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201573017141872
201573017141872
Pin Configuration
OC# 1 5 VOUT VOUT 1 5 VOUT VOUT 1 5 VOUT VOUT 1 5 VIN
uP7534C/D
uP7534E/F
uP7534A
uP7534B
(uP7534C) EN EN(uP7534E)
3 4 VIN VIN 3 4 EN VIN 3 4 VIN NC 3 4
(uP7534D) EN# EN#(uP7534F)
SOT23-5 (MA5) SOT23-5 (M5) SOT23-5 (M5) SOT23-5 (MA5)
VOUT 1 5 VIN
OC# 1 8 NC GND 1 8 VOUT
uP7534G/H
uP7534C/D
uP7534A/B
Note: uPI products are compatible with the current IPC/JEDEC J-STD-020 requirement. They are halogen-free, RoHS
compliant and 100% matte tin (Sn) plating that are suitable for use in SnPb or Pb-free soldering processes.
VIN
NC
OC# GND
VIN 7 7 VOUT
VIN 7 2 VOUT
Charge
Pump
Thermal Deglitch
UVLO
Sense
4 GND
Thermal Information
Package Thermal Resistance (Note 3)
SOP-8 θJA ------------------------------------------------------------------------------------------------------------------------------- 160°C/W
SOP-8 θJC ------------------------------------------------------------------------------------------------------------------------------- 39°C/W
SOT23-5 θJA ------------------------------------------------------------------------------------------------------------------------------- 250°C/W
SOT23-5 θJC ------------------------------------------------------------------------------------------------------------------------------ 50°C/W
MSOP-8 θJA ------------------------------------------------------------------------------------------------------------------------------ 160°C/W
MSOP-8 θJC ------------------------------------------------------------------------------------------------------------------------------- 40°C/W
PMSOP-8 θJA ------------------------------------------------------------------------------------------------------------------------- 86°C/W
PMSOP-8 θJC --------------------------------------------------------------------------------------------------------------------------- 30°C/W
Power Dissipation, PD @ TA = 25°C
SOP-8 ------------------------------------------------------------------------------------------------------------------------------------------ 0.625W
SOP23-5 ------------------------------------------------------------------------------------------------------------------------------------------ 0.4W
MSOP-8 ------------------------------------------------------------------------------------------------------------------------------------------ 0.625W
PMSOP-8 ------------------------------------------------------------------------------------------------------------------------------------------- 1.16W
Electrical Characteristics
(VIN= 5V, TA = 25OC, unless otherwise specified)
Supply Input
EN#
VOUT
TR TF
TON TOFF
OC Trip Threshold
ISC_TRIP
Note 1. Stresses beyond those listed as the above Absolute Maximum Ratings may cause permanent damage to
the device. These are for stress ratings only. Functional operation of the device at these or any other
conditions beyond those indicated in the Recommended Operation Condition section of the specifications is
not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility
to affect device reliability.
Note 2. Devices are ESD sensitive. Handling precaution recommended.
Note 3. θJA is measured in the natural convection at TA = 25°C on a low effective thermal conductivity test board of
JEDEC 51-3 thermal measurement standard.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. These items are not tested in production, specified by design.
