the parameters
2.1.4 Comparison between MATLAB code and TRNSYS type

A comparison between the two models is carried out in order to validate the TRNSYS type.
A simulation is run between day 275 (October) up to day 485 (April). This is the same case of
study used in [1] to validate the MATLAB model. From Tab. 2.5 to 2.9 all the inputs required
in this comparison are listed. Almost all the inputs coincide between MATLAB and TRNSYS,
with the following exceptions. The domains of the two models are different: the MATLAB
domain is wider and symmetric because the flat-panel is kept in the centre of the domain,
while TRNSYS calculates only the nodes on the flat-panel itself plus one extra node. Moreover,
the time step is different. MATLAB uses days while TRNSYS use hours, since a bigger timestep
is not allowed by the software. Finally, the MATLAB model uses the power per square meter
of heat exchange surface per day, while the TRNSYS one uses the total power per day and
calculates the value per square meter with the parameter 8 (length of thermal exchange
surface). The resulting power demand per days per square meter of heat exchange surface is
the same for the two models and it is plotted in figure 2.3(b). Also, in the TRNSYS model some
extra outputs are added at the outputs of the Tab.2.4, in order to be able to read the
temperature in each node (this is not possible in the final version of the type).
Table 2.5 – Terrain properties for the comparison MATLAB/TRNSYS
Terrain Properties
Soil thermal conductivity [W/mK] 1.48
Soil density [kg/m3] 1720
Soil Heat Capacity [J/kgK] 1950
Table 2.6 – Flat-panel geometrical properties for the comparison MATLAB/TRNSYS
Flat Panel Geometrical Properties

Height [m] 1
Depth (distance from the top to the surface) [m] 0.5
Total length of the heat exchange surface 1
Table 2.7 – External surface temperature trend for the comparison MATLAB/TRNSYS
External Surface Temperature

Average temperature of soil in stable layer (coincides with 16.3
average air temperature) [°C]
Yearly amplitude of thermal oscillations at the ground 10.8
surface [°C]
Coldest day [day] 15
Frequency [1/days] 0.017
Table 2.8 – MATLAB geometrical domain
MATLAB Domain
x-axis node discretization [m] [4 5 6]
z-axis node discretization [m] [0:0.1:1.7]
Table 2.9 – TRNSYS geometrical domain
TRNSYS Domain
Flat-panel node discretization [m] 0.2
Extra point x-value [m] 0
Extra point z-value [m] 0
The power demand and the trend of the external surface temperature can be seen in Fig.2.3.
Three values of this temperature are plotted in Fig. 2.3(a):
1) the value calculated directly with Eq. (1) of the mathematical model [1];
2) the value taken from the first line of MATLAB temperature matrix, which represents
the surface temperature;
3) the value calculated by TRNSYS running a simulation with parameters number 10 and
11 both equal to zero.
Figure 2.3(a) shows that the three values coincide. This is an example of the utility of the
extra-point of TRNSYS Type 207. In fact, the extra point can be used to evaluate the
temperature everywhere in the terrain, from the surface, like in Fig. 2.3(a), until the depth in
the ground where the temperature is stable at the value 𝑇𝑚 (see Eq. (1)).
WP 3 Deliverable 3.3 Issue date: 31/01/2020 P a g e | 10
(a) (b)
Figure 2.3 – Trend of the surface temperature for all the simulations (a) and trend of the power demand to the flat panel
during the simulation time (b)
In Figure 2.4(a) and 2.4(b) the trend of the node temperature is represented as a function of
depth and time and compared between MATLAB and TRNSYS. It is evident how the
temperature values are almost identical. Moreover, the small differences between
temperature become even smaller if the MATLAB code is set with a time step of 1 hour like
TRNSYS. However, if the MATLAB model is set with a time step in hours, the simulation time
become much longer in MATLAB than in TRNSYS.
(a) (b)
Figure 2.4 – Trend of the node temperature in MATLAB and TRNSYS. The temperature values are plotted in defined times:
285th 325th and 365th day in (a) and 405th 445th and 485th day in (b)
2.2 Type 206: improving Type 207 for more compliant boundary conditions
After the comparison above, the TRNSYS type is modified in order to be used in connection
with another component (i.e. a heat pump) using the fluid temperature and flow rate as
inputs. The type is called Type 206 and its functioning is summarised on the flow chart
represented in Figure 2.5.
The new type does not include the information of the power demand at the beginning of each
time step like the previous Type 207. It makes a guess and calculates the power demand using
the difference between the outlet liquid temperature at the previous timestep and the liquid
inlet temperature at present time step. Then the iterative calculation starts, and all the node
temperature will find out, as the current value for the outlet liquid temperature. After that it
calculates the power demand with the difference of the current inlet/outlet temperature and
also it calculates an error using the difference between the supposed and calculated power
demand. If the error is sufficiently small the type will return the node temperature values to
the TRNSYS kernel, and the simulation goes on, if not it iterates until the convergence is
reached.
The parameters of the type are the same as in Table 2.2, while inputs and outputs are listed
in Table 2.10 and 2.11. The “number of iterations per timestep” can be found among the
outputs. This is an indicator of how many iterations the type needs to reach convergence. The
number of iterations has been limited to 100 per time step. If this number is exceeded, the
type stops to iterate and uses the last value of power calculated to find the node
temperatures, then sends a “non-convergence” warning to TRNSYS. When the number of
warnings per simulation is too high the simulation stops (this is a standard TRNSYS procedure
independent from the type code). In Type 206 code, other warning and error procedures are
inserted in order to avoid the user to get unreliable results. In particular, the simulation is
stopped if the node temperature diverges or if the parameters and input values are
inconsistent.
Figure 2.5 – Simplified flow chart of Type 206
2.2.1 Inputs and outputs

The tables below describe the list of all the inputs and outputs of Type 206.

Number
1 Inlet Liquid [°C] The temperature of the liquid entering the
panel
Table 2.11 – Description of Outputs of Type 206

Number
panel
4 Total Power [kJ/h] The total power demand of the flat-panel
Demand at timestep at the timestep
5 Number of iterations [-] The number of iterations required at the
per timestep time step to reach convergence
2.2.2 Comparison between Type 206 and TESS Type 997

Even if the validation of Type 206 is already carried out with experimental data [1], in the
following paragraph the comparison with a standard type is carried out.
In [2], an equivalence between a flat-panel heat exchanger and a horizontal straight pipes
geothermal heat exchanger is demonstrated under special circumstances. In particular, is
verified that a flat-panel installed in a one meter trench has approximately the same
behaviour of a group of 8 straight pipes one meter long installed in two parallel layers. The
liquid flows in the same direction in each pipe, going from a supply collector to an exit
collector. The equivalence is shown in Figure 2.6. More geometrical features are required for
the equivalence to be true: a list has been drawn up in Tables 2.12 and 2.13. Tess Type 997
[3] is chosen to make a comparison with Type 206. The simulation studio workspace set for
comparison is shown in Figure 2.7(b). The terrain properties and the external air properties
used for the validation tests are shown in Tables 2.5 and 2.7.
The external surface temperature and the inlet fluid temperature trend are depicted in Fig.
2.7(a), and simulation studio workspace for the comparison between Type 206 and 997 is
depicted in Fig 2.7(b).
Figure 2.6 – Geometrical scheme of the equivalence between a flat-panel ground heat exchanger and a horizontal pipes
ground heat exchanger
Table 2.12 – Flat -panel geometrical properties used in the validation test
Flat-panel Geometrical Properties

Height [m] 1
Depth (distance from the top to the surface) [m] 0.5
Total length of the heat exchange surface 8
Table 2.13 – Horizontal pipes geometrical properties used in the validation test
Horizontal Pipes Geometrical Properties

External diameter of pipes [m] 0.0269
Internal diameter of pipes [m] 0.002
Number of pipes layers [-] 2
Number of pipes per layer [-] 4
Space between pipes (from center to center) [m] 0.3
Depth of the first layer of pipes [m] 0.55
Depth of the second layer of pipes [m] 1.45
Length of pipes [m] 8
(a) (b)
Figure 2.7 – Results and simulation studio workspace for the comparison between the two Types
An annual simulation, from day 0 up to day 365, is carried out. The flow rate entering the
GHEs is set to a fixed value. The external surface temperature is varying sinusoidally as well
as the inlet liquid temperature of GHEs. The trend of these two temperatures is shown in Fig.
2.7(a). Two outputs of the types are compared: the outlet liquid temperature and the total
power demand. The outlet liquid temperature of the flat-panel is evaluated using nodes
spaced 0.2 m. On the other hand, the nodes on the horizontal pipes of Type 997 are set to 4
per pipe. The effect of a higher number of nodes in both Types is negligible in this test.
The results are shown in Figure 2.8. The value of the outlet temperatures is very similar
throughout the all year. The differences between the two temperature values never exceed
the 0.6°C, as already highlighted in [2], and the trend during the year is the same. The power
has some differences that are higher when the flow rate is greater: this is because the power
value is calculated by the use of the difference between input/output fluid temperature. Even
if the difference between the two types is minimal, when it is multiplied by a high flow rate,
the resulting power in the two types can be significantly dissimilar. In the worst case, so when
the flow rate is equal to 400 kg/h, the power difference reached a value of 100W over a
maximum power of about 200W.
Furthermore, the calculation time of the two types is comparable in this simulation, with Type
206 it is a little bit faster. In general, the calculation time is heavily influenced by the node
spacing of the type.
(a) (b)
(c) (d)
(e) (f)
(g) (h)
Figure 2.8 – Outlet fluid temperature (a), (c), (e), (f) and total power demand (b, (d,) (f), (h) for the Type comparison. Flow
rate equal to 50 kg/h for (a) and (b), 100 kg/h for (c) and (d), 200 kg/h for (e) and (f), 400 kg/h for (g) and (h).
2.2.2.1 Comparison during transients

The behaviour of the Type 206 and the Type 997 is also compared during a step transient. The
inlet liquid temperature and the inlet flow rate are varied with a step transition. All the other
inputs and parameters of the type are unchanged from previous comparison. The liquid outer
temperature is analysed as output. In all tests, Type 206 shows a continuity in the value of the
outlet liquid temperature, while the TESS Type shows a step in the value of this temperature.
Two kind of step transients are here reported as examples, an inlet temperature transient
(Fig. 2.9(a)) and a flow rate transient (Fig. 2.9(b)).
(a) (b)
Figure 2.9 – Comparison between Type 206 and Type 997 during an inlet temperature step transient (a) and a flow rate
transient (b)
2.2.3 Behaviour in a full plant

Type 206 has been also tested in more complex simulations, up to a simulation of a full plant.
The flat-panel is connected to a water-to-water heat pump serving a hydronic loop connected
to three fan coil units serving three thermal zones (one fan-coil for each zone). The building
that generates the power and thermal demand is modelled with Type 56. Many simulations
are carried out throughout all the year just to test Type 206. A comparison with Type 997 is
also done. Type 997 is inserted in the same plant in place of the flat-panel. The calculation
time of Type 206 is about 10% lower than the one of Type 997 in a whole year simulation. In
Figure 2.10 the workspace used in Simulation Studio is shown. In all the simulations Type 206
presented no problems.
Figure 2.10 – Full plant simulation on TRNSYS using Type206
Some examples of the results of a 1 year-simulation are shown in Figure 2.11 and 2.12. The
values of the liquid temperature exiting the ground exchangers and the liquid supply
temperature from the hydronic plant are represented in the following figures.
In figure 2.11 is shown the simulation with Type 206, while in figure 2.12 is used is Type 997.
The fluid temperature trend is affected by the on-off of the heat pump. From the images is
possible to see that the trends of the temperature are identical, as it is identical the influence
of the on-off of the heat pump.
Figure 2.11 – Annual simulation of full plant with Type 206 Figure 2.12- Annual simulation of full plant with Type 997
2.3 Type 209: improving of Type 206 by adding of PCM functionality

Type 206 was modified to include the addition of one layer of PCM on each side of the flat-
panel (Figure 2.13). The new type resulted from the modified Type 206 was identified as Type
209.
Figure 2.13 - Geometrical scheme of the flat-panel without PCM (on the left) and with PCM (on the right)
2.3.1 Model description

