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Analyzer Overview 1

Electronic Compartment
Component Descriptions and 2
Maintenance Procedures

Maxum II Specifications 3

PD PA AP
Maxum II Reference Manual

Manual

Product Descriptions and Maintenance for Maxum II


Airless/Airbath Model Gas Chormatograph

7/2017
2000596-001
Legal information
Warning notice system
This manual contains notices you have to observe in order to ensure your personal safety, as well as to prevent
damage to property. The notices referring to your personal safety are highlighted in the manual by a safety alert
symbol, notices referring only to property damage have no safety alert symbol. These notices shown below are
graded according to the degree of danger.

DANGER
indicates that death or severe personal injury will result if proper precautions are not taken.

WARNING
indicates that death or severe personal injury may result if proper precautions are not taken.

CAUTION
indicates that minor personal injury can result if proper precautions are not taken.

NOTICE
indicates that property damage can result if proper precautions are not taken.
If more than one degree of danger is present, the warning notice representing the highest degree of danger will be
used. A notice warning of injury to persons with a safety alert symbol may also include a warning relating to property
damage.
Qualified Personnel
The product/system described in this documentation may be operated only by personnel qualified for the specific
task in accordance with the relevant documentation, in particular its warning notices and safety instructions. Qualified
personnel are those who, based on their training and experience, are capable of identifying risks and avoiding
potential hazards when working with these products/systems.
Proper use of Siemens products
Note the following:

WARNING
Siemens products may only be used for the applications described in the catalog and in the relevant technical
documentation. If products and components from other manufacturers are used, these must be recommended or
approved by Siemens. Proper transport, storage, installation, assembly, commissioning, operation and
maintenance are required to ensure that the products operate safely and without any problems. The permissible
ambient conditions must be complied with. The information in the relevant documentation must be observed.

Trademarks
All names identified by ® are registered trademarks of Siemens AG. The remaining trademarks in this publication
may be trademarks whose use by third parties for their own purposes could violate the rights of the owner.
Disclaimer of Liability
We have reviewed the contents of this publication to ensure consistency with the hardware and software described.
Since variance cannot be precluded entirely, we cannot guarantee full consistency. However, the information in
this publication is reviewed regularly and any necessary corrections are included in subsequent editions.

Siemens AG Document order number: 2000596-001 Copyright © Siemens AG 2007 - 2017.


Division Process Industries and Drives Ⓟ 08/2017 Subject to change All rights reserved
Postfach 48 48
90026 NÜRNBERG
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Table of contents

1 Analyzer Overview........................................................................................................................................7
1.1 Introduction..............................................................................................................................7
1.2 Analyzer Specific Documents..................................................................................................8
1.3 Parts of the Maxum II...............................................................................................................8
1.4 Isothermal Oven.......................................................................................................................9
1.5 Switching and Sampling Valves.............................................................................................10
1.6 Operator Controls...................................................................................................................11
2 Electronic Compartment Component Descriptions and Maintenance Procedures.....................................13
2.1 Power Supplies......................................................................................................................13
2.1.1 Power System Module...........................................................................................................13
2.1.2 Replacement Procedure........................................................................................................15
2.2 Power Entry and Control Module...........................................................................................18
2.2.1 PECM Overview.....................................................................................................................18
2.2.2 Feature Additions...................................................................................................................19
2.2.3 PECM Functions....................................................................................................................20
2.2.3.1 AC Input and Distribution.......................................................................................................20
2.2.3.2 Oven Temperature Control....................................................................................................21
2.2.3.3 Communication and Power Distribution.................................................................................22
2.2.3.4 Onboard Solid State Relays...................................................................................................23
2.2.3.5 Oven Functions......................................................................................................................24
2.2.3.6 Electronic Enclosure Environment.........................................................................................26
2.2.4 Replacement Procedure........................................................................................................28
2.2.4.1 Troubleshooting.....................................................................................................................28
2.2.4.2 Removing The PECM............................................................................................................30
2.2.4.3 Installing The New PECM......................................................................................................31
2.3 System Controller Version 2.1 (SYSCON2.1)........................................................................32
2.3.1 Description.............................................................................................................................32
2.3.2 Mechanical.............................................................................................................................33
2.3.3 SYSCON2.1 Components......................................................................................................34
2.3.3.1 Communication and Control Board (CAC3)...........................................................................34
2.3.3.2 CAC3 Status Indicator LEDs..................................................................................................35
2.3.3.3 SIB.........................................................................................................................................36
2.3.3.4 Ethernet Port Expansion........................................................................................................44
2.3.4 Maintenance Overview...........................................................................................................48
2.3.5 Service Procedures................................................................................................................48
2.3.6 Replacing the Lithium Battery on the SYSCON Module Introduction....................................53
2.3.7 Procedure...............................................................................................................................53
2.4 Analog and Digital IO.............................................................................................................54
2.4.1 IO Card Common Features....................................................................................................55
2.4.2 Digital IO Card........................................................................................................................58
2.4.3 Analog IO Board.....................................................................................................................59

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Table of contents

2.4.4 Analog and Digital IO Board...................................................................................................60


2.5 Detector Personality Modules................................................................................................61
2.5.1 DPM Types............................................................................................................................61
2.5.2 Base3 Detector Personality Module (DPM)...........................................................................61
2.5.3 Replacing a Base3DPM.........................................................................................................66
2.5.4 Intrinsically-Safe Thermal Conductivity DPM (IS-TCD3)........................................................68
2.5.5 Replacing an IS-TCD DPM....................................................................................................70
2.5.6 Replacing a TC-DPM.............................................................................................................71
2.6 Sensor Near Electronics (SNE) Software..............................................................................72
2.7 Solid State Relay Module.......................................................................................................74
2.8 Solenoid Valves.....................................................................................................................76
2.8.1 Solenoid Valve Control Module (SVCM)................................................................................76
2.8.2 Replacing a Solenoid Valve...................................................................................................80
2.9 Electronic Pressure Control Module.......................................................................................81
2.9.1 EPC Module Description........................................................................................................81
2.9.2 Replacing an EPC Module.....................................................................................................83
2.10 Color Touchscreen.................................................................................................................85
2.10.1 Description.............................................................................................................................85
2.10.2 Maintenance Overview...........................................................................................................85
2.10.3 Replacement Procedures.......................................................................................................86
3 Specifications.............................................................................................................................................93
Index...........................................................................................................................................................99

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WARNING
Do not connect analyzer to the internet.
This equipment must not be connected to the internet except by a secure connection using
a network security appliance administered by qualified IT personnel.
Failure to implement robust network security may expose your company to internet hacking
attacks that could result in theft or loss of sensitive data, equipment damage, serious injury
or death.

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Maxum II Reference Manual
6 Manual, 7/2017, 2000596-001
Analyzer Overview 1
1.1 Introduction

The Maxum edition II system, also called the “Maxum II”, represents a significant advance in
process chromatography. The Maxum II combines the best of the Siemens Advance Maxum
and PGC 302 gas chromatographs into a single platform analyzer. From oven and electronic
components to software and communication networks, the system is modular. Pre-configured
application modules are available for many common measurements.
A Maxum II system offers a wide range of detector modules including Thermal Conductivity,
Flame Ionization, Flame Photometric, and the Pulsed Discharge Detector (which can operate
in Helium Ionization, Photoionization, and Electron Capture modes). All detector modules are
available for both air bath and airless ovens. The Maxum II oven is designed so it can be
divided into two independently heated isothermal ovens for parallel chromatography
applications.
The Maxum II Maintenance Panel provides maintenance personnel with access to all
maintenance functions and data. In addition, the Maintenance Panel displays both real time
and archived chromatograms. A PC-based network workstation runs the Gas Chromatograph
Portal software.

Analyzer Specific Documents


Included with each analyzer is a custom documentation-drawing package. This package
provides drawings and information pertinent only to a specific analyzer. Contents of this
package are application-dependent and vary for each analyzer. Typical drawings included are:

● System Block and Utility Requirements ● Applicable Wiring Diagrams


● System Outline and Dimensional Drawings ● Oven Plumbing Diagram - Sensor Near
● Sampling System - Plumbing and Spare Electronics
Parts List ● Recommended Spare Parts - Analyzer
● Sampling System Dimensional Diagram ● Manufacturing Test Charts
● Sampling Probe ● Stream Composition Data
● Electronic Enclosure Section - Internal ● Database
Layout

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Manual, 7/2017, 2000596-001 7
Analyzer Overview
1.3 Parts of the Maxum II

1.2 Analyzer Specific Documents


Included with each analyzer is a custom documentation-drawing package. This package
provides drawings and information pertinent only to a specific analyzer. Contents of this
package are application-dependent and vary for each analyzer. Typical drawings included are:

● System Block and Utility Requirements ● Applicable Wiring Diagrams


● System Outline and Dimensional Drawings ● Oven Plumbing Diagram - Sensor Near
● Sampling System - Plumbing and Spare Electronics
Parts List ● Recommended Spare Parts - Analyzer
● Sampling System Dimensional Diagram ● Manufacturing Test Charts
● Sampling Probe ● Stream Composition Data
● Electronics Compartment - Internal Layout ● Database

1.3 Parts of the Maxum II

Overview
The Maxum II Gas Chromatagraph is completely enclosed in an air-purgable, metal cabinet
with hinged doors. Mounted above the isothermal oven is the electronics enclosure and
regulator panel. The analyzer may be mounted on a wall, in a rack or on a floor stand.

Electronics Regulator
Enclosure Panel

Color
Touchscreen
Detector
Compartment

Isothermal
Oven

Figure 1-1 Maxum II External Component Locations

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Analyzer Overview
1.4 Isothermal Oven

Electronics Enclosure
The Electronics Enclosure houses all the electronics and pneumatic modules required for
performing all temperature, valve control and analysis functions. The Electronics Enclosure
modules are interconnected using simple cable connections made to each module. All modules
can be easily removed and replaced. The Maxum II software recognizes each Maxum II’s
application, hardware components and network configurations.

International System Controller (SYSCON) For Communications,


Power Supply Human Interface and Database Management.

Solid
State
Relay 8-Channel Electronic
Module Pressure Control. Up
To 4 Modules. 2
Channels Each For
Control Of Carrier
Gas Pressure

Power
Entry
Control
Module
(PECM)

Detector Personality Module (DPM)


for Detector Data Acquisition

Figure 1-2 Electronics Enclosure Component Locations

Regulator Panel
The regulator panel contains space for seven gauges and regulators. The base Maxum II
comes with two standard regulators and an electronics enclosure fast purge. See the custom
documentation drawing package that was shipped with the analyzer to see which gauges and
regulators are mounted on the analyzer.

1.4 Isothermal Oven

The Maxum ll has a wide variety of isothermal oven configurations. Both air bath and airless
ovens are available. All air bath configurations are available with Vortex cooling for sub-
ambient temperature operation. A program temperature oven option is available for Maxum II
applications where isothermal, multi-dimensional chromatography is not practical. Typically
the program temperature Maxum II is used for Motor Gasoline (ASTM 3710) & Simulated
Distillation (ASTM 2887) applications.

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Analyzer Overview
1.5 Switching and Sampling Valves

Oven Configurations

Split Airless Oven


Single Air Bath Oven

Fully independent dual ovens with separate oven doors. The


Large, spacious compartment for complex applications and
oven uses cartridge heaters in each side to heat the oven
for ease of maintenance.
enclosure and its components.

Programmed Temperature Air Bath Oven

Dual Air Bath Split Oven


Provides a programmed temperature gradient for applica‐
tions requiring this.
Split Oven Configuration: Offers two temperature zones for
one or more applications.

1.5 Switching and Sampling Valves

Application Model Description


Vapor Samples Model 50 10-port non-plunger diaphragm. Contains no moving parts. It will operate over 10
million cycles on clean samples and can operate on carrier gas or other bottled inert
gas with negligible consumption. It does the work of two Model 11 valves and is half
the size.
Vapor or Liquid Sam‐ Model 11 6-port diaphragm–plunger valve high reliability and life. Used as a liquid or vapor
ples and Model sample valve, column switching valve or a column back flush valve. Process lines,
11 LDV columns and valve-to-valve tubes can be connected directly to the caps of the Model
11 LDV (Low Dead Volume) version of the valve.

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Analyzer Overview
1.6 Operator Controls

Vapor or High Pres‐ Model 20 The air-pressure actuated, diaphragm valve provides uniform sample volume, low
sure Liquid Samples internal volume, high pressure up to 1500 psi, 10350 kPa, fast switching (millisec‐
onds), reliability, and durability. It functions equally well as a liquid or vapor sample
valve, column switching valve, or column back flush valve.
Liquid Sample LIV The liquid injection valve can be used to automatically inject a constant quantity of
liquid sample followed by fast, complete vaporization. Small gas quantities can also
be injected using the valve.
Vapor Valveless The device has no parts to fail or wear out and exhibits essentially zero dead volume
Live Column for fast column switching and sample injection with capillary columns.
Switching

1.6 Operator Controls

Color Touchscreen

The color touchscreen displays all mainte‐


nance functions and data in a graphical dis‐
play. In addition it can also display both real-
time and stored chromatograms. The stored
chromatograms include voltages and cycle
times for future comparison as well as zoom
and pan features. Operational and routine
maintenance tasks for the analyer can be per‐
formed from the color touchscreen interactive
display screens and menus. System security
is assured with multiple levels of password
protection for all analyzer-operating func‐
tions.
A color touchscreen emulator (also called a Human Machine Interface, or HMI, emulator) is
available from the Maxum Gas Chromatograph Portal (GCP) software. This emulator allows
a user to perform color touchscreen tasks without being located at the unit.

Status LEDs

Purge (Flashing Red) Purge pressure lost

Fault (Red) "Failure" status is active

Warning (Yellow) "Maintenance request" status signal is active

Power (Green) 24 V power supply is on

All LEDs are on during power-up boot.

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Manual, 7/2017, 2000596-001 11
Analyzer Overview
1.6 Operator Controls

Workstation

The Maxum II uses a PC based network


workstation for programming and data
processing. Analyzers can be program‐
med and monitored from a single location,
and, like the color touchscreen, the work‐
station includes graphical displays for op‐
eration, maintenance, and diagnostics. It
also supports PC printers to print chroma‐
tograms and alarm logs in order to meet
record keeping requirements.

The Maxum II workstation software, Gas Chromatograph Portal (GCP), is designed for PCs
with Microsoft® Windows operating systems. PC workstations can be connected through
existing LANs for wide access to monitoring or maintenance tasks. The graphical interface
recognizes and displays all network hardware. The system monitors the alarm status of all
analyzers connected to the network to centralize system maintenance. More information can
be found in the GCP Help Manual.

Chromatography Software
EZChrom© industry specific software is incorporated in the GCP software. This is a laboratory
quality application builder developed by Scientific Software, Inc. and includes custom features
for the Maxum II. Using EZChrom, it is possible to set up methods and component peak
identification. More information can be found in the Release Notes file supplied with the
EZChrom software (under the Maxum EZChrom directory).
EZChrom allows a user to choose the best peak gating and basing methods automatically. It
is also possible to:
● Re-process captured chromatograms with different methods
● Measure unknown component peaks automatically
● Record multiple detector measurements simultaneously.

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Electronic Compartment Component Descriptions and
Maintenance Procedures 2
2.1 Power Supplies

2.1.1 Power System Module

Overview
The Power System Module (PSM) is a 110/230 VAC switching power supply that provides 24
VDC operating system voltages. It also provides 110/220 VAC conditioning. The 24 VDC power
supply provides high speed switching with power factor correction and universal input. The
PSM is a stand-alone system consisting of a power supply, filtering, circuit fuse protection and
a power monitor board.

