SPECIFICATION FOR FLEX PCBs

General specification
PCB production:
PCB inspection:
Vendor certification
IPC Class

PCB Technology
PCB type: Remark:

Material definition

PCB Thickness Tolerance Definition

Min. Tg Halogen-free
CTI CAF Resistance

Rigid IPC 4101

Flex IPC 4202, 4203 & 4204
Thickness of core & bonding materials must follow Stack-up
Special requirements

Conductive Layer definition

Rigid conductive layers: Flex conductive layers:

Outer layer Base Cu Plating

Final Cu PTH plating not defined

Inner layer Base Cu Final Cu #N/A

Solder mask & Surface Finishes

Solder mask Color Thickness
Appearance SM on Via
Special requirements

Coverlay PI Glue
Special requirements

Surface treatment
Additional surface
Wire bonding pads Wire bonding method
Special requirements
 SPECIFICATION FOR FLEX PCBs

Additional options
Silkscreen Colour

Peelable mask Kapton tape

Edge plating Plated half-holes

Countersink holes Remarks

Depth / Angle / Plated or Non-plated

Beveling Edge Remarks

Depth / Angle

Marking on PCB & Panel

Location 1 UL94 V0 Date Code

Location 2 UL E-No. RoHS
PCB Name/No. in Panel frame Pb Free
Special requirements

PCB & Panel definition

PCB size X Y Tolerance
Panel size X Y Tolerance
Edge Profile PCB per panel
Special requirements

X-out in Panel

Test, Inspection & Verification documents

CoC & Inspection Rep.
Electrical Test
E-Test Marking
Impedance Traces Test & Verification

Signal Type of Trace Trace/Trace Trace/GND GND Ref.1 GND Ref.2 Impedance Impedance
Layer Impedance Width Space Space Layer Layer value Tolerance

PPAP Remark

Enginnering
Working Gerber approval
Panel design approval
 SPECIFICATION FOR FLEX PCBs
Technical Question contact
Stepped stencil data must be send to
General specification
Production
IPC 6013 Flexible Printed Boards
IPC 6016 High Density Interconnect (HDI) Structures
Inspection
IPC A-600
Vedor certification
IATF 16949 - Automotive
ISO 13485 - Medical
AS9100 - Aerospace
IPC Class
IPC 601X Series class 2
IPC 601X Series class 3

PCB Type
Single sided
Double sided
Multilayer
HDI 1-step
HDI 2-step
HDI 3-step
ELIC
Other see Remark

Thickness
0,10mm
0,15mm
0,20mm
0,25mm
0,30mm
0,35mm
0,40mm
0,45mm
0,50mm
0,55mm
0,60mm
0,65mm
0,70mm
0,75mm
0,8mm
1,0mm
1,2mm
1,6mm
2,0mm
2,4mm
3,0mm
3,2mm
Other see free text
Finished board thickness tolerance:
Tolerance +/-0,1mm
Tolerance +/-0,15mm
Tolerance +/-0,2mm
Tolerance +/-10%
Other see free text

Thickness definition
Measured over bare laminate
Measured over Cu + metallic surface treatment
Measured over bare laminate + Solder mask
Measured over Cu + Solder mask

Min. Tg.
Min. Tg. 130
Min. Tg. 150
Min. Tg. 170
Min. Tg. 200
Min. Tg. 250
Other see free text
Halogen-Free
Yes
No
CAF resistance
Yes
No
CTI (Comparative tracking Index)
CTI < 100 -- PLC 5
CTI 100 - 174 -- PLC 4
CTI 175 - 249 -- PLC 3
CTI 250 - 399 -- PLC 2
CTI 400 - 599 -- PLC 1
CTI ≥ 600 -- PLC 0

IPC-4101/ RIGID
IPC-4101/101 or /121 (Standard Tg.)
IPC-4101/127 (Standard Tg.) Low Halogen content
IPC-4101/99 or /124 (Mid Tg.)
IPC-4101/128 (Mid Tg.) Low Halogen content
IPC-4101/126 or /129 (High Tg.) CAF Resistance
IPC-4101/130 or /131 (High Tg.) Low Halogen content , CAF Resistance

