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GP1A70R/GP1A71R

OPIC Photointerrupter with


GP1A70R/GP1A71R Encoder Functions

■ Features ■ Outline Dimensions ( Unit : mm )


1. 2-phase ( A, B ) digital output Internal connection diagram
2. Sensing accuracy 6
1 5
( GP1A70R Disk slit pitch : 1.14mm )
GP1A70R 4

6.0
2

7.2
( GP1A71R Disk slit pitch : 0.7mm ) 3
OPIC
3. PWB mounting type 6.0
1 Anode 4 GND
( Lead bending type ) 12.5 2 Cathode 5 V CC
3 V OB 6 V OA
4. TTL compatible output

2.0 - 0.2
0.1
13.0 3 4 5 6
5. Compact, lightweight

+
± 0.15
■ Applications 10.5

2.5MIN.
1. Printers 6.5
2. Copiers 0.75
2 - φ 2.0± 0.1

3. Numerical control machines 2 - C0.2


12.0 2 1
(6.56 ) 2 - (1.75)
2 3 4

3 - (1.27)
1 4.0 ± 0.1 (2.54)
*Tolerance :± 0.3mm
5 6 *( ) : Reference dimensions

*“OPIC ” ( Optical IC ) is a trademark of the SHARP Corporation.


An OPIC consists of a light-detecting element and signal-
processing circuit integrated onto a single chip.

■ Absolute Maximum Ratings ( Ta = 25˚C )


Parameter Symbol Rating Unit
Forward current IF 50 mA
*1
Peak forward current I FM 1 A
Input
Reverse voltage VR 6 V
Power dissipation P 75 mW
Supply voltage V CC 7 V
Output Low level output current I OL 20 mA
Power dissipation PO 250 mW
Operating temperature T opr 0 to + 70 ˚C
Storage temperature T stg - 40 to + 80 ˚C
*2
Soldering temperature Tsol 260 ˚C
*1 Pulse width<=100µ s, Duty ratio 0.01
*2 For 5 seconds

“ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”
GP1A70R/GP1A71R

■ Electro-optical Characteristics ( Ta = 25˚C unless otherwise specified )


Parameter Symbol Conditions MIN. TYP. MAX. Unit
Forward voltage VF I F = 20mA, Ta= 25˚C - 1.2 1.4 V
Input
Reverse current IR V R = 3V, Ta= 25˚C - - 10 µA
Operating supply voltage VCC 4.5 5.0 5.5 V
*3
High level output voltage V OH V CC= 5V, I F = 20mA 2.4 4.9 - V
Output *3
Low level output voltage VOL I OL = 8mA, V CC= 5V, I F = 20mA - 0.1 0.4 V
*4
Supply current I CC V CC= 5V, I F = 20mA - 5 20 mA
Transfer GP1A70R *5 *3
25 50 75 %
Duty ratio DA , D B V CC= 5V, I F = 20mA, f = 2.5kHz
charac- GP1A71R 25 50 75 %
teristics Response frequency f MAX. *3
V CC= 5V, I F = 20mA - - 10 kHz
*3 Measured under the condition shown in Measurement Conditions.
*4 In the condition that output A and B are low level.
t t
*5 D A: AH x 100, D B : BH x 100, Duty ratio : Average disk rotation time per turn
t AP t BP
■ Output Waveforms

Output A
( VOA)
t AH
t AP

Output B
( VOB)
tAB1 t BH Rotational direction : Counterclockwise when seen
from OPIC light detector
t BP

Fig. 1 Forward Current vs. Ambient Fig. 2 Output Power Dissipation vs.
Temperature Ambient Temperature
60 300

50 250
Output power dissipation P O ( mW )
Forward current I F ( mA )

40 200

30 150

20 100

10 50

0 0
0 25 50 70 75 100 0 25 50 70 75 100
Ambient temperature T a ( ˚C) Ambient temperature T a ( ˚C)
GP1A70R/GP1A71R

Fig. 3-a Duty Ratio vs. Frequency Fig. 3-b Duty Ratio vs. Frequency
(GP1A70R) (GP1A71R)
80 80
VCC = 5V VCC = 5V
I F = 20mA
I F = 20mA
T a = 25˚C
70 T a = 25˚C 70

60 60
Duty ratio ( % )

Duty ratio ( % )
t AH t AH
t AP x 100 ( Output A ) t AP x 100 ( Output A )
50 50

40 t BH t BH
40
t BP x 100 ( Output B ) t BP x 100 ( Output B )