Line Voltage Selector Switch


Power Fuse Holder
System
Module

Figure 2-1 Power System Module Location in EC

AC Line Input
AC power input to the power supply is from the Power Entry Control Module. A line cord from
the PECM plugs into the front AC receptacle of the power supply. A primary Line Voltage
Selector selector switch (located above the AC receptacle) must be set to match the primary
AC voltage input from the Power Entry Control Module.

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Electronic Compartment Component Descriptions and Maintenance Procedures
2.1 Power Supplies

Output Connections
Output 24 VDC is supplied to components within the Maxum II via a cable harness that exits
the backside of the PSM. The cable terminates in quick disconnect connectors. Typically, a
white connector supplies 24 volts to the SYSCON2.1 cage and an orange connector supplies
24 volts to the PECM, where it is distributed to various modules in the EC. DC/DC converters
in the modules generate the other voltage levels needed by various circuits.

Fuse Replacement
The Power System Module is equipped with a fuse (Siemens Part Number A6X19905350).
This fuse is located on the front of the PSM just above the power cord plug. The fuse is a 250
V, 4.0 A, “slow-acting” type. Although this fuse rarely fails, replacement is simple (disconnect
power to the analyzer first). To remove the fuse, unplug the power cable that comes from the
PECM. Access the fuse by removing the fuse cap with a large blunt screwdriver.

Specifications

Voltage Range 115 VAC (85 to 140 VAC), 230 VAC (185 to 264 VAC)
Line Frequency Range 47 to 63 Hz
Nominal Input Current 2 amp @ 115 VAC, 1 amp @ 230 VAC
Nominal Output Voltage 24 VDC ±3%, 1% ripple plus noise at a bandwidth of 30 MHz
Nominal Output Current 6 A @ < 104°F (40°C)
4 A @ 104° to 150°F (40° to 70° C)
Static Load 0.2 A; 0.0 A open circuit permitted
Dynamic Load Between 0.2 A to 3 A in the load range. A maximum load of 2 A at 1.8 kHz is
switched. Switching is controlled by pulse width. Precision range is not exceeded
in this operational mode.
Overcurrent Cutoff Cutoff starts at 6.4 to 7.5 amps. When current drops, device switches on.
Overvoltage Cutoff Cutoff starts at 27 to 31 VDC. When voltage drops, device switches on.
Overtemperature Cutoff After temperature decreases to specified tolerance, device switches on.
Power Fail Transitions Occurs 20 ms after a primary power failure. Should a power failure occur, a low
20 ms signal is generated.
Electric Isolation Input/Output: 3.7 kV
Dimensions Length: 10.24 inches (260 mm)
Width: 2.36 inches (60 mm)
Depth: 3.54 inches (90 mm)
Cooling Convection and conduction through aluminum mounting plate.
Output Wiring Cable harness

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Electronic Compartment Component Descriptions and Maintenance Procedures
2.1 Power Supplies

2.1.2 Replacement Procedure

Power Supply Location

Note
This procedure assumes that power is off in the analyzer.

The 24V power supply is easily accessed at the top of the electronics enclosure.

Replacement Steps

WARNING
Voltage dangerous to life exists in the electronics enclosure. Failure to follow proper safety
procedures may result in injury or death.
Turn off line votage to the analyzer before disassembling power-supply components. Even
though nothing appears to be operating, AC voltage can still be present on many of the
components in the enclosure.

NOTICE
Obtain all permits that may be required to perform this work.
Observe local codes and obtain any required permits before starting the work.

The power supply has an integral bracket that slips under flanges in the top of the enclosure
on the right side, and by two muts on threaded studs on the left side. Slots in the bracket allow
removing the supply without completely removing the nuts.

2
1

3 4 6
5

7 7

A. B. C.

Figure 2-2 Removing the Power Supply Module

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Electronic Compartment Component Descriptions and Maintenance Procedures
2.1 Power Supplies

1. Ensure that power has been disconnected from the analyzer.


2. Open the electronics enclosure door.
3. Unplug SYSCON power cable from the bottom of the SYSCON cage.
4. Unplug the PECM 24V cable.
5. Loosen nuts (1 in photo A above)
6. Slide the power supply forward enough to disengage the power-supply tabs from enclosure
tabs as shown in photo below. (2 in photo A above)
7. Tilt the power supply clockwise to allow the tabs to clear the flanges. (3 in photo A above)
8. Drop the power supply off the nuts. (4 and 5 in photo B above)
9. Before completely removing the supply, unplug the safety ground wire from the spae lug
on the back of the enclosure. (See 7 in the photo C Removing the Power Supply Module
above.)
10.Slide the power supply out of encloure. (6 in photo B above)
Mo
un
tin
g fla
n ge
so
ni
ns
ide
top
of
en
cl o
su
re

Line-voltage
To PECM power connector To safety
selector switch
ground lug
on back wall
Fuse holder
To SYSCON
power connector Line-cord connector
on bottom-left of cage

Figure 2-3 Power Supply Module Details

Reinstalling the power supply


The new supply is installed using the steps in reverse order. It may be necessary to slightly
bend the flange edges down to allow the supply bracket to engage the flanges. See C in the
photo Removing the Power Supply Module above.

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Electronic Compartment Component Descriptions and Maintenance Procedures
2.1 Power Supplies

Note
Verify proper position of line-voltage selector switch and fuse value. Incorrect settings can
damage the equipment.
See the information packet that was shipped with the analyzer for information on the individual
analyzer.

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Manual, 7/2017, 2000596-001 17
Electronic Compartment Component Descriptions and Maintenance Procedures
2.2 Power Entry and Control Module

2.2 Power Entry and Control Module

2.2.1 PECM Overview

Overview
The PECM3-CTL board mounts on the PECM-SSR board. This assembly provides a variety
of power and control functions. The connections are shown below.

AC in MWH out
LWH1 - LWH5
out HWH SSR
power out
Optional
UPS input Purge Air
for 24vdc Switch
supply
24v in
Fan
HWH SSR
power
control out
Temp RTD in
F1
u les
I2C bus
mo d t
F5
TL/
OT
tr o l ou MW
H Air bath heater
on in
F2 Hc trol monitor in
cov
er) H W H co n Solenoid
i th out HW
(w control out
F4 ver)
t co
w i th ou
( Atmospheric
F3
pressure sensor
PECM-SSR Board i n
on trol Purge disable jumper
WHc
Filtered H/M Purge signal out
LW
AC out I2C bus (Ribbon-cable
to 24v connector to
supply L1 MMI PECM-SSR)
PECM3-CTRL Board LED out

Figure 2-4 PECM3 I/O Connections

The PECM3 assembly part number is 2021828-002. An upgrade kit, part number 2022019-001
is available to replace earlier units.

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Electronic Compartment Component Descriptions and Maintenance Procedures
2.2 Power Entry and Control Module

2.2.2 Feature Additions

Improvements in PECM3-CTL from PECM-CTL


● Seven I2C connectors are provided compared to 4 on the previous PECM-CTL, eliminating
the need for a Wiring Distribution Board (WDB).
● An Atmospheric pressure sensor has been added.

Improvements In PECM2 Assembly from Original PECM


The PECM design has changed since its original release. The newest version of this part is
also used as the spare-part replacement for the previous version. The original PECM was a
single electronic circuit board with a metal protective shield. It provided connection points for
the electrical power coming into the Maxum GC and mounted low power electrical relays which
could switch power to any electrical heater with a power rating of less than 200 watts.
The newest version of the module, PECM2, is a two part circuit board. One part connects the
electrical power. The other part includes certain electronic circuits. Key features of the newer
design are:
● Easy access (no cover)
● Two on-board temperature control circuits. May allow elimination of a DPM that is only used
for temperature control, such as for heated valves or the methanator.
● Additional medium-wattage heater circuit
● Four connectors providing I2C and 24VDC power distribution have been added. This
replaces some of the functions of the Wiring Distribution Board (WDB).
● Includes solenoid valve control which eliminates the need for individual SVCM controller
boards. When converting an older analyzer and eliminating original SVCM controller
boards, additional long cables are required.
● Improved low-profile fuse holders
● LED indicators for air pressure switch on air-bath heater circuits
● Built-in provision for connection of Uninterruptible Power Supply (UPS) for 24VDC circuits.
The heaters are powered through different connectors to minimize the loading of the AC
power needed for running the 24VDC circuits.

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Electronic Compartment Component Descriptions and Maintenance Procedures
2.2 Power Entry and Control Module

2.2.3 PECM Functions

2.2.3.1 AC Input and Distribution


AC mains power is wired to TB1 and TB2. TB10 is an optional connection for an uninterruptable
power supply for the 24 V power supply output, as shown in the diagram below.

Note
The power switching circuit is designed for either 115 VAC or 230 VAC. For safety reasons,
the PECM is not designed to convert DC to AC. Attempted operation from a DC source will
damage or destroy the PECM. To generate and control 115 VAC from a DC voltage system,
the customer must use components external to the PECM.

TB10* TB1 TB2


*TB10 parallel-connected
to TB1 if UPS is not used
HN HNG 1 HNG

3
2
1
2

3
2
1

N1

N2
L1

L2

Filtered AC
F3
3A
Holder
J1 Low Wattage
Hot

H 1 Heater Relays 1- 5
Hot

G 2
N 3 F4 10A

AC Filter Plug AC Chassis Medium Wattage


(for 24V supply) Ground Heater Relays
Hot

F5 6A

Hot Hot

F1
Holder

Holder

F2
16A 16A
ABH2 ABH1
TB9
1

2
3

Air Bath Heater Power

Figure 2-5 PECM AC Power Distribution

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Electronic Compartment Component Descriptions and Maintenance Procedures
2.2 Power Entry and Control Module

Fuses

Circuit Fuses for 115 Fuses for 230 VAC


VAC
F1 AC power circuit 1 - Oven heater 2 16 A 10
(1901693-001) A(1901694-001)
F5 Medium or low wattage heater channel 6 6.3 A 6.3 A
- MWH/LWH6 )
(1901695-001) (1901695-001)
F2 AC power circuit 2 - Oven heater 1 16 A 10
(1901693-001) A(1901694-001) )
F4 Low wattage heaters 1-5 - LWH1 - LWH5 10 10
A(1901694-001) A(1901694-001) )
F3 Power supply (24 VDC) - FILT AC 3.15 A 3.15
(1302004-033) A(1302004-033) )

)

2.2.3.2 Oven Temperature Control


Oven Temperature Monitoring and Control: The PECM_CTL board has two temperature
monitor and control channels for use with the high-wattage heaters (HWH) and medium-
wattage heaters (MWH). Each channel includes;
● RTD input
● Mounting location and connector for set point resistor module
● Comparator circuit
● PWM control signal output
● Control input (can accept an external control signal from another module if desired)
● Control output for High or Medium Wattage Heater Solid State Relay module
● AC power output for High or Medium Wattage Heater Solid State Relay
Each circuit consists of two series-connected solid-state relays. One of these relays controls
the 1400-Watt or 650-Watt AC heater to maintain the set point temperature by monitoring the
air bath RTD and heater pressure switch. The second relay is used for safety purposes. It
performs an emergency analyzer heater shutdown if an over-temperature condition is
detected. Both relay circuits are completely independent of each other. However; in order for
the power circuit to be energized, both relays must be enabled. Temperature controls are
monitored by the Detector Personality Module and routed to the PECM via a dedicated cable
and connector, or by the temperature-control circuits on the PECM-CTL board itself. No other
functions are connected to the temperature control circuit. When over temperature is detected
the PECM over temperature circuit inhibits the SSR from powering the heater and stays off
until power is reset. Alarm conditions are reported to the SYSCON over the I2C link.

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PECM Air Bath Oven

Temp Analog Temp Control,


Compare
Setpoint Temp Limit,
Modules Overtemp RTDs

SYSCON
I2C
PWM
SSR Pair High-Wattage
Airflow
Heater
Loss
Shutdown
Digital Air Pressure
Switch

Airflow Loss Temperature


Shutdown Control

AC
Line Heater
SSRa SSRb

Figure 2-6 PECM Heater Control Functions

2.2.3.3 Communication and Power Distribution

The 24V power supply connects to one of two parallel power connectors, TB1 and TB2 on the
PECM-CTL board. Another module can be powered from the other connector.
Each of the 7 I2C connectors also provides 24VDC power to the connected module.
A separate connector powers a 24V fan.

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2.2.3.4 Onboard Solid State Relays

Low-Wattage Heater SSR Control


The PECM has six solid-state relay circuits. These circuits can control low wattage (10 to 250
Watts) air bath heaters, heaters in the heated Flame Ionization and Flame Photometric detector
housings or in heated sample injection valves, and can be adapted for on-off control of a
sample valve or other device. The output voltage from each relay can either be 115 VAC or
230 VAC depending upon the mains supply voltage. Available outputs from the relays are on
TB3 through TB8. Corresponding inputs are labeled LWH1 through LWH6. The LWH6 input
controls the medium wattage heater (MWH) output. When a relay output is used for sample
valve control, the supplied jumpers must be inserted in the corresponding input LWH1 through
LWH4. (See Additional Relay Outputs below for using the individual SSRs in outputs 5 and
6.) For safety, since the power switching circuits are primarily designed for low-wattage air-
bath heater control, each circuit has two series-connected SSRs, each being separately
controlled. The jumper ties the two relays together to function as one output when they are not
used for low wattage heater control. The circuitry is similar to the 1400-Watt High Wattage
Heater Power Switching and it is controlled by signals from the Detector Personality Module
(DPM) heater circuit. The diagram below shows a simplified schematic of the Low Wattage
Heater Relay Circuit LWH4.

TB2
AC Power Input

R47 10kΩ
LWH 4A On

LWH 4A Enabled SSR4A 1


3

5V J6 10kΩ 5A
1 DET/CTRL A
2
SSR EN A R54
LWH 4B On 3 4 2
DET/CTRL B
4 4 2
LWH 4 Plug Det SSR EN B
5
Plug Detect

6
GND TB5
LWH4 CTRL PLUG 5V 1
3
1 Line
LWH 4B Enabled
SSR4B
2 Neutral

LWH4

Figure 2-7 LWH4 Heater Circuits

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Additional Relay Outputs


Relay circuits LWH5 and LWH6 when used for purposes other than on/off control of low
wattage heaters can supply four separate outputs. A simple jumper on pins 1 to 2 on output
connector TB7 or TB8 makes this possible. With the jumper in place, each connector will
provide two independent outputs; see the diagram below.

Relay AC Supply Voltage


Usage
TB7 (LWH5)
Sample
or Heater System Relays
TB8 (MWH)

Jumper
A&B Common Unused

Jumper
AC Hot
Solid
State SSRA Hot SSRA Load Hot
Relay
AC Neutral A Unused SSRA Load Neutral
SSRB Hot To LWH Hot Load SSRB Load Hot

AC Neutral B To LWH Neutral SSRB Load Neutral

Figure 2-8 LW5 & LW6 Relay Circuit Jumper Connections

2.2.3.5 Oven Functions

Temperature Monitoring and Control


The PECM_CTL board has two temperature monitor and control channels for use with the high-
wattage heaters (HWH). Each channel includes;

● RTD input ● Control input (can accept an external


● Mounting location and connector for control signal from another module if
setpoint module desired)
● Comparator circuit ● Control output for HWH SSR module
● PWM control signal output ● AC power output for HWH SSR

The HWH control path is shown below.

