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Features
· Planar Die Construction SOT-23
· 350mW Power Dissipation on FR-4 PCB Dim Min Max
· General Purpose, Medium Current A A 0.37 0.51
· Ideally Suited for Automated Assembly B 1.20 1.40
Processes
B C C 2.30 2.50
Mechanical Data D 0.89 1.03
* Add “-7” to the appropriate type number in Table, Sheet 2 example: 6.2V Zener = MMBZ5234B-7.
Notes: 1. Mounted on FR4 PC Board with recommended pad layout which can be found on our website
at http://www.diodes.com/datasheets/ap02001.pdf.
2. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
Month Jan Feb March Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
0.3
100
0.2 VR = 1V
VR = 2V
0.1
10
0 1 10 100
0 25 50 75 100 125 150
VZ, NOMINAL ZENER VOLTAGE (V)
TA, AMBIENT TEMPERATURE (°C) Fig. 2 Total Capacitance vs Nominal Zener Voltage
Fig. 1 Power Dissipation vs Ambient Temperature
1000 100
10
10
1 1
1 10 100 1 10 100 1000
VZ, NOMINAL ZENER VOLTAGE (V)
PULSE WIDTH (ms)
Fig. 3 Zener Voltage vs. Zener Impedence
Fig. 4 Maximum Non-repetitive Surge Power
30
50 Tj = 25°C
Tj = 25°C 10
5V6
12
6V8
40
IZ, ZENER CURRENT (mA)
8V2
15 Nominal Zener Voltage
20
30
Test current IZ
18
20
22
10
27
Test Current IZ 33 36 39
10
20mA
0
0
0 1 2 3 4 5 6 7 8 9 10
0 10 20 30 40
VZ, ZENER VOLTAGE (V)
VZ, ZENER VOLTAGE (V)
Fig. 5 Zener Breakdown Characteristics
Fig. 6 Zener Breakdown Characteristics
DS18011 Rev. 7 - 2 3 of 3 MMBZ5221B - MMBZ5259B
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