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Intel® Compute Module HNS7200APR

Specifications
Export specifications

Essentials

Intel® Compute Module HNS7200AP Family


Product Collection

Products formerly Adams Pass


Code Name

Marketing Status Discontinued

Launch Date Q1'18

Expected Discontinuance Q2'19

EOL Announce Monday, June 10, 2019

Last Order Friday, August 9, 2019

Last Receipt Attributes Saturday, December 7, 2019

Limited 3-year Warranty Yes

Extended Warranty Available for Purchase (Select


Yes
Countries)

Intel® Compute Module HNS2000 Extended Warranty


Additional Extended Warranty Details

Compatible Product Series Intel® Xeon Phi™ Processor 7200 Series

Board Form Factor Custom 6.8" x 14.2"

Chassis Form Factor 2U Rack

Socket LGA 3647-1

Integrated BMC with IPMI Emulex Pilot III controller

Rack-Friendly Board Yes

TDP 230 W

(1) – Intel Server Board S7200APR


(3) – System fans
(1) – Slot 1 Riser Card
(1) – Slot 2 Riser Card
(1) – I/O Bridge Board
Included Items (1) – Power Docking Board
(1) – 130mm 2x7 Fan Assembly Cable
(1) – 140mm 2x3 Internal Power Cable
(1) – Air Duct
(1) – Plastic Cover
(1) – Processor Heat Sink

Intel® C612 Chipset


Board Chipset
Target Market High Performance Computing

New Design Availability Expiration Date Wednesday, October 26, 2022

Sign in with your CNDA account to view additional SKU details.

Supplemental Information

Embedded Options Available No

Intel® Server S7200APR Product Family provides


parallelized workflows in the HPC market, featuring
Description features support for Intel® Xeon® Phi™ processors, with 6
DIMMs (1DPC) and optional support for Intel® Omni
Path® Fabric Technology. Air cooled node

Memory Specifications

Max Memory Size (dependent on memory type) 384 GB

Registered DDR4 (RDIMM) and Load Reduced DDR4


Memory Types
(LRDIMM)

Max # of Memory Channels 6

Max Memory Bandwidth 512 GB/s

# of Memory Slots 6

ECC Memory Supported ‡ Yes

GPU Specifications

Integrated Graphics ‡ Yes

Graphics Output Internal RGB Video Header

Expansion Options

PCI Express Revision 3.0

Max # of PCI Express Lanes 32

PCIe x16 Gen 3 2

Riser Slot 1: Total # of Lanes 16

Riser Slot 2: Total # of Lanes 16


I/O Specifications

# of USB Ports 2

USB Revision 3.0

Total # of SATA Ports 1

RAID Configuration Intel(R) Embedded Server RAID Technology (ESRT2)

# of Serial Ports 1

Integrated LAN 2) RJ-45 1Gb NIC ports

Package Specifications

Max CPU Configuration 1

Advanced Technologies

Intel® Virtualization Technology for Directed I/O


No
(VT-d) ‡

Intel® Remote Management Module Support Yes

Intel® Node Manager Yes

Intel® Quick Resume Technology Yes

Intel® Quiet System Technology Yes

Intel® Rapid Storage Technology enterprise Yes

Intel® Fast Memory Access Yes

Intel® Flex Memory Access Yes

Intel® I/O Acceleration Technology Yes

Intel® Advanced Management Technology Yes

Intel® Server Customization Technology Yes

Intel® Build Assurance Technology Yes

Intel® Efficient Power Technology Yes

Intel® Quiet Thermal Technology Yes

TPM Version 2.0

Security & Reliability

Intel® AES New Instructions Yes

Intel® Trusted Execution Technology ‡ Yes

Drivers and Software

Support

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle,
specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not
make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability,
functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or
systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers
(ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall
not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is
responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system
delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller,
memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility.
Functionality, performance, and other benefits of this feature may vary depending on system configuration.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM,
i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest
Processor configuration update.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

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secure. // Your costs and results may vary. // Performance varies by use, configuration and other factors. // See our complete legal
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