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PECM Air Bath Oven

Temp Analog Temp Control,


Compare
Setpoint Temp Limit,
Modules Overtemp RTDs

SYSCON
I2C
PWM
SSR Pair High-Wattage
Airflow
Heater
Loss
Shutdown
Digital Air Pressure
Switch

Airflow Loss Temperature


Shutdown Control

AC
Line Heater
SSRa SSRb

Figure 2-9 PECM Heater Control Functions

Each circuit consists of two series-connected solid-state relays. One of these relays controls
the 1400-Watt AC heater to maintain the set point temperature by monitoring the air bath RTD
and heater pressure switch. The second relay is used for safety purposes. It performs an
emergency analyzer heater shutdown if an over-temperature condition is detected. Both relay
circuits are completely independent of each other. However; in order for the power circuit to
be energized, both relays must be enabled. Temperature controls are monitored by the
Detector Personality Module and routed to the PECM via a dedicated cable and connector, or
by the temperature-control circuits on the PECM-CTL board itself. No other functions are
connected to the temperature control circuit. The connections are EMC filtered. When over
temperature is detected the PECM over temperature circuit inhibits the SSR from powering
the heater.
Alarm conditions are reported to the SYSCON over the I2C link.

Solenoid Control
Includes solenoid valve control which eliminates the need for individual SVCM controller
boards. When converting older design and eliminating original SVCM controller boards,
additional long cables are required.

Air-Supply Monitoring for Air-Bath Oven


The 1400-watt heater assembly is used in many air bath configurations (single isothermal;
dual isothermal; or Programmed Temperature Control). A single heater is used for the single
isothermal configuration and two heaters are used in the other configurations.
Additionally, a “medium power” Solid State Relay Module (temperature control relay module)
is available. These smaller relays are capable of controlling the 500 watt air bath heater
assembly. This can be used in single isothermal configurations where the controlled oven
temperature is 70°C or less. In addition, the “medium power” SSR Module can be used to
control the two 250 watt heaters used in the Maxum airless oven configurations.
See the PECM3 I/O Connections diagram in PECM Overiew for connector locations.

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2.2.3.6 Electronic Enclosure Environment

Purge Monitoring
The PECM monitors the state of the purge condition for the analyzer. If a loss of purge is
detected the purge switch is enabled. The purge control alarm signal is controlled by the
SYSCON. The purge signal cable from SYSCON to PECM plugs into connector J1302 on the
PECM2. Connection SW1 on the PECM2 is used to connect atmospheric reference for the
purge switch.
When a purged enclosure is not required per the safety codes, connector J2 on the PECM2
can be used to disable the purge alarm. See the PECM3 I/O Connections diagram in PECM
Overiew for connector locations.

Atmospheric Pressure Monitoring (New for PECM-CTL3)


This sensor allows a Maxbasic program to measure the ambient atmospheric pressure for
custom applications. A tube must be connected from the sensor (J44 on the PECM-SSR board)
to the exterior of the EC.

L1 MMI LEDs
Maintenance Panel Level 1 consists of LEDs on the outside of the analyzer door. It is intended
for use in GCs that are not equipped with the full feature Maintenance Panel. The PECM
supplies the control signals for Maintenance Panel Level 1, if equipped. For PECM-1, the
Maintenance Panel Level 1 connects to position J17. See the PECM3 I/O Connections
diagram in PECM Overiew for the location of connector J17.

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Physical Location
The PECM is mounted to the left inside wall of the EC cabinet. All fuses and electrical
connections are readily accessible.

Figure 2-10 PECM3 Mounted in EC

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2.2.4 Replacement Procedure

General Precautions
The PECM is the entry point for the line voltage for the entire analyzer.

Note
Specific additional instructions are provided with tags placed on the Maxum II and in the custom
application drawing package noted below. Installation must include all of the items noted in
both of these as well as the manuals. The tagging and custom application drawing package
are unique to the particular Maxum II.

● This procedure must be performed by a user who has detailed knowledge of the Maxum.
If a customer does not have the knowledge required for this procedure, then it is
recommended that Siemens Field Service personnel be contracted to assist.
● A tool kit including both standard and metric wrenches, Hex wrenches, and nut drivers is
required to perform this procedure.
● Before beginning replacement, be sure to save a current database of the application to be
reloaded after the PECM is replaced in case this becomes necessary.

WARNING
Voltage dangerous to life is present on the PECM. Failure to observe proper safety measures
can cause severe injury or death.
Before beginning to remove or install the PECM assembly, the power must be externally
removed from the GC. AC power comes directly into this board for regulation and distribution
in the electronics enclosure, so power must be removed and secured/tagged to prevent
inadvertent application while this procedure is being performed.

2.2.4.1 Troubleshooting

PECM Status LEDs


The PECM3 should start automatically once power is applied. If the unit is not operational after
applying power, then review the information below to aid in correcting the problem.
The most common issue with replacing the PECM3 is cables, wiring connections, and jumpers.
Check all of the cable connections to ensure that they are seated and connected properly.

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The alarm system can also provide direct information on alarms for an error. Review the alarms
to see if they provide an indication of the problem. Each alarm has a written description that
may provide an indication of the problem area.

The LEDs on the PECM board can help with LEFT Heater Status RIGHT Heater status
troubleshooting problems. There are two
sets of LEDs: one on each side of the front Heater 1 Air Pressure Heater 2 Air Pressure
board as shown in the diagram to the right. Heater 1 Power Activate Heater 2 Power Activate
The bottom set of three LEDs is the same as

PECM-CTRL PCB
Heater 1 Temp Limit Heater 2 Temp Limit
used on other boards (described below.) The Heater 1 Overtemp Heater 2 Overtemp
left set is for the PECM software. (The other
LEDs are not used for PECM1 replacement.)
The corrective action to take for each of the Normal Normal Temperature
LED indications is noted below with a correc‐PECM Status Fault Fault Controller
tive action reference number on the diagram Warning Warning
Status
at the right. The normal state indication is
shown in the diagram below.

PECM LEDs

State 1

State 5 - Warning condition; data good temporarily


1. If all units in this state, then power to the analyzer and/
or board is not active
2. Reset the device or cycle power
3. Check power connections to board (AC and 24VDC)

State 6 - Fault condition; data invalid


4. Replace unit
State 2 State 3 - Address assignment

State 4 - Normal operation


1. Reset the device or cycle analyzer power
2. Replace unit
State 1 - Power off

State 3
State 2 - Self test

1. Reset the device or cycle analyzer power


2. If all modules are in State 3, then SNECON is not
communicating (check cabling and connections)
3. Replace unit
State 4 Normal Operation
Normal
State 5
1. Reset the device or cycle power Fault
2. Check communication cable connections Warning
State 6
PECM LED Interpretation
1. Reset the device or cycle power
2. Check communication cable connections
3. Check for missing Temp Limit setpoint boards
4. Check for shorted or open RTDs
5. Replace the unit
6. Replace other connected units

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2.2.4.2 Removing The PECM

Precautions
Before starting this procedure, follow the steps in the General Analyzer Shutdown Procedure.

WARNING
Voltage dangerous to life exists. Failure to follow proper safety procedures may result in
severe injury or death.
Before beginning to remove or install the PECM assembly, the power must be externally
removed from the GC. AC power comes directly into this board for regulation and distribution
in the electronics enclosure, so power must be removed and secured/tagged to prevent
inadvertent application while this procedure is being performed.

WARNING
High-voltage circuitry. Failure to follow proper procedures may result in equipment damage,
personal injury or death.
The cable harness connectors and the chassis plugs associated with the Heater circuits are
marked with orange identifier tags. Before reconnecting any connector or plug to a Heater
circuit, ensure that the orange identifier tag on the connector or plug reads identical to the
orange identifier tag on its mating connector.

CAUTION
Observe proper fuse values to prevent equipment damage or personal injury.
The PECM1 is used in applications with both 115VAC and 230VAC power. Before installing
a replacement assembly, ensure that the correct fuses for the particular application are
installed in the replacement PECM3.

Procedure
1. Open electronics door. If the latch is locked, use 4mm (5/32’”) Allen wrench to unlock.
2. Label all cable connections before disconnecting if they are not already labeled. Be sure
to read the Warning below concerning those tagged with orange labels.
3. Unplug cables from all PECM connectors.
4. Unplug the atmospheric reference tube from the purge switch. (labelled “Purge SW”, tubing
connection next to the back wall of the EC, on the PECM1.
5. Use a 5mm nut driver to loosen two hex nuts at the top of each side of base plate of the
PECM.
6. Slide the PECM up and then lift the PECM off of the mounting bolts.

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2.2.4.3 Installing The New PECM

Procedure
1. On the replacement PECM3 assembly do the following:
– Set the Purge Disable jumper JP2 to the same setting as the PECM being replaced.
– Install the appropriate fuses for either 115VAC or 230VAC in Fuses F1 and F2 and install
fuse covers.
– Move jumper cables or termination plugs to the replacement PECM.
– Move the TL/OT modules from the old PECM to the replacement PECM, in the mounting
locations marked “TEMP CONTROL 1” and TEMP CONTROL 2”. These are required
to avoid false alarm codes.
– If Heater Termination Plugs are installed in the old PECM instead of cables at the
positions marked “TEMP RTD 1” and “TEMP RTD 2”, move these to identical locations
on the replacement PECM. The plugs disable the PECM temperature circuits, including
the LEDs.
2. Ensure that there are no wires behind the mounting position of the PECM.
3. Because the atmospheric Purge switch SW1 is near the back wall after the PECM is
installed, if desired, the Purge tube may be installed on SW1 before mounting the PECM
in the next step.
4. Install the replacement PECM on the two mounting bolts.
5. Tighten the two 5mm hex nuts.
6. Start at the back of new controller and plug in the following cables (see the connector
identification illustrations)
– If not already connected in step 12, connect the Purge switch SW1 (tubing connection)
– Relay power plug TB9 and Heater Relay Control cable
– Fan power cable plug J18, and 24VDC power cables to the orange TB1 and TB2 on top
board (there are TB1 and TB2 AC connectors on the bottom board as well - see
illustration at right.)
– I2C connections (J24 - J26, J30 - J33)
– Low wattage heater connections (TB8, TB3 to TB5, and LWH1 to LWH6)
– AC inputs (TB1, TB2, & TB10.)
– Heater pressure switch (J10) (If no cable, then a jumper is needed.)
7. When replacing in a unit that has a MMI-1, then connect the MMI LED cable to J17.
8. Connect the Purge Signal cable to J1302.
9. Move 24V cable (from power supply) from WDB J1 to PECM3 TB1.
10.Add 24V power cable, 2021837-001 from PECM3 TB2 to WDB J1.

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11.Ensure the correct fuses are in the correct positions, as shown in PECM AC Power
Distribution illustration.
12.When the procedure is completed, follow the steps in the General Analyzer Startup
Procedure.

2.3 System Controller Version 2.1 (SYSCON2.1)

2.3.1 Description
The System Controller (SYSCON2.1) is a combination of two interconnected boards that
together function as the control processor and motherboard for the Maxum analyzer.
The SYSCON2.1 consists of two boards, the Communication and Analytical Control (CAC3)
board and the SYSCON Interface Board (SIB3). The CAC3 contains the processor and
memory functions for the SYSCON2.1 as well as control of external Ethernet communications
(via the Ethernet Switch Board). The CAC3 is mounted on and operates in conjunction with
the SIB3. With the exception of external Ethernet, the SIB3 contains all interfaces provided by
the SYSCON2.1.
The CAC3 on the SYSCON2.1 stores the analyzer application database, combines all data
results, and performs additional high-level data processing and calculations. All network
communications, maintenance panel and analyzer functions are also coordinated by the
SYSCON2.1. The SYSCON2.1 provides communication between the Controller Board, I/O
Boards and the EC operating modules.
More information about the SYSCON can be found in the System Controller version 2
(SYSCON2.1) Installation Manual (Siemens part number A5E02643617001).

Additional Functions

● Processing and communicating the ● Display and operator control


measurement values ● Controlling associated systems, such as
● Controlling system functions, such as gas supply
calibration ● Generating reports

Software Support
The SYSCON2.1 is supported only by software version 5.2 or greater.

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2.3.2 Mechanical

Overview
The SYSCON2.1 board pair resides in the SYSCON assembly. This assembly is a pullout,
drop-down drawer located on a slide rail assembly mounted to the upper wall of the Electronic
Enclosure. The SYSCON assembly is a card cage housing the SYSCON2.1 boards, the
Ethernet Switch Board, and any other associated hardware such as I/O boards.

Serial
SYSCON2.1 External
Ethernet
Intrinsic-Safety Ground Connection Points Ports Cage Ports

TIB Door Assembly

I/O Display Cable Routing


Connectors Into SYSCON

Figure 2-11 SYSCON2.1 In Electronics Enclosure

The Color Touchscreen cables directly to the


SIB3 through an opening in the rear of the SY‐
SCON assembly.
All PC boards in the SYSCON assembly are
visible through the front of the drawer for making
all I/O connections. Interface connectors to the
front panel display, and communication connec‐
tors are also located and labeled on the front of
the drawer.

SYSCON2.1 Drawer

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2.3.3 SYSCON2.1 Components

2.3.3.1 Communication and Control Board (CAC3)


The Communication and Control board (CAC) is a standardized, single-board central
processing unit for intended for use in Siemens products. For the Maxum family of products
the third generation of the CAC board (CAC3) is used.
The CAC3 includes an on-board 10/100 Ethernet controller, used for connection to external
Ethernet. This is connected via a short RJ-45 patch cable to the Ethernet Switch Board, which
resides in a card slot on the SIB3.
More information and details pertaining to the CAC3 can be found in the System Controller
version 2.1 (SYSCON2.1) Installation Manual (Siemens part number A5E02643617001).

Figure 2-12 CAC3 Board (Part Number A5E02599492004)

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2.3.3.2 CAC3 Status Indicator LEDs


The CAC3 is equipped with several LEDs that communicate useful information about the
operating status of the CAC3.

Link Status

Link Acknowledge

LED7

LED2 LED3 LED4


LED1 LED5

Figure 2-13 CAC3 LED Locations

LED1 Debug LED1 Green – On during normal operation.


LED2 Debug LED2 Green – On during normal operation. Off during bootload.
LED3 Power Good Green – Power to CAC3 is functional.
LED4 Maintenance Yellow – Off during normal operation. On during bootload.
LED5 Fault Red – CAC3 Board fault
LED6
LED7 Ethernet Speed Green –
On – Speed is 100 Mb/sec (or auto-negotiating)
Off – Speed is 10 Mb/sec (or disconnected)
RJ-45 Link Status Green – LED is green when link is in full duplex mode.
Green
RJ-45 Yel‐ Link Acknowl‐ Yellow – LED is on when link is active. Will flash off for transmit or receive activity.
low edge

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2.3.3.3 SIB

SYSCON Interface Board (SIB3) Overview

Compared to the SYSCON2 in previous Maxum II analyzers, the SIB3/CAC3 together with the
Color Touchscreen equipped with a TIB module replaces the SIB2/CAC3 and Color
Touchscreen equipped with a CIM module. This simplifies the internal cabling in the electronics
enclosure.
The SYSCON Interface Board version 3 (SIB3) is a board, with the CAC3 mounted on it,
performs the function of the SYSCON2.1. Unlike the CAC3, the SIB3 is specific to the Maxum
family of products (including the Maxum, the Maxum II, NAU). The combined SIB3 and CAC3
are an electrically and mechanically compatible replacement for the legacy SYSCON board
in the Maxum.

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SIB3 LEDs

LED Locations
The SIB3 has several LEDs that indicate useful information about the operating status of
various interfaces.

Internal
Ethernet I2C LEDs
Power LEDs to SNECON
LEDs

I2C-Pullup
Active LEDs

CAC3

CAN
Bridge
LEDs

0 1 2 3

DI Mode
Switch
(Set to Mode 2)

PCI Slot LEDs


Reset
I/O Connector

Figure 2-14 SIB3 LEDs and Switches

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Power LEDs
Located at the back of the board near the RJ 45 connector

Description Color and Meaning


Power Green – 3.3V power is available. Should be on at all times
Power Bad Red – Power is faulty or SYSCON hardware reset switch is being pressed
CAC Conn Bad Red – Connection from the SIB3 to the CAC3 is faulty or incomplete. After power up, this
LED should turn off once CAC3 to SIB3 connection is completely initialized.