84 20
82
80 15
78
10
76
74 5
72
70 0
2.5 3 3.5 4 4.5 5 5.5 2.5 3 3.5 4 4.5 5 5.5
Input Voltage VIN (V) Input Voltage VIN (V)
SOP-8 Package
OC# Delay Time vs. Input Voltage EN/EN# Threshold Level vs. Input Voltage
10 1
9
High/Low Threshold Level (V)
0.8
OC# Delay Time (ms)
8
7 0.6
6
5 0.4
4
0.2 Low Level
3
High Level
2 0
2.5 3.5 4.5 5.5 2.5 3.5 4.5 5.5
Input Voltage VIN (V) Input Voltage VIN (V)
2.5 100
On Resistance (mΩ)
2.0 80
1.5 60
1.0 40
0.5 20
0.0
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 -50 0 50 100 150
Input Voltage VIN (V) Junction Temperature (OC)
SOP-8 Package, VIN = 5V
27 10
Quiescent Current (uA)
17 6
12 4
7
2
2
0
-50 0 50 100 150
-50 0 50 100 150
Junction Temperature (OC) Junction Temperature (OC)
VIN = 5V VIN = 5V
VOUT
0.8
2V/Div
0.6
0.4
EN
2V/Div
0.2
High Level
Low Level IIN
0
2A/Div
-50 0 50 100 150
Junction Temperature (OC) Time (1ms/Div)
VIN = 5V VIN = 5V, COUT = 1600uF
VIN
VOUT 2V/Div
2V/Div
EN
2V/Div V OUT
2V/Div
ILOAD
250mA/Div ILOAD
250mA/Div
VIN VOUT
2V/Div 5V/Div
OC#
2V/Div
VOUT OC#
2V/Div 5V/Div
ILOAD
250mA/Div IIN
2A/Div
VOUT
5V/Div
OC#
5V/Div
ILOAD
2A/Div
Time (4ms/Div)
VIN = 5V, COUT = 470uF, RLOAD = 0Ω
6 3
capacitance of downstream device. Ferrite beads are VIN 7 2 VOUT
recommended in series with all power and ground connector
+
VBUS
8 1
pins. Ferrite beads reduce EMI and limit the inrush current
during hot-attachment by filtering high-frequency signals.
The DC resistance of the ferrite bead should be specially EN# OC#
4.80 - 5.00
1.85 REF
5.80 - 6.20
3.80 - 4.00
6.15 REF
8.00 MIN
4.00 MIN
0.10 - 0.25
Note
1.Package Outline Unit Description:
BSC: Basic. Represents theoretical exact dimension or dimension target
MIN: Minimum dimension specified.
MAX: Maximum dimension specified.
REF: Reference. Represents dimension for reference use only. This value is not a device specification.
TYP. Typical. Provided as a general value. This value is not a device specification.
2.Dimensions in Millimeters.
3.Drawing not to scale.
4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm.
0.62 0.95
MAX REF
2.90 BSC
1.22 REF
3.85 MAX 2.62 REF 1.40 MIN 2.8 BSC 1.50 - 1.75
Note
1.Package Outline Unit Description:
BSC: Basic. Represents theoretical exact dimension or dimension target
MIN: Minimum dimension specified.
MAX: Maximum dimension specified.
REF: Reference. Represents dimension for reference use only. This value is not a device specification.
TYP. Typical. Provided as a general value. This value is not a device specification.
2.Dimensions in Millimeters.
3.Drawing not to scale.
4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm.
0.65 REF
4.80 - 5.00
2.90 - 3.10
3.50 REF
4.50 REF
0.08-0.23
Note
1.Package Outline Unit Description:
BSC: Basic. Represents theoretical exact dimension or dimension target
MIN: Minimum dimension specified.
MAX: Maximum dimension specified.
REF: Reference. Represents dimension for reference use only. This value is not a device specification.
TYP. Typical. Provided as a general value. This value is not a device specification.
2.Dimensions in Millimeters.
3.Drawing not to scale.
4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm.
1.42 - 2.15
1.38 - 1.85
1.30 - 1.90
4.80 - 5.00
2.90 - 3.10
4.50 REF
3.50 REF
0.65 REF
0.08-0.23
Note
1.Package Outline Unit Description:
BSC: Basic. Represents theoretical exact dimension or dimension target
MIN: Minimum dimension specified.
MAX: Maximum dimension specified.
REF: Reference. Represents dimension for reference use only. This value is not a device specification.
TYP. Typical. Provided as a general value. This value is not a device specification.
2.Dimensions in Millimeters.
3.Drawing not to scale.
4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm.
Important Notice
uPI and its subsidiaries reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products
and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information
before placing orders and should verify that such information is current and complete.
uPI products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment. However, no responsibility
is assumed by uPI or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its
use. No license is granted by implication or otherwise under any patent or patent rights of uPI or its subsidiaries.
COPYRIGHT (C) 2007, UPI SEMICONDUCTOR CORP.