~ o LAYER COUNT PCB MAXIMUM SIZE RAW MATERIALS. BOARD THICKNESS THICKNESS TOLERANCE OUTER BASE COPPER THICKNESS INNER BASE COPPER THICKNESS, MAXIMUM ASPECT RATIO SURFACE FINISH OTHER SURFACE FINISH GOLD FINGER DRILL BIT MINIMUM WIDTH/SPACE ON OUTER LAYER MINIMUM WIDTH/SPACE ON INNER LAYER MINIMUM BGA PAD SIZE. IMPEDANCE MININUM SOLDER MASK BRIDGE COUNTER SINK HOLE HALF HOLES (PTH) MINIMUM HOLE TO HOLE DISTANCE DEPTH CONTROL ROUTING ICAPE RIGID PCB CAPABILITIES STANDARD CAPABILITIES Single side ~ 10 layers. 500 x 560 mm FR&4 (Tg130, 150, 170) CEM! 06mm to3,2mm. E<10 mm: +/- 0.1mm 18 um ~ 105 um. 18 um ~ 105 um. area] OSP, HASL LF, HASL SNPB, ENIG, Immersion Tin, Immersion silver Peelable mask, Carbon ink No 025- 6mm 4/6 mils 414 mils Dmils < 50 ohms: +/- Sohms > 50 ohms: +/- 10% Smils 60° <= angle du chanfrein <= 180° 2.5 mm <= Diameter <= 65mm >=0.8mm >=12mils 4/025 mm ADVANCED CAPABILITIES >10 layers. 1040 x 560 mm. TI600, Rogers4350, 370HR (Other thickness on request E<10mm:4/-0.1 mm E>1.0mm:+/- 8% Other thickness on request Other thickness on request 151 Hard gold, Flash gold, Hybrid N/A. Yes < 0.25 mm or > 6mm. (Use routing instead) 3/3 mils 3/3 mils to mils Other tolerance on request Base on copper thickness Others on request >=0.6 mm ~<0.8mm, >=10mils ~ Rlayers Istep, 2 steps 450 x 600 mm FR47G170 06 mm to 32mm T<10mm:+/-0.1mm 18 urn ~ 105 pm 18 pm ~105 um 101 08a 81 OSP, HASL LF, HASL SNPB, ENIG, Immersion Tin, Immersion silver Peelable mask, Carbon ink 0.25~6mm 4 mils, S mils, 6 mils 8 mils, 10 mils, 12 mils 44 mils 4/4 mils mils < 50 ohms: +/-5 ohms > 50 ohms: +/-10% 5 mils >= 12 mils 0.25 mm ADVANCED CAPABILITIES >=14 layers 3 steps or above N/A CTI600, Rogers4350, 370HR Other thickness on request T<10mm:+/-0.1mm T?10 mm: 4/-8% Other thickness on request Other thickness on request asa " 101 Hard gold, Flash gold, Hybrid N/A. Yes < 025mm or > 6mm. (Use routing instead) other laser hole sizes on request other buried hole sizes ‘on request 3mils 3/3 mils 10 mils Other tolerance on request Base on copper thickness >=10 mils ~ <12 mils 0.2mm~ o ALUMINIUM PCB CAPABILITIES LAYER COUNT PCB MINIMUM SIZE RAW MATERIALS THERMAL CONDUCTIVITY SURFACE FINISH METAL THICKNESS. THICKNESS TOLERANCE DIELECTRIC THICKNESS BASE COPPER MINIMUM WIDTH/SPACE MININUM SOLDER MASK BRIDGE. MININUM SOLDER MASK CLEARANCE SOLDER MASK SILKSCREEN MINIMUM HOLE. HOLE TOLERENCE ROUTING TOLERANCE ICAPE: STANDARD CAPABILITIES sS&DS 500 x 560 mm Boyu, Ventec 1Wim-k, 15 Wim-k, 2 Win-k OSP, HASL LF, ENIG, Immersion 0.8mm~20mm T<10mm:+/-010 mm T>1mm:: 4/10 % 50 um ~ 150 um. 18 um, 35 um, 70 wm 46 rvils 6 mils 3mils White, Black, Green, Blue, Red, Yellow White, Black Yellow 10mm, +/01mm 402mm ADVANCED CAPABILITIES 4layers & up Other sizes on request N/A >= 3 Wim-k N/A Other thickness and tolerance on request Other thickness and tolerance on request N/A. >=105 um. N/A. Depend on copper foil Depend on copper foil N/A N/A >=0.5mm N/A 4/015 mm.