I2C Bus LEDs, Buses A and B


Located next to I2C Bus connectors

Description Color and Meaning


LED2/5 Norm/Comm Dim Green – I2C Bus is normal
Bright Green - I2C Bus is communicating
LED3/6 Warning Yellow – Warning on the I2C Bus
LED4/7 Fault Red –I2C Bus fault

I2C Bus Pullup-Active LEDs


Located next to battery holder

Description Color and Meaning


LED19, 20 The Auto-pullup feature is supplying pullup current on the I2C Bus.

Can Bridge LEDs


Located to the left of the far left PCI slot

Description Color and Meaning


LED16 Ready/Comm Dim Green – Can Bridge is normal
Bright Green – Can Bridge is communicating
LED17 Warning Yellow – Warning on the Can Bridge
LED15 Fault Red – Can Bridge fault

Can I/O LEDs


Located next to far left CAN direct connector, CAN direct 5

Description Color and Meaning


LED8 TX Green – On when a valid CAN I/O message (other than a heartbeat reply) has been received
and queued for processing
LED9 RX Green – On when a CAN message (other than a heartbeat transmission) has been queued
for sending to the CAN hardware

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Description Color and Meaning


LED10 Heartbeat Green – Flashes once for each heartbeat message transmitted. This LED will flash once
every 1.5 seconds for each active CAN card
LED11 Fault Red – On when an error state is detected on the CAN bus hardware

PCI Slot LEDs


Located between PCI slots

Description Color and Meaning


LED14 Slot 0 Fault Red – Overcurrent or thermal shutdown on PCI slot 0
LED13 Slot 1 Fault Red – Overcurrent or thermal shutdown on PCI slot 1
LED18 Slot 2 Fault Red – Overcurrent or thermal shutdown on PCI slot 2
LED12 Slot 3 Fault Red – Overcurrent or thermal shutdown on PCI slot 3

Internal Ethernet LEDs


Located next to and on SIB3 RJ-45 connector

Description Color and Meaning


Green LED on RJ-45 Green – LED is green when link is in full duplex mode
Yellow LED on RJ-45 Yellow – LED is on when link is active. Will flash off for transmit or receive activity.
LED1 Speed Green –
On – Speed is 100 Mb/sec (or auto-negotiating)
Off – Speed is 10 Mb/sec (or disconnected)

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SIB3 Connectors
Other than external Ethernet, the SIB provides all interfaces for the SYSCON2.1. The
connections are described below. All connectors in the SYSCON2.1 have the same pin
assignments as the corresponding connectors in the original SYSCON, except where noted
below.

42
3
5
Ethernet
Ethernet (to Ethernet Maintenance I2C B
Reset
to SNECON Switch) Panel (Legacy)
(Legacy)
(if used)

I2C A

CAC3 Power

Purge
SYSCON
Debug CAN
Internal
Serial Port 2

Serial Port 1 2 3 4 5 CAN


Direct

for Ethernet Switch Board


Color Network Expansion Slot
Touchscreen
0 1 2 3

I/O Mode
Switch

CAN Bus Serial Serial


PCI Slots Port 3 Port 4
Reset
I/O Connector

Figure 2-15 SYSCON2.1 Connections

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PCI and CAN Direct Slots


The PCI slots on the SIB accommodate a variety of special function cards, including I/O boards
or an ANCB board. Four PCI slots are equipped in the SYSCON2.1; however, typically only
three slots are available for use in the standard configuration, because one SYSCON slot is
used for serial/debug port hardware.
In addition to PCI type cards, the card slots can also accommodate Maxum CAN I/O cards.
The small green connector in line with the PCI slot allows CAN I/O cards to be installed in the
slot. When a CAN card is installed, the green connector provides the power and CAN signals
for the card. The PCI slot connector has no electrical connection for CAN cards.

Note
Only use cards specified and sold by Siemens for the SYSCON2.1. Installation of a card that
is not approved by Siemens into a SYSCON2.1 PCI slot, may damage both the card and the
SYSCON2.1.

Network Expansion Slot


The Ethernet Switch Board (or Ethernet Switch Board with Fiber) plugs into this connector,
located on the far right side of the SYSCON2.1. The connector slot provides power to the
Ethernet Switch, but no communication. All communication between the Ethernet Switch and
the SYSCON2.1 is through a short CAT5 Ethernet Cable that connects from the CAC3 to the
Ethernet Switch.

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Serial Ports
● SYSCON Debug – This serial RS-232 port provides the SYSCON2.1 debug function on
the CAC3. The debug port has no support for hardware handshake. The debug port is
accessed via a DB9 connector on the front of the SYSCON assembly cage.
● Serial Ports 1 and 2 – The SYSCON2.1 is equipped with two serial ports, each ground-
isolated and configurable for RS-232 or RS-485. Both ports support RTS/CTS hardware
handshake. Maximum supported data rate on the serial ports is 115200 bits/second. Serial
Port 1 supports Modbus and Serial Port 2 may be used to support a printer.
Note
RS-485 Operation
When configured for RS-485 operation, the serial ports are designed to comply with the
Profibus standard. This results in a different pinout than for the previous version of SYSCON
(pins 8 and 2 reversed). For backward Modbus RS-485 compatibility when replacing a
SYSCON+ with a SYSCON2.1, an adapter cable (part number A5E02283873001) is
available.

DB-9 Pin RS-232 Signal RS-485 Modbus Signal


1 - -
2 RX %v power
3 TX Line B (RxD+/TxD+)
4 - -
5 GND Common
6 - -
7 RTS -
8 CTS Line A (RxD-/TxD-)
9 - -

● Serial Ports 3 and 4 – These two serial ports, equipped on the same slot connector as the
SYSCON Debug port, are not active in software release 5.0.

I2C Bus
The I2C connectors are shown in the upper right corner of the SYSCON2.1 Connections photo.
Two I2C buses are equipped on the SYSCON2.1. These are labeled I2C Bus A and I2C Bus B.
● I2C Bus A includes the two connectors on the right as shown in the SYSCON2.1
Connections photo. I2C Bus A is dedicated and hard wired to the CAN Bridge function. This
allows the new SYSCON2.1 to interface with legacy CAN I/O cards in the PCI slots.
● I2C Bus B includes the three I2C connectors on the left as shown in the SYSCON2.1
Connections photo. I2C Bus B is supports2 future configuration changes in the Maxum II.

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Resets
The SYSCON2.1 has a pushbutton reset switch at the front of the board. This switch may be
accessed via the front of the newest version SYSCON assembly cage. The second connection
consists of two pin connections at the back of the board (top left of the SIB connections photo)
second connection operates using a simple loop closure, and supports legacy SYSCON
assembly cages that provide a separate wired pushbutton reset. Both connections allow the
user to initiate a hard reset of the SYSCON (same as initial power up).

Purge
The purge detect signal is received from the PECM and handled by the SYSCON as a digital
input to generate a purge alarm.

Display Connectors
Interface and power for the Color Touchscreen connect to the SYSCON2.1 using a cable
assembly. This cable runs directly from two connectors on the SIB, out through tthe back of
the SYSCON cage, to the Color Touchscreen panel.

Power
The 24 V power supply mounted beside the SYSCON cage powers the SYSCON2.1 directly
through a cable that plugs into the bottom of the cage. On-board power conversion derives
the other voltages needed for operation.

Note
The real-time clock on the CAC3 board is powered by a backup circuit on the SIB. Older SIBs
may have a battery in the backup circuit. Because the back-up circuit is located on the SIB
board while the real time clock is on the CAC3 board, if the CAC3 board is disconnected from
the SIB, then backup power is lost. The time and date must then be set on the analyzer.

IO Connections
The SYSCON has the following channels:
● x4 digital output relay channels providing a normally closed (NC) and normally open (NO)
with common.
● x4 digital input channels. Straight contact closure and sourcing from the device to trigger
state change is provided. See DI_SINK_SOURCE section for more explanation.
● x2 analog output current channels. Output ranges are 0 to 20mA, 4 to 20mA, 3.8 to 20.5mA
(NAMUR) and 0 to 25mA. The last two are possible with latest versions of software only
(ver 4.3 and later).
DO1 is for system alarms (Fault only) and cannot be addressed.
AO1 is used for the chart recorder but may be used as an AO. If the chart recorder is turned
on it will control the AO’s output.
The field wiring is connected to terminals 1 through 12 and 13 through 24.

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The field-wireable connector is an orange 12 position female connector (P/N 1700281-001)


regardless of the board version.
Recommended wire is 0.2mm2 to 1.3mm2 (24-16AWG), twisted pairs

IO Pinout

Signal Pin Signal


AO1+ 13 1 DO1 NC Analog Inputs: -20 to 20mA into 50Ω or -10 to 10V,
AO1 GND 14 2 DO1 Common R10=1MΩ, mutually isolated 10V
AO2+ 15 3 DO1 NO Analog Outputs: 0-4 to 20mA. Common negative
pole, galvanically separated from ground, freely con‐
AO2 GND 16 4 DO2 NC nectable to ground; working resistance 750Ω.
DI1+ 17 5 DO2 Common Digital Inputs: Optocoupler with internal 12-24VDC
DI Common 18 6 DO2 NO power supply, switchable with floating contacts; alter‐
DI2+ 19 7 DO3 NC native: switchable with external voltage 12-24VDC,
common negative pole.
DI Common 20 8 DO3 Common
Digital Outputs: Digital Outputs: Floating double-
DI3+ 21 9 DO3 NO throw contacts, max. contact load rating 30V / 1A
DI Common 22 10 DO4 NC I/O Terminal Design: Plug-in terminal strips for stran‐
DI4+ 23 11 DO4 Common ded or solid conductors with a maximum diameter of
DI Common 24 12 DO4 NO 1.3mm2 or 16AWG.

2.3.3.4 Ethernet Port Expansion

Ethernet Switch Board (ESB)


The primary external communication for the SYSCON2.1 is via Ethernet connection. The
CAC3 has an on board 10/100 Ethernet port. This is connected via a short RJ-45 patch cable
to the Ethernet Switch Board (ESB) that resides on the SIB3. The ESB converts the single
CAC3 Ethernet into four Ethernet connections. This allows the SYSCON2.1 to remain
connected to an external network while, at the same time, allowing a laptop to be temporarily
connected for maintenance and troubleshooting purposes. The remaining connections
provided by the ESB are available to connect to other Maxum network options, such as an
ANCB installed in the SYSCON chassis or an external connection to a Siemens redundant
network interface. The ESB (or ESBF) is required when a SYSCON2.1 is installed in the
Maxum.
The ports on the ESB are auto-negotiating for either 10Base or 100Base operation. The
Ethernet Switch is plug-and-play as it does not require initial setup or configuration.
Configuration of the ESB is not supported at this time.
The ESB is equipped with a jumper setting, R2, located in the lower right portion of the board.
For proper field operation this jumper should be set to default position, 2-3 (or the jumper can
be removed for default operation as well). There are several LEDs equipped on the Ethernet
Switch. These identify the operating speed of each port as indicated in the following table.

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LEDs for external connectors count from the bottom up (e.g. bottom LED is for top connector).

LED Meaning Description


1 On=100Mb Off=10Mb Internal RJ-45 Connector to CAC3
2 External Top RJ-45 Connector
3 External Second RJ-45 Connector
4 External Third RJ-45 Connector
5 External Bottom RJ-45 Connector

Figure 2-16 Ethernet Switch Board (ESB, Part Number A5E02368691001)

Ethernet Switch Board with Fiber (ESBF)


The Ethernet Switch Board with Fiber (ESBF) is similar to the Ethernet Switch Board (ESB)
described previously. The primary difference is that for the ESBF one of the 10/100Base-T
connectors has been replaced with a 100Base-FX 1300 nm fiber optic connection with duplex
ST® connectors. This fiber connection is not compatible with 10 megabit fiber systems.
As can be seen in Figure 2-22 on the following page, the ESBF is equipped with two edge
connectors, one on the top of the board and one on the bottom. The board is designed in this
manner to support its use in either the network slot (slot 5) of a SYSCON2.1 or in a PCI slot
of a SYSCON2.1 or legacy SYSCON1. The slot edge connectors are labeled on the board as
“SYSCON2.1 NETWORK SLOT” and “SYSCON/PCI SLOT”. Only one Ethernet Switch may
be used in an analyzer for external Ethernet communication.
However, It is possible to use an ESB in slot 5 for external Ethernet, and an ESBF in another
slot in the alternate configuration for internal Ethernet in cases where legacy SNECON
modules must be used.

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Figure 2-17 Ethernet Switch Board with Fiber (ESBF, Part Number A5E02555919001)

Multiple Mode Use of ESBF


The unique dual edge connector allows the ESBF to be used in both the SYSCON2.1 and
legacy SYSCON. The ESBF may be installed in the following configurations:
● Default – In the default configuration, the ESBF installs in the network slot of the
SYSCON2.1 (far right slot 5). In this configuration the slot edge connector labeled
“SYSCON2.1 NETWORK SLOT” is used (the fiber optic connection is on the top in this
configuration).
● SYSCON2.1 Expansion – ESBF is capable of installing in one of the PCI slots (slots 1
through 4, counting from left) of the SYSCON2.1. This configuration is used in the
SYSCON2.1 when communicating with more than one SNE or when additional Ethernet
communication ports are required. In this configuration the ESBF is turned “upside-down”
and the “SYSCON/PCI SLOT” slot edge connector is used (the fiber optic connection is on
the bottom in this configuration).
● SYSCON1 Enhancement – ESBF installs in an empty PCI slot (slots 1 through 4, counting
from left). This allows the original SYSCON1 to communicate to more than one Ethernet
device at the same time (such as communication to a local laptop computer while still
connected to the network). This also allows for easy configuration to support fiber Ethernet
connection.
In this configuration the ESBF is turned “upside-down” and the “SYSCON/PCI SLOT” slot
edge connector is used (the fiber optic connection is on the bottom in this configuration).
To support the dual edge connector configuration, the ESBF is equipped with a special
reversible bracket. This bracket is detached and turned upside down when the board is
installed upside down in a PCI slot. To reverse the bracket, unscrew it and turn it upside down.
Then, connect the bracket using the opposite set of holes to align the bracket appropriately.

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Figure 2-18 ESBF Bracket Position (Default at left, Alternate at right)

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2.3.4 Maintenance Overview

Board Replacement
A failure in the SYSCON2.1 will generally interrupt communication between the GCP
networkbased software and the detectors. A simplified view of the system is shown below.

120/240VAC
Heaters
120/240VAC PECM
SSR
Board 120/240VAC 24 V
Supply

24VDC

Color
Touch I2C I2C
Display SYSCON DPMs
24VDC
(SIB3)
PECM I2C
RS232 EPCs
Controller 24VDC
RS485
24VDC Board
CAN CAC3 I2C
SVCMs
Ethernet 24VDC
GCP

AC Supply
GCP
Ethernet I/O
Switch Boards DC Supply
Analyzers (I2C)
(optional)
Ethernet Digital Communication

Figure 2-19 Power Distribution and Communication Paths

Most problems can be resolved by checking interconnects between cable, boards, and
connectors. If a component must be replaced, the following sections give detailed procedures.

Remote Database Backup


Because these procedures separate the CAC3 memory from the backup-battery voltage on
the SIB3, the database must be backed up to a workstation on the network or directly
connected.

2.3.5 Service Procedures

Preparing to Replace A Component


The analyzer must be shut down using the General Analyzer Shutdown Procedure in the
Maxum Edition II Analyzer General Maintenance Manual.

