2024 Q2

Winbond DRAM
Memory Roadmap

1
Winbond DRAM Technology Roadmap

2024Q2-a Winbond Confidential 2

Winbond Specialty DRAM Memory Portfolio

2024Q2-a Winbond Confidential 3

Winbond Mobile DRAM Memory Portfolio

2024Q2-a Winbond Confidential 4

Winbond SDRAM Roadmap

2024Q2-a Winbond Confidential 5

Winbond DDR Roadmap

2024Q2-a Winbond Confidential 6

Winbond DDR2 Roadmap

2024Q2-a Winbond Confidential 7

Winbond DDR3/DDR3L Roadmap

2024Q2-a Winbond Confidential 8

Winbond DDR4 Roadmap

2024Q2-a Winbond Confidential 9

Winbond PSRAM Roadmap

2024Q2-a Winbond Confidential 10

Winbond HYPERRAMTM Roadmap

2024Q2-a Winbond Confidential 11

Winbond LPSDR/DDR Roadmap

2024Q2-a Winbond Confidential 12

Winbond LPDDR2 Roadmap

2024Q2-a Winbond Confidential 13

Winbond LPDDR3 Roadmap

2024Q2-a Winbond Confidential 14

Winbond LPDDR4 Roadmap

2024Q2-a Winbond Confidential 15

Winbond LPDDR4x Roadmap

2024Q2-a Winbond Confidential 16

Specialty DRAM Ordering Information

W 63 2G G 6 N B - 09
1 Winbond Standard Product 5 Data Width 8 Flexible Code 10 Product Grade &
8: x8 Temperature Range
W: Winbond — : if digit of 9 + 10 is <3
6: x16
2: x32 Blank: Commercial Grade indicating one of
Blank : if digit of 9 + 10 is =3 three options:
2 Product Family Note 0°C to 70°C (SDR/DDR)
66: DDR4 0°C to 85°C (DDR2)
63: DDR3 For KGD, 4 & 5 indicated voltage and 0°C to 95°C (DDR3/4)
94: DDR I/O. Please refer to the datasheet or 9 Speed (clock rate)
97: DDR2 contact Winbond sales for detail. I: Industrial Grade & -40°C to 85°C
75: 133 MHz 25: 400 MHz
98: SDRAM (SDR/DDR)
7: 143 MHz 18: 533 MHz
6: 166 MHz 15: 666 MHz I: Industrial Grade & -40°C to 95°C
3 Density 6 Process Technology
5: 200 MHz 12: 800 MHz (DDR2/3/4)
16: 16Mb To identify different design / FAB / process 4: 250 MHz 11: 933MHz J: Industrial Grade Plus & -40°C to 105°C
32: 32Mb node change of same density. 3: 333 MHz 09: 1066MHz A: Automotive Grade & -40°C to 95°C
64: 64Mb 08: 1200MHz 07: 1333MHz K: Automotive Grade & -40°C to 105°C
M: 38nm
12: 128Mb 06: 1600MHz W:Automotive Grade & -40°C to 115°C
N: 25nm
25: 256Mb S: Automotive Grade & -40°C to 125°C
R: 20nm
51: 512Mb T: 16nm
1G: 1Gb
2G: 2Gb 7 Package Type
4G: 4Gb B: BGA
8G: 8Gb H: TSOP
4 Operation Voltage T: Thin BGA
G: KGD w/o RDL
G: Operation voltage corresponding to Product
A~ : KGD with RDL version
Family
U: DDR3 Power Supply 1.5V/1.35V
• For Speed, DDR/DDR2/DDR3/DDR4 interface data rate are double clock rate.
• EX: DDR3 1066MHz → 2133Mbps
2024Q2-a Winbond Confidential 17
 Mobile DRAM Ordering Information

W 97 A H 2 N B V A 2 A
1 Winbond Standard Product 4 Operation Voltage 7 Package Type 10 Speed (clock rate)
W: Winbond A:3V/3V (VDD/VDDQ) K: KGD 1: 533MHz A: 667MHz
D:1.8V/1.8V (VDD/VDDQ) A: Asyn Page 2: 400MHz B: 800MHz
H:1.8V/1.2V/1.2V (VDD1/VDD2/VDDQ) B: BGA (LPDR) 3: 333MHz C: 933MHz
2 Product Family N:3.0V/3.0V Half Density F: BGA (x8 pSRAM, DDP) 4: 220MHz / 250MHz D: 1066MHz
K:1.8V/1.8V Half Density Q: BGA(LPDR,DD/DC,CSx1 per channel) 5: 200MHz; E: 1333MHz
98:SDRAM/LPSDRAM
L:1.8V/1.1V/1.1V (VDD1/VDD2/VDDQ) 6: 166MHz; F: 1600MHz
97:DDR2/LPDDR2
M:1.8V/1.1V/0.6V (VDD1/VDD2/VDDQ) 7: 133MHz G: 1866MHz
94:DDR/LPDDR 8 Pad Configuration code
P:1.8V/1.1V/1.1V (VDD1/VDD2/VDDQ) w/ ECC 8: 125MHz H: 2133MHz
96:CRAM(pSRAM) Non MUX
Q:1.8V/1.1V/0.6V (VDD1/VDD2/VDDQ) w/ ECC Specify Pad sequence / Ball # / 9: 104MHz/108MHz
95:HYPERRAM / CRAM(pSRAM) MUX
63:DDR3/LPDDR3 5 Data Width package dimension
66: DDR4/LPDDR4 11 Product Grade &
8: x8
6: x16 9 Package Material Temperature Range
3 Density 2: x32 E: Extended Grade & -25°C to 85°C
A: Lead-free + Halogen-free I: Industrial Grade & -40°C to 85°C
5: 32Mb 6 Process Technology (Green-package) , SAC305
6: 64Mb (pSRAM/LPR1/LPR2/LPR3)
B: Lead-free + Halogen-free I: Industrial Grade & -40°C to 95°C
7: 128Mb To identify different design / FAB / process
(Green-package) , SAC302 (LPR4/4X)
8: 256Mb node change of same density.
H: LPDDR4/4x x16 BGA 100ball J: Industrial Grade Plus & -40°C to 105°C
9: 512Mb M: 38nm U: LPDDR4/4x 0.8mm thickness
A: 1G A: Automotive Grade & -40°C to 85°C
N: 25nm Q: LPDDR4/4x 1.1mm thickness (pSRAM/LPR1/LPR2/LPR3)
B: 2G R: 20nm -- : KGD
C: 4G A: Automotive Grade & -40°C to 95°C
T: 16nm (LPR4/4X)
D: 8G
K: Automotive Grade & -40°C to 105°C
W:Automotive Grade & -40°C to 115°C
S: Automotive Grade & -40°C to 125°C
• For Speed, HYPERRAM/LPDDR/LPDDR2/LPDDR3/LPDDR4 interface data rate are
double clock rate.
2024Q2-a Winbond Confidential • EX: LPDDR3 1066MHz → 2133Mbps 18
Thank You
Website www.winbond.com
E-mail mkt_online@winbond.com

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