A simplified approach that allows a relatively short time of calculation was adopted in the
development of Type 209. The approach is energy-based: for each timestep the type solves
iteratively the energy balance reported in the following equation:
̇ = 𝑄̇ 𝑝𝑐𝑚 + 𝑄̇ 𝑔𝑟𝑜𝑢𝑛𝑑
𝑄𝑓𝑝 (2)
where the energy balance is centred in the PCM layer as outlined in Fig.2.14.
Figure 2.14 - The one node energy balance, centred in the PCM. The fluxes are considered
and where:
• 𝑄̇ 𝑓𝑝 is the heat demand of the flat-panel [W];
• 𝑄̇ 𝑝𝑐𝑚 is the rate at which energy is stored/released in/from the PCM [W];
• 𝑄̇ 𝑔𝑟𝑜𝑢𝑛𝑑 is the rate at which energy is exchanged with the ground by the flat panel
[W].
In the following paragraphs the energy balance of eq. (2) will be described in each different
operation mode of the flat-panel.
2.3.1.1 Inactive PCM layer
When the PCM is not melting/freezing the following energy balance is valid:
̇ = 𝑄̇ 𝑔𝑟𝑜𝑢𝑛𝑑
𝑄𝑓𝑝 (3)
𝑄̇ 𝑝𝑐𝑚 = 0 (4)
In this operation mode the functioning of Type 209 is the same as Type 206. Indeed, Type 206
essentially uses the flat-panel heat demand as an input to calculate the temperature
̇ ) is
distribution in the ground, as reported before and in [1]. The flat-panel heat demand (𝑄𝑓𝑝
derived iteratively since the actual input of the type are liquid water temperature and flow
rate. If flow rate is set to zero also 𝑄𝑓𝑝 and 𝑄̇𝑔𝑟𝑜𝑢𝑛𝑑 are set to zero and the temperature
distribution in the ground is influenced only by the external surface temperature (Tab. 2.14,
parameters number 1 and 2).
2.3.1.2 Active PCM layer
When the temperature of the ground reaches the changing phase dead band temperature
the balance described in eq. (2) becomes valid. The temperature of liquid flowing out from
the flat-panel is assumed to be equal to the centre of the dead band. This assumption allows
to solve iteratively the eq. (2) and to determine which is the amount of heat stored or taken
out of the PCM. When the flat-panel is completely melted or frozen the Type starts to operate
normally again according to equation (3) and (4).
If the flow rate is set to zero when the PCM is active, eq. (2) turns into eq. (5) and (6).
𝑄̇ 𝑝𝑐𝑚⁡ = −⁡𝑄̇ 𝑔𝑟𝑜𝑢𝑛𝑑 (5)
𝑄̇ 𝑓𝑝 = 0 (6)
So, also when flow rate is 0, the PCM can still exchange energy with the ground. Indeed, the
PCM is at a stable temperature at the time of its phase change. Also, the ground is constantly
influenced by the surface ground temperature varying according to Tab. 2.14, parameters
number 1 and 2.
2.3.2 Inputs, outputs and parameters

The tables below describe the list of all the inputs, outputs and parameters of Type 209. With
respect to types 206 and 207, thermal resistance of the flat-panel will be included in the next
Type 209 version.
Parameter Parameter Name Unit Description

number
1 Average [°C] The average temperature of soil in stable
temperature of soil layer, usually equal of the average
in stable layer temperature of air of that location during
the year
thermal oscillations the ground surface. Used for the
at the ground calculation of the natural temperature
surface distribution of undisturbed soil
3 Specific Heat of [kJ/kgK] The specific heat of the liquid stream
Liquid Stream flowing through the flat-panel
conductivity homogeneous layer in which the flat-
panel is buried
5 Soil Density [kg/m3] Soil density of the homogeneous layer in
6 Soil Heat Capacity [J/m2K] Soil density of the homogeneous layer in
7 Flat Panel Depth [m] The depth at which the flat-panel is
buried. measured from the top of the flat-
panel to the ground surface
8 Height of the flat- [m] The height of the flat-panel, measured
panel exchange from the bottom to the top of it
surface
9 Total length of the [m] The total length of the flat-panel surface
flat-panel exchange exchange. In the case of simulating more
surface flat-panel connected in series, this value is
the sum off all the length of all the flat-
panels.
10 Latent Energy of [J/kg] Specific Latent Energy of the PCM material
PCM
11 Density of PCM [kg/m3] Density of the PCM material
12 Phase Change [°C] Temperature of the phase change
temperature material. This temperature is assumed to
be in the centre of the phase change dead
band
13 Phase change dead [°C] The width of the phase change dead band.
band The phase change temperature is
assumed to be in the centre of this dead
band
14 Thickness of the [m] The thickness of the PCM layer. The PCM
PCM layers is assumed to be placed on both sides of
the flat-panel. There is one layer per side.
Each layer has the thickness indicated in
this parameter.
Set this value to zero if no PCM is installed
with the Flat-Panel
15 PCM Volume [-] The volume fraction of pcm held in the
fraction volume of of the thickness specified in
parameter 14
16 Flat-panel node [m] The distance between the nodes on the
discretization flat-panel where the temperature is
calculated
17 Flat-Panel Thermal 2
[m K/W] The thermal resistance of the flat-panel
Resistance (ongoing)
18 x-coordinate for [m] The x-coordinate of the point in the
Temperature ground of which the user wants to know
evaluation the temperature. The problem is
symmetrical so only positive value are
allowed (the flat-panel is installed on x=0)
19 z-coordinate for The z-coordinate of the point in the
Temperature ground of which the user wants to know
evaluation the temperature. z=0 corresponds to the
ground surface. Only positive values are
allowed. the top of the flat-panel is placed
in z=d while the bottom of the flat-panel is
placed in z=(d+h)

Number
1 Inlet Liquid [°C] The temperature of the liquid entering the
panel
3 PCM convergence [-] A positive value that can influence both the
index speed of the model and its ability to find a
solution for each timestep when the PCM is
active. The default value is suitable for most
cases, but it can be changed by expert users
depending on the timestep of the
simulation and on the value of the
temperature/flow rate used as input to the
Type

Number
panel
3 Ground Average [°C] the average node temperature of the
Temperature ground
5 Total Power [kJ/h] The total power demand to the flat panel,
Demand to the flat positive if heat is put into the flat-panel,
panel negative is heat is taken out from the flat-
panel
6 Total Power [kJ/h] The total power demand to the ground,
Demand to the positive if heat is put into the ground,
Ground negative is heat is taken out from the
ground
7 Total Power demand [kJ/h] The total power demand to the PCM,
to the PCM positive if heat is put into the PCM -so it is
liquifying, negative is heat is taken out from
the PCM- so it is solidifying
8 Latent Energy stored [J] The latent Energy stored in the PCM
in PCM
9 Liquid/Solid fraction [-] The liquid/solid ratio of the PCM. when 1 it
is full liquid, when it is 0 it is full solid
10 Phase Change Index [-] A value that indicates if the PCM is melting
or solidifying (if it is 1). If the value is 0
nothing is happening in the PCM
11 Number of iterations [-] The number of iterations required at the
per time step time step to reach the convergence of the
internal calculation of the Type
2.3.3 Increasing the computational speed

The source code of Type 209 is also modified (starting from Type 206) in order to increase the
simulation speed. It is increased by optimizing the calculation of the integrals in the model of
[1]. For example, with reference to a dual-source plant as illustrated in Figure 2.15, the
modified Type 209 is 90% faster than a standard 209 Type (or also Types 206 and 207) in a
simulation of 1000 hours. The Type 209 is much faster than the others GHE types (for instance
Type 997). These modifications will be also brought in Types 206 and 207.
2.3.4 Validation
Type 209 model is based on the previously validated Type 206. However an additional
validation is required and it will be carried out using experimental data.
2.3.5 Behaviour in a full plant

An example of the use of Type 209 is going to be described in this paragraph. Figure 2.15
shows the simulation studio workspace in which a dual source (air and ground source heat
pump) plant is modelled. Two simulations are carried out using Type 209. One simulation with
a 10 cm layer of PCM for each side of the flat-panel and one without the PCM layer. The
simulation lasts 1000 hours starting from the 1st of January and it uses a typical winter climate
of Bologna, Emilia Romagna, Italy.
Figures 2.16 and 2.17 show the trend of the ground temperature around the flat-panel during
the simulation time. In figure 2.16 no PCM is installed, while in figure 2.17 a PCM layer is
present. The PCM has a melting point around 3°C. By the moment the temperature of the
ground is assumed equal to the melting point during all the phase change transition (future
developments of the type will consider its variation). The results show that the temperature
of the ground has a higher value when a PCM layer is present.
Figure 2.15 – Simulation Studio workspace of the dual source heat pump plant
Figure 2.16 – Trend of the ground temperature without Figure 2.17 – Trend of the ground temperature with a 10
PCM layer cm PCM layer installed on each side of the flat-panel
3 TRNSYS type for the PV/T panel

The already available Type 601 models a photovoltaic array that includes a layer of PCM. The
solar cells of the PV type panel are made of standard silicon such as those that characterise
the innovative PV/T-PCM panel developed within IDEAS project. The type also provides for
the passive energy exchange between the PCM and its surroundings, but the PV/T-PCM panel
of IDEAS proposes an actively cooling system. Therefore, in order to simulate the real
behaviour of the PV/T-PCM system, the type was implemented with an active cooling by a
liquid flow (water or another liquid).
Furthermore, the PV/T-PCM panel of IDEAS is provided with a Compound Solar Concentrator
(CPC) installed under the PV’s silicon surface with the aim of increasing direct solar radiation.
As the existing Type 601 does not include this functionality, it’s ongoing the modification of
the source code by adding an equation that contains a multiplier on the solar radiation.
Depending on the nature of the concentrator, the concentration ratio could depend on the
angle of incidence, but it can still be handled by an equation without any further modification
of the type.
All these characteristics as well as the code modifications make the Type 601 consistent with
the PV/T-PCM panel developed in IDEAS, where the heat produced by the system will be
absorbed by the PCM and stored as latent heat. The system PV cell temperatures will be
monitored and the output heat into the PCM will be measured.
3.1 Model description

The idea of including a PCM layer in a PV array is that PVs are more efficient at lower cell
temperatures. Where the cells in a standard PV array heat up, the PCM layer in a PV/PCM
array absorb incident solar energy that is not being converted to electrical energy by the PV
cells and melts, keeping the PV cells cooler and more efficient.
The PCM layer in Type 601 takes, as parameters, the PCM liquefaction and solidification
temperatures, the latent heat of fusion for the material, its density and the thickness of the
layer.
Type 601 includes four modes of calculating PV performance depending on available data. In
the first mode, the user must provide a constant overall efficiency of the array as a parameter
to the model. In the second mode of operation, the user provides efficiency information for
reference conditions as well as coefficients that describe how the overall efficiency changes
with cell temperature and incident solar radiation. In the third mode, Type 601 takes the array
efficiency as a time dependent input. In the final mode, efficiency information is provided as
a function of incident radiation and ambient temperature in an external data file.
The PV/PCM array can include the possibility to have a cover realised by a transparent glazing.
If it has the cover can protect the PV cells from ambient conditions, otherwise the PV cell layer
is exposed to ambient conditions and is therefore directly affected by the convective and
radiative loss terms.
3.2 Inputs, outputs and parameters

The type bases its electrical performance calculation on a user provided overall array
efficiency. Efficiency may be constant, variable, provided as a function of cell temperature
and incident radiation in an external file or provided by an external file. Depending on the PV
efficiency mode chosen for the type, different parameters will be entered in this list.
Table 3.1 - Description of Parameters of Type 601
Parameter Name Unit Typical Comment

