Cire i: IPC CHECKLIST for Producing Printed Board AssembliesTable of Contents IPC Offices ..... Production Cycle Classification . Producibility LEVEIS ....sscsssssssssesssssssseesseeessesessseeee 5 Standards Checklist ......-.cscseseeeeseseeneeesseeeeneeennnen 6 IPC Reference Standards .. soe cccseneecenneees soeeeeseeseene 7 IPC Standards — Everything You Need from Start to Finist 15, Phenomena in Cross Section of Plated Through Holes 16 CAD Text Standards — Design ......ssscsssssseseneennees 7 PCB with IPC Standards . 18 PCBA with IPC Standards — Soldering and Assembly 19 Cleaning and Coating with IPC Standards... Lab — Board/Assembly Quality Check... Notes .,IPC Offices IPC HQ Office 2000 Lakesice Drive, 105 N Bannockbum, IL 60015 Tek + 1 887-615-7100 wwrnipc.org IPC Atlanta Office 393 North Point Canter East Sute 260, Apharetta, GA 30022 Tals = 1 947-615-7100 wwenipe.org IPC Washington, D.C. Office 1831 Penneyivania Avenue, NW Suite 625 South Washington, 0.C. 20004 Tek: +1 202-661-8090 won ipc.org IPC China IPC China HO Room 510 Modern Logistic Bulcing #448 Hongcao Ra. Xunui District ‘Shanghai, 200253, PRC Teh +86 400 6219 810, wwrnipc.org.cn IPC Europe IPC Europe HQ IPC Electronics Europe Gmbh Herzogspitalsrasse 24 1D-80331 Munich Germany Tor +49 181 16518587 aww ipcorgieurops IPC India IPC India HO (Oig No. 26, (New No. 35) 2nd floor stn Mani, 4in Block, Jayanagar, Bangalore, 560011 Te: +91 80 26582011 wuwipc.org/pc-indaProduction Cycle Lica Dy DESIGN Taking a concept and creating the drawings and documentation for an electronic product including stackup, component layout, and routing; Bill of Materials (BOM), fabrication and assembly notes, and more. Signal integrity and other simulations typically also occur during the design phase. SUPPORTED BY Ipc PRINTED BOARD FABRICATION STANDARDS Laminates, surface finish, plating process, thermal stress methodology and engineering documentation required by drawing ASSEMBLY Materials, components and engineering documentation required by drawing Pay Too) Engineering Documentation Drawings, specifications, technical illustrations and other documents, prepared and released by the design activity in any form of media, that establish the design and design requirementsClassification IPC Product/Performance Classes Three general product/performance classes are established to reflect progressive increases in sophistication, functional performance requirements and testing/inspection frequency. There may be an overlap of product/performance classes in complex multi-unit electronic systems. Class 1 General Electronic Products Includes products suitable for applications where the major requirement is function of the completed assembiy, Class 2 Dedicated Service Electronic Products Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically, the end-use environment would not cause failures. Class 3 High Performance/Harsh Environment Electronic Products Includes products where continued high performance or performancs-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems, The Use of Addendums An addendum is written to a spectfc revision of a base document. Addendume are industry segment specific and are not standalone documents. They must be used with a base document.Producibility Levels IPC design standards, including the IPC-2220 series and the IPC-7382, provide design producibility levels of features, tolerances and measurements within the printed board manufacturing process. These are intendad to reflect increases in the sophistication of tooling and processing and therefore, progressive increases in fabrication cost. ‘These levels are: Level A: General Design Producibilty — Preferrad Level B: Moderate Design Producibilty — Standard Level C: High Design Producibility — Reduced The producibility levels are not to be interpreted as a design requirement but rather as a method of communicating the degree of difficulty of a feature between the design authority and manufacturing. The