Data sheet acquired from Harris Semiconductor

SCHS052B – Revised June 2003

The CD4067B and CD4097B types are supplied

in 24-lead hermetic dual-in-line ceramic
packages (F3A suffix), 24-lead dual-in-line
plastic packages (E suffix), 24-lead
small-outline packages (M, M96, and NSR
suffixes), and 24-lead thin shrink small-outline
packages (P and PWR suffixes).

Copyright © 2003, Texas Instruments Incorporated

 PACKAGE OPTION ADDENDUM

www.ti.com 18-Nov-2023

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

CD4067BF ACTIVE CDIP J 24 15 Non-RoHS & Call TI N / A for Pkg Type -55 to 125 CD4067BF Samples
Non-Green
CD4067BF3A ACTIVE CDIP J 24 15 Non-RoHS & Call TI N / A for Pkg Type -55 to 125 CD4067BF3A Samples
Non-Green
CD4067BM LIFEBUY SOIC DW 24 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4067BM
CD4067BM96 ACTIVE SOIC DW 24 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -55 to 125 CD4067BM Samples

CD4067BM96G4 LIFEBUY SOIC DW 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4067BM
CD4067BPW LIFEBUY TSSOP PW 24 60 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM067B
CD4067BPWG4 LIFEBUY TSSOP PW 24 60 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM067B
CD4067BPWR ACTIVE TSSOP PW 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM067B Samples

CD4097BF ACTIVE CDIP J 24 15 Non-RoHS & Call TI N / A for Pkg Type -55 to 125 CD4097BF Samples
Non-Green
CD4097BM LIFEBUY SOIC DW 24 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4097BM
CD4097BME4 LIFEBUY SOIC DW 24 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4097BM
CD4097BMG4 LIFEBUY SOIC DW 24 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4097BM
CD4097BPW LIFEBUY TSSOP PW 24 60 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM097B
CD4097BPWR LIFEBUY TSSOP PW 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM097B
CD4097BPWRE4 LIFEBUY TSSOP PW 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM097B

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 18-Nov-2023

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF CD4067B, CD4067B-MIL, CD4097B, CD4097B-MIL :

• Catalog : CD4067B, CD4097B

• Military : CD4067B-MIL, CD4097B-MIL

NOTE: Qualified Version Definitions:

• Catalog - TI's standard catalog product

• Military - QML certified for Military and Defense Applications

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 5-Dec-2023

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4067BM96 SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1
CD4067BM96G4 SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1
CD4067BPWR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1
CD4097BPWR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 5-Dec-2023

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4067BM96 SOIC DW 24 2000 350.0 350.0 43.0
CD4067BM96G4 SOIC DW 24 2000 350.0 350.0 43.0
CD4067BPWR TSSOP PW 24 2000 356.0 356.0 35.0
CD4097BPWR TSSOP PW 24 2000 356.0 356.0 35.0

Pack Materials-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 5-Dec-2023

TUBE

T - Tube
height L - Tube length

W - Tube
width

B - Alignment groove width

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
CD4067BM DW SOIC 24 25 506.98 12.7 4826 6.6
CD4067BPW PW TSSOP 24 60 530 10.2 3600 3.5
CD4067BPWG4 PW TSSOP 24 60 530 10.2 3600 3.5
CD4097BM DW SOIC 24 25 506.98 12.7 4826 6.6
CD4097BME4 DW SOIC 24 25 506.98 12.7 4826 6.6
CD4097BMG4 DW SOIC 24 25 506.98 12.7 4826 6.6
CD4097BPW PW TSSOP 24 60 530 10.2 3600 3.5

Pack Materials-Page 3
 MECHANICAL DATA

MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997

J (R-GDIP-T**) CERAMIC DUAL-IN-LINE PACKAGE

24 PINS SHOWN

24 13

1 12
0.065 (1,65)
Lens Protrusion (Lens Optional)
0.045 (1,14) 0.010 (0.25) MAX

0.090 (2,29) 0.175 (4,45)

A
0.060 (1,53) 0.140 (3,56)

Seating Plane

0.018 (0,46) MIN

0.022 (0,56) 0.125 (3,18) MIN

0.100 (2,54)
0.014 (0,36) 0.012 (0,30)
0.008 (0,20)

PINS ** 24 28 32 40
DIM NARR WIDE NARR WIDE NARR WIDE NARR WIDE
MAX 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85)
”A”
MIN 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99)
MAX 1.265(32,13) 1.265(32,13) 1.465(37,21) 1.465(37,21) 1.668(42,37) 1.668(42,37) 2.068(52,53) 2.068(52,53)
”B”
MIN 1.235(31,37) 1.235(31,37) 1.435(36,45) 1.435(36,45) 1.632(41,45) 1.632(41,45) 2.032(51,61) 2.032(51,61)
MAX 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19)
”C”
MIN 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50)

4040084/C 10/97

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.
C. Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin).
D. This package can be hermetically sealed with a ceramic lid using glass frit.
E. Index point is provided on cap for terminal identification.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 PACKAGE OUTLINE
PW0024A SCALE 2.000
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

SEATING
PLANE
6.6 C
TYP
A 6.2
0.1 C
PIN 1 INDEX AREA
22X 0.65
24
1

2X
7.9 7.15
7.7
NOTE 3

12
13
0.30
24X
4.5 0.19 1.2 MAX
B
4.3 0.1 C A B
NOTE 4

0.25
GAGE PLANE
0.15
0.05

(0.15) TYP
SEE DETAIL A 0.75
0 -8 0.50
DETAIL A
A 20

TYPICAL

4220208/A 02/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.

www.ti.com
 EXAMPLE BOARD LAYOUT
PW0024A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

24X (1.5) SYMM

1 (R0.05) TYP

24X (0.45) 24

22X (0.65)
SYMM

12 13

(5.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 10X

SOLDER MASK METAL UNDER SOLDER MASK

METAL
OPENING SOLDER MASK OPENING

EXPOSED METAL EXPOSED METAL

0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND

NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)
SOLDER MASK DETAILS
15.000

4220208/A 02/2017
NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
PW0024A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

24X (1.5) SYMM

(R0.05) TYP
1
24X (0.45) 24

22X (0.65)
SYMM

12 13

(5.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE: 10X

4220208/A 02/2017
NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

www.ti.com
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