Gab 6 69 The heat transfer rate per unit width (normal to the page) from a longitudinal section, x — x, can be Eel fa hae ith T), where has AS veesi ? [) Laminar flow the average cece for the section ake : 2) Ts content 1x). Consider laminar flow over a flat plate with form temperature 7, The spatial variation of the local convection coefficient is ofthe form h, = Cx, where Cis.a constant . i A) Dari peburgan + — tie L ae rap Sgr = inks Fes 4 fede, nah oe dake © ee tee) dam nerees n= —— \ hx Ax the average coefficients h, and h,, corresponding to Ay Teg and, nope i ke = _! | cx tax = ac Kok XX Ki ae (ee Xe Goyer) a Teer) don 4p he O28) CT To) re? ha Xi Cas Te) > by Te eT = ie Cx) Che te} hie = be ket hike - Xo7-Kr 6.20 Experimental measurements of the convection heat trans- — won fer coeficient fora square bar in cross flow yielded the AS yong: f) Ne? CRe Pr Gove vies 2) Constent peep erties: 1, =50Wim?-K when T= 40Wim?-K when ce osm 7 ce a) Berdsar tan Na = CRe™ Pe, my = © ia rie a ‘Assume that the functional form of the Nusselt number is Nu = CRe® Pr’, where C, m, and mare constants. Wk (@) What will be the convection heat transfer co- eee efficient for a similar bar with L = 1 m when V=15 ms? a (b) What will be the convection heat transfer coefficient [. 2 f y,\™"% xk PNfora similar bar with L = 1 m when V'= 30 m/s? (© Would your results be the same if the side of the bar, rather than its diagonal, were used as the char- acteristic length? a “(ay So 40 m = 0,732 Dending han Neeeperinertt Aung on Nues: ” h ba Va La XK = a l ae Vly ee by) $-D-@) I 20-05 a = ( Vala | Wh 0,78 _ : 5:1 ) daa) aa C) CA eperts peorape tile Na bervbeh MM den A Ebfap Some 626 Forced air at 7. = 25°C and V= 10 m/siis used to cool electronic elements on a circuit board. One such ele- ‘ment is a chip, 4mm by 4mm, located 120 mm from the leading edge of the board. Experiments have revealed that flow over the board is disturbed by the elements and that convection heat transfer is correlated by an expression of the form Nu, = .04Ré* Pr cv. im, ob et NN tt = Chip ‘ Board 14 1 jt anaes ¥,. t d } ee ee Estimate the surface temperature of the chip if N & dis-’ sipating 30 mW. 6,85 Nae = 0,04 Reo p' Asunsi =!) Steady siste aya: 3) Uniewm J, 4) he = baat S)Nguyine Cediakion- §) T= 40% Kerowusti (regi ta UE Jom i Paste lx (13> Te) = 30° -3 Ae es 0,09 Re p-%, dsci 4): k 0,85 h« = 4 aaa a) “a PrToh Alege GOR Nelle ol edie accommo cance % Stereo “fake nw ® sey wor h pas ; r 4 he = 269-2? . 0,04 [12 coe peor ae ley 5) hae [20 1S, BF - [o7& [2tro,jea @ldoaa)al GGTse.S)) em ie © Sey Fe Ork 7 | epaaslet 7 = Uc ly miig Renmei cor Asem’: 1) Lanne flow 6 2) / ~dirersional | det tran ster phe a at 25 fe over the pleat wey of eee 2 pec toe ore er ee eS BM for qin each, Poodles tau ree ey hep came Insulation leas roo nm ob, vcne —* Trax fy < (1 = Ts) (@) Find the required power generation, @ (Wim’), in a a ‘module positioned at a distance 700 mm from the lead 1 4) Apply Greryy Cons within cv edge. maximum temperature Tra, in the heat Te 2 Cs t eye = Jlo & ides 0,030) 2 wins V= 22,02 we Th p> 0,678 Re = Wal = 30-00%? = 4537-67 turwien: Vv 210. Wego approvsimesi Ly th) iss , Ry = 300: (700 425). = 91877: 22/02: w Gunsran kore: Chilton > Colburn + = as V Ws Vy Nae = 070296 Ren” peM> = 0, 0276. (4/8770) * 0,474 ‘ae cea ee Hgaeiet . eee eeaieeeeaet gece eee eLearn egEEEaN RE IS le (70 125) ©? 4 = 67,7 Cise- 28) = 8,290? Y,> bw? b) To = TCye) © 4a 47 = Iw ($0-6?)* 4 i590 = 1594 °C- Bre ais 7s