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SUMMARY The study investigated the effect on the tensile/peel bond strength of the variables
associated with the bracket base, the enamel surface, and the type of adhesive when both new
and used brackets were rebonded to a previously bonded enamel surface.
The tensile/peel bond strength was firstly evaluated for three different types of stainless steel
orthodontic bracket/base combinations. The cast integral base gave a significantly lower bond
strength than the foil-mesh and photo-etched bases. Following debonding, a group of new
brackets were bonded to the teeth using a chemically-activated or a light-cured adhesive. The old
adhesive had been removed from the enamel by either a hand sealer or a tungsten-carbide bur.
The rebonded new brackets demonstrated a small, but statistically significant fall in bond strength.
No differences were found between the enamel preparations or the adhesives.
A further group of previously debonded brackets were rebonded to the same teeth. The bracket
bases were prepared by either smoothing with a green stone or heating in a bunsen flame followed
Score 0 = no adhesive left on the tooth. Two main methods of bracket base preparation
Score 1 = less than half of the adhesive left on were used before rebonding. Before rebonding,
the tooth. 20 of each type of base were prepared by
removing adhesive from the base using a green
Score 2 = more than half of the adhesive left
stone in a slow speed handpiece. A further 20
on the tooth.
of each type were prepared according to the
Score 3= all adhesive left on the tooth, with method described by Buchman (1980). First,
a distinct impression of the bracket the bracket was held in a bunsen flame for 3
base. seconds in order to burn off the acrylic. This
produces a temperature of approximately
Rebonding new brackets 1200°C. The bracket was then quenched in
After bond testing, 40 new Microlok brackets room temperature water and cleaned in a
were bonded to the teeth from which brackets laboratory sandblaster for 5 seconds in order
had been debonded (Group 2). For 20 of these to remove inorganic filler particles. Finally, the
teeth, the adhesive was removed from the bracket was electropolished for 20 seconds by
previously bonded enamel surface with a tung- connecting the alligator clip of a Rocky Moun-
sten-carbide bur in a slow speed handpiece. tain 700 electropolisher (Rocky Mountain
The remainder were prepared by using a hand Orthodontics, Denver, Colorado) to a wire
sealer (Ash osteo No. 4, Dentsply Ltd., Glouces- ligature holding the bracket. In order to
ter). Equal numbers of the new brackets were differentiate the effects of flaming and sandblast-
bonded with either the same two-paste adhesive ing from the electropolishing process, a group
or a light-cured adhesive. This gave four groups of 20 Microlok brackets were rebonded follow-
of tooth preparation/adhesive combinations.
120
109.7
rength (1Newtoi
98.3 100.9
100
87 2-paste
80 light-cured
66.7
w 60
•a
ensi le/peel bor
40
20
0
Original Tungsten-carbide Sealer
Figure 2 Mean tensile/peel bond strength (in Newtons) of the new Microlok brackets rebonded to a debonded enamel
surface. The original (i.e the control) bond strength is shown for comparison.
way bases and 64.8 per cent for the Microlok strength of new Microlok brackets bonded to
bases. These differences between original and previously bonded enamel was significantly
rebond tensile/peel bond strength were tested higher than any of the used brackets (P<0.05).
statistically using a paired /-test and found to
be significant at the P< 0.001 level. It is Adhesive remnant index (ARI) distribution
interesting to note that despite the reduction The main purpose of recording the adhesive
in their bond strength, the used A-Company remnant index following the initial debonding
bases were still stronger than the original new procedure was to allow the selection of compar-
Edgeway bases. The differences between the able sub-groups for the subsequent tests. The
types of bracket preparation were not statistic- percentage frequency distribution of the ARI
ally significant, although it can be seen that is given in Table 2. This shows a broadly similar
just flaming the Microlok brackets results in a distribution amongst the three types of bracket
very low rebond strength. The tensile/peel bond base with most of the bases leaving over 50
130 D. REGAN ET AL.
Table 2 Percentage frequency distribution of the between the various types (Fig. 4). The bases
adhesive remnant index (ARI) for each type of new were classified into two groups; those with less
bracket following initial debonding. than 50 per cent of the undercuts filled with
adhesive and those with more than 50 per cent
Bracket ARI = 0 ARI=l ARI = 2 ARI = 3 of the undercuts filled with adhesive. It was
A-Company 2.4 19.0 27.4 51.2
found that 49.2 per cent of the Edgeway bases
Edgeway 0 18.8 34.4 46.8 had less than 50 per cent of the undercut areas
Microlok 1.8 15.5 48.2 34.5 filled with fractured adhesive whereas no
A-Company and only 4.6 per cent of Microlok
bases failed in such a manner. It appeared that
per cent of the adhesive on the enamel surface the mesiodistal horizontal channels provided
following removal in the tensile/peel mode. the main undercut areas in these premolar
Since all the teeth and brackets could be Edgeway bases, thus reducing the effective
identified at each stage of the experiment, it undercut to 2.98 mm2 (i.e. the area of these
channels as measured on the electron micro-
was possible to investigate the effect of the graphs). A particular problem noticed with the
ARI on both the initial and rebond strength Microlok bases was the presence of voids due
using the analysis of variance procedure. No to air entrapment. This would also tend to
significant differences were found between the reduce the efficiency of the undercuts.
ARI value and either the initial bond strength
or the rebond strength for each of the bracket The difference in these results compared with
bases. earlier data illustrates the danger of basing
recommendations on the outcome of testing
one type of bracket only. It is difficult to
dontic patients require the removal of stain This retention of adhesive on the enamel
which has formed on resin still present even surface was confirmed by this study. Figure 5
years after orthodontic treatment (Brown, reveals an enamel surface following bracket
1988). debonding. Etching had produced the typical
Type I etching pattern where the enamel rod
centres are preferentially etched (Ten Cate,
1989). The centres of the rods are now filled
with resin tags. Figure 6 shows an area next to
one of these islands following the application
of an etching liquid. It appears that the etching
procedure has no effect on the areas with
adhesive still present. This may explain the
reduction in bond strength which occurs even
when new brackets are used since there will be
a reduction in the amount of mechanical
retention available on the enamel surface.
Although this fall in bond strength with new
brackets was statistically significant it is unlikely
to be of clinical importance since the rebond
strength still falls within the value regarded as
necessary to withstand orthodontic and occlusal
forces (Reynolds, 1975). In similar studies with
new brackets, Faust et al. (1978) found that
Figure 6 Enamel surface following debonding and re-etching. Next to the retained adhesive (A) are resin tags (RT) from
the original bonding. The acid-etching procedure has no effect on composite.
when using a bunsen flame to remove adhesive experienced (Matasa, 1989). A stainless steel
from stainless steel bracket bases. In addition, bracket subjected to high temperatures also
further problems such as clogging of the base takes on an unacceptable brown appearance
and obstruction of undercuts and slots may be and requires repolishing using an electropol-
ishing process. This may result in significant
loss of metal and alteration in the undercuts
(Fig. 8). The present study found no difference
between any of the bracket preparation pro-
cesses and the use of heat cannot be recom-
mended.
Zachrisson (1985) recommended a 3-minute
rebonding procedure involving removal of
adhesive from the enamel surface using a sealer
or tungsten-carbide bur. If a new bracket is
not to be used, the adhesive remaining on the
loose bracket is removed with a bur or merely
roughened. Following a 60-second etch, the
bracket is then bonded with a chemically-cured
heavily-filled adhesive. From the present study,
(a) the suitability of this technique has been
confirmed for the foil-mesh brackets. However,
with both the photo-etched and cast bases, the