Material Flex
PI Adhesiveless
PI + Epoxy Glue
PI + Acrylic Glue
Conductive Layer definition
Rigid
0-layer
1-layer
2-layer
4-layer
6-layer
8-layer
10-layer
12-layer
14-layer
16-layer
18-layer
20-layer
Other

PTH plating
Flex 2 Layer (Type 2) = min. 12um
Flex ML & Rigid/Flex < 1,5mm (Type 3&4) = min. 25um locally 20um
Flex ML & Rigid/Flex > 1,5mm (Type 3&4) = min. 35um locally 30um

Outer layer CU thickness, base foil:

Start Cu
5um
9um
12um
17,5um
35um
52um
70um
105um
140um
175um
210um
Other

PTH plating not defined

Inner layer CU thickness, base foil:

Start Cu
9um
12um
17,5um
35um
52,5um
70um
105um
140um
175um
210um
Other

Solder mask
Yes
No
Only Top side
Only Bot side
Halogen-free

Coverlay
PI
12um
25um
50um
75um
125um

Surface Finish
LF HASL (Sn) min. 1-40µm
LF HASL (Sn) min. acc. to IPC 6010 Series (Coverage and Solderable)
ENIG (Ni/Au) min. Ni 3µm / Au min. 0,05µm
ENEPIG (Ni/Pd/Au) min. Ni 3µm / Pd min. 0,05um/ Au min. 0,05µm
Immersion Silver Thick (Ag) min. 0,12µm
Immersion Silver Thin (Ag) min. 0,05µm
HASL (Sn/Pb) min. 1-40µm
HASL (Sn/Pb) min. acc. to IPC 6010 Series (Coverage and Solderable)

Silkscreen (Legend print)

On Top side
On Bot side
On both sides
No Silkscreen
Peel-able mask
On Top side
On Bottom side
On Both sides
No Peel-able mask

Kapton Tape
On Top side
On Bottom side
On Both sides
No Kapton tape

Edge plating
No
Yes

Plated Half-Holes
No
Yes

Countersink Holes
No
Yes

Edge Connector Bevelling

No
Yes

Marking
Solder mask Top side
Solder mask Bot side
Silkscreen Top side
Silkscreen Bot side
Cu on Top side
Cu on Bot side
UL94 V0
Yes
No
Date code
WWYY
YYWW
No Date code
RoHS
Yes
No
UL E-No.
Yes
No
Pb Free
Yes
No
Customer PN in Cu in frame
Yes
No

Single unit size:

Tolerance +/-0,1mm
Tolerance +/-0,2mm
Tolerance +/-0,3mm
Tolerance +/-0,4mm
Tolerance +/-0,5mm
Tolerance +/-0,6mm

Panel size:
Tolerance +/-0,1mm
Tolerance +/-0,2mm
Tolerance +/-0,3mm
Tolerance +/-0,4mm
Tolerance +/-0,5mm
Tolerance +/-0,6mm

Profile
Routing (Milling)
V-cut
Routing (Milling) + V-cut
Punching (Stamp)

X-Out in Panel
No X-outs
X-out Allowed max 5%
X-out Allowed max 10%
X-out Allowed max 20%
1 X-out per panel allowed
2 X-out per panel allowed
3 X-out per panel allowed
4 X-out per panel allowed
5 X-out per panel allowed

Quality standard
Standard verification IPC Class 2 / CoC and Quality test report incl. Micro-section
Standard verification IPC Class 3 / CoC and Quality test report incl. Micro-section
Full verification IPC Class 3 / Extended CoC & Quality test report incl. Micro-sections