Number Value
1 PV efficiency - 1 The mode defining how the PV
mode efficiency should be calculated by
the model:
1 = Constant PV efficiency
2 = Linear modifiers for off-rated cell
temperature and incident radiation
3 = Efficiency provided as an INPUT
to the model
4 = User-provided data file of PV
efficiency as a function of cell
temperature and incident radiation
2 Cover mode - 1 This parameter indicates whether
the PV system has a transparent
cover: 0 = No cover, 1 = Covered
3 Area m² 1.0 The area of the PV array; consistent
with the provided efficiency
parameters and inputs
4 Resistance of (h m² 0.0 The resistance to heat transfer for
PV cell backing K)/kJ the material separating the PV cells
material and the PCM layer
5 Resistance of (h m² 3.0 The resistance to heat transfer for

back insulation K)/kJ the back of the collector
material
6 Top emissivity 0-1 0.9 The emissivity of the outer surface
for long-wave radiation exchange
with the sky
7 Back emissivity 0-1 0.9 The emissivity of the collector back
surface for long-wave radiation
exchange with the zone
8 Absorptance 0-1 0.9 The absorptance of the PV surface
for solar radiation
9 PCM layer m 0.03 The thickness of the PCM layer
thickness
10 PCM layer Kg/m³ 1000.0 The density of the PCM layer
density material
11 Solid phase kJ/(kg K) 2.50 The specific heat of the PCM layer
specific heat material in its completely solidified
state
12 Liquid phase kJ/(kg K) 2.50 The specific heat of the PCM layer
specific heat material in its completely liquefied
state
13 Energy of kJ/kg 1000.0 The energy per unit mass required
solidification to transform the PCM from 100%
solid to 100% liquid
14 Initial PCM °C 20.0 The temperature of the PCM layer at
temperature the beginning of the simulation
15 Solidification °C 20.0 The temperature below which the
temperature PCM is completely solidified
16 Liquefaction °C 20.0 The temperature above which the
temperature PCM is completely liquefied
17 PV efficiency 0-1 The efficiency of the PV cells in
converting absorbed solar radiation
to electrical energy
Table 3.2 - Description of Inputs of Type 601
Parameter Name Unit Typical Comment

Number Value
1 Ambient °C 20.0 The temperature of the
temperature environment for calculating
losses from the collector
surfaces (top and back)
2 Sky °C 20.0 The temperature of the sky for
temperature calculating long-wave
radiation losses from the
collector surface.
3 Zone °C 20.0 The temperature of the air

temperature located behind the back
surface of the collector
4 Back radiant °C 20.0 The temperature of the
temperature surfaces located behind the
collector. This temperature will
be used for radiative loss
calculations from the back
surface of the collector
5 Top heat loss kJ/(hr m² K) 64.0 The convective heat transfer
coefficient coefficient from the cover
surface to the ambient air. A
commonly used correlation is
hconv=3.6*(5.7+3.8* wind
speed in m/s)
6 Back heat loss kJ/(hr m² K) 11 The convective heat transfer
coefficient coefficient from the back
surface of the collector to the
zone air
7 Incident solar kJ/(hr m² K) 0.0 The rate at which incident solar
radiation radiation (beam + diffuse)
strikes the sloped collector
surface
8 PV efficiency 0-1 0.12 The efficiency of the PV cells in
converting absorbed solar
radiation to electrical energy –
not requested for PV Efficiency
Mode 1
9 Total horizontal kJ/(hr m² ) 0.0 The rate at which total solar
radiation radiation (beam + diffuse)
strikes a horizontal surface
10 Horizontal kJ/(hr m² ) 0. The rate at which diffuse
diffuse radiation strikes a horizontal
radiation surface
11 Ground - 0.2 The reflectance to solar
reflectance radiation of the surface upon
which the collector is located
12 Incidence angle Degrees 0.0 The angle of incidence
between beam solar radiation
and the sloped collector
surface
13 Collector slope Degrees 45.0 The slope of the collector
surface of the ICS enclosure
(0=horizontal, 90=vertical
facing the azimuth)
Parameter Name Unit Comment

Number
1 PV efficiency - The efficiency of the PV cells in converting
incident solar radiation to electrical energy;
expressed as a fraction
2 PV power kJ/hr The rate at which the photovoltaic cells are
producing electrical power
3 Mean PV °C The temperature of the PV cells
temperature
4 Cover temperature °C The temperature of the PV/PCM array cover
5 PCM temperature °C The temperature of PCM layer
6 Back surface °C The temperature of the back surface of the
temperature collector (zone air / collector back interface)
7 Absorbed solar kJ/hr The net rate at which solar radiation is
radiation absorbed by the collector. This value does not
include the radiation that was absorbed by
the PV cells and converted to electrical energy
8 Collector top losses kJ/hr The rate at which energy is lost to the
- environment through convection from the
convective top surface of the collector
9 Collector top losses kJ/hr The rate at which energy is lost to the
- environment through radiation losses from
radiative the top surface of the collector
10 Collector back kJ/hr
The rate at which energy is convected from
losses
the back of the collector to the zone air
- convective
11 Collector back kJ/hr
The net rate at which energy is radiated from
losses
the back of the collector to the zone surfaces
- radiative
12 PCM net energy kJ/hr The rate at which heat is transferred into the
transfer rate PCM material at the current time step
13 PCM quality 0-1 The quality of the PCM material at the end of
the time step. 0 = fully solid, 1 = fully liquid, -
0.1 = subcooled solid, 1.1 = superheated
liquid, 0 to 1 = partially solid / partially liquid
(2-phase)
14 Elapsed time - hr The elapsed time that the PCM material has
subcooled been below a quality of 0.0
15 Elapsed time - two hr The elapsed time that the PCM material has
phase been in a two-phase Condition
16 Elapsed time - hr The elapsed time that the PCM material has
superheated been above a quality of 1.0
4 TRNSYS type for the radiant floor

In order to simulate the PCMs integrated in the underfloor heating/cooling system in TRNSYS,
Type 399 was used. This component allows to model PCMs integrated in passive and active
systems installed in floor, wall and roof constructions. As Type 399 is a nonstandard Type,
since it was developed by TRNSYS developer in Germany (Transsolar), it was validated as
reported in section 4.4.
4.1 Model description

4.1.1 Modelling the floor construction
The floor construction is modeled with a Crank-Nicolson algorithm [4] (Figure 4.1) and an
elimination method to solve the heat conduction equation. The discretisation scheme is one-
dimensional. The number of nodes depends on the thickness of each layer.
Figure 4.1 - One dimensional Crank-Nicolson scheme
4.1.2 Modelling the PCM

The calculation method integrated in Type 399 uses the enthalpy as an invertible function of
the temperature, therefore two different data files with a temperature dependent heat
capacity of the PCM is needed: one for the melting and one for the solidification process.
Thus, it is possible to model the temperature dependent behaviour of the PCM as illustrated
in the following figure:
Figure 4.2 -Specific enthalpy h(T) as a function of the material temperature for the melting and solidification process
T > Tlow,m → T > Tup,m → T < Tup,c → T < Tlow,c

Material consequently heated up (data file for the melting process: solid, melting range and
liquid) and then consequently cooled down (data file for the crystallization process: liquid,
melting range, solid)
T > Tlow,m → T < Tup,m
Material heated up (data file for the melting process: solid, melting range), If material is
cooled down in the next time step, but material is still in the melting range (data file for the
melting process: melting range, solid)
T > Tup,cc → T < Tup,c:
Material cooled down (data file for the crystallization process: liquid, melting range).
T < Tup,c →T > Tlow,c:
Material cooled down (data file for the crystallization process: solid, melting range). If the
material is heated up in the next time step, but still in the melting range (data file for the
crystallization process: liquid, melting range).
4.1.3 Modelling the piping

The total resistance (Rt) between the supply temperature of the active system and the core
temperature is a serial coupling of the single resistances. Each of these single resistances
models the influences and characteristics of the active system: the piping depth (Rz), the heat
flux between pipe and water (Rw, Rr) and the pipe spacing and diameter (Rx):
𝑅𝑡⁡ = ⁡𝑅𝑧⁡ + ⁡𝑅𝑤⁡ + ⁡𝑅𝑟⁡ + 𝑅𝑥 (7)
1
𝑅𝑧⁡ = ⁡ (8)
2 ∙ 𝑚̇ ∙ 𝑐𝑝𝑤
𝜎
𝑑𝑥 ∙ 𝑙𝑛 ( )
𝜎 − 2 ∙ 𝑑𝑟 (9)
𝑅𝑟⁡ = ⁡
2 ∙ 𝜆𝑟 ∙ 𝜋
where 𝑚̇ is the mass flow rate, 𝑐𝑝𝑤 is the specific heat capacity of water, 𝑑𝑥 is the pipe
spacing, 𝜎 is the wall thickness of the pipe, 𝑑𝑟 is the thermal conductivity of the pipe material.
4.2 Inputs, outputs and parameters

Parameter Unit Description

Number
1 - Number of different material layers
2 kJ/(hr m K) Thermal conductivity of layer n
3 kg/m³ Density of layer n

4 kJ/(kg K) Heat capacity of layer n
5 m Thickness of layer n
6 - Discretization of layer n
7 - Which layer contains the PCM material?
8 °C Lower phase change temperature
9 °C Upper phase change temperature
10 m² Wall area
11 sec Internal Timestep of the Type in seconds (360 seconds)
12 - Logical unit cp-data file heat up
13 - Logical unit for the data file, which contains the
dependant cp-values for the PCM material, case heat up
14 °C Logical unit cp-data file cool down
15 m Logical unit for the data file, which contains the
dependant cp-values for the PCM material, case cool
down
16 m Initialization temperature for all temperature nodes
17 m Pipe to pipe distance
18 kJ/ (hr K) Pipe diameter
19 kJ/ (kg K) Pipe wall thickness
20 m Thermal conductivity pipe material
21 - Heat capacity of the fluid in the pipe
22 - Depth of active layer
22+i m Number of parallel loops
Parameter
Symbol Unit Description
Number
1 TB1 °C Boundary temperature on side 1
- If linked to Type 56 then:
If the side1 is facing “the airnode”: TB1 =
Tstar (= NType 23: star node temperature of
zone)
- If surface is facing outside, then:
TB1 = ambient air temperature
- If the side is facing “userdefined boundary
condition”:
TB1 = boundary temperature as defined in
Type56
2 TB2 °C Boundary temperature on side 2
If linked to Type 56 then see definition Input 1 -
TB1
3 h1 kJ/(hr m² K) Heat transfer coefficient on side 1
If the side1 is facing “the airnode”:
h1 = 1/ MAX(REQV * AREA ,0.001) (REQV =

NType 86; AREA = NTYPE 113)
h1 = HCONVO ( = NTYPE 107)
condition”:
h1 = HCONVO ( = NTYPE 107)
4 h2 kJ/(hr m² K) Heat transfer coefficient on side 2
If linked to Type 56 then see definition Input 3 -
h1
5 QWG1 kJ/hr Energy gain on side 1
If the side1 is facing “the airnode”:
LW Mode = STANDARD:
QWG1 = QABSI - QWG (QABSI = NType 21;
QWG = NTYPE 82)
LW Mode = DETAILED:
QWG1 = QABSI + QABSILW - QWG (QABSI =
NType 21; QWG = NTYPE 82; QABSILW =
NTYPE 110;)
QWG1 = HT * ABS-BACK – QSKY (HT = NTYPE
116; ABS-BACK = absorption coefficient as
defined in Type 56; QSKY = NTYPE 83)
condition”:
QWG1 = 0
6 QWG2 kJ/hr Energy gain on side 2
If linked to Type 56 then definition see Input 5 -
QWG1
7 Tsupply °C Supply temperature of the working fluid
8 mtot kg/hr Total mass flow rate
Parameter
Symbol Unit Description
Number
1 TSI1 °C Surface temperature on side 1
2 TSI1 °C Surface temperature on side 2
3 QSI1 kJ/hr Heat flux on the surface on side 1
If linked to Type 56 then coupled as surface gain
to the dummy surface of Type56
4 QSI2 kJ/hr Heat flux on the surface on side 2
If linked to Type 56 then coupled as surface gain
to the dummy surface of Type56
5 - °C Temperature of the first temperature node
(seen from the zone) Also this node will be
modified in case of an active element
6 cp_PCM kJ/ (kg K) Average specific heat capacity of all PCM nodes
7 Q Fluid kJ/ hr Input power by the fluid of the integrated pipe
system of the total wall area:
negative → cooling
positive → heating
8 Treturn °C Return temperature of fluid
9 - °C Average node temperature overall PCM-nodes
10 PHASE - Phase of the PCM
PHASE =0 → solid
PHASE >0 → partly melted
PHASE ≥1 → liquid
11 QPCM kJ Actual amount of energy charged/discharged in
the PCM
12 ePCM kJ Cumulated amount of energy charged/
discharged in the PCM
13 qSI1 kJ/(hr m²) Specific heat flux on the surface on side 1
14 qSI2 kJ/(hr m²) Specific heat flux on the surface on side 2
15 q_Fluid kJ/(hr m²) Specific input power by the fluid of the
integrated pipe system of the total wall area
negative → cooling
positive → heating
16 q_PCM kJ/m² Actual amount of specific energy charged/
17 e_PCM kJ Cumulated amount of specific energy charged/
18 - - Indicator which external file is in use:
=1 → file associated with par12
=2 → file associated with par 13
18+i - °C Userdefined temperature in depth i
4.3 Model validation

