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Next Generation Structural Adhesives Presentation
Next Generation Structural Adhesives Presentation
2
Lightweighting Opportunities Target BIW Subsystems
BIW Material Distribution Vehicle Subsystems
180 Mpa 200 – 220 Mpa System Priority Low Medium High High
7% 9%
260 Mpa Rear doors Front doors Hood
Closures High
Decklid Fenders
Deep Drawn Steel 10%
19%
C-pillar Shock tower Engine cradle
Medium
BIW Floor Truck frame B-pillar
High
A-pillar
50%
Composites
30%
Aluminum
20%
Steel-Alu-
Hybrid Mode I: Mode II: Mode III:
Innovative Opening In-plane shear Out-of-plane
Steels shear
10%
Year
2010 2015 2025+
▪ OEMs assemble and ship components globally ▪ Adhesive subject to various loads and strain rates
▪ Uncured adhesive must maintain fracture toughness after ▪ Toughening technology
humidity exposure ▪ APGE and durability
▪ Adhesive manufacturers need to consider both uncured and cured adhesive properties
▪ Help to expand OEM processing capabilities and enable light-weighing opportunities
▪ One formulation for steel and aluminum bonding
▪ -40°C impact wedge peel, good adhesion, stress durability, wash-off resistance, humidity resistance, flammability resistance
Engineering Adhesive Solutions for Next Generation Structural Bonding April 8, 2020 6
Next Generation Uncured Adhesive Requirements
Wash-off Resistance: Teroson EP 5095
EP 5089 EP 5089
50000
2000
EP 5095 EP 5095
Stress (Pa)
5000 1000
+115%
500
500 0
0.01 0.1 1 10 100 0 10 20 30 40
Log Shear Rate (1/s) Shear Rate (1/s)
Engineering Adhesive Solutions for Next Generation Structural Bonding April 8, 2020 7
Next Generation Uncured Adhesive Requirements
Teroson EP 5150: Humidity Resistance and Adhesion to Aluminum
Open Bead T-peel Humidity Resistance Closed Bead T-peel Humidity Resistance Open Bead -40°C IWP
20 20 3 months uncured exposure 35 °C at 85% RH 45
(a) ▪ Toughening and cure chemistry designed and optimized for humidity resistance
▪ Overbake cure condition (205°C for 30 min. MT)
0.2 mm ▪ T-peel and IWP strength meets initial requirement after uncured open and closed
Initial Exposed bead exposure
(b) ▪ 3 months closed bead
▪ Reduced blistering and interfacial failure due to moisture absorption
0.2 mm ▪ Good impact wedge peel strength on CRS and AI at -40°C and above
Initial Exposed ▪ Young’s Modulus = 2.0 GPa
Engineering Adhesive Solutions for Next Generation Structural Bonding April 8, 2020 8
Next Generation Uncured Adhesive Requirements
Teroson EP 5150: Weld Flammability Resistance and Al Welding
Engineering Adhesive Solutions for Next Generation Structural Bonding April 8, 2020 9
Advanced Toughening Technology
Pre-dispersed core shell nanoparticles Scanning Electron Micrographs (SEM) of T-peel Fracture Surface
180° Peel
Engineering Adhesive Solutions for Next Generation Structural Bonding April 8, 2020 10
Next Generation Cured Adhesive Requirements
Teroson EP 5150: Toughness: T-peel and Impact Wedge Peel Strength
T-peel Strength (Initial) IWP Strength (-40°C) IWP Strength (+23°C)
20 50 50
T-peel Strength (N/mm)
18 45 45
Strength (N/mm)
Strength (N/mm)
14 35 35
12 30 30
10 25 25
8 20 20
6 15 15
4 10 10
2 5 5
0 0 0
CRS CRS EZG HDG AI CRS CRS AI CRS CRS AI
(0.8mm) (1.6mm) (0.8mm) (0.8mm) (2.0mm) (0.8mm) (1.6mm) (2.0mm) (0.8mm) (1.6mm) (2.0mm)
Benefits of structural bonding ▪ Good T-peel and impact wedge peel strength -40 °C and above on various substrates
▪ Improved stiffness of car ▪ Overbake cure condition (205 °C for 30 min. MT)
body assemblies ▪ Good lap shear strength: 22.9 MPa on aluminum
▪ 100% cohesive mode of failure under static and dynamic peel loads
▪ Up to 25% increase of energy
absorption in the metal CRS EZG HDG Al LB HB
structures
▪ Increased fatigue durability
▪ Bonding of different
substrates possible
▪ Acoustic & vibration damping
Engineering Adhesive Solutions for Next Generation Structural Bonding April 8, 2020 11
Next Generation Cured Adhesive Requirements
Teroson EP 5150: Stress Durability on Al: Environmental Aging Under
Static Load
Stress Durability/APGE Cycling T-peel and IWP Mode of Failure
APGE Durability (# of Cycles) 60 CRS (0.8 mm) CRS (1.6 mm) HDG (0.8 mm) Al (2.0 mm)
50
40
30
20
10 22 cycle requirement
0 LB HB
Low Bake High Bake
▪ Bulk adhesive properties and interfacial adhesion optimized for APGE durability with a 2400N static load
▪ Achieved stress durability with good adhesion to various substrates with good -40 °C IWP strength
Engineering Adhesive Solutions for Next Generation Structural Bonding April 8, 2020 12
Next Generation Adhesive Properties
Experimental Product Development Summary
T-peel Strength on CRS (0.8mm)
Stress Durability (HB, AL) 60 T-peel Strength on CRS (1.6mm)
50
Stress Durability (LB, AL) T-peel Strength on EZG (0.8mm)
40
10
IWP (RT, CRS, 1.6mm) T-peel Strength (7 Day Open Bead) Requirements
0
Next Gen Product
▪ Developed Next Generation technology to exceed advanced body shop adhesive requirements
▪ One experimental product for aluminum and steel bonding
Engineering Adhesive Solutions for Next Generation Structural Bonding April 8, 2020 13
Topics
Mobility
Surrogate Data Card Materials Science AI
Alliance
▪ Initiate product development and define requirements using a surrogate data card
▪ Utilize artificial intelligence and design of experiments (DOE) to accelerate product development
▪ Apply the scientific method to create new products to solve customer problems
Engineering Adhesive Solutions for Next Generation Structural Bonding April 8, 2020 15
Conclusions
▪ Closures and BIW show greatest opportunity for lightweighting
▪ Established interdisciplinary connections between materials, processing and engineering for BIW structural
adhesive applications
▪ Developed a Next Generation Universal adhesive for aluminum and steel bonding
▪ Advanced uncured and cured properties to expand OEM
processing capabilities
▪ Excellent adhesion to various substrates (bare steel, coated steels and Al)
▪ Good dynamic impact strength over a broad temperature range
▪ Good durability to ensure long term, durable adhesion over vehicle lifetime
▪ Accelerating product development through modelling and design, cutting edge materials science and artificial
intelligence (AI) April 8, 2020 16
Thank you!
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