use of one level for a specific feature does not mean that other features must be of the same level, and selection should recognize Precision, performance, pattern density, equipment and assembly/testing requirements. The specific requirement for any feature shall be as specified in the procurement documentation.Standards Checklist Note: ‘The decisions mad using this checklist are depencient upon the type of assembly, i.e. rigid, Tigid flex, etc. and the operating environment of the completed product. [Typical Process Steps for a Printed Board Assembly IPC Standard(s) 'Select component package IPO-222%, PO-7352, |PO-7083, IFO-7095 [Select surface finish on components IPO y-STD.002 Data transfer and electronic product documentation needs PO-2581, IPC-2610 (CAD according to Ciass 1.2 or 8 IPO-2221, IPC-2222 and IPO-2228 [CAD according to Producibilty Level A, B or G IPG-2221, IPO-2222 and IPG-2228 Footprint/iana according to Producibilty Laval A, B or C. IPG-7361 ana IPO-7362 Printed board internal/external thermal management IPG-2901 ana IPO-2162 Design /GAD of QFN IPC-7083 Design CAD of BGAYCSP IPC-7095 Design GAD of stencils IPO-7525 Placement of components IPO-222%, |PO-7352, |PO-7093, IFO-7095 ‘Select printed board base material IPO-4104 ‘Select printed board base material Qu fol IPO-4582 [Select printed board solder mask IPO-SM-840 'Select printed board surface finish IPG-4882, |PO-4688, IPO-4654, IPO-4555 lor IPO-4556 ‘Select printed board hanaling and storage IPo-1602 [Solderablity of printed board IPG J-STD-008 Printed board procass requirements at supplier IPC-6011, IPC-6012, IPC-6018, IPO-6017 lor IPO-6018 |Stanciv/printing options IPC-7526 ana IPO-7627 Printed board assembly requirements Class 1, 2 or 3 IPG J-STD-001 Printed board assembly acceptabilly Class 1, 2 oF 3 IPC-A-610, ‘Solder pasie/bar/wire options IPC J-STD-006 and IPC J-STD-008 Flux with solder paste/bar/vire options IPC J-STD-004 Reflow/vapor phase/wave/selectvefhand options IPo-2004 [Select soldering environments (O, free, N, or Ai) IPC-2921, IPO-7525 ‘Select Po or Pb-free process IPO-2221, IPC-WP-012, IPC-WP-014 and IPC/BERM-2001, ‘Select moisture sensitive level (MSL) IPC J-STD-033 ‘Select cleaning method IPC-CH-65, IPO-702, IPO-5708 ‘Conformal coating IPC-CC-880 ana IPC J-STD-001 Printed board assembly rework, modification and repair IPO-7711/21 Printed board assembly requirements/acceptabilty for electronic encio Isures, IPC-A-630_ Printed board assembly requirements/acceptabilty for cable IPCWHMA-A-620)IPC Reference Standards IPC’s robust library of standards and guidelines help electronics manufacturers build electronics better. The following documents are available from shopipc.org. For a complete is, including obsolete, superseded, retired, and other documents published before 2010, please visit httos:y/ \wewipc-org/ipe-document-revision-table. Interested in helping develop or create an IPC document? You join a committee for FREE by visiting hitips:/wwawips.org/join-committes-home-page and referencing the commitise code beloww Deets Dect utd Ce a coarse J-STD-001 | Flequiremants for Soldered Electrical and Eleotronio |5-22a | J-STD-OD1 Task Group Assembly Processes, ‘Assemblies ‘JESTD-001xA/ | Automotive Addendum to IPC J-STD-001 5-222 | J-STD-001 Task Group Assembly Processes, A610xA | Requirements for Soldered Electrical and Electronic ‘Automotive | Assomblias and IPC-A-610 Accopiabilly of ‘Addendum | Electronic Assemblies J-STO. ‘Space Applications Electronic Hardware Addendum |5-22as | Spaco and Military ‘Assembly Processes O01xS Space |forJ-S7D-001 Electronic Assemblies Task Hardware Group Addendum Ipc. Handbook and Guide to the Requirements for 8:22f | IPC-HDBK-001 Task Group Assembly Processes HDBK-001 | Soldered Electrical and Electronic Assemblies J-STD-020 | Moisture/Reflow Sensitivity Classification of Plastic |B-10a | Plastic Chip Carrior Quality, Reliability, Surface Mount Devices Cracking Task Group Test