As the Type 399 is a nonstandard Type, it was validated by comparing the results obtained
from simulations carried out with TRNSYS and with COMSOL MultiphysicsV.5.3® [5] for the
heating period.
4.3.1 Setting PCM properties in Type 399 and in COMSOL
The main properties of the PCM material that will be integrated in the radiant floor (RF)
system, i.e. an inorganic hydrated salt with a melting point of 27°C for heating (S27), are
reported in the following table. These data were set both in Type 399 (TRNSYS) and in
COMSOL.
Table 4.4 – Properties of the PCM S27 set in TRNSYS and in COMSOL [6]
Properties Unit of measure S27
Melting temperature [°C] 27
Lower phase change temperature [°C] 26
Upper phase change temperature [°C] 30

Specific heat capacity [kJ/(kgK)] 2.2
Latent heat [kJ/(kgK)] 185
Thermal conductivity [W/(mK)] 0.54
Density [kg/m3] 1,530
The calculation method integrated in Type 399 uses the enthalpy as an invertible function of
the temperature in order to model the phase change of the PCM. For this reason, the Type
uses two different data files with a temperature dependent heat capacity of the PCM: one for
the melting and one for the crystallisation process.
Taking into consideration the PCM S27 that will be used in the heating floor system, the first
step of the validation process was to build the external files reporting the related temperature
dependent cp-values for melting and solidification process of the PCM. The values of specific
heat capacity were calculated on the basis of the following equation used in Ref. [7]:
𝑛 𝑛
𝑐𝑝,𝑠 = ⁡ ∑ 𝑟𝑖 ∙ (1 − 𝐻𝑖 (𝑇)) ∙ (𝑐𝑖𝑆 + ℎ𝑖𝑆𝐿 ∙ 𝐷𝑖 (𝑇)) + ∑ 𝑟𝑖 ∙ 𝐻𝑖 (𝑇) ∙ (𝑐𝑖𝐿 + ℎ𝑖𝑆𝐿 ∙ 𝐷𝑖 (𝑇)) (10)
𝑖=1 𝑖=1
where the functions 𝐻𝑖 (𝑇) and 𝐷𝑖 (𝑇) are introduced to control and drive the thermo-physical
properties of each PCM during the phase change. The specific heat capacity 𝑐𝑝 was defined
to consider the latent heat of fusion ℎ 𝑆𝐿 by means of a normalised Dirac's pulse 𝐷(𝑇),
expressed in K-1. Moreover, the phase change between the liquid phase (L) and the solid one
(S) were expressed as a function of a dimensionless variable 𝐻(𝑇) which is the volumetric
fraction of the liquid phase in a PCM, ranging between 0 and 1 with respect to the
temperature and changing around the melting point (𝑇𝑚 ± ∆𝑇). These functions were
introduced to moderate the switching between solid (𝐻(𝑇𝑚 − ∆𝑇) = 0) and liquid phase
(𝐻(𝑇𝑚 + ∆𝑇) = 1). In eq. (1) 𝑟𝑖 is the mass ratio of the PCM considered if a mixture of several
PCM materials is analysed. Here, as only one PCM was considered, 𝑟𝑖 = ⁡1 was used to solve
the equation. Furthermore, for the sake of simplicity, it was assumed 𝑐𝑖𝑆 = ⁡𝑐𝑖𝐿 = 𝑐𝑝,𝑆27 =
𝑐𝑝,𝑆21 .
The obtained temperature dependent cp-values for melting and solidification process of the
PCM are reported in Fig. 4.3.
Figure 4.3 - Temperature dependent cp-values for melting and solidification process of PCM S27
4.3.2 Setting RF configuration in Type 399 and in COMSOL

The RF configuration simulated both in TRNSYS and in COMSOL to validate Type 399 is
illustrated in the following figure.
Figure 4.4 – RF configuration used in TRNSYS and in COMSOL for the validation of Type 399
Structure of the radiant floor outlined in Fig. 4.4 was implemented into COMSOL, where
calculations were carried out for 1 m of the radiant floor in order to reduce the calculation
time. PCM layer consists of 4 plastic containers filled with S27. The length of each container
is equal to 25 cm. A view of the geometry is displayed in Fig. 4.5. The full mesh is shown in
Fig. 4.6 and it is limited to 13,780 elements to reduce the computational time.
Figure 4.5 – RF configuration used for the validation of Type 399 in COMSOL
Figure 4.6 – Mesh of the RF configuration
Parameters describing the RF composition, geometrical and thermal properties of the

different layers were then set in Type 399 (Figure 4.7), as well as in COMSOL.
Type 399 allows to insert the number of layers composing the floor (parameter 1 in Fig. 4.7),
to identify which layer include the PCM material (parameter 27 in Fig. 4.7) and to define the
depth at which water pipes are located (parameter 40 in Fig. 4.7).
Figure 4.7 – Parameters describing the RF configuration set in Type 399
4.3.3 Setting environmental and boundary conditions in Type 399 and in COMSOL
Dimensional and thermal properties of the building envelope of the mock-up where the
radiant floor will be installed were defined in the TRNBuild package and, more in detail, in the
multi-zone building simulation subroutine called Type 56 [8-9]. Although the mock-up is
composed of three rooms, for the sake of simplicity it was supposed to include only a unique
space with a surface of about 19 m2 and a volume of nearly 47 m3.
All parameters describing environmental and boundary conditions used in TRNSYS and in
COMSOL are reported in Table 4.5.
Table 4.5 – Environmental and boundary conditions set in TRNSYS and COMSOL
Parameter Unit of measure TRNSYS COMSOL
hfloor inside * [W/m2K] 10.0 10.0
hfloor outside [W/m2K] 0 –
hexternal wall inside [W/m2K] 10.0 –
hexternal wall outside [W/m2K] 17.8 –
hroof inside [W/m2K] 10.0 –
hroof outside [W/m2K] 17.8 –
𝜇roof ** [W/m2K] 2.08 –
𝜇external wall [W/m2K] 0.23 –
indoor heating setpoint temperature [°C] 22, 23 22
ground surface temperature [°C] 14 14
pipe spacing [m] 0.12 0.12
pipe diameter [m] 0.016 0.016
pipe wall thickness [m] 0.002 –
water supply temperature [°C] 31 31
*h = convective heat transfer coefficient
**𝜇 = thermal transmittance
In COMSOL, a constant temperature of 14°C was assumed as initial condition. The left and
right side of the domain was assumed adiabatic. At the bottom of the domain, a constant
temperature of 14°C was supposed.
4.3.4 Comparison of TRNSYS and COMSOL simulation results

Simulations were carried out in steady state and in transient conditions with a timestep of 1
minute both in TRNSYS and in COMSOL. Similarly to other studies in literature [10-11],
simulations were conducted in March, from March 20 to 24 th, as during this time outdoor air
temperature usually fluctuate in the range from 0°C to 20°C. The large temperature difference
is beneficial to PCM charge and discharge and its behaviour can be more clearly appreciated.
More in detail, the radiant floor system was simulated continuously on for the first three days
(72 hours) in order to maintain an indoor temperature of 22°C (in a second scenario a heating
setpoint temperature of 23°C was analysed in TRNSYS) – corresponding to steady state. Then,
the heating floor system was supposed to be turned off and the thermal behaviour of the
floor system was investigated for 24 hours – referring transient mode.
Comparison of simulation results are outlined in the following charts, where are illustrated
data regarding the floor surface temperature (Figure 4.8) and heat flux on the surface (Figure
4.9) during the 24 hours period.
Figure 4.8 – Floor surface temperature Figure 4.9 – Heat flux on the floor surface
Figure 4.8 underlines that in steady state conditions the floor surface reaches a temperature
of about 28°C both in TRNSYS and in COMSOL. The floor surface temperature is about 28.5°C
in the second case study simulated with TRNSYS, with a heating setpoint temperature of 23°C.
In transient state the floor surface temperature stabilises around 25°C according to COMSOL
results and around 24°C on the basis of TRNSYS results. However, taking into consideration
the TRNSYS results obtained with a heating setpoint temperature of 23°C, the difference in
floor surface temperature between COMSOL and TRNSYS is only of 0.5 K.
As regards the heat flux on the floor surface (Figure 4.9), in steady state conditions it is about
60 W/m2 according to COMSOL results and about 90 W/m2 on the basis of TRNSYS results,
therefore there is a quite considering discrepancy. However, in transient conditions the heat
flux reaches an average value of 30 W/m2 both in COMSOL and in TRNSYS simulations, while
according to TRNSYS results obtained with a heating setpoint temperature of 23°C the mean
heat flux is 35 W/m2.
The discussion of the results obtained from the simulations carried out in COMSOL and in
TRNSYS allows to assess that despite the slight difference in values, the system behaves
similarly.
4.3.5 Comparison of TRSNSYS simulation results of the RF with and without PCM
Further simulations were carried out in TRNSYS in order to evaluate more in detail the
reliability of Type 399 in modeling the impact of PCM. Two scenarios were analysed from
January 1st to 30th, a RF with PCM and a RF without PCM, as illustrated in Figure 4.10(a) and
4.10(b) respectively. Properties of the layers are outlined in table 4.6. Environmental and
boundary conditions used to simulate the two scenarios are reported in table 4.7.
(a) (b)
Figure 4.10 – RF configuration with PCM (a) and without PCM (b)
Table 4.6 – Properties of RF layers
Layer number 1 2 3a 3b 4 5 6
Description finishing sand PCM NO PCM sand insulation slab
Thickness [m] 0.003 0.020 0.015 0.015 0.066 0.120 0.200
Density [kg/m ] 3 1200 1500 1530 1530 250 200 2500
Specific heat [J/(kgK)] 1000 900 2200 2200 1500 1460 1000
in solid or liquid state
Specific heat [J/(kgK)] – – fig.3.1 – – – –
during melting/solidification
Thermal conductivity 0.8 1.0 0.54 0.54 0.05 0.04 1.0
[W/(mK)]
Table 4.7– Environmental and boundary conditions used in TRNSYS

Parameter Unit of measure TRNSYS
hfloor inside [W/m2K] 10.0
hfloor outside [W/m2K] 0
hexternal wall inside [W/m2K] 10.0
hexternal wall outside [W/m2K] 17.8
hroof inside [W/m2K] 10.0
hroof outside [W/m2K] 17.8
𝜇roof [W/m2K] 2.08
𝜇external wall [W/m2K] 0.23
indoor heating setpoint temperature [°C] 20
ground surface temperature [°C] 14
pipe spacing [m] 0.10
pipe diameter [m] 0.016
pipe wall thickness [m] 0.002
water supply temperature [°C] 40
water flow rate [kg/h] 360
4.3.5.1 Simulation results of the RF with PCM