~ 7 FPC CAPABILITIES LAYER COUNT FLEX MAXIMUM SIZE. RAW BASE MATERIALS. POLYIMIDE BASE MATERIAL THICKNESS (PI THICKNESS) ADHESIVE THICKNESS BOARD THICKNESS THICKNESS TOLERANCE OUTER BASE COPPER THICKNESS, INNER BASE COPPER THICKNESS MAXIMUM ASPECT RATIO SURFACE FINISH GOLD FINGER COVERLAY MINIMUM COVERLAY OPENING SIZE MINIMUM COVERLAY BRIDGE SOLDER MASK COLOR STIFFENER STIFFENER PASTE TOLERANCE MECHANICAL DRILL SIZE MINIMUM LASER DRILL SIZE MINIMUM PUCHING HOLE MININUM SLOT WIDTH LASER CUTTING PUNCHING TOOLING ICAPE: STANDARD CAPABILITIES Single side ~ 4 layers 230 x356 mm Polyimide, PET 125 um, 204m, 25 um, SO um 125 um, 20 um, 25 um 0,07 mm to. 0.2mm +/0.05 mm 12 um, 18 ym, 35 pm 18 um, 35 um el OSP.ENIG No Yellow, Black, White 06 mm or 06 0.4mm 03mm Green, black, Yellow, White FR4, Pl, PET, 3M tape +-025mm 015~ 6.0mm 0.075 mm 06mm O.6mm +40.1mm +/-013 mm ADVANCED CAPABILITIES G layers & up 230 x S80 mm Other materials on request Other PI thickness on request Other adhesive thickness ‘on request Other thickness on request NA Other thickness on request Other thickness on request 61 Flash gold, Immersion Tin, Immersion silver, HASL LF Yes Others on request NA 025mm Others on request Stainless steel, aluminum sheet, others Others on request Others on request Others on request Others on request Others on request Others on request Others on request~ o LAYER COUNT MAXIMUM SIZE RAW MATERIALS. (RIGID PART) RAW BASE MATERIALS. (FLEX PART) POLYIMIDE BASE MATERIAL THICKNESS (PI THICKNESS) ADHESIVE THICKNESS BOARD THICKNESS (RIGID PART) THICKNESS TOLERANCE. BOARD THICKNESS (FLEX PART) THICKNESS TOLERANCE RIGID PART COPPER THICKNESS FLEX PART COPPER THICKNESS MAXIMUM ASPECT RATIO (PTH) MAXIMUM ASPECT RATIO. (LASER) SURFACE FINISH GOLD FINGER COVERLAY MINIMUM COVERLAY ‘OPENING SIZE MIN. COVERLAY BRIDGE ADHESIVE SQUEEZE-OUT AT RF TRANSITION MIN. FLEX WIDTH(FOR INDIVIDUAL RIGID FLEX) MECHNICAL DRILL SIZE MINIMUM LASER DRILL SIZE LASER CUTTING PUNCHING TOOLING ICAPE: RIGID-FLEX CAPABILITIES STANDARD CAPABILITIES DS ~8 layers 380 x 560 mm FR4 (Tg130,150,170) Adhesiveless FCCL (Polyimide) Adhesive FCCL (Polyimide, PET) 125 um, 20 um, 25 um, $0 um 125 um, 20 ym. 0.4mm to 25mm T<10mm:+/0.1mm T>10mm: +/-10% 0.07 mm to 0.2mm +/-0.05 mm 18 um ~105 um 12um ~70 um al ost OSP.ENIG No Yellow, Black, White 0.6 mm, or 0.6 * 0.4mm. o3mm 15mm 1smm 0.15 mm ~ 6.0 mm. 0.075 mm 4/01 mm. 4/-013 mm ADVANCED CAPABILITIES 10 layers ~ 12 layers 380 x 736 mm, Rogers 4350, 370HR Other materials on request Other PI thickness on request Other adhesive thickness on request Other thickness on request N/A Other thickness on request N/A Other thickness on request Other thickness on request qa " Flash gold, Immersion Tin, Immersion silver, HASL LF Yes: Others on request N/A 0.25 mm. 05mm 12mm Others on request Others on request Others on request Others on request