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Replacing A CAC3
The CAC3 memory content depends on backup-battery voltage from the SIB3. When the CAC3
is removed from the SIB3, the memory content is lost. Observe safe ESD handling procedures.
1. Disconnect the ethernet cable from the CAC3 board.
2. Remove the two 2mm screws and o-rings as shown in the illustration below. Early SIB3s
had threaded studs, with two nuts with o-rings.
3. Remove the CAC3 by gently pulling it straight up. Avoid rocking or tilting motions.

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Early SIB3s
with nuts on Current SIB3s have screws
threaded studs in nuts swaged into the board
securing the CAC3 to secure the CAC3

Figure 2-20 Mounting the CAC3 on the SIB3

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Installing the CAC3 on the SIB3


It will be neccessary to download the database saved earlier using GCP.
1. Carefully align the CAC3 connectors over the mating connectors of the SIB3.
2. Press down to fully engage the connectors.
3. Install the 2mm screws with o-rings. Avoid overtightening.
4. Plug in the ethernet cable.
5. Follow the steps in the General Analyzer Startup Procedure in the Maxum Edition II
Analyzer General Maintenance Manual.

Removing a SIB3
1. As each cable is disconnected, move it clear of the SIB so it can be removed.
2. Make note of
– I/O board positions
– I/O cable location
– All cable positions to the SIB3
– SIB3 I/O Mode switch
3. Disconnect
– I/O cables from SIB3 and I/O boards
– Display cables
– Ethernet cable from CAC3
– Internal ethernet cable to SNEs if used
4. Remove ESB
5. Remove I/O boards
6. Disconnect from the SIB3
– I2C cables
– Purge cable
– Power cable
– Serial cables
– CAN bus cable if present
7. If the existing CAC3 will be reused, remove it following the procedure in the preceding
section and place in a static-protected area.

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8.
Remove 6 mounting screws from
the locations shown in the illustra‐
tion at right.

Mounting Screw Locations

SIB3 Mounting Screw Locations

9. Remove the SIB, rear edge first to pull the I/O connectors from the SYSCON cage opening.

Installing a SIB3
1. Set the I/O mode switch on the SIB3 to the same position as the board that was removed.
2. Install a CAC3 using the procedure described earlier. The two boards together are called
the SYSCON2.1.
3. Install the SYSCON2.1 in the tray and secure with the 6 mounting screws removed earlier.
4. Install these cables to the SIB3:
– I2C cables
– Purge cable
– Power cable
– Serial cables
– CAN bus cable if present
5. Install the ESB and reconnect the Ethernet cable from the rear RJ-45 connector to the
horizontal RJ-45 conncector on the CAC3.

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6. Install the I/O boards.


7. Reconnect these cables:
– I/O cables from SIB3 and I/O boards
– Display cables
– Ethernet cable from CAC3
– Internal ethernet cable to SNEs if used

2.3.6 Replacing the Lithium Battery on the SYSCON Module Introduction


Older versions of the SYSCON module are equipped with a lithium battery for on‑board
memory backup. For the original version SYSCON module this is a 3.6 V tube shaped battery.
For the SYSCON2 module it is a 3.0 V flat battery. The latest version does not require a battery.
If a lithium battery is present in your unit, Siemens recommends that the battery be replaced
every 5 years. The battery should only be replaced with an approved spare. Contact Siemens
for a replacement.

NOTICE
Observe battery polarity. Reversing the battery can damage the board.
Before removal of battery, note location of its positive end when installed in battery holder.
The positive and negative terminals are marked on the battery. For the 3.6 V version (original
SYSCON), note that the physical shape of the Positive and Negative terminals on the battery
are NOT STANDARD.

2.3.7 Procedure
Follow this procedure to replace the battery.
1. Power down the analyzer using standard procedures.
2. Open electronic enclosure door (using a 4 mm (5/32 inch) Allen wrench if necessary). When
door is open DO NOT place tension on the Maintenance Panel interface ribbon cable.
3. Using appropriate tools, loosen the topmost SYSCON Assembly fastening hardware that
secures the assembly to electronic enclosure mounting bracket.
4. Pull the SYSCON drawer out and lower it so that it rests in the tilted-out position.
5. The battey holder is located on the left side of the SIB3 board. (Near the back on the original
SYSCON board) Remove battery from its holder.
6. When installing the lithium battery in its holder, place the positive (+) side following the
marking on the holder. Refer to the applicable picture in the previous step.
Note that for the original SYSCON (3.6 V tube shaped battery) the physical shape of the
positive and negative terminals on the battery are NOT like a standard battery.
7. After installation, push the SYSCON assembly back into its mounting facility and secure
assembly in place with the fastening hardware.

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8. Before closing door and reapplying AC power, be certain the battery is securely installed
in its holder..
9. When the battery in a SYSCON is removed, current date and time information is lost. If the
analyzer is configured to obtain date and time information from a central server, then it will
update automatically. If no time server is set, it will be necessary to manually set the date
and time on the analyzer.

2.4 Analog and Digital IO

How IO Channels Are Used


When low-power devices other than detectors are used either for measurements or control
functions, IO channels can be used. These fall into four categories:
Digital Inputs allow the analyzer to detect whether some device is on or off. These can be
either 'sinking' (Mode 2, the default configuration) or 'sourcing' (Mode1, used on legacy
hardware and sometimes needed for a particular application). A switch on the SIB3 and on
current IO boards selects between the two modes.
Digital Outputs are simply output relay channels that are either open or closed. These typically
enable or disable a device, turn an indicator light on or off, or select a measurement range in
a sensor.
Analog Inputs accept a variable voltage level and convert the level to a digital value that can
be used in software.
Analog Outputs convert a digital value into a variable current that can be used to control some
device or process.

SIB3-Based IO
The SYSCON2.1 has ten on-board inputs/outputs. The connectors for these are wired from
two orange connectors on the front of the SYSCON assembly cage. Switch SW3 selects sink
(Mode 2) or source (Mode 1) for the digital inputs.

IO Expansion Boards
The IO expansion boards are plugged into the SIB3 backplane. The IO card circuitry is isolated
from the connectors except for the 24v power connection on the CAN connector. The IO cards
communicate with the SYSCON over the I2C cable assembly. Although this cable assembly
also supplies 24v, the board is only powered from the CAN edge connector unless the IO board
is being used outside of the backplane in a special configuration.

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2.4.1 IO Card Common Features

Available IO Boards
The newest version of IO board communicates over the I2C bus. The I2C IO boards are the
type available for new installation.
● Analog IO board (AIO_I2C, Part Number A5E02486267001): has 8 analog output channels,
8 analog input channels, and 2 digital input channels
● Digital IO board (DIO_I2C, Part Number A5E02486268001): has 8 digital outputs and 6
digital inputs
● Analog and Digital IO board (ADIO_I2C, Part Number A5E02359491001): has 4 digital
outputs, 4 digital inputs, 4 analog outputs, and 4 analog inputs
The DOs are rated for 1A resistive load. Inductive loads are different. A DO should not drive
an inductive load greater than 0.5A. An example is the typical block-and-bleed application
which uses two parallel solenoids at 0.4A each. Separate DOs should be used to drive each
solenoid. Each DO connected to a solenoid should have a diode to suppress the solenoid load.
The analyzer supports optional ESBF and ANCB and up to two I2C IO boards. These boards
provide approximately twice the number of circuits as previous CAN IO boards. However, if
an application needs more than two IO boards, a NAU can be installed. This allows installation
of additional I2C IO boards that the Maxum II can access remotely.

I2C Bus Connections and Addressing


There are two standard I2C bus connections on the top of each I2C IO board. Either of these
connections may be used as either a bus input or bus extension connection. In this manner
the I2C bus can daisy chain from one board to another or to other I2C devices.
The I2C IO boards use an 8-bit board identification number as an address on the I2C bus. The
address is a hex number from 00 to FF, corresponding to a decimal number from 0 to 255.
Address numbers from 1 to 254 are used (numbers 0 and 255 are reserved).
DIP switches are used to set the address for the physical board as shown below. When
replacing a board, the user only needs to set the switches on the new board to match the old
board being replaced.
The DIP switches used to set the address are on the top back part of the board and are labeled
BOARD ID. Together, the DIP switches correspond to an 8 bit binary number that is set to
match the board address. Each switch is labeled for the binary digit it represents, and setting
a switch is equivalent to setting that bit to 1. For example, if the switches for 1, 2, and 4 are
set, then the board ID would be 1+2+4 = 7.

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Legacy position Default position I2C ID Switches

Figure 2-21 IO Board Switches

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IO Board Status LEDs


Each I2C-bus IO board has three status LEDs; a green Normal, a yellow Waning, and a red
Fault indicator. The Normal LED may flash to show active communication.

I2C Bus
I/O Board
LEDs
CAN Bus
I/O Board LEDs

CAN Bus I2C Bus


I/O Boards I/O Board

Figure 2-22 IO Board Status LEDs

In the illustration above, one I2C IO board is shown on the right. Two legacy CAN boards are
shown to the left. These boards have a number of additional status LEDs, described in the
section on CAN IO Board Information.

IO Board DI Mode Switch


Switch SW1 located at the top of the board near the front (connector end) controls the mode
setting for the on-board digital inputs (DIs). The switch sets the mode for all DI circuits on the
board (mixing of modes on a board is not supported). The available options are Default/Sink
(Mode 2) and Legacy (Mode 1) A diagram is printed on the back of each board showing the
setting. The Legacy option is designed to adjust for a non-standard configuration that may be
in use on some systems. The Mode switch should be set to Mode 2 unless instructed differently
by Siemens.

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2.4.2 Digital IO Card


Circuits on the DIO board (DIO_I2C) are wired as shown in the following table. The table is
the view as seen when looking at the connector while the board is installed.

Table 2-1 DIO_I2C Wire Side View

Signal Pin Signal


DI Common 2 1 DI6 Digital Inputs: Optocoupler with internal 12-24VDC pow‐
DI Common 4 3 DI5 er supply, switchable with floating contacts; alternative:
switchable with external voltage 12-24VDC, common
DI Common 6 5 DI4 negative pole.
DI Common 8 7 DI3 Digital Outputs: Digital Outputs: Floating double-throw
DI Common 10 9 DI2 contacts, max. contact load rating 30V / 1A
DI Common 12 11 DI1 The DOs are rated for 1A resistive load. Inductive loads
DO8 Common 14 13 DO8 NC are different. A DO should not drive an inductive load
greater than 0.5A. The typical block and bleed applica‐
DO7 NC 16 15 DO8 NO
tion, which uses two parallel solenoids at 0.4A each,
DO7 NO 18 17 DO7 Common should use separate DOs to drive each solenoid. Each
DO6 Common 20 19 DO6 NC DO connected to a solenoid should have a diode to sup‐
press the solenoid load.
DO5 NC 22 21 DO6 NO
I/O Terminal Design: Plug-in terminal strips for stranded
DO5 NO 24 23 DO5 Common
or solid conductors with a maximum diameter of
DO4 Common 26 23 DO4 NC 1.0mm2 or 18AWG.
DO3 NC 28 27 DO4 NO
DO3 NO 30 29 DO3 Common
DO2 Common 32 31 DO2 NC
DO1 NC 34 33 DO2 NO
DO1 NO 36 35 DO1 Common

Figure 2-23 Digital IO Board (DIO_I2C)

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2.4.3 Analog IO Board


Circuits on the AIO board (AIO_I2C) are wired as shown in the following table. The table is the
view as seen when looking at the connector while the board is installed.

Table 2-2 AIO_I2C Wire Side View

Signal Pin Signal


AI8 -10V 2 1 AI8 +10V Analog Inputs: -20 to 20mA into 50Ω or -10 to 10V,
AI7 -10V 4 3 AI7 +10V R10=1MΩ, mutually isolated 10V
AI6 -10V 6 5 AI6 +10V Analog Outputs: 0-4 to 20mA. Common negative
pole, galvanically separated from ground, freely con‐
AI5 -10V 8 7 AI5 +10V nectable to ground; working resistance 750Ω.
AI4 -10V 10 9 AI4 +10V Digital Inputs: Optocoupler with internal 12-24VDC
AI3 -10V 12 11 AI3 +10V power supply, switchable with floating contacts; alter‐
AI2 -10V 14 13 AI2 +10V native: switchable with external voltage 12-24VDC,
common negative pole.
AI1 -10V 16 15 AI1 +10V
I/O Terminal Design: Plug-in terminal strips for stran‐
18 17 AO8 Current ded or solid conductors with a maximum diameter of
20 19 AO7 Current 1.0mm2 or 18AWG.
22 21 AO6 Current
24 23 AO5 Current
26 23 AO4 Current
28 27 AO3 Current
AO_GND 30 29 AO2 Current
32 31 AO1 Current
34 33 DI2
DI Common 36 35 DI1

Figure 2-24 Analog IO Board (AIO_I2C)

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2.4.4 Analog and Digital IO Board


Circuits on the ADIO board are wired as shown in the following table. The table is the view as
seen when looking at the connector while the board is installed.

Table 2-3 ADIO_I2C Wire Side View

Signal Pin Signal


AI4 -10V 2 1 AI4 +10V Analog Inputs: -20 to 20mA into 50Ω or -10 to 10V, R10=1MΩ,
AI3 -10V 4 3 AI3 +10V mutually isolated 10V
AI2 -10V 6 5 AI2 +10V Analog Outputs: 0-4 to 20mA. Common negative pole, galvani‐
cally separated from ground, freely connectable to ground; work‐
AI1 -10V 8 7 AI1 +10V ing resistance 750Ω.
10 9 DI4 Digital Inputs: Optocoupler with internal 12-24VDC power supply,
12 11 DI3 switchable with floating contacts; alternative: switchable with ex‐
DI Common 14 13 DI2 ternal voltage 12-24VDC, common negative pole.
16 15 DI1 Digital Outputs: Digital Outputs: Floating double-throw contacts,
max. contact load rating 30V / 1A
18 17 AO4 Current
I/O Terminal Design: Plug-in terminal strips for stranded or solid
20 19 AO3 Current conductors with a maximum diameter of 1.0mm2 or 18AWG.
AO_GND 22 21 AO2 Current
24 23 AO1 Current
DO4 Common 26 23 DO4 NC
DO3 NC 28 27 DO4 NO
DO3 NO 30 29 DO3 Common
DO2 Common 32 31 DO2 NC
DO1 NC 34 33 DO2 NO
DO1 NO 36 35 DO1 Common

Figure 2-25 Analog and Digital I/O Board (ADIO_I2C)

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2.5 Detector Personality Modules

2.5.1 DPM Types


Three DPM types are used for temperature control and detector interface:
● Intrinsically Safe Thermal Conductivity DPM
● Base3DPM
● Temperature Control Personality Module (TC-PM)
The interfaces available for each are shown in the table below.

Function TC-PM IS-TCD DPM Base3DPM


Temperature control x x
Intrinsic safety x
Detector inferfaces:
RTD x
Thermistor x
Filament x
FID x
FPD x
VPD x

2.5.2 Base3 Detector Personality Module (DPM)


Output signals from any of the detectors connect to each associated Detector Personality
Module (DPM) input. The transfer of detector data is based on the database method. The DPM
digitizes the signal and then passes the data to the SYSCON via an I2C port. Results can then
be viewed on the Color Touchscreen or the workstation.
The method is the part of the application that contains the parameters for controlling the
hardware used by one cycle clock. It provides peak areas and component concentrations and
includes all cycle clock timed events. There is one cycle clock per method.

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RTD Temp Control Input

Access hole for mounting


screw for Temp Setpoint modules

Flame Sense and


Filament Detector Input

Location
ID Switch

Mezzanine Ignite Signal/


Module Igniter Power
Mounting
Location
Status
LEDs

Signal Cable
from Detector

Figure 2-26 Base3DPM With Mezzanine Module

Part Number
The Base3 DPM (Part Number A5E02645925001) is shipped with current analyzers. It can
be used as a replacement part for earlier DPMs in Maxum I analyzers using an adapter, part
number A5E34938458001.