Results regarding the percentage of melted PCM during the simulation period and the heat
flux on the floor surface (q) for the RF configuration with PCM are illustrated in Figure 4.11
and 4.12 respectively. Values of outdoor air temperature (Text), room temperature (Troom),
supply water temperature (Tin) and return water temperature (Tout) are outlined in the same
figures.
Figure 4.11 – Temperatures and percentage of melted PCM (RF with PCM)
Figure 4.12 – Temperatures and heat flux on the floor surface (RF with PCM)
With an average outdoor air temperature of 0 °C, the temperature of the room ranges from
18 to 22 °C, while return water temperature varies from 25 to 35 °C within a period of about
17 hours. Related to the same timestep, heat flux on the surface ranges from 40 to nearly 74
W/m2.
4.3.5.2 Simulation results of the RF without PCM
Results regarding the percentage of melted PCM and the heat flux on the floor surface (q) for
the RF configuration without PCM are reported in Figure 4.13 and 4.14, where values of
outdoor air temperature (Text), room temperature (Troom), supply water temperature (Tin) and
return water temperature (Tout) are also illustrated.
Figure 4.13 – Temperatures and percentage of melted PCM (RF without PCM)
Figure 4.14 – Temperatures and heat flux on the floor surface (RF without PCM)
Considering the RF configuration without PCM, the temperature of the room varies from 18
to 20 °C, therefore is slightly lower than in the configuration with PCM, while return water
temperature ranges always from 25 to 35 °C. However these variations occur within a period
of nearly 7 hours. With the same timestep, heat flux on the surface ranges from about 38 to
nearly 86 W/m2, therefore reaching more significant fluctuations that RF with PCM.
4.3.5.3 Remarks
Taking into consideration RF configuration with PCM, results reported above underline that
the room temperature, the return water temperature as well as the heat flux on the floor
surface are not subjected to the same important fluctuations that characterise the
configuration without PCM. This is due to the energy storage effect of PCM, which store large
amounts of energy upon melting and then release equal amounts of energy upon freezing in
the form of latent heat, thus vastly increasing the thermal mass of the building envelope. Thus
the PCM allows to reduce and delay the drops in temperature as well as in heat flux, which in
the RF with PCM occur during a decisively longer period (17 hours) than in RF without PCM (7
hours).
The discussion of the results obtained from the last simulations carried out in TRNSYS allows
to assess that Type 399 properly works and is able to reflect the behaviour of the PCM.
5 References
[1] Bortoloni, M.; Bottarelli, M. On the sizing of a glat-panel ground heat exchanger,
International Journal of Energy and Environmental Engineering 2015, 55-63
[2] Cirello, V.; Bottarelli, M.; Di Federico, V.; Tartakovsky, D. Temperature fields induced by
geothermal devices, Energy 2015, 1896-1903
[3] Thermal Energy Systems Specialists (TESS). TESSLibs 17 - GHP Library, Mathematical
Reference
[4] Huang, K.; Zollinger, D.G.; Shi, X.; Sun, Pi. A developed method of analyzing temperature
and moisture profiles in rigid pavement slabs, Construction and Building Materials 2017,
151, 782-788
[5] COMSOL, COMSOL Multiphysics Reference Manual, version 5.5, 2019.
[6] PCM Products Ltd, PlusICE Hydrated Salt (S) Range, 2018.
http://www.pcmproducts.net/files/S%20range-2018.pdf
[7] Bottarelli, M.; Bortoloni, M.; Su, Y. Heat transfer analysis of underground thermal energy
storage in shallow trenches filled with encapsulated phase change materials, Applied
Thermal Engineering 2015, 90, 1044-1051
[8] Athienitis, A.; O'Brien, W. Modeling, design, and optimization of net-zero energy
buildings; Ernst & Sohn: Berlin, DE, 2015; ISBN: 978-3-433-03083-7
[9] Solar Energy Laboratory, TRANSSOLAR, Centre Scientifique et Technique du Bâtiment,
Thermal Energy System Specialists. Multizone Building modelling with Type56 and
TRNBuild, TRNSYS 17: Vol.5, 2012
[10] Lu, S.; Tong, H.; Pang, B. Study on the coupling heating system of floor radiation and
sunspace based on energy storage technology, Energy and Buildings 2018, 159, 441–
453
[11] Cheng, W.; Xie, B.; Zhang, R.; Xu, Z.; Xia, Y. Effect of thermal conductivities of shape
stabilized PCM on under-floor heating system, Applied Energy 2015, 144, 10-18
[12] Carslaw, H.S.; Jaeger J.C. Conduction of Heat in Solids. Oxford University
Press, 1959
PART B - ITES-MES numerical

model
1 Introduction
The deliverable D3.3 focuses on the preliminary model of the Multi-source/sink Energy Sub-
system layout (MES) dedicated to the thermal management of all Intra-day/season Thermal
Energy Storage (ITES) foreseen in the IDEAS system which is as follows:
− Photovoltaic Panel equipped with compound parabolic concentrator (CPC) and heat
exchanger (PVT);
− Flat-Panel, so called horizontal ground heat exchanger (FP);
− Radiant floor, as technology for building heating/cooling (RF).
The activity is part of Task 3.2: ITES-MES numerical model, as highlighted in the following
layout of WP3.
Figure 1.1 – Tasks included in WP3
In IDEAS project, MES is designed according to the functionality of an invertible heat pump,
preliminarily assumed as a standard water-to-water technology, electrically driven to exploit
PV power and reversible to satisfy both heating and cooling requirements. Compact air heat
exchanger (fin & tube), Flat-Panel ground heat exchangers and a biomimetic PVT heat
exchanger provide a multi-source thermal harvesting opportunity, whose tailored
exploitation will be controlled in real-time by a control unit to optimise and match energy
supply and demand, also considering the weather conditions (WP4).
According to the main needs and functionalities identified in the deliverable D3.2 (Multi-
source/sink Energy Sub-system), used as a reference, the parametrized MES system was
numerically implemented in commercial software TRNSYS, in order to test how different
conditions (for example building loads, climate zones, PCMs) affect system performance, and
therefore to propose preliminary control rules to manage the full thermal system
implemented in WP4.
Especially, the results of the TRNSYS model will be compared with the prototype behaviour
and eventually modified/calibrated for having a decisional support system for design
ITES/MES solutions according to different combinations among building energy labels and
climate zones.
2 Mock-Up layout
The test building where the small-scale IDEAS prototype will be installed has a square plant
of 4.50 x 4.24 m in size and a flat roof with a height of 2.80 m. The roof slope of 1% towards
the south for the drainage of rainwater.
The Mock-Up has three different rooms: two smaller rooms called guard-rooms, which are
orientated through the east and west sides respectively, and a larger central one. In addition
to the difference in size, the rooms also differ in the way they are conditioned: all of them
have fan-coil conditioning, whereas the central room will also have a winter and summer
conditioning system created with a radiant floor plus PCMs technology system. Figure 2.1
depicts the Mock-Up geometry and its conditioning unit.
The power demand of the Mock-Up is due to the maintenance of the requested temperature
in the three rooms during the winter and the summer period respectively. The amount of
power demand of the building is supplied by means of the user loop, whereas the source side
composed by the PVT loop and by the air-ground loop.
Figure 2.1 – Mock Up plant

3 Small-scale system layout

The preliminary design of the HP system, depicted in Fig. 3.1, implements a generalised HP
system with an invertible heat pump group able to exploit different thermal source/sink as
the PVT, the air (outdoor and waste heat) and the ground. Therefore, the heat pump is here
assumed as a standard water-to-water technology, electrically driven to exploit the PV power,
reversible to satisfy both heating and cooling requirements, and integrated with PCM thermal
storage by means of specific technologies foreseen by user-side (heating/cooling floor, FP,
PVT).
The system is mainly composed of three parts:
1. PVT loop (-10/+80°C), whose heat source is the PV/T device, which stores heat in the
buffer tank n.1 (BF1).
2. Air-ground loop (-15/+50°C), in which air and ground can be alternatively source or
sink for the HP, which operates through the buffer tank n.1 of the PVT loop (BF1).
When the HP is off, this loop may be used to control the temperature of the PVT
device.
3. User loop (+10/+60°C), which warms up the buffer tank n.2 of the radiant floor or the
fan coil systems (BF2).
Compared to the full IDEAS plant system foreseen in the deliveravle D3.2, the small-scale
system that will be installed at the TekneHub laboratory will be then equipped with two
storage tanks, named BF1 and BF2, and a plate exchanger that allows an immediate panel
cooling by supplying heat to the user side. This layout was discussed ad agreed during the
meeting carried out in Belfast in November 2019.
For experimental purposal, the connection of the PVT with the heating system (radiant floor
and/or fan coils) is foreseen but at the moment it is not used by the system. The two tanks
are used as buffer tanks in order to control the thermal inertia of the system and that the
heat pump can operate without problems when it is turned on (see Fig. 3.1).
In Figure 3.1 the two sides of the heat pumps are underlined with different coulors: the souce
side an the user side. With reference at the heating season, the thermal source for the HP
evaporator (HX1) is the buffer tank n.1 (BF1), which can be recharged by air, ground and solar
source, or by their mixing according to weather conditions or other boundary conditions.
Therefore, BF1 temperature should be assumed as main source reference temperature for
the HP model.
HP condenser (HX2) can provide heating for the buffer tank n.2 (BF2) which is devoted to
heating the radiant floor. Since the heating of the central room by means of radiant floor
system has the priority over the fan coil system, the valve V5 setting considers that the flow
rate should firstly flow through the radiant floor and if necessary, through the fan coil.
Meanwhile the fan coil system heats the guard rooms. BF2 and PCMs in the radiant floor can
compensate for the absence of direct heating. Temperature in BF2 (radiant floor) should be
assumed as sink reference temperature for the HP model, according to the set point fixed by
the user supplies.
The temperature into the BF1 can be heated up thanks to PVT and GHX or/and AHX. The
choice depends on the temperature of the outdoor air and the ground. If the air temperature
drops below a certain temperature (for example 5-7°C) the GHX can supply the heating,
because the ground temperature is higher than the outdoor air temperature and so the heat
pump’s COP can be increased.
Figure 3.1 – HP system layout

4 TRNSYS model
4.1 TRNSYS components
The numerical analysis of the plant described in section 3 has been conducted via TRNSYS,
modelling all the components as reported in the following lines.
Type 56 – Building: Type 56 is used to model the test building. All the information about the
geometry, wall structures and materials are inserted in Type 56. Type 56 simulates the total
thermal power demand of the building, which is supplied from user side loop. The power
came from the exploitation of different thermal sources (PVT loop and air-ground loop)
connected with an heat pump.
Type 996 – Fan coil units: this type is used to model the three different fan coils that are
placed in the three thermal zones of the test building. Type 996 is performance-map based.
This kind of types rely on external performance maps meaning that their results are based on
information wrote in a user-supplied data file containing catalogue data for the capacity and
power draw as a function of entering load and/or air and liquid temperatures. As a first
approach a typical fan coil performance map was used. A new performance map will be
created by using experimental data when they are available.
Type 927 – Water-to-water heat pump: the type is used to model a water-to-water heat
pump. This is also a performance-map based type, also in this case a typical performance map
of a water-water heat pump was used. A new performance map will be created when the
experimentation will start, and experimental data will be acquired. By the moment, the heat
pump is not characterized with values of the real power, but it has been dimensioned with an
estimated power derived from initial considerations that take into account the energy
demand of the Mock-Up in non-stationary mode. The rated heating capacity was set to 4 kW.
As characterized in WP2 and Task 3.1, behaviour and performance of different PCM
installations were numerically implemented in the PVT/PCMs, floor and flat-panel types,
respectively to analyse the impact and to maximize the overall performance. The previous
deliverable (D3.3a) describes new routines called “types”, developed by using the TRNSYS
model in order to represent the Flat-Panel/PCM ground heat exchanger and the PVT/PCM
system, whereas the building requirement and the water-to-water heat pump are already
available in the numerical suite.
Type 399 – Radiant floor with embedded phase change material: the type is used to model a
radiant floor with embedded the PCM. This radiant floor is installed in the central room of the
test building. This is the only room with two heating/cooling devices. This will be the testing
room for the cooling/heating behaviour of the radiant floor system coupled with a PCM
technology. This type was described in the previous deliverable (D3.3a).
Type 209 – Flat-panel ground heat exchanger with embedded phase change material: this
type is used to model the flat panel ground heat exchanger. A first routine of the type was
implemented for solving the Flat-Panel heat transfer in the ground by means of Green
Functions methodology, already programmed in FORTRAN language that is compatible with
TRNSYS. A second routine was developed to describe the PCM effect; it is based on the
equivalent heat capacity methodology, to couple with the previous 2 modules. The type
embedded with the PCM was named Type 209. All types and routines are described in the
deliverable (D3.3a).
Type 555 – Photovoltaic panel with embedded phase change material and heat exchanger:
to characterize the PVT system, a third routine was implemented with modules already
available in TRNSYS for standard application, as partially modified and adapted to represent
the new PVT behaviour in terms of energy and thermal performance. This type models a
photovoltaic array that includes a layer of PCM and provides an active cooling system. The
heat pump source liquid flows through the panel keeping its temperature low and its
efficiency high. The CPC installed under the PV’s surface is also included.
Type 996 – Liquid to air heat exchanger: the air/liquid heat exchanger used in the heat pump
source loop will be modelled with type 996 which is a performance-map based type. Since no
performance map are available right now, a simplified approach was used to gain first
approach results. The heat exchanger was modelled with a simple equation that imposes a
temperature of the leaving liquid entering the heat exchanger. This temperature is always 3°C
lower than ambient temperature. This very simplistic approach will change once experimental
data will give the ability to build a performance map.
Other TRNSYS standard types are used in the model, like circulation pumps, water storage
tanks and liquid splitting valves and mixing valves.
Figure 4.1 illustrates the TRNSYS layout of the plant system.
Figure 4.1 – TRNSYS full plant layout

