ELECTRICAL NETWORK ANALYSIS LAB

PROJECT NAME : SIMPLE TWO WAY INTERCOM CIRCUIT

GROUP MEMBERS :

1. IFRAH GOHAR KHAN(220701058)

2. MAHNOOR(220701002)

DEPARTMENT: AVIONICS ENGINEERING

SUBMITTED TO:MA’AM RIDA NASIR

 TABLE OF CONTENTS

CONTENTS
SERIAL
NUMBER

1 ABSTRACT

2 INTRODUCTION

3 BACKGROUND OF THE PROJECT

4 AIM/OBJECTIVE OF THE PROJECT

5 SIGNIFICANCE OF THE PROJECT

6 SCOPE OF THE PROJECT

7 ADVANTAGES OF THE PROJECT

8 MATERIALS/ TOOLS AND EQUIPMENT USED

9 EXPALANATION/DETAILS OF SPECIFIC MATERIALS

AND COMPONENTS USED

10 CIRCUIT DIAGRAM AND WORKING OF THE PROJECT

11 SEQUENCE OF OPERAATIONS

12 CONCLUSION

ABSTRACT:

This project is on the design and construction and implementation of an audio

amplifier using our ENA and ENA lab concepts and methods. This project aims to design and
implement a high-performance audio amplifier, utilizing advanced circuitry and components.
The focus is on achieving optimal signal clarity, efficiency, and compatibility with various audio
sources. Through rigorous testing and optimization, the project seeks to deliver a reliable and
high-quality audio amplification solution, catering to diverse applications in entertainment and
communication.

INTRODUCTION:

In a world where audio quality is paramount, our proposed High-Performance Audio Amplifier
project aims to redefine the audio experience. As technology advances and audio enthusiasts
seek superior sound reproduction, the need for an exceptional audio amplifier becomes
increasingly evident. This project seeks to design and develop an innovative audio amplifier that
not only meets but exceeds the expectations of audiophiles, catering to a diverse range of audio
applications.

Our team is driven by a passion for audio excellence, and this proposal outlines the key
objectives, scope, and anticipated outcomes of our endeavor. By leveraging cutting-edge
technologies and meticulous design principles, our goal is to create an audio amplifier that
delivers unparalleled fidelity, precision, and versatility. This proposal will provide an overview
of the project's significance, outline the methodology, and highlight the expected benefits of our
High-Performance Audio Amplifier

BACKGROUND OF THE PROJECT:

The project background acknowledges the evolution of audio amplification, highlighting the
challenges faced by traditional amplifiers in meeting modern audio expectations. Our High-
Performance Audio Amplifier project aims to overcome these challenges by combining
traditional audio engineering principles with cutting-edge technologies, creating an amplifier that
sets new standards in sound quality. Embracing both legacy excellence and contemporary
advancements, the project aims to deliver an authentic and immersive audio experience across
various applications.

AIM OF THE PROJECT:

 Design and develop an innovative audio amplifier.

 Surpass existing standards in sound quality, fidelity, and versatility by making use of
different values of capacitors and resistors.
 Combine traditional audio engineering principles with state-of-the-art technologies.
 Cater to the evolving needs of audio enthusiasts and diverse audio applications.
 Seamlessly integrate with modern audio sources.
 Provide an authentic and immersive listening experience.
 Push the boundaries of audio reproduction capabilities.
SIGNIFICANCE OF THE PROJECT:

 Elevates audio experience with superior sound quality.

 Contributes to technological advancements in audio amplification.
 Offers versatility across diverse audio applications.
 Seamlessly integrates with modern audio sources.
 Meets and exceeds audiophile expectations.
 Potential contribution to industry standards.
 Enhances entertainment and communication experiences

SCOPE OF THE PROJECT

 Design and develop a high-performance audio amplifier.

 Incorporate advanced technologies for superior audio quality.
 Ensure compatibility with modern audio sources.
 Rigorous testing and optimization for reliability.
 Comprehensive documentation of design and specifications.
 User-friendly interface for control and customization.
 Alignment with industry standards and potential contributions.
 Versatility for applications in home and professional setups.
 Prototyping for real-world testing and validation.
 Establish a framework for continuous improvement

ADVANTAGES OF THE PROJECT:

 Easy To Use
 User friendly operations
 Clear audio quality
 Cost effective solution
 Energy efficient design
 Customizable features
 Scalability
 Seamless integration and communication
 Modern technological features

MATERIALS USED:

1. IRFZ44N
2. Resistors (10K)
3. 16V 100uF Capacitor
4. Wires
 5. Speaker
6. Headphone Jack

DETAILS OF COMPONENTS USED:

1. Veroboard:
Veroboard is a brand of stripboard, a pre-formed circuit board material of copper strips
on an insulating bonded paper board which was originated and developed in the early
1960s by the Electronics Department of Vero Precision Engineering Ltd (VPE). This type
of wiring board may be used for initial electronic circuit development, to construct
prototypes for bench testing or in the production of complete electronic units in small
quantities. These are the advantages of the vero board.
They cost significantly less than PCB’s.
It is easier to modify a circuit on Veroboard rather than a PCB.
Veroboard is easily available. PCB’s are impossible or at best hard to obtain for older
projects.
Making your own PCB can prove to be difficult. You’ll need some extra kit and
chemicals and then there’s the drilling to contend with
2. Soldering, Soldering wire And Soldering Paste
Soldering: Soldering is a process used for joining metal parts to form a mechanical or
electrical bond. It typically uses a low melting point metal alloy (solder) which is
melted and applied to the metal parts to be joined and this bonds to the metal parts
and forms a connection when the solder solidifies.
Soldering Wire: Solder wires are generally two different types - lead alloy solder
wire and lead-free solder. There are also rosin-core solder wire which has a tube in
the center of the wire that contains the flux. Lead solder wire is usually made from an
alloy of lead and tin.
Soldering Paste: Solder paste is commonly used to create electrical connections and
mechanical bonds between printed circuit board pads and surface mount devices, such
as resistors and capacitors. It is made up of powdered solder in a flux paste. The flux
serves several purposes.
3. IRFZ44N:
Type: Power MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor)
Purpose: Typically used in electronic circuits as a switch or amplifier for moderate to
high power applications.
Characteristics: High current-carrying capability, low on-resistance, suitable for
switching applications.
In the context of the IRFZ44N MOSFET, the "N" stands for "N-Channel." MOSFETs
come in two main types: N-Channel and P-Channel. These designations refer to the
type of semiconductor material used in the channel through which current flows.
N-Channel MOSFET (IRFZ44N):
 The "N" indicates that the MOSFET is made with N-type semiconductor material in
the channel region.
In an N-Channel MOSFET, electrons are the majority charge carriers in the channel.
When a positive voltage is applied to the gate relative to the source, it creates an
electric field that allows electrons to flow from the source to the drain, completing the
circuit. in practical terms, N-Channel MOSFETs are more commonly used in
electronic circuits, especially in applications where the majority of charge carriers are
electrons. The IRFZ44N, being an N-Channel MOSFET, is often employed in power
electronics and switching applications where high current capabilities and fast
switching speeds are crucial.

4. Resistors (10K):
Value: 10,000 ohms (10KΩ)
Purpose: Resistors limit the flow of current in a circuit, and a 10K resistor is
commonly used for various applications, such as voltage dividers or pull-up/pull-
down resistors.
5. 16V 100uF Capacitor
Voltage Rating: 16 volts
Capacitance: 100 microfarads (uF)
Purpose: Capacitors store and release electrical energy. In this context, it may be used
for smoothing voltage fluctuations or as a filter in audio applications.
6. Wires:
Purpose: Connecting various components in the circuit. Wires serve as conduits for
electrical signals and power, ensuring proper functioning of the circuit.
7. Speaker:
Type: Transducer that converts electrical signals into sound waves.
Purpose: Output device for audio signals. The speaker produces sound based on the
electrical signals received from the amplifier circuit.
8. Headphone Jack:
Type: 3.5mm stereo audio jack.
 Purpose: Provides a connection point for headphones, allowing audio signals to be
transferred from the amplifier circuit to headphones for personal listening. Often used
in audio output applications.

CIRCUIT DIAGRAM OF THE PROJECT:

AUDIO JACK

WORKING OF THE PRROJECT:

In this high-performance audio amplifier project, the operation involves several key stages to
deliver an enhanced audio experience.

Firstly, audio signals from a source, such as a music player or smartphone, enter the amplifier.
These signals undergo conditioning in the input stage to prepare them for amplification.

The heart of the amplification process lies in the MOSFET, specifically the IRFZ44N, which
serves as a crucial component in the circuit. The MOSFET amplifies the electrical signals,
significantly increasing their strength and power. This is particularly beneficial for applications
where high-current capabilities and fast switching speeds are essential, as in audio amplification.
To further refine and enhance the audio signals, additional components like resistors and
capacitors may be strategically placed in the circuit. These elements contribute to shaping the
sound and optimizing its quality.

The amplified signals are then directed to the output stage, where they can be connected to either
a speaker or a headphone jack. If a speaker is used, the signals drive the speaker, producing
sound waves for a broader auditory experience. On the other hand, if a headphone jack is
incorporated, users have the option of connecting headphones for a more personal and immersive
listening session.

SEQUENCE OF OPERATIONS:

 Gather all required components, including the IRFZ44N MOSFET, resistors, capacitors,
wires, speaker, headphone jack, and a vero board.
 Plan the circuit layout on paper or using a schematic diagram.
 Cut the vero board to the needed size and mark positions for component placement and
connection points.
 Begin placing components on the vero board, inserting leads through the holes.
 Connect component leads with insulated wires following the circuit design.
 Carefully place the IRFZ44N MOSFET on the vero board, aligning its leads properly.
 Solder the component leads and wires securely, avoiding overheating.
 Connect the speaker and headphone jack to designated points, ensuring proper grounding.
 Establish power supply connections with correct polarity and voltage levels.
 Perform initial testing before enclosing the circuit to identify any issues.
 Optionally, place the vero board in an enclosure for protection and portability.

Conclusion:

In conclusion, the high-performance audio amplifier project successfully integrates the

IRFZ44N MOSFET, resistors, capacitors, and meticulous wiring on a vero board to create a
robust circuit. This amplifier aims to deliver superior sound quality, versatility, and
compatibility across applications. The iterative process of planning, soldering, and testing has
resulted in a functional and adaptable design. User controls, careful connections, and a
reliable power supply contribute to the project's comprehensive nature. Continuous
improvement, guided by user feedback and emerging technologies, ensures the amplifier's
relevance. In its final form, this project exemplifies a commitment to advancing audio
standards.