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Overview of DPM Functions


The Base 3 Detector Personality Module (DPM) combines these functions in a single module:

Input from detector via mezzanine module


Ignite signal / glow-plug output
Range-select output
FID 300-V bias output
Flame-sense input (used in Maxum I analyzers only)
Input from detector via mezzanine module
Ignite signal / glow-plug output
Range-select output
Enable signal output
Including Mezzanine FPD 300V bias output
Modules
Flame-sense input (used in Maxum I analyzers only)
Input from detector via mezzanine module
Analog volt‐ Range-select output
age input
Filament Detector Input via connector on right side (as viewed inside analyzer EC)
Temperature setpoint module connector
Two RTD inputs
Temperature control Two heater-control outputs
System communication I2C port with ID-select switch

Input Signal Paths


The input-signal functions are shown below.

Network I2C I2C Analog Mezzanine Analog Flame Ionization or


BaseDPM
GCP SYSCON PECM Module Flame Photometric
A/D
(signal conditioning) Detector

Color
Touch
Display

Figure 2-27 FID, FPD, or Analog Input Detector Input Signal Path

Network I2C I2C


Analog Filament
BaseDPM
GCP SYSCON PECM Detector
A/D

Color
Touch
Display

Figure 2-28 Filament Detector Input Signal Path

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Detector Control Paths


Several control signals are available to control various detector functions as shown below.

Digital
(Range
Network I2C I2C Select) Mezzanine
BaseDPM
GCP SYSCON PECM Module
A/D
(signal conditioning)

Color Digital (Ignite) / Power (Glow Plug)


Touch 300 V Bias (FID) FID
Display FPD
Enable (FPD)
Analog
5 V Power (FPD) Output

Figure 2-29 Maxum II Detector Control Functions

Location ID Switch
The Location ID Switch, shown previously in the photograph, selects the DPM location that is
incorporated in the address, to be reported in the results.
The DPM I2C port is connected directly to the system controller via the PECM or a wiring
distribution board. In this scenario, the following values are applied:

Switch Value Location


1 Left
2 Center
3 Right

NOTE:
If the DPM I2C port is connected to an SNE, the value is always set to “1”. The actual location
value is determined by the SNE.

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DPM-Based Temperature Control


The Base3 DPM has two temperature-control channels. Two RTD inputs feed two comparator
circuits to drive two heater-control outputs. The heater-control outputs connect to inputs on
the PECM in most analyzers. The control path is shown below.

Air Bath Oven


DPM
Temp Analog Temp Control,
Compare
Setpoint Temp Limit,
Modules Overtemp RTDs
SYSCON

I2C PECM
PWM
SSR Pair High-Wattage
Airflow
Heater
Loss
Shutdown
Digital Air Pressure
Switch

Airflow Loss Temperature


Shutdown Control

AC
Line Heater
SSRa SSRb

Figure 2-30 Heater Control Path Using DPM

A mounting location and connector are provided for two Temperature Setpoint Modules. The
modules are installed on the left side (back) of the DPM, shown below. This same position is
used in the Temperature Control DPM.

RTD Temp Control Inputs


Temp Setpoint Module
Heater Control Outputs to PECM

Mounting Screw Access

Location ID Switch
I2C

Status
LEDs

Temp Setpoint Module


Mounting Location

Figure 2-31 Temperature Setpoint Modules Installed on Left Side of Base3 DPM

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Mezzanine Modules
A mezzanine module conditions the signal from a non-conductivity detector. The mezzanine
plugs into the Base3 DPM in order to tailor the DPM for a specific measurement.
Three primary types of mezzanine are available to accommodate FID and FPD detectors, and
various detectors that produce a scaled analog output (AI) mezzanine. Some of the
mezzanines have a dual range function for maximum flexibility. See the table below for details
relating to the various mezzanine options.
The AI mezzanine can be used for reading a detector voltage signal from a specialized or third
party detector, such as the Valco PDD, where the device only supplies a scaled voltage output.
The AI signal will be treated like a normal detector signal, with a 50% balance range.

Table 2-4 Mezzanine Part Number Descriptions

Mezzanine Detector Sub Usage Normal Alternate


Module Type Range Range
2020960-001 FID Low level FID 0.2nA none
2020960-003 Standard FID 1nA 20nA
2021328-002 Large Scale FID 100nA 1000nA
2021328-001 FPD FPD 100nA none
2021328-003 FPD, 0.18 Hz Filter 100nA none
2021326-001 Universal Voltage AI ±1V ±10V
1901614-001 When Base DPM is Filament only, none none
Dummy Plug and no mezzanine required

2.5.3 Replacing a Base3DPM

Removing the Base3DPM


See the illustration Base3 DPM With Mezzanine Module and Temperature Setpoint Modules
Installed on Left Side of Base3DPM for connector and module locations.
1. Back up and shut down the unit using the General Analyzer Shutdown Procedure.
2. Open the electronics enclosure door.
3. Disconnect the detector signal cable from the mezzanine module.
– FID and FPD mezzanine modules use SMA coaxial cables. Unscrew the nut to unplug
the cable.
– Analog input mezzanine modules use small terminal block connectors that can be
unplugged.
4. Disconnect the fIlament detector cable if present.
5. Disconnect the RTD temperature input cables (top rear of unit, if present).
6. If present, take out screws holding the IS ground cables (typically only installed on modular
oven models).
7. Remove the nut on the bottom-front of DPM bracket.

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8. Slide the unit forward to disengage the rear mounting lug.


9. Lift the unit up and part way out of the enclosure.
10.Disconnect the I2C/power cable and temperature control output cables from the rear edge
of the board.
11.Remove the unit from the analyzer and place on ESD-safe work surface.
12.Unscrew the two mounting screws at the top corners of the mezzanine module, and unplug
it from the Base3 DPM.
13.Unscrew the mounting screw for the temperature setpoint module stack using the access
hole in the metal plate near the filament detector input.
14.Unplug the temperature setpoint module stack from the left side of the board.
15.Remove the two mounting screws near the upper corners and remove the old board from
the cage.

Configuring the New Base3DPM


Set the location ID switch on the replacement unit to match the unit being removed.

Installing the Replacement Base3DPM


1. Install the new unit into the DPM cage. Insert the bottom edge into the slot in the plastic
DPM mounting rail on the DPM cage, and secure with the two screws removed from the
old unit.
2. Plug the temperature setpoint module stack onto its mount on the left side of the unit.
3. Reinstall the screw to secure the temperature setpoint module stack through the access
hole on the right side of the unit.
4. Plug the mezzanine module onto its connector on the right side of the unit, and reinstall the
two screws ear the top edge.
5. Insert the rear lug into the slot at the rear of the DPM mounting position with the mounting
stud at the front inserted through the slot in the DPM bracket.
6. Slide backward to lock the rear mounting lug into the slot.
7. Reinstall the nut on the threaded stud to secure the DPM.
8. Reconnect the I2C/power cable and temperature control output cables from the rear edge
of the board.
9. Reconnect the RTD temperature input cables (top rear of unit, if present).
10.Reconnect the fIlament detector cable if present.
11.Reconnect the detector signal cable from the mezzanine module.
12.Follow the steps in the General Analyzer Startup Procedure.

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2.5.4 Intrinsically-Safe Thermal Conductivity DPM (IS-TCD3)

Overview
Output signals from Thermal Conductivity Detector (TCD) in the Modular Oven are input to the
associated Detector Personality Module (DPM). The DPM is mounted inside the Electronics
Enclosure (EC) on the floor of the compartment. The DPM digitizes the incoming analog signal
and then passes the data to the SYSCON via an I2C port. The resulting data is then processed
by the Embedded SNE software. Results can then be viewed on the maintenance panel or the
workstation.

Network I2C I2C IS-TCD Analog


TCD Beads
GCP SYSCON PECM DPM
(thermistor)
(A/D)

Color
Touch
Display

Figure 2-32 Thermal Conductivity Detector Signal Path

The IS-TCD3 DPM is an enclosed unit that is not field repairable. Opening the case may violate
the safety protection of the device. Service is limited to replacement of the entire DPM.

Part Number
The IS-TCD3 DPM (part number A5E02645923001) is shipped with current analyzers. It can
be used as a replacement part for earlier DPMs in Maxum I analyzers using an adapter, part
number A5E34938550001.

Intrinsic Safety
The intrinsic safety feature of this module is only used in the Maxum II Modular Oven model.
The following two paragraphs apply only if this feature is used.
The TCD DPM in the Maxum II, as well as the actual detector controlled by the TCD, is
protected by intrinsic safety. Intrinsic safety is a method of protection where a circuit is designed
such that it will not create a spark or other condition capable of causing ignition of flammable
vapors or gases, even under fault conditions. Various circuits in the Maxum analyzer use this
form of protection, including the IS-TCD3.

Note
To preserve the intrinsically safe design protection of the IS-TCD3, certain measures are
required. Failure to adhere to all requirements for use of the IS-TCD3 in the Maxum II could
violate the safety protections of the analyzer. See the Maxum II Explosion Protection Safety
Standards Manual (A5E02220442001) for more information on the safe use of intrinsically safe
circuitry in the Maxum II.Maxum II Explosion Protection Safety Standards Manual
(A5E02220442001) for more information on the safe use of intrinsically safe circuitry in the
Maxum II.

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Connections
The connections to the IS-TCD3 DPM are shown below.

I2C Connector
DPM
Mounting
Screw
Intrinsic Safety Ground
DPM Connection Lugs
Cage

Inputs from
DPM Detector
Mounting
Screw

Position
ID Switch
Reference
Selector
Switches

DPM Mounting Rail

Figure 2-33 IS-TCD3 DPM Connector Locations

Orange connectors to detectors: Each IS-TCD3 DPM consists of two connections. Each
connection is capable of interfacing to two pairs of TCD elements (four total channels, 1 for
reference and 3 for signal).

Figure 2-34 Detail of Detector Connectors

Intrinsic Safety Grounds: The intrinsically safe design of the IS-TCD3 DPM (not normally used
with airless or airbath ovens) requires two ground connections to the chassis terminated to
two different terminals. The Maxum II Modular Oven is shipped with these grounds connected
correctly. Refer to the Maxum II Explosion Protection Safety Standards Manual
(A5E02220442001) for more information on the safe use of intrinsically safe circuitry in the
Maxum II.
I2C Bus Connection: The white connector on the reverse side of the DPM connects to the I2C
Bus on the PECM.

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Position ID Switch: Reference


1 = Left Selector
2 = Center Switches:
3 = Right Selects
(Described in reference
Location ID Switch) channel

Figure 2-35 IS-TCD3 DPM Switches

7&''HWHFWRU%ORFN
,&&DEOH

,&&DEOH '30&DEOH

HP61(UXQQLQJRQ
6<6&21
3(&0,& 6DPSOH
RUKDUGZDUH61( 5HI*DV 'HWHFWRU7KHUPLVWRU
RQROGHUXQLWV 'LVWULEXWLRQ 7&''30 %HDG3DLU
(OHFWURQLFV&RPSDUWPHQW 2YHQ

Figure 2-36 TCD Information Path (Airless and Airbath models)

2.5.5 Replacing an IS-TCD DPM

Removing the IS-TCD3 DPM


See the illustration IS-TCD3 DPM Connector Locations (Page 69) for connector locations.
1. Back up and shut down the unit using the General Analyzer Shutdown Procedure in the
Maxum Edition II Analyzer General Maintenance Manual.
2. Open the electronics enclosure door.
3. Disconnect the detector cables by unplugging the orange connectors.
4. Disconnect the I2C/power cable.
5. If present, take out screws holding the IS ground cables (typically only installed on modular
oven models).
6. Remove the nut on the bottom-front of DPM bracket.
7. Slide the unit forward to disengage the rear mounting lug.

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8. Lift the unit up and out of the enclosure and place on an ESD-safe work surface.
9. Remove the two mounting screws near the upper corners and remove the old unit from the
DPM cage.

Configuring the New IS-TCD3 DPM


Set the location ID switch and reference-selector switches on the replacement unit to match
those on the unit being removed.

Note
The newer units use slide switches in place of the 2-position rotary switches on older units.
The function is the same.

Installing the Replacement IS-TCD3 DPM


1. Install the new unit into the DPM cage. Insert the bottom edge into the slot in the plastic
DPM mounting rail on the DPM cage, and secure with the two screws removed from the
old unit.
2. Insert the rear lug into the slot at the rear of the DPM mounting position with the mounting
stud at the front inserted through the slot in the DPM bracket.
3. Slide backward to lock the rear mounting lug into the slot.
4. Reinstall the nut on the threaded stud to secure the DPM.
5. Reconnect the I2C/power cable.
6. Reconnect the IS ground cables if used.
7. Reconnect the detector cables.
8. Follow the steps in the General Analyzer Startup Procedure in the Maxum Edition II
Analyzer General Maintenance Manual.

See also
Intrinsically-Safe Thermal Conductivity DPM (IS-TCD3) (Page 68)

2.5.6 Replacing a TC-DPM

Removing the TC-DPM


See the illustration Temperature Control Personality Module Connections for connector and
module locations.
1. Back up and shut down the unit using the General Analyzer Shutdown Procedure.
2. Open the electronics enclosure door.
3. Disconnect the RTD temperature input cables (top rear of unit, if present).

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4. Remove the nut on the bottom-front of DPM bracket.


5. Slide the unit forward to disengage the rear mounting lug.
6. Lift the unit up and part way out of the enclosure.
7. Disconnect the I2C/power cable and temperature control output cables from the rear edge
of the board.
8. Remove the unit from the analyzer and place on ESD-safe work surface.
9. Unscrew the mounting screw for the temperature setpoint module stack using the access
hole near the center of the metal plate.
10.Unplug the temperature setpoint module stack from the left side of the board.
11.Remove the two mounting screws near the upper corners and remove the old unit from the
cage.

Configuring the New TC-DPM


Set the location ID switch on the replacement unit to match the unit being removed.

Installing the Replacement TC-DPM


1. Install the new unit into the DPM cage. Insert the bottom edge into the slot in the plastic
DPM mounting rail on the DPM cage, and secure with the two screws removed from the
old unit.
2. Plug the temperature setpoint module stack onto its mount on the left side of the unit.
3. Reinstall the screw to secure the temperature setpoint module stack through the access
hole on the right side of the unit.
4. Insert the rear lug into the slot at the rear of the DPM mounting position with the mounting
stud at the front inserted through the slot in the DPM bracket.
5. Slide backward to lock the rear mounting lug into the slot.
6. Reinstall the nut on the threaded stud to secure the DPM.
7. Reconnect the I2C/power cable and temperature control output cables from the rear edge
of the board.
8. Reconnect the RTD temperature input cables (top rear of unit, if present).
9. Follow the steps in the General Analyzer Startup Procedure.

2.6 Sensor Near Electronics (SNE) Software


The Sensor Near Electronics (SNE) is a software module that provides Maxum II Gas
Chromatograph physics control, data analysis and data reduction. This virtual SNE operates
as a set of intercommunicating tasks running on the pSOS+ operating system. These functions
run on the SYSCON2.1 hardware in recent Maxum II analyzers. In older analyzers, these
functions run on processors mounted in the SNE cage along with the DPMs.

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Configuration
The SNE is configured by the System Controller (SYSCON) and periodically reports analysis
results. It can be interactively controlled for Real-Time decisions on operation scenarios. The
SNE software controls all sampling relating to its internal configuration and sensor setup.