4.2 Climatic condition

One of the first operations to do when performing a dynamic simulation is the insertion of a
file containing information about the climatic conditions that characterize the location where
the building is sited. In order to do this operation, the TRNSYS model provides a climate
database in which the user can search the weather file containing the information related to
the desired city. Since the Ferrara’s weather file updated to the current year is not available
yet, it has been decided to make a first approximation by inserting the file relating to the city
of Bologna of the year 2018.
In order to check that the weather file used in the TRNSYS model is sufficiently representative
of the right location weather conditions, the Day-Degrees for the winter period have been
calculated for each of the two locations and they have been compared. The difference
between the Day-Degrees relative to the two locations results acceptable for modelling
purposes.
4.3 Control rules

4.3.1 Heat Pump controller
The heat pump’s work is controlled by monitoring the temperature into the buffer tank
located on the user loop (BF2). During the winter period the supply temperature on the user
side has to be equal to a specific setpoint (e.g. 35°C) according to the energy requirement
which mainly depends on the design of the system and the building thermal performance.
Therefore, the heat pump and the circulation pumps which serve the source side and the load
side respectively are turned on or off depending on the tank temperature. Until the tank
temperature is lower than the setpoint, the pumps and the HP are working, when the set
point is reached, they will be switched off.
4.3.2 Fan Coil controller

The fan coil units have three different fan speeds. The setting of the speed depends on the
room temperature: the lower the temperature in the room, the higher will be the fan speed
to restore the room to the required conditions. This fan coils behaviour has been simulated
using a control type with an n-stage heating thermostat which outputs n on/off control
functions that can be used to control a system having n levels of heating alternatives.
Type 970 has been chosen. It allows the user to have different dead bands for each setpoint,
and this component also has on and off time delays.
The controllers were chosen with dead bands in order to prevent them from turning
equipment ON and OFF in fast succession when the monitoring temperature and set point
temperature are close to one another. In heating mode, equipment would remain OFF until
the monitored temperature had fallen to the specified set point minus the lower dead band
temperature difference. Once ON, the equipment would remain ON until the monitored
temperature exceeds the specified set point temperature plus the upper dead band. Type 970
centres the specified heating and cooling dead band temperature differences on each set
point.
For example, the fan coil inserted into the system should work as follow. If the monitored
temperature drops below a certain point, the highest fan speed turns on. If the temperature
increases until reaching the second set point, the fan coil will switch over to second high fan
speed. If the temperature in the room continues to increase, the fan coil switches to its
minimum fan speed, adding less energy to the space. Such a fan coil would be referred to by
this model as a three-stage heating device. Every rooms temperature will be controlled with
this type.
A heating made of three set point temperatures and dead band temperature difference are
shown graphically in the following figure.
Figure 4.2 – Fan speed control graphic representation
4.3.3 Radiant Floor controller

In order to control the temperature of the central room heated by means of the radiant floor,
a control logic based on the on/off of the mass flow rate entering the floor piping has been
used. The working fluid flow rate flows into the radiant floor’s piping until the set point
temperature is reached, when the required temperature is achieved the flow rate is diverted
directly to the return circuit.
The controller used for this proposal generates a control function that can have a value of 0
or 1. The value of the control function was chosen as a function of the difference between
upper and lower temperatures (𝑇𝐻 and 𝑇𝐿) compared with two dead band temperature
differences (Δ𝑇𝐻 and Δ𝑇𝐿). The controller is also used with the output control signal
connected to the inlet control signal giving a hysteresis effect.
Then, the control signal has been multiplied by a percentage of the flow in order to provide
the correct amount of flow rate as input to the various types.
4.3.4 Source controller

The core of a multi-source heat pump system consists in the logic that decides whether the
heat pump power should be supplied with the air source, the ground source or solar source.
In the TRNSYS model, the user can easily change the control logic and perform different
simulations in order to understand the best logic for making the system more efficient.
In the modelled plant, the first switching control rule regards the solar source: it is possible
to decide whether the PVT is bypassed or not. By the moment this decision isn’t automatic,
and it has been set by the user at the beginning of the simulation. An automatic logic will be
implemented in the future.
The second main decision regards the possibility to use the air or the ground as sources. This
switching rule is already automatic, and it has been implemented as follow. If the external air
temperature is above 6°C, the air-source is always active and the Flat-Panel doesn’t work. If
the outdoor air temperature drops below 6°C the switch between the air and the ground is
decided with a hysteresis cycle such the one represented in Figure 4.3.
When the signal is equal to the value 1 it means that the heat pump is working using the air
mode, otherwise when the signal is equal to 0 the heat pump works using the ground as
source. Depending on the relation between the ground temperature and the air temperature
the choice between air and source is automatically made. By using the hysteresis cycle the
system guarantees that the ground source is exploited only when it is more favourable than
the air source.
All the parameters of this control can be easily changed by the user if necessary, as well as
the splitting of the mass flow rate between air and ground, that will be defined according to
a specific rule (see futher).
Figure 4.3 – Switch air-ground source graphic representation

4.4 Valves correspondence

In order to have a direct comparison between the TRNSYS model and system plan Table 4.1
reports which valves of the real plant corresponds to the valve-type in the numerical model.
These valves are those for which some rules will be studied in order to regulate their
proportional behaviour and set how they will divide the working fluid flow rate that flows in
the circuit (WP4).
Moreover, Figure 4.4 gives an immediate graphic representation of the correspondence
between the proportional valves present in the circuit with those of the numerical model.
Table 4.1 – Proportional valves correspondence: real scale - numerical scale

Valve TRNSYS model valve
Description
Number name
V1 Bypass AHX + GHX Valve for bypass the AHX and GHX
V2 Switch Air/Ground Valve for bypass AHX or GHX
V3 Switch Series Valve for let the system working in series or in parallel mode
V4 Switch PV/T Valve for bypass the PV/T
V5 Div RF/FC Valve for splitting the flow rate through the RF or FC_Clim
V6 Not implemented yet
Figure 4.4 – TRNSYS circuit with real plant valve name

5 Preliminary energy balance

This chapter aims to analyse the behaviour of a multi-source heat pump and its potential
benefits over conventional air-source heat pump.
Incorporating both the ground-source, the air-source and the PVT source in a multi-source
heat pump is possible to achieve high efficiency by switching to the more favourable
source/sink between air, ground and thermal collector according to their temperature, thus
also preventing from frosting during winter for the outdoor air unit. In some cases is also
possible to open the regulation valves of the PVT loop and the air-ground loop letting them
working contemporarily.
In the TRNSYS model, a user-defined function has been programmed to realise a virtual
control of switching between the air and ground heat exchangers according to a minimum
temperature threshold for the outdoor air and the ground, and the temperature difference
between them. For what concern the PVT loop a switching rule is going to be programmed,
by the moment the switch is user-set.
5.1 Modelling cases

The building heating demand time series, obtained by means of TRNBuild, can be applied to
the heat exchangers of a multi-source heat pump.
A numerical analysis has been carried out in order to determine some comparison between
preliminary energy balances that take into account different combinations of the heat pump
sources. For instance, the electric energy consumption of a conventional air-source heat
pump (ASHP) was take as reference value and it was compared with the electrical
consumption of a dual-source heat pump (DSHP) considering different sizes of the ground
heat exchanger (GHX) and then the addition of phase change materials (PCM). The dual
source was obtained by coupling an air and a ground-source heat pump, respectively. The PVT
contribution was then added to the global system (DSHP+PVT) to test the requested energy
reduction.
Table 5.1 shows the results in terms of thermal power supplied by the different sources, and
the electric power consumed by the heat pump. The negative value referred to the GHX
thermal power is due to heat extraction of the system from the ground. In Table 5.2 reports
the operating hours of the heat pump using the air or the ground as sources respectively.
The ASHP case was taken as a reference for comparison with the DSHP in all its combination
of GHX’s sizes, PCM or PVT addition, in terms of global system energy and operating hours in
one mode rather than another. The simulations were carried out during the heating season
but considering only the month of January.
Table 5.1 – Energy comparison
HP sources ASHP DSHP DSHP + PVT DSHP + PCM DSHP DSHP

GHX size [m] 0 6 12 24
AHX 560 219 198 213 90 31

Thermal Power
GHX 0 -350 -353 -359 -488 -555

[kWh]
PVT 0 0 18 0 0 0
HP source side 559 568 568 571 578 585
HP user side 677 677 677 677 677 677
118 109 108 106 100 92

Electric
Power
[kWh]
HP
100% -7.8%* -8%* -10%* -16%* -22%*
* Values referred to the ASHP electrical power demand
Table 5.2 – Operating hours comparison
HP sources ASHP DSHP DSHP + PVT DSHP + PCM DSHP DSHP

GHX size [m] 0 6 12 24
Operating
hours [h]
AHX 167 69 70 64 27 10
GHX 0 99 98 104 143 162
5.2 Comparison between reference case ASHP and DSHPs

For the reference case ASHP it is possible to see that the air heat exchanger can provide the
amount of thermal power needed to the heat pump working. The electrical power summed
with the thermal power on the source side of the heat pump return the thermal power
needed by the users on the load side.
5.2.1 ASHP vs DSHP with 6 meters of GHX

Incorporating the ground-source with a total size of its ground heat exchanger of 6 meters, it
appears that whereas the thermal energy requested by the user side is equal to the reference
case, the sources that supply this power are both air and ground. This is due to the coupling
of the ASHP and the GSHP based on switching rule foreseen between them: if the air
temperature drops below a user-set temperature, the GHX can supply the heating instead of
the AHX. This because the ground temperature is higher than the outdoor air temperature,
so the working fluid temperature at the HP’s evaporator heated by GHX is higher, and as direct
consequence the heat pump’s electric energy consumption can be reduced. The amount of
the electric power reduction between the ASHP and the DSHP with a GHX size of 6 meters
was estimated to be equal to 7.8%. All results are in Tab. 5.1.
With reference at Tab. 5.2, it can be notice that the operating hours of the air heat exchanger
decrease from 167 hours calculated during ASHP operating mode, to 69 hours in DSHP
operating mode. The reduction of the working hours of the AHX is due to the presence of the
GHX: the system evaluates the convenience to switch to the ground-source.
5.2.2 ASHP vs DSHP with 6 meters of GHX and PVT panel

For the second comparison, a photovoltaic panel with heat exchanger was added to the DSHP
system. The heat pump’s total electric power reduction is not much greater than in the
previous comparison: the amount of the reduction is equivalent to 8% compared to the ASHP
system. Table 5.2 shows that also the operating time of the heat pump in air-source mode or
in ground-source mode is not so different compared to the case without the PVT panel. The
reason of this slight improvement could be because the PVT type hasn’t been calibrated yet,
in the future more tests will be carried out in order to bring the panel's behaviour closer to
the real one. Moreover, the PVT surface here implemented is too small to be profitable in
January.
5.2.3 ASHP vs DSHP with 6 meters of GHX coupled with PCM

In order to test the contribution of phase change materials in the plant system they were
coupled with the ground heat exchanger having a total length of 6 meters, and the results of
this simulation were compared with the reference case where the system were composed
only by ASHP. The proposal of coupling PCMs with ground heat exchangers is related to a
specific shallow type so-called Flat-Panel.
The use of PCMs for underground thermal energy storage allows to exploit the additional
thermal inertia of the phase change, improving the heat exchanges temperature and
increasing the performance in favour of a significant reduction in the GHX length and
therefore in the installation cost of the geothermal units.
The total amount of PCM that has been considered in the geothermal closed loop was estimated
to be equal to the volume of a 2 x 2.0m x 1.1m x 0.1m parallelepiped. Where 2.0m x 1.1m are the
length and the height of the Flat-Panel respectively, and 0.1 stands for the thickness of the PCM
layer. The fraction of PCM volume has been set equal to 0.5 in order to make the system
recognised that only half of the total volume previously described is occupied by PCMs. The
density of the phase change material is 1720 kg/m³ and its phase change temperature has been
set equal to 3°C.
Using this technology, the amount of the electric power requested by the heat pump can be
decreased up to 10% respect to ASHP consuming. A second comparison can be made with
reference to Tab. 5.2, so referring to the permanence hours of the heat pump in air-source
mode or in ground-source mode. If the system is an ASHP, the heat pump exploits only the
air-source, but when it was coupled with GHX plus PCMs the operating time in air mode
decrease more than 60% since the rest of the time the heat pump is working in ground-source
mode.