30 30

20 20
1 2 5 10 1 2 5 10
Frequency f ( kHz ) Frequency f ( kHz )

Fig. 4-a Phase Difference vs. Frequency Fig. 4-b Phase Difference vs. Freauency
(GP1A70R ) (GP1A71R )
130 130
VCC = 5V VCC = 5V
I F = 20mA I F = 20mA
120 T a = 25˚C 120
Phase difference θ ABI ( deg. )

Phase difference θ AB1 ( deg. )

110 110 t AB1


θ AB1 =
t AP x 360˚
t AB1
θ AB1 = 360˚
100 t AP 100

90 90

80 80

70 70
1 2 5 10 1 2 5 10
Frequency f ( kHz ) Frequency f ( kHz )

Fig. 5-a Duty Ratio vs. Fig. 5-b Duty Ratio vs.
Ambient Temperature Ambient Temperature
(GP1A70R ) (GP1A71R )
80 80
VCC = 5V VCC = 5V
I F = 20mA I F = 20mA
70 f= 2.5kHz 70 f= 2.5kHz

60 60
Duty ratio ( % )
Duty ratio ( % )

t AH
t AH x 100 ( Output A )
t AP x 100 ( Output A ) t AP
50 50

t BH t BH
40 40 x 100 ( Output B )
t BP x 100 ( Output B ) t BP

30 30

20 20
0 10 20 30 40 50 60 70 0 10 20 30 40 50 60 70
Ambient temperature T a ( ˚C) Ambient temperature T a ( ˚C)
GP1A70R/GP1A71R

Fig. 6-a Phase Difference vs. Ambient Fig. 6-b Phase Difference vs. Ambient
Temperature Temperature
130 130
VCC = 5V VCC = 5V
I F = 20mA I F = 20mA
120 f= 2.5kHz 120 f = 2.5kHz

Phase difference θ AB1 ( deg. )


Phase difference θ ABI ( deg. )

110 110 t AB1


θ AB1 = t AP x 360˚
t AB1
θ AB1 = t AP x 360˚
100 100

90 90

80 80

70 70
0 10 20 30 40 50 60 70 0 10 20 30 40 50 60 70
Ambient temperature T a ( ˚C) Ambient temperature T a ( ˚C)
Fig. 7-a Duty Ratio vs. Fig. 7-b Duty Ratio vs.
Distance ( Xdirection ) Distance ( X direction )
(GP1A70R ) (GP1A71R )
80 80
VCC = 5V VCC = 5V
I F = 20mA I F = 20mA
70 f= 2.5kHz 70 f= 2.5kHz
T a = 25˚C T a = 25˚C

60 60
Duty ratio ( % )

Duty ratio ( % )

t AH
t AH ( )
t AP x 100 Output A
t AP x 100 ( Output A )
50 50

t BH t BH
40 ( )
t BP x 100 ( Output B )
40 t BP x 100 Output B

30 30

20 20
- 1.0 0 1.0 - 1.0 0 1.0
Distance X ( mm ) ( Shifting encoder ) Distance X ( mm ) ( Shifting encoder )
Fig. 8-a Phase Difference vs. Distance Fig. 8-b Phase Difference vs. Distance
( X direction ) ( X direction )
(GP1A70R ) (GP1A71R )
130 140
VCC = 5V VCC = 5V
I F = 20mA I F = 20mA
120 f= 2.5kHz 130 f= 2.5kHz
T a = 25˚C T a = 25˚C
Phase difference θAB1 ( deg. )
Phase difference θ ABI ( deg. )

110 120 t AB1


θ AB1 = t AP x 360˚
t AB1
θ AB1 = t AP x 360˚
100 110

Reference position Reference position


90 (-) (+) 100 (-) (+)
GP1A70R
GP1A71R
80 90

Disk Disk
70 80
- 1.0 0 1.0 - 1.0 0 1.0
Distance X ( mm ) ( Shifting encoder ) Distance X ( mm ) ( Shifting encoder )
GP1A70R/GP1A71R

Fig. 9-a Duty Ratio vs. Fig. 9-b Duty Ratio vs.
Distance ( Ydirection ) Distance ( Y direction )
(GP1A70R ) (GP1A71R )
80 80
VCC = 5V VCC = 5V
I F = 20mA I F = 20mA
70 f= 2.5kHz 70 f= 2.5kHz
T a = 25˚C T a = 25˚C