Components
The major SNE software components are as follows:

● Data Manager ● Hardware Manager


● Communications Manager ● Computational Engine

Data Manager
The Data Manager maintains configuration data that controls hardware sequence of events
and controls what manipulation is performed on sampled data.
The Data Manager also provides results and status information to externally connected devices
via the Communication Manager. This data is organized as a set of Sensor Analyzer Module
(SAM) structures. The data represents the unit as a standard sensor to external host.

Communication Manager
The Communication Manager acts as a central point of control for communication links
attached to the Sensor Near Electronics (SNE). This allows Internal SNE software to function
regardless of which communication link is being used to communicate with the system.

Hardware Manager
The Hardware Manager provides scheduling and communication services for the hardware in
the analysis zone. These include devices such as the following:

● Detectors ● Pressure monitors and controllers


● Sample valves ● Temperature monitors and controllers
● Relays ● Flow control valves

Computational Engine
The Computational Engine takes acquired chromatography data and performs system
calculations. Most of these calculations are performed by functions contained in the EZChrom
method, which provides all peak identifications and integration and response factors.

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2.7 Solid State Relay Module

2.7 Solid State Relay Module


The Solid State Relay (SSR) Module is made up of two pairs of high wattage heater relays
that are used for controlling the oven air bath heaters. One pair controls ABH1 and the other
ABH2. Each pair of relays controls Temperature Limit and Oven Temperature shut down. If
the over temperature limit is exceeded, the power to the air bath heater is shutdown. Two
different configurations of SSR are available, the SSR and the Medium Wattage SSR. There
are also original and new versions of the standard SSR.

Original SSR New SSR Medium Wattage SSR


Figure 2-37 Solid State Relay Modules

The SSR module assembly is mounted to the left side of the EC back wall. A metal cover not
shown in the photograph above protects the relays for the standard version of the SSR. The
standard version of the SSR is equipped with heat dissipating fins that extend through the back
of the enclosure wall to dissipate generated heat to the outside atmosphere. The medium
wattage version dissipates heat to the interior of the electronics enclosure using heat sinks.
The standard SSR, also called high wattage, can provide switching for two heater elements
of up to 1400 watts each. The medium wattage version can control two heater elements of up
to 500 watts each. Relays for both the original and new standard SSR versions are available
as spare parts. For the medium wattage SSR, individual relays cannot be replaced.

NOTICE
The SSR module supports either 115 VAC or 230 VAC power. For 115 VAC power the in-line
fuses to the SSR should be rated at 16 A. For 230 VAC, the fuses must be rated at 10 A. DO
NOT use a 16 A rated fuse for 230 VAC primary AC power. This could result in overheating
and equipment damage.

High Wattage SSR


The relays on the newer SSR provide an indicator LED which shows the operational status of
the control signals. In addition the newer SSR is equipped with a plastic shield which covers
the connection screw terminals and helps prevent inadvertent contact. Note, however, that
the older SSR is entirely enclosed in a sheet metal housing so human contact is not possible
without disassembly of the module.

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The PECM provides the voltage to the two pairs of 1400-Watt AC Air Bath heater power
switching circuits located on the rear wall of the electronic enclosure. A dedicated cable
connects the PECM to the relay assembly. Each circuit has two solid-state relays connected
in series.
One series-connected relay controls the 1400-Watt AC heater functions to maintain controller
initiated set point temperature. In conjunction with the control signal, the air bath heater
pressure switch enables the relay. The second series-connected relay is used for safety
purposes. It performs an emergency analyzer system shutdown if an over-temperature
condition is detected. Both relay circuits are completely independent of each other. However,
in order for the power switching to occur both relays must be enabled. Temperature controls
are monitored on the Detector Personality Module located in the SNE and routed to the PECM
via a dedicated cable. No other functions are connected to the temperature control circuit.

Schematic A

3
1 4
2 3 Rc 1 Load

3 Zero

Snubber
1 4 Control voltage AC
Voltage LED or Line
2 detect

4 2 Load

Figure 2-38 Air Bath Heater Relay Schematic

Medium Wattage SSR


A medium wattage version of the Solid State Relay (SSR) module is available. The original
assembly included four large relays suitable for switching two of the 1400 watt air bath oven
heater elements. However, many Maxum GCs do not require that much power. Therefore, a
new SSR Module was added to the Maxum spare part offering. The newer board provides
smaller relays which are capable of controlling the new 500 watt air bath heater assembly
described previously. In addition, the “medium power” SSRB can be used to control the two
250 watt heaters used in the Maxum airless oven configurations. The newer board can also
be used to control the low wattage heaters in the heated Flame Ionization and Flame
Photometric detector housings or in heated sample injection valves.
The relays on the medium wattage SSR cannot be replaced individually. However, the module
is easily replaced. Another difference between the high wattage SSR and medium wattage
SSR is that the medium wattage version does not required heat dissipating fins on the back
of the enclosure. The relays are equipped with heat sinks on the front of the module as shown
in the photograph below.

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2.8 Solenoid Valves

Status LEDs Status LEDs

Power Cable Control Cable from


from PECM PECM or DPM

Figure 2-39 Medium Wattage SSR Module

2.8 Solenoid Valves

2.8.1 Solenoid Valve Control Module (SVCM)


The Solenoid Valve Control Module (SVCM) provides pneumatic interface to control flow to
the oven sampling and column valves. Solenoid valves are suitable for air, nitrogen and helium
on the pressure side and vacuum on the vent side. The electronic enclosure has space for up
to three modules.

SVCM Versions
There are two configurations of SVCM. The old version, which is still supported as a spare
part, is equipped with a valve driver circuit board. For the newer version of the SVCM, this
valve drive circuitry has been moved to the PECM2 module. The newer version has a lower
cost and is more reliable and robust.
The SVCM electronics, whether onboard for the old version or on the PECM for the new
version, receives commands from the SYSCON module (via the I2C bus). Pulse timing is
controlled from the SVCM electronics.

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Solenoid Control Connectors


(cable assembly to PECM)

Plastic Tubing Connectors

Solenoids

Test Buttons
(bottoms of solenoids)

Solenoid Valve Tubing Manifold

Legacy SVCM Present SVCM

Figure 2-40 Solenoid Valve Control Module (SVCM)

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Mechanical
Each SVCM incorporates 8 solenoid valve circuits for driving 3-way and 4-way solenoid valves.
The SVCM is mounted in the Controller Enclosure on the manifold block. It can also be mounted
in a Division 2 purge enclosure. Up to 3 SVCM assemblies can be mounted in the Maxum II.
This allows for up to twelve 3-way solenoids and twelve 4-way solenoids. SVCM-1 is mounted
in the lower right portion of the back wall. SVCM-2 is mounted in the lower left portion of the
back wall. SVCM-3 is mounted (vertically) in the upper right portion of the back wall. The
original SVCM is equipped with Parker solenoids. The newer SVCM is equipped with SMC
solenoids. Manifold in/out SST tubing connections incorporate one touch push type tubing
connectors.

Figure 2-41 Solenoid Control Module

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2.8 Solenoid Valves

Digital Control Channels


On present Maxum II analyzers, the solenoid control circuitry is on the PECM. Digital outputs
assigned to each solenoid valve are shown in the table below. If a digital output is 0 the valve
is OFF; if the output is a 1, the valve is ON. Each group of four valves is identified as being
left or right. There are no digital inputs. See the table below for the numbering pattern of
solenoid valves (same for original and newer versions). Each solenoid valve can be manually
set to the ON or OFF conditions by manually depressing the red button on each solenoid. This
button is on the top-front of each Parker (original) solenoid and on the bottom of each SMC
(new) solenoid.

Table 2-5 Digital Output Solenoid Valve Groups

Group Solenoid Valve


Left Valve 1
Valve 2
Valve 3
Valve 4
Right Valve 1
Valve 2
Valve 3
Valve 4

Table 2-6 SVCM I/O Assignments

SYSCON I/O Name Group Channel


Channel
Number
DO1 LEFT_GROUP_VALVE_1 80h
DO 2 LEFT_GROUP_VALVE_2 40h
DO 3 LEFT_GROUP_VALVE_3 20h
DO 4 LEFT_GROUP_VALVE_4 10h
DO 5 RIGHT_GROUP_VALVE_1 08h
DO 6 RIGHT_GROUP_VALVE_2 1 04h
DO 7 RIGHT_GROUP_VALVE_3 02h
DO 8 RIGHT_GROUP_VALVE_4 01h

Table 2-7 SVCM Fault Indicators

Fault Indicator Fault Condition


VALVE_SWITCH_ERROR Valve status read back is incorrect
J10_DISCONNECTED (left bank connector) J10 connector not connected
J11_DISCONNECTED (right bank connector) J11 connector not connected

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2.8 Solenoid Valves

Table 2-8 Specifications

Function Specification
Switching Speed (Maximum response time on/off ms)
4-way 15ms
3-way non-latching 15ms
Operating Voltage 24VDC
Pressure Range, 3-way 25 to 100psi
Pressure Range, 4-way 25 to 100psi
Vacuum Range 0 to 27" of Hg
Ambient Temperature Range -18°C to 65°C
-0.4°F to 149°F (dry air)
Leakage ≤ 50 microLiter/min, air @ 69.8?F (21°C) with 50psig on the
common port.

Operation Test
1. Using a fine-pointed object, press Solenoid Valve red button.
2. When pressed, pressure is applied to the piston that moves to either the open or closed
position. Resulting pressure is then applied to the column or sample valve.
3. If piston does not operate when the button is pressed, check for correct gas pressure.
4. If piston does not operate and pressure is 75 psig, Solenoid Valve is defective and must
be replaced.
5. Repeat for each valve operating on and off. Allow at least 1 second between button presses.

2.8.2 Replacing a Solenoid Valve


The solenoid valves are mounted on either the floor or back of the electronic enclosure,
depending on configuration. Valves are replaced individually. The Solenoid Valve
Replacement Kit is available as part number 2020149-001.

WARNING
Voltage dangerous to life exists. Failure to follow proper procedures may result in equipment
damage, personal injury or death.
Before performing the removal and installation procedures, turn off primary AC power to the
Maxum II from the main circuit breaker. Observe all site safety requirements before
performing any repair or maintenance on the Maxum II.

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Procedure
1. Back up and shut down the unit using the General Analyzer Shutdown Procedure.
2. Open electronic enclosure door (using a 4mm (5/32”) Allen wrench if necessary).
3. Unplug the cable to the solenoid to be replaced.
4. As show below, use a small screwdriver to remove the two screws that fasten the solenoid
to the manifold. If the black gasket adheres to the manifold after removing the solenoid,
then remove the gasket manually.

Solenoid Valve Retaining Screws

Solenoid Valve Mounting Position

5. Install the new solenoid, using a new gasket from the kit.
6. Reattach the cable to the solenoid.
7. Follow the steps in the General Analyzer Startup Procedure.

2.9 Electronic Pressure Control Module

2.9.1 EPC Module Description

The Electronic Pressure Control (EPC) Module reduces oven set-up time by using precise
pressure control without restrictors or needle valves. This module also allows programmed
pressure control for faster chromatography and modern applications. It allows precise control
of pressures. The EPC can be used for both carrier and fuel gas supply, which eliminates the
less reliable mechanical regulation. Four independent EPCs can be installed in one Maxum II.
Each EPC provides two independently regulated pressures for use on carrier and flame fuel
sources in the oven. Gas connection is located in the regulator section. Regulated pressure
range is 5-100 psig. Two slightly different versions of the EPC are available. The primary
difference between the two versions is that the newer version is equipped with DIP switches
that identify the location ID of the module. The older version uses a jumper plug to identify the
ID. The differences between these methods of identification are described fully in the procedure
to replace the EPC. There are no other functional differences.

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2.9 Electronic Pressure Control Module

Tubing Manifold

Ch2
Ch1
Location ID
Selector Switches
Low Pressure
Switch Inputs I2C Connector

Figure 2-42 EPC Module Connections

Mechanical

The EPC is mounted


to right side wall of the
Electronic Enclosure.
Up to four (a total of 8
EPC channels) can be EPCs mounted on
right-hand wall of
installed in a single analyzer
Electronic Enclosure.
The EPC is easily field
replaceable using
common tools.

EPC Location In Analyzer

Electrical
The EPC is made up of a printed circuit board with two pressure transducers, two proportional
valves with associated electronic circuitry, manifold for pneumatic connections, and a
connector for I2C communication signals and DC power.
The EPC provides electrically controlled pressure for helium, hydrogen and nitrogen carriers
etc., as well as low flow and low pressure (<100psi) applications such as flame detector fuel.
The EPC operates from 24VDC at 4 watts. Electrical connections are made using plug type
connectors.

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The EPC receives commands from the SYSCON via I2C bus regarding timing and pressure
setpoint. The timing of messages from the SYSCON controls timing within the EPC. There is
no time base in the EPC. Module control is established by sending parameters, such as
setpoint pressures and ramp rates to the EPC. The EPC is used in the Maxum II to control the
carriers and/or fuels for the detector modules. The EPC can also be used in field-mounted
installations.
The EPC communicates with other components via the I2C bus and communicates actual
pressure back to the SYSCON. Regulated pressure range is 5-100psig.

Channels
Each EPC channel consists of a pressure sensor amplifier and analog filter followed by an A/
D Converter. The converter is read by the local controller that calculates a new control value
used to control the proportional solenoid valve.
Control parameters, such as set-point pressures are sent via the I2C bus to the EPC. Status
and diagnostic data is available via software.

Diagnostics
EPC diagnostics are read-back of setpoint pressure via the software, DC power within
operating limits, monitoring of line and short-term pressure variations with respect to the
setpoint regulation, out of range pressure alarm and a diagnostic failure.

2.9.2 Replacing an EPC Module

WARNING
Voltage dangerous to life exists. Failure to follow proper procedures may result in equipment
damage, personal injury or death.
Before performing the removal and installation procedures, it is important that primary AC
power to the Maxum II be turned off from the main circuit breaker. Observe all plant safety
requirements before performing any repair or maintenance on the Maxum II.

Note
Do not over-tighten ferrules. Oertightening may damage the ferrules.
The ferrules connected on the gas supply side of the EPC manifold are composed of vespel-
graphite. To prevent damage, these ferrules must NOT be over-tightened. Proper tightness
is typically ½ turn past finger-tight.

Note
Do not disassemble the EPC.
The EPC is made up of a manifold that is mounted to the electronic enclosure wall on standoffs
and the module itself. Due to safety and certification issues, it is necessary to replace both the
EPC and manifold as one assembly.

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Procedure
1. Open electronic enclosure door (using a 4mm (5/32”) Allen wrench if necessary). When
door is open DO NOT place tension on the display panel interface cable.
2. Disconnect any external interface connectors to EPC. It is recommended that all cables be
identified with their EPC connector location.
3. Remove the external gas connections from the EPC, labeling each if necessary.
4. Remove the four 4mm Allen screws that secure the manifold to the Electronics Enclosure
and then remove the assembly. These are captive screws and will be completely removed
with module.
5. If the replacement EPC a module ID jumper, move the jumper that is connected to location
J2 (bottom side of PC board) from the old module to the new module.
6. If the EPC is equipped with ID switches, set the switches on the replacement EPC to match
the ID of the EPC that was removed (see Setting Location ID).
7. To reinstall the new EPC, perform steps 1 to 4 in reverse order. Use caution when
reconnecting gas lines. Do not over-tighten.
8. Before applying AC power, be certain the gasket between the manifold and the Electronics
Enclosure is properly seated and interface cable connectors are correctly connected.
9. Inspect the system for leaks.

Setting the Location ID


The newest version of the EPC has DIP switches in place of the J2 ID Connector used in the
previous version. These are used to set the location ID, which is used in software as part of
the hardware ID string. The location ID is set using a binary counting of the switches from right
to left (as numbered on the board and not on the actual switches). Note that this also matches
binary wiring of the first three pins of the J2 plugs used on the bottom side of the older version
EPC.