Increasing the size of the ground heat exchanger from 6 meters up to 12 meters, the power
supplied to the heat pump is due to the contribution of the AHX but for the majority to the
contribution of the GHX: the thermal energy coming from the ground is higher. As a
consequence, the operating hours in ground-source mode increase, meanwhile the amount
of hours in which the heat pump extracts heat from the air decrease. The amount of the
electric power consumption reduction of the heat pump due to the different size of GHX,
respect to the reference case, was estimated to be equal to 16%. Comparing in relative terms
the reduction in heat pump consumption between the case where the flat panel length is 6
metres and this configuration, a reduction in percentage equal to 9 % is carried out.

When the total length of the flat panel used as ground heat exchanger was extended up to
24 meters, it was possible to achieve an amount of heat pump electric energy consumption
lower than 22% respect to the amount of the reference case ASHP. In terms of working hours,
the heat pump operates few hours using the air mood and almost the totality of the time
exploiting the ground to extract thermal energy. From the relative comparison between this
configuration and the case where the flat panel length is 6 metres, it was found that the
percentage reduction is equal to 15%.
5.2.6 Different GHX lengths for a standard ground-source heat pump

The different size of the flat panel also affects the inlet fluid temperature of the heat pump.
Figure 5.1 shows the trends of the temperatures during a period of 40 hours in January (from
hour 360th to hour 400th of the year), when the system is mainly exploiting the ground.
For the simulation three different lengths have been considered: 6 meters, 12 meters and 24
meters. In each case is possible to see that the inlet temperature varies with a certain step
between two values. This is due to the on-off of the heat pump. In fact, the switching on and
off of the heat pum affects all the source loop till the return fluid will enter into the heat pump
again. The dynamics of the transitions of the heat pump hasn’t been considered in the model
so the variation of the temperature is a step-variation. In the 6 meters case, some other
oscillation of the temperature can be noticed; this is due to some instabilities in the
air/ground switching control. This instabilities have been considered negligible in a first
approach analysis where the switch between air and ground is not optimized.
It becomes evident from the temperature trends that, as the heat exchanger length increases,
the inlet temperature of the heat pump increases too, allowing the heat pump to work with
higher COP. Increasing the size of the Flat-Panel from 6 up to 24 meters, the temperature
supplied to the heat pump rises up to 8 °C. This is beneficial for the efficiency of the whole
system but requires longer, and consequently more expansive, flat-panel ground heat
exchangers.
10
6 meters 12 meters
-5
-10
360 370 380 390 400
Figure 5.1 – HP inlet fluid temperature
5.2.7 DSHP with 6 meters of GHX, with and without PCM

Figure 5.2 shows the average ground temperature obtained by two TRNSYS simulations with
two different flat-panels configurations. In both cases, the length of the flat panel doesn’t
change but in one simulation some PCM has been coupled with the flat panel itself. The
simulation period is from hour 360th to hour 730th of the year. The chosen PCM has a
melting/freezing temperature of about 3°C. The effect of coupling it with the flat panel is
reflected on the temeprature of the ground close to the flat panel. Using the PCM
configuration the temperature is higher since the PCM stays for a lot of hours at the phase
change temperature where the freezing or melting material depends on the energy fluxes
between the flat-panel and the ground. This has a direct consequence on the outlet liquid
temperature of the flat panel, which can be higher. If this temperature is higher the heat
pump can work with higher COP.
9
-1
-3
6 meters 6 meters + pcm
-5
360 460 560 660
Figure 5.2 – Ground temperature
5.2.8 Energy comparison

Figure 5.3 represents the electric power histograms of the different plant configurations. The
simulation results show that the use of a multi-source heat pump can may be fairly profitable
because it can reduce the heat pump electrical energy consumption. In addition, the switch
between the air-source and ground-source can effectively alleviate the frosting issue, which
is a common issue for operation of a heat pump in the cold winter.
450000
400000
350000
Electic Power [kJ]
300000
250000
200000
150000
100000
50000
0
ASHP DSHP DSHP DSHP DSHP DSHP
(GHX 6m) (GHX 6m) (GHX 6m) (GHX 12m) (GHX 24m)
+ PV/T + PCM
Figure 5.3 – Electric power histogram of different plant configurations

PART C – Preliminary MES

state configurations
1 Introduction
The MES system control will be implemented in WP4 according to different configuration
states of the HP and rules for the thermal sources optimisation. In the following paragraphs,
the methodology of the process is presented, as preliminary discussed and agreed with IMP
(WP4). This approach is an advancement of what already proposed in Deliverable 3.2, and
follows a deeper knowledge of the building system. Further advancements will be developed
during the project, definitely.
Mainly, the methodology is based on the knowledge of the thermodynamic state of all system
components, and therefore relevance has the monitoring system, which is here reported as
designed at the present step to identify probes for operating control needs and overall
behaviour of the system. Then, preliminary operating configurations are proposed at user-
side (combinations of different terminals for cooling/heating) and sources-side (combinations
of different thermal sources), to define different system states for the logic control of all
devices (HP, GHX, AHX, PVT, valves, …). Finally, some control rules to control some
proportional valves are proposed.
The effort here carried out is mainly addressed to share the methodology with all partners,
and to benefit of their contributes.
2 Monitoring system
The monitoring system at the moment designed is depicted in Fig. 1.1, in which all probes are
set in specific plant sections to mainly collect the thermodynamic state of all parts of the
IDEAS system. With exception of few probes directly related to the control unit or for other
needs, a datalogger will collect all probes and store all values via FTP in a storage unit; the
control unit will be then connected with the datalogger via MODBUS.
For what concern the hydraulic system and therefore the working fluid (side-user, side-
sources), temperature measurements will be measured by PT sensors. They will be located at
various places in the whole system; i.e., the temperature will be monitored at inlets and
outlets of the ground heat exchanger (GHX), air heat exchanger (AHX), PVT. The average tank
temperature will be monitored for BF1 as well as for BF2. During measurements also the mass
flow rate of working fluid will be monitored using flowmeters. In order to monitor the
performance of the heat pump, the temperature at the inlets and outlets of the exchangers
HX1 and HX2 will be measured (4 probes in total), the same as pressure at the inlets of both
exchangers. Gas pressure will be also measured for knowledge of the compressor’s pressure
drop. Rooms temperature will be controlled as reference for the knowledge of the setpoint,
as well as the radiant floor and the weather conditions. Moreover, electricity supplied to the
compressor and the circulation pumps will be monitored, as well as at the PVT panels and
inverter.
In Tab. 1.1, a list of probes, parameters and functions are presented, as described as follows:
- Probes (m) are values collected in real time from the monitoring system;
- Parameters (fixed values) are default reference values;
- Functions (f) are relationships between probes and parameters to select the system
state and manage the plant;
- Rules (r) are functions to specifically control the proportional valves.
T RH USER SOURCES
T
radiant floor
RF HF solar source
PVT
P3 T
RF
S
V5
V4
V6 T FM
T FM fan coil
FC
T BF1
T BF2
HP P1
LEGEND: T FM
P2
3
2
1 proportional valve
clapet valve HX2 HX1

pump T
FM
T Temperature
T V1
RH Relative Humidity HF T T T
GHX_1 no PCMs V3
FM Flow Meter
V2
A
HF Heat Flux meter
air source T RH
HF T T
T FM
GHX_2 CONTAINERS G AHX
HF T
GHX_3 GRANULATE ground source T
Figure 2.1 – Probes location
Table 2.1 – List of probes (m), parameters (values), functions (f) and rules (r) to support the control system
NAME VALUE UNIT DESCRIPTION
m_a f kg/h Mass flow rate of the working fluid through AHX (wfs)
m_a_a f kg/h Mass flow rate of outdoor air through AHX (air)
Qa f W Thermal power of AHX exchanger
RHa m % Relative humidity of outdoor air at the AHX
Ta m °C Outdoor air temperature at the AHX

Ta_AHX_in m °C Inlet temperature of the working fluid entering AHX (wfs)
Ta_AHX_out m °C Outlet temperature of the working fluid leaving AHX (wfs)
DTag_span_S 5 K Min temp. difference between ground and outdoor air
temp. for ground exploitation in summer
DTag_span_W 3 K Min temp. difference between ground and outdoor air
temp. for ground exploitation in winter
HF_GHX1 m W/m2 Heat flux at the GHX_1
m_g m kg/h Mass flow rate into geothermal loop (wfs)
Qg f W Thermal power of geothermal loop
Ta_gsave_S 30 °C Min outdoor air temperature to avoid ground exploitation
in summer
Ta_gsave_W 8 °C Min outdoor air temperature to avoid ground exploitation
in winter
Tg f °C Ground temperature
Tg_GHX1 m °C Ground temperature of the flat-panel group GHX_1
Tg_GHX1_out m °C Outlet temperature from GHX_1
Tg_in m °C Inlet temperature at the the geothermal loop
Tg_out f °C Outlet temperature at the the geothermal loop
c_wfs 4.2 kJ/(kg*K) Specific heat of the working fluid in source loop
c_wfu 4.2 kJ/(kg*K) Specific heat of the working fluid in user loop
m_HX1 m kg/h Mass flow rate into HX1 exchanger (wfs)
m_HX2 m kg/h Mass flow rate into HX2 exchanger (wfu)
P_HP m W HP power
P_P1 m W P1 power
P_P2 m W P2 power
P_P3 m W P3 power
Qu_S f W Thermal power requirement in cooling mode
Qu_W f W Thermal power requirement in heating mode
T_BF2_W f °C BF2 tank target temperature in winter (inlet temperature
at HX2)
T_BF2_S f °C BF2 tank target temperature in summer (inlet temperature
at HX2)
DT_BF2_W 2 K Hysteresis for turning off in winter
DT_BF2_S 2 K
T_BF1 m °C BF1 tank temperature (inlet temperature at HX1)
T_BF2 m °C BF2 tank temperature (inlet temperature at HX2)
T_HX1 m °C Outlet temperature at HX1 exchanger
T_HX2 m °C Outlet temperature at HX2 exchanger
DTr_down_W 1 K Hysteresis for turning off in winter
DTr_up_W 1 K Hysteresis for turning on in winter
DTr_down_S 1 K Hysteresis for turning off in summer

DTr_up_S 1 K Hysteresis for turning on in summer
HF_RF m W/m2 Radiant floor heat flux
m_fc m kg/h Mass flow rate into FAN COIL (wfu)
RHr m % Relative humidity of indoor air (room)
Tr m °C Room temperature
Tr_target_S 27 °C Setpoint for room temperature in summer
Tr_target_W 21 °C Setpoint for room temperature in winter
eta_s_e 0.15 % Electrical efficiency of PVT
eta_s_t 0.7 % Thermal efficiency of PVT
m_s m kg/h Mass flow rate into PVT (wfs)
Ps f W PVT power
Psr m W Real PVT power
Qs f W Thermal power of PVT panel
Qs_min 50 W/m2 Min solar power for PVT thermal exploitation
r_PVT 0.1 % Solar reflectance of PVT panel
Ts m °C PVT temperature
Ts_limit 80 °C Max PVT temperature
Ts_PVT_in m °C Inlet temperature of the working fluid entering PVT
Ts_PVT_out m °C Outlet temperature of the working fluid leaving PVT
BURIAN m logic Forecast of very cold weather within X days (1=save UTES)
Gs m W/m2 Solar irradiance
SAHARA m logic Forecast of very hot weather within X days (1=save UTES)
R1 r % Proportionality of valve 2 (sources)
R5 r % Proportionality of valve 5 (user)
Table 2.2 – Preliminary functions (f) and rules (r)