Electical test
Yes
No
Yes - Must be tested against IPC356 netlist

Impedance Traces
Yes
No

PPAP
Yes
No

Working Gerber for Approval

Yes
No

Panel design approval

Yes
No
Min. Tg
Min. Tg. 130
Min. Tg. 130
Min. Tg. 150
Min. Tg. 150
Min. Tg. 170
Min. Tg. 170
Flex
1-layer
2-layer
3-layer
4-layer
5-layer
6-layer
7-layer
8-layer

Final Cu
IPC 6010 Series single sided
Final Cu
Final Cu min. 0um
Final Cu min. 6,2um
Final Cu min. 9,3um
Final Cu min. 11,4um
Final Cu min. 24,9um
Final Cu min. 40,3um
Final Cu min. 55,7um
Final Cu min. 86,6um
Final Cu min. 117,5um
Final Cu min. 148,8um
Final Cu min. 179,22um
Final Cu Other see free text

IPC 6010 Series class 1&2&3

Final Cu
Final Cu min. 6,2um
Final Cu min. 9,3um
Final Cu min. 11,4um
Final Cu min. 24,9um
Final Cu min. 40,3um
Final Cu min. 55,7um
Final Cu min. 86,6um
Final Cu min. 117,5um
Final Cu min. 148,8um
Final Cu min. 179,22um
Final Cu Other see free text

Colour
Green
White
Super White
Black
Blue
Red
Yellow
Other

Glue
12um
25um
50um
75um

Additional Surface
Galvanic plated hard gold IPC Class 1&2 min. Au min. 0,8µm
Galvanic plated hard gold IPC Class 3 min. Au min. 1,25µm
Carbon ink for Keypads or Switches
Other -- See Special requirements
Wire bonding pads
Yes
No

Wire bonding Method

Alu
Gold

Silkscreen
Colour
White
Yellow
Black
Blue
Red
Green
Marking placement1
On each PCB
In frame only
E-test Marking
Pen marking on PCB Edge or Panel Edge
Stamp on each PCB or Panel Frame

Test & Verification

Imp. Test
Imp. Test incl. Detailed Verification Report
No Impedance Test
CAF
No
No
No
No
Yes
Yes
IPC 6010 Series Flex 2 Layer (Type 2)
Final Cu
Final Cu min. 13,1um
Final Cu min. 16,2um
Final Cu min. 19,3um
Final Cu min. 23,4um
Final Cu min. 37,9um
Final Cu min. 53,3um
Final Cu min. 68,7um
Final Cu min. 98,6um
Final Cu min. 129,5um
Final Cu Other see free text
Final Cu Other see free text
Final Cu Other see free text
Solder mask surface
Semi-Matt
Matt
Glossy
Other
Halogen-Free
No
Yes
No
Yes
No
Yes
IPC 6010 Series Flex ML & Rigid/Flex < 1,5mm (Type 3&4)

Final Cu min. 28,1um

Final Cu min. 31,2um
Final Cu min. 34,3um
Final Cu min. 38,4um
Final Cu min. 52,9um
Final Cu min. 68,3um
Final Cu min. 83,7um
Final Cu min. 113,6um
Final Cu min. 144,5um
Final Cu Other see free text
Final Cu Other see free text
Final Cu Other see free text
Details
8-40µm
16-80µm (2 x SM)
Other see free text
IPC 6010 Series Flex ML & Rigid/Flex > 1,5mm (Type 3&4)

Final Cu min. 28,1um

Final Cu min. 31,2um
Final Cu min. 34,3um
Final Cu min. 38,4um
Final Cu min. 52,9um
Final Cu min. 68,3um
Final Cu min. 83,7um
Final Cu min. 113,6um
Final Cu min. 144,5um
Final Cu Other see free text
Final Cu Other see free text
Final Cu Other see free text
Via-Plugging
Covered with SM
Open in SM
Plug with SM IPC4761 type IV
Filled with SM or Epoxy & Cover with SM IPC4761 type VI
Filled with Epoxy & Cu Cap - IPC-4761 type VII
Other see free text