Location ID #1 Location ID #2 Location ID #3 Location ID #4

1st switch / connector Second switch / connec‐ 1st & 2nd switch / con‐ 3rd switch / connector
pin set (binary 1) tor pin set (binary 2) nector pin set (binary 3) pin set (binary 4)

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2.10 Color Touchscreen

2.10.1 Description

Overview
The color touchscreen display is a convenient tablet-like panel that combines a high-resolution
color LCD display with an intuitive touch interface.

TIB
Touch Interface (Touch Interface
Data, Power Board)
SIB3
(in SYSCON2.1)

LCD Data, Power

Display Panel

Figure 2-43 TIB Door Components

Components
The LCD display panel controller and power supply are integrated into the SIB3 board in the
SYSCON2.1. The touch interface board (TIB) is mounted directly to the LCD panel /
touchscreen as a single assembly. The TIB and LCD panel are individually replaceable.

2.10.2 Maintenance Overview

General Care and Cleaning of the Display


Keep touch screen surfaces clean and free of any dust and dirt to prevent small particles from
scratching the touch screen under a sliding finger or stylus.
Use a soft lint-free cloth dampened with isopropyl alcohol to clean contaminates from the touch
screen.

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2.10.3 Replacement Procedures

Overview
Replacing the color touchscreen panel requires removal and disassembly of the door.

WARNING
Follow Safety Precautions. Failure to follow proper procedures may result in equipment
damage, personal injury or death.
Full safety precautions must be followed throughout all sections of this procedure to prevent
possible injury, equipment damage, or death. Verify that the area is clear of flammable gases
and vapors and that appropriate authorization is obtained to do the work (hot work permits).

NOTICE
Electrostatic Discharge Precautions.
The TIB can be damaged by electrostatic discharge (ESD). Take appropriate precautions
when unpacking and handling these components to avoid ESD damage.

1. Allow any applications to complete, and place in Hold.


2. Using GCP, save the existing database of the NAU to the hard drive of the Workstation.
– From the Network Portal, select the line entry for the device and then click the Backup
button at the top of the view.
– The "Save backup file as..." dialog box will appear. Type or select a name for the backup
file in the File Name field. If the user does not identify a file extension, then the default
extension of .amd will be used.
– Click the Save button in the dialog box to begin the backup. A progress dialog box will
appear, showing the saving of the database to flash memory and then the saving of the
file to the computer. When the backup is complete the progress box displays
"Successful".
– Click “OK” to close the progress box.
The .amd database file is saved to the hard drive of the PC.
3. Power down the analyzer.
4. Open the analyzer door.
5. Disconnect the door-to-chassis ESD ground wires.

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6. Disconnect the intrinsic safety wires from the studs above the PECM.
Intrinsic-Safety Ground Connection Points

TIB Door Assembly

ESD
Ground
Connection

Display Cable Routing Into SYSCON

Figure 2-44 TIB Door and Display Cables

7. Pull out the SYSCON2.1 drawer and disconnect the display cables from the SIB3 as shown
below. The cables can then be pulled out through the rear of the cage.

Display Cable Routing

Display
Cable
Connections

Figure 2-45 Display Cable Connectors In SYSCON2.1

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8. Remove door by lifting it out of its hinge sockets and place on work surface.

Figure 2-46 Removing or Installing Electronics Enclosure Door

The following steps refer to the exploded assembly view below.

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Display
panel to
TIB cable

LCD
from
SIB3

Intrinsic safety D
ground wires

E
B
E Backlight
Connector
E
E Hole for
wire-tie
E
Wire-tie
anchors, ESD
E insertion ground
points connection
points

Hole for
wire-tie
D

Figure 2-47 TIB Color Touchscreen Door Exploded View

9. Remove the TIB protective cover by removing the 4 screws. (A in exploded view) This
allows access to two of the 6 mounting studs for the LCD assembly. (E in exploded view)
10.Disconnect the three connectors of the display cable assembly; the backlight connector,
the TIB cable connector, and the LCD connector. (B in exploded view)

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11.Disconnect the two cables from the display panel to the TIB
12.Unscrew the four standoffs and remove the TIB. (C in exploded view)
Keep touch screen surfaces clean and free of any dust and dirt because small particles
could scratch the touch screen.)
13.Cut the three wire ties securing the cable assemblies to the display assembly. (In small slot
on panel steel slab adjacent to cutout for LCD connector, small hole near corner of slab for
backlight connector, and TIB lower standoff) (D in exploded view)
14.Unplug the two wire-tie anchors by compressing the nylon anchor as shown below. (The
cable assembly and anchors may be left in place if desired.)

Figure 2-48 Removing Wire-Tie Anchors

15.Remove the 6 nuts (E in exploded view) and remove display assembly.

Assembly Considerations
Reassembly of the TIB door is generally the reverse order of the disassembly steps given
above.

Display Panel
The replacement display panel has a protective plastic sheet on the glass surface. Remove
this prior to mounting on the door.
When replacing the mounting nuts, use between 3 and 5 inch-pounds of torque. Do not
overtighten.

Wire Ties
Three wire ties are required on the display steel slab. See the exploded view above and the
illustration below for installation locations.
When installing the wire tie for the LCD connector, orient the head flat to keep it clear of the
protective cover when it is reinstalled.

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Install wire tie for the LCD connector Install wire tie on the lower Install wire tie for backlight connector
through hole adjacent to the cutout. TIB standoff near the through small hole at the corner of the
intrinsic safety ground lugs. panel plate.

Figure 2-49 Wire Tie Installation Detail

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Table 3-1 General

Temperature control ±0.02°C (±0.05°F)


Calibration Comparison measurement with external standard
● Type Manual or automatic
● Zero value Automatic baseline correction
● Span Standard sample cylinder (single or multipoint calibration possible)

Table 3-2 Measuring Response

Sensitivity (depending on applica‐ ±0.5% of span


tion)
Linearity (depending on application) ±2% of span
Effects of vibrations Negligible
Repeatability in % of full scale Range Value
(Depending on application) 2 and 100% ±0.5%
0.05 and 2% ±1%;
50 and 500 ppm ±2%
5 and 50 ppm ±3%
0.5 and 5 ppm ±5%

Table 3-3 Climatic conditions

Ambient temperature and humidity -18 to 50°C (0 to 122°F) application-dependent


Specific installations may require additional environmental constraints. See the custom
documentation package.
Note: If the Maxum II is exposed to high condensing humidity with the electronics open
or without dry purge air applied, then it must be allowed to re-stabilize at the above
stated conditions for at least 8 hours before electrical power is applied.
** Depending on application characteristics such as number of detectors, oven tem‐
perature, and electronic loading, the acceptable ambient temperature range may be
reduced. For application-specific detail, contact Siemens through the Siemens Industry
Online Support (SIOS) website:
https://support.industry.siemens.com.
Altitude Up to 2000m (6561') for analyzers using 230VAC Supply
Up to 3000m (9842') for analyzers using 115VAC Supply

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Table 3-4 Gas supply

Instrument air ● At least 350 kPa (50 psig) for units with Model 11 or Valco valves
● At least 825 kPa (120 psig) for units with Model 50 valves
● At least 175 kPa (25 psig) for airbath ovens; 85 l/min per oven
● Instrument air quality requirement: ISO-8573-1:2010 [3:2:3]
[ 3 : - : - ] Dust filtering down to 1 micron
[ - : 2 : - ] Dew point of -40°C
[ - : - : 3 ] Total hydrocarbon below 1 mg per cubic meter (appr. 0.8 ppmw)
Carrier gas ● Hydrogen, Nitrogen, Helium, Argon, or Synthetic Air in compressed gas cylinder,
purity 99.999%, or hydrogen with a purity of 99.999% (depending on application).
● Typical consumption quantity: 5 to 100 l/month per detector module
Corrosion protection ● Purging with dry air to protect the electronics
● Airbath oven with stainless steel lining
● Airless oven made of aluminum
● Steel lining painted on outside (epoxy powder coating)

These are general parameters that vary depending on the individual application and
configuration.

Table 3-5 Typical Gas Requirements

Type Quality Pressure Typical Consumption


Carrier gas Hydrogen 5.0 (≥ 99,999%) 500 to 1000 kPa (72.5 to 50 to 150 ml/min/train
Nitrogen 145 psig)
Helium
Argon
Synthetic Air
Combustion gas Hydrogen 5.0 (≥ 99,999%) 500 to 1000 kPa (72.5 to 30 to 50 ml/min/FID
145 psig) Approx. 100 ml/min/FPD
Combustion air Synthetic air Hydrocarbon free 500 to 1000 kPa (72.5 to Approx. 400 ml/min/FID
145 psig) Approx. 100 ml/min/FPD
Actuation air Instrument air
Purge air Instrument air Instrument air 400 to 1655 kPa (58 to 240 Initial purge: Approx. 65l/min
(py purge) or Nitrogen psig) Operating purge: Approx. 3.5 l/min
Purge air Instrument air Instrument air 400 to 600 kPa (58 to 87 Initial purge: 60 to 80 l/min
(px purge) or Nitrogen psig) Operating purge: 12 to 18 l/min
Valve gas Instrument air 500 to 1000 kPa (72.5 to
(for Model 50) 145 psig)
Oven heating Instrument air 400 to 600 kPa (58 to 87 85 l/min/oven
(for Airbath psig)
oven)
Vortex cooler Instrument air 300 to 600 kPa (43.5 to 87 130 to 170 l/min
psig)
PTGC Instrument air 400 to 600 kPa (58 to 87 210 l/min
psig)

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Type Quality Pressure Typical Consumption


PTGC + Vortex Instrument air 400 to 600 kPa (58 to 87 Approx. 575 l/min
psig)
Strip gas Nitrogen 5.0 (≥ 99,999%) 400 to 600 kPa (58 to 87 6 to 8 l/h
psig)

Table 3-6 Influencing variables

Effects of ambient temperature Negligable with electronic pressure control. Different effects with mechanical pressure
control (depending on application)

Table 3-7 Mounting Clearance

Mounting clearance ● Clearance on left: 460 mm (18") from walls and other devices
● Clearance on right: 460 mm (18") in all cases
● Clearance at front: 654 mm (26") in all cases
● Center-to-center: 1,120 mm (44") in all cases

Table 3-8 Dimensions

Weight 77 kg (170 lbs.) application dependent


Overall Dimensions Height: 1053.6 mm (41.5”)
(including mounting hardware) Width: 752 mm (26.6”)
Depth: 417.4 mm (16.4”)

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Figure 3-1 Maxum II Airless/Airbath Dimensions

Table 3-9 Configuration

Oven options ● Single isothermal airbath oven or divided airbath oven with two independent
isothermal zones
● Single oven or two independent, airless ovens in separate oven areas.
● Programmable-temperature (PTGC) oven
Detector options ● Thermal conductivity
● Flame ionization
● Flame photometry
● Pulse discharge detector in Helium ionization mode
● Pulse discharge detector in Photo-ionization mode
● Pulse discharge detector in Electron capture mode
Number of detectors ● 1, 2 or 3 in any combination of detector module types for airbath ovens (max. 2
FPDs)
● 1, or 2 in any combination of detector module types for airless ovens, up to 3 in
special configurations

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Sampling and column valves ● Diaphragm valves


● Diaphragm piston valves
● Sliding vane rotary valves
● Slider valves
● Liquid injection valve
Valveless option Live switching
Column options Packed, micropacked or capillary columns
Regulation of gas supply Up to 8 electronic pressure regulator channels and up to 6 mechanical pressure reg‐
ulators

Table 3-10 Enclosure Protection

Ingress protection IP54, Category 2


Explosion protection ● Standard configurations:
● Certified according to ATEX with air or nitrogen purging for Zone 1 (II2G Ex ... IIB
+ H2 ... Gb)
● Suitable for use in non-hazardous areas and with non-dangerous conditions
● Certified according to CSA C/US for use in Class 1, Div. 1, Groups B, C, D with air
or nitrogen purging
● Certified according to CSA C/US for use in Class 1, Div. 2, Groups B, C, D.
Important note! Purging of the electronics area with instrument air or nitrogen is rec‐
ommended to maintain optimum measurement performance. The PDD is not certified
for hazardous areas.
EMI/RFI design ● CE-compatible; in conformity with 2014/30/EU (EMC directive)
● CE-compatible; in conformity with 2014/35/EU (low-voltage directive)
● Tested according to EN 61010-1 / IEC 61010-1

Table 3-11 Electrical characteristics

Power supply ● Single-phase AC, 100 to 130 V or 195 to 260 V (selectable), 47 to 63 Hz


● Single oven: max. 1800 VA
● Dual oven: 2 circuits, max. 1800 VA each

Table 3-12 Electrical inputs and outputs

Standard input and output ● 2 analog outputs


● 4 digital outputs (1 for output of system faults, 3 are user-configurable)
● 4 digital inputs;
Card slots for optional inputs and 2
outputs via internal I2C bus
Input and output cards ● I2C_AIO: 8 analog outputs, 8 analog inputs, 2 digital inputs
● I2C_DIO: 6 digital inputs and 8 digital outputs
● I2C_ADIO: 4 digital inputs and 4 digital outputs, 4 analog inputs and 4 analog
outputs

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Digital inputs ● Optically coupled with a common for all inputs.


● Self powered floating-contact input, or configurable for sinking or sourcing current.
● Sourcing current mode: 24 V internal isolated supply, with positive terminal of
supply at common.
● Sinking current mode: 5 V internal isolated supply, with negative terminal of supply
at common.
Digital outputs Floating double-throw contacts, maximum contact load rating 1 A at 30 V (AC or DC).
External diode shunt suppression should be used for inductive DC loads, preferably
at the load
Analog inputs -20 to 20 mA into 50 Ω or
-10 to 10 V Rin = 0.1 MΩ
With alternate insulation up to 10 V
Analog outputs 0/4 to 20 mA into max. 750 Ω, common negative pole, electrically isolated from ground;
freelyconnectable to ground
Termination SYSCON-based I/O: Terminal strip for braided or solid cable with maximum section of
1.5 mm2 (16AWG)
Expansion board-based I/O: Screw terminal for shielded or solid cable with a maximum
area of 0.82 mm2 (18AWG)

Table 3-13 Communication

Serial ports 4 RS232/RS485 ports, e.g. Modbus


Ethernet ● Standard 10/100 BaseT Ethernet with 4 RJ45 connectors e.g. Modbus TCP IP or
OPC
● Optional ESBF board Fiber-optic 100Base FX multimode with ST connection 3 x
RJ45 and 1 x optical

Table 3-14 Gas sample inlet conditions

Sample flow 5 to 100 ml/min (depending on application)


Sample filter size 0.1 to 5 μm with gaseous samples (depending on type of valve)
Minimum sample pressure 35 kPa (5 psig) standard
Maximum sample pressure 200 kPa (29 psig) standard, higher pressure as option
Maximum sample temperature 121°C (250°F) standard; higher temperature as option
Materials in contact with sample Stainless steel and Teflon; other materials as option

Table 3-15 Combustion gas supply

Combustion gas ● Hydrogen with a purity of 99.999%


● Typical consumption quantity: 2 000 l/month per detector module
Combustion air ● Reference air (< 1 ppm THC, O2 concentration 20 to 21%). Synthetic air, or supply
through instrument air with catalytic purification (optional).
● Typical consumption quantity: 26 000 l/month

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Index

A
ABH1, 74
ABH2, 74

F
Fuses, 74

H
Heater Termination Plug, 31

I
IO Board DI Mode Switch, 57
IO Board Status LEDs, 57

S
Solid State Relay Module, 74

T
TEMP CONTROL, 31

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