NAME FUNCTION
Tg ground average temperature of sole working groups (Tg_GHX1, Tg_GHX2,
Tg_GHX3)
Tg_out outlet average temperature of sole working groups (Tg_GHX1, Tg_GHX2,
Tg_GHX3)
Qa m_g*c_wfs*(Ta_AHX_in-Ta_AHX_out)
Qg m_g*c_wfs*(Tg_in-Tg_out)
Qs if m_s=0 then Gs*(1-r_PVT)*(eta_s_t-eta_s_e) else m_s*c_wfs*(Ts_in-Ts_out)
Ps eta_s_e*Gs*(1-r_PVT)
Qu_W m_HX2*c_wfu*(T_HX2-T_BF2)
Qu_S m_HX2*c_wfu*(T_BF2-T_HX2)
R1 to be defined
R2 (T_HX1-Tg_out)/(Ta_AHX_out-Tg_out)
R3 to be defined
R4 to be defined
R5 MAX(ABS(Tr_target_W-Tr); DTr_up)/DTr_up
3 Proportional diverting valves

In order to facilitate the interpretation of all diverting valves settings, it was decided to
identify each inlet/outlet of the V valves with a number. So, the nomenclature of the valves
will be Vi.j, where the “i” indicate the number of the valve, and the “j” indicates the
considered inlet/outlet.
The in/out section numbering follows the clockwise direction: a graphical representation is
shown in Fig. 1.2.
Figure 3.1 - V valves section legend
4 User-side system states configurations

At user-side, the heating or cooling requirement is controlled by a standard room
temperature sensor which turns on/off the pump P2, and eventually the HP according to the
temperature in the buffer tank BF2.
As the room temperature could be far from the setpoint and because of the high thermal
inertia of the radiant floor, valve n.5 is proposed proportionally controlled (R) to
maximise/minimise the fan coil usage according to the difference between the room
temperature and the target temperature; within a default interval, the fan coil is then no
more used.
This state of the system is called U1, as depicted in Tab. 1.7, and the system configuration is
reported in Tab. 1.8, in which is stated that for heating/cooling:
- HP is turned on (according to T_BF2);
- P2 is turned on;
- V5.1 is full open;
- V5.2 is proportionally controlled (R);
- V5.3 follow the proportional control of V5.2 (1-R);
- V6.1 is full open;
- V6.2 is closed;
- V6.3 is full open.
Table 4.1 – Cases and system states

CASES ACRONYM STATE EXCHANGERS HP
Heating/Cooling RF&FC U1 RF + FC On
Table 4.2 – System states configurations – USER SIDE
U1 RF&FC
SYSTEM
HP X
P2 X
P3
V5.1 X
V5.2 R
V5.3 1-R
V6.1 X
V6.2
V6.3 X
Table 4.3 – Preliminary rules for valve V5 in winter or summer season

NAME RULES
R_V5 MAX(ABS(Tr_target_W-Tr); DTr_up_W) / DTr_up_W
OR
MAX(ABS(Tr_target_W-Tr); DTr_up_S) / DTr_up_S
5 Sources-side system states configurations

Table 1.6 lists all possible thermal sources combinations and modality in which the system
could be operating. These states of the system are mainly related to the corresponding heat
exchangers and the on/off of the heat pump. E.g., the acronym “G” is for the sole exploitation
of the ground as thermal source, that needs to set the group valves in a way suitable to use
the sole GHX exchanger. All system states configuration does not change between winter and
summer, but their setting follows the energy requirement that are not only related to the HP
operating for heating or cooling (primary function), but also for cooling the PVT, underground
thermal energy storage, free cooling or heating.
Table 5.1 – Cases and system states

CASES ACRONYM STATE EXCHANGERS HP AIM
Solar source S S1 PVT On Use of PVT for
heating
Ground source G S2 GHX On Use of GHX for
heating/cooling
Air source A S3 AHX On Use of AHX for
heating/cooling
Ground + Air source GA S4 GHX + AHX On Use of GHX & AHX
for heating/cooling
Solar + Air source SA S5 AHX + PVT On Use of AHX & PVT
for heating
Solar + Ground source SG S6 GHX + PVT On Use of GHX & PVT
for heating
Solar + Ground + Air SGA S7 GHX + AHX + PVT On Use of GHX, AHX &
source PVT for heating
Free Heating FREE_H S8 PVT Off Use of PVT for
direct heating
Free Cooling FREE_C S9 GHX + AHX Off Use of GHX & AHX
for direct cooling
Underground heating UHS S10 GHX + AHX + PVT Off Use of AHX & PVT
storage for ground heating
storage
Underground cooling UCS S11 GHX + AHX + PVT Off Use of AHX & PVT
storage for ground cooling
storage
PVT cooling PVT S12 GHX + AHX + PVT Off Use of GHX & AHX
for PVT cooling
According to the list of parameters described in Table 1.1, the conditions that address to all
specific system states configurations are reported in Table 1.7 for winter season, and in Table
1.8 for summer season. Both tables are still preliminary and not completed yet; they will be
probably enhanced during the implementation of the control unit and the experimental test.
The state S4 is here described for a better understanding.
The configuration for ground and air thermal exploitation (state S4, acronym GA) in winter
season (heating) has to be selected if the following conditions are respected:
- air temperature has to be lower than a specific threshold ( Ta_gsave_W), which

preserves the thermal energy in ground;
- air temperature has to be higher than the ground temperature;
- the difference between air and ground temperature has to be higher than a specific
value (DTag_span_W);
- PVT temperature has to be lower than the ground temperature;
- the thermal power of the PVT panel has to be lower than a specific threshold
(Qs_min);
- HP has to be turned on;
- No adverse weather conditions are expected in the coming days.
Table 5.2 - States conditions in winter season

STATE NAME Ta Tg Ts Qs HP BURIAN
S1 S >Ta_gsave_W <Ta+DTag_span_W > Ta > Qs_min on
S2 G <Ta_gsave_W >Ta+DTag_span_W < Tg < Qs_min on FALSE
S3 A >Ta_gsave_W < Ta+DTag_span_W < Ta < Qs_min on
S4 G+A <Ta_gsave_W >Ta+DTag_span_W < Tg < Qs_min on FALSE
AND
>Tg
S5 A+S >Ta_gsave_W < Ta+DTag_span_W > Ta > Qs_min on
S6 G+S <Ta_gsave_W >Ta+DTag_span_W > Tg > Qs_min on FALSE
S7 G+A+S < a_gsave_W >Ta+DTag_span_W > Ta > Qs_min on FALSE
AND
>Tg
S8 FREE_H > > Qu_W and > off
T_B Qs_min
F2
S9 FREE_C not analysed or relevant
S10 UTHS < T_BF1 > Qu_W and > off
Qs_min
S11 UTCS not analysed or relevant
S12 PVT not analysed or relevant
Table 5.3 - States conditions in summer season

STATE NAME Ta Tg Ts Tr Qs HP SAHARA
S1 S
S2 G >Ta_gsave_S <Ta-DTag_span_S on FALSE
S3 A <Ta_gsave_S on
S4 G+A not analysed or relevant
S5 A+S not analysed or relevant
S6 G+S not analysed or relevant
S7 G+A+S not analysed or relevant
S8 FREE_H >Ts_limit <Tr_target_S off
AND
>Ta
S9 FREE_C <TBF2-DTr_down <TBF2-DTr_down off
S10 UTHS not analysed or relevant

S11 UTCS <Tg <Ta off
S12 PVT >Ta off
In Table 1.9 all configuration states of the system are reported in terms of states of group
valves, HP and P1 circulator.
Following for simplicity the previous state S4 (GA):
- HP is operating, as well as the circulator P1;
- Valve n.1 is open at side 1 and 3;
- Valve n.2 is open at side 3 and proportionally at sides 1 and 2, to control the mass flow
rate toward GHX and AHX;
- Valve n.3 is open at side 3 and proportionally at sides 1 and 2, to modulate the
operating in parallel or series;
- Valve n.4 is open at side 2 and 3, closed at side 1 (no PVT).
Table 5.4 – System states configurations – SOURCE SIDE

FREE_H
FREE_C
UHS
SGA
UCS
PVT
SYSTEM
GA
SG
SA
G
A
S
S1 S2 S3 S4 S5 S6 S7 S8 S9 S10 S11 S12

HP X X X X X X X
P1 X X X X X X X X X X X
P3 X
V1.1 X X X X X X X X X X X X
V1.2 X
V1.3 X X X X X X X X X X X
V2.1 X R X R X R X
V2.2 X 1-R X 1-R 1-R X X
V2.3 X X X X X X X X X X X
V3.1 X R X R
V3.2 1-R X X X 1-R X
V3.3 X X X X X X X X
V4.1 X R R R R R X
V4.2 X X X X X X X X X X X X
V4.3 X X X 1-R 1-R 1-R 1-R X 1-R X
X, section or device on
R, section proportionally controlled
“”, section or device off
Finally, in Table 1.10 is given as an example the sole rule to control the proportionality of valve
n.2, as follows from the energy balance between valve n.1 and n.3. By multiplying the
reported ratio for the overall mass flow rate flowing at HX1, the share to the AHX is estimated
and that to the GHX follows as difference. Also in this case, only a preliminary proposal is here
reported, since the operating rules will be compiled during the installation of the small scale
prototype.
Table 5.5 – Preliminary rules
NAME FUNCTION
R_V1 to be defined
R_V2 (T_HX1-Tg_out)/(Ta_AHX_out-Tg_out)
R_V3 to be defined
R_V4 to be defined

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PART A - TRNSYS types for the ITES-MES numerical model .................................................... 1

PART B - ITES-MES numerical model ........................................................................................ 1

3 Small-scale system layout .................................................................................................. 4

PART C – Preliminary MES state configurations ...................................................................... 1

PART A - TRNSYS types for the

Figure 1.1 – Tasks included in WP3

2 TRNSYS types for flat-panel ground heat exchangers

2.1 Type 207: development of TRNSYS type based on MATLAB code

(a) (b) (c)

Figure 2.1 – Bi-dimensional domain

Table 2.1– Inputs to the MATLAB Model

Input Input Name Unit Description

12 x-axis vector [m] The vector representing the position of all

(a) (b) (c)

(d) (e) (f)

2.1.2 Power set as input

2.1.3 Inputs, outputs and parameters

Table 2.2 – Description of Parameters of Type 207

Parameter Parameter Name Unit Description

so only positive value are allowed (the flat-

Table 2.3 – Description of Inputs of Type 207

Input Input Name Unit Description

Table 2.4- Description of Outputs of Type 207

Output Output Name Unit Description

2.1.4 Comparison between MATLAB code and TRNSYS type

Table 2.5 – Terrain properties for the comparison MATLAB/TRNSYS

Table 2.6 – Flat-panel geometrical properties for the comparison MATLAB/TRNSYS

Flat Panel Geometrical Properties

External Surface Temperature

Table 2.8 – MATLAB geometrical domain

Table 2.9 – TRNSYS geometrical domain

Figure 2.5 – Simplified flow chart of Type 206

2.2.1 Inputs and outputs

Table 2.10 – Description of Inputs of Type 206

Input Input Name Unit Description

Table 2.11 – Description of Outputs of Type 206

Output Output Name Unit Description

2.2.2 Comparison between Type 206 and TESS Type 997

Flat-panel Geometrical Properties

Horizontal Pipes Geometrical Properties

2.2.2.1 Comparison during transients

2.2.3 Behaviour in a full plant

Figure 2.10 – Full plant simulation on TRNSYS using Type206

2.3 Type 209: improving of Type 206 by adding of PCM functionality

2.3.1 Model description

𝑄̇ 𝑝𝑐𝑚⁡ = −⁡𝑄̇ 𝑔𝑟𝑜𝑢𝑛𝑑 (5)

2.3.2 Inputs, outputs and parameters

Table 2.14 – Description of Parameters of Type 209

Parameter Parameter Name Unit Description

Table 2.15 – Description of Inputs of Type 209

Input Input Name Unit Description

Table 2.16 – Description of Outputs of Type 209

Output Output Name Unit Description

2.3.3 Increasing the computational speed

2.3.5 Behaviour in a full plant

3 TRNSYS type for the PV/T panel

3.1 Model description

3.2 Inputs, outputs and parameters

Table 3.1 - Description of Parameters of Type 601

Parameter Name Unit Typical Comment

5 Resistance of (h m² 3.0 The resistance to heat transfer for