60 60
t AH

Duty ratio ( % )
Duty ratio ( % )

t AH
t AP x 100 ( Output A ) t AP x 100 ( Output A )
50 50

t BH t BH
40 t BP x 100 ( Output B ) 40 t BP x 100 ( Output B )

30 30

20 20
- 1.0 0 1.0 - 1.0 0 1.0
Distance Y ( mm ) ( Shifting encoder ) Distance Y ( mm ) ( Shifting encoder )
Fig.10-a Phase Difference vs. Distance Fig.10-b Phase Difference vs. Distance
( Y direction ) ( Y direction )
(GP1A70R ) (GP1A71R )
130 140
VCC = 5V VCC = 5V
I F = 20mA I F = 20mA
120 f= 2.5kHz 130 f= 2.5kHz
T a = 25˚C T a = 25˚C
Phase difference θ ABI ( deg. )

Phase difference θ AB1 ( deg. )

110 120 t AB1


t AB1 θ AB1 = t AP x 360˚
θ AB1 = t AP x 360˚
100 110
GP1A70R
( +) GP1A71R
90 100
Reference ( +)
position Reference
80 (- ) 90 position
(- )
Disk
70 80 Disk
- 1.0 0 1.0 - 1.0 0 1.0
Distance Y ( mm ) ( Shifting encoder ) Distance Y ( mm ) ( Shifting encoder )
Fig.11-a Duty Ratio vs. Fig.11-b Duty Ratio vs.
Distance ( Z direction ) Distance ( Z direction )
(GP1A70R ) (GP1A71R )
80 80
VCC = 5V VCC = 5V
I F = 20mA I F = 20mA
70 f= 2.5kHz 70 f= 2.5kHz
T a = 25˚C T a = 25˚C

60 60
t AH
Duty ratio ( % )

Duty ratio ( % )

t AH
( )
t AP x 100 ( Output A ) t AP x 100 Output A
50 50

40 t BH 40 t BH
x 100 ( Output B )
t BP x 100 ( Output B ) t BP

30 30

20 20
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.1
Distance Z ( mm ) ( Shifting encoder ) Distance Z ( mm ) ( Shifting encoder )
GP1A70R/GP1A71R

Fig.12-a Phase Difference vs. Distance Fig.12-b Phase Difference vs. Distance
( Z direction ) ( Z direction )
(GP1A70R ) (GP1A71R )
120 140
VCC = 5V VCC = 5V
I F = 20mA I F = 20mA
110 f= 2.5kHz 130 f= 2.5kHz
T a = 25˚C t AB1 T a = 25˚C

Phase difference θ AB1 ( deg. )


Phase difference θ ABI ( deg. )

θ AB1 = t x 360˚
t AB1 AP
100 θ AB1 = t x 360˚ 120
AP

90 110

( Detecting side )
80 100
( Detecting side ) Z Disk
Z OPIC
OPIC Disk
70 90 GP1A71R
GP1A70R ( Emitting side )
( Emitting side )
60 80
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Distance Z ( mm ) ( Shifting encoder) Distance Z ( mm ) ( Shifting encoder)

<Measurement Conditions> ( Unit : mm )


6˚ 3˚
3˚ 1.5˚

R10.89 R13.45

RO RO
GP1A70R GP1A71R
7.2

7.2
X X' X X'

R13.24 R15.8

13 13
Disk center Disk center

6 6
2.0

2.0
0.5

0.3
10.5

10.5
6.5

6.5
0.1

0.1

8.625 4 11.185 4
0.75

0.75

S S

< GP1A70R Basic Design> < GP1A71R Basic Design>


RO ( distance between the disk center and half point of RO ( distance between the disk center and half point of
a slit ) and S ( installing position of GP1A70R) will be a slit ) and S ( installing position of GP1A71R) will be
provided by the following equations. provided by the following equations.

RO=N /60 x 10.89 ( mm ) N : number of slits RO= N/120 x 13.45 ( mm ) N : number of slits
S= RO- 2.265 (mm ) S= RO- 2.265 (mm)

■ Precautions for Use


( 1 ) This device is designed to be used under the condition of IF = 20mA
( 2 ) It is recommended that a by-pass capacitor of more than 0.01µF be added
between V CC and GND near the device in order to stabilize power supply line.
( 3 ) As for other general cautions, refer to the chapter “ Precautions for Use” .
Application Circuits

NOTICE
●The circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
●Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
●Observe the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
●Contact a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
●If the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
●This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also required before any use of this publication
may be made by a third party.
●Contact and consult with a SHARP representative if there are any questions about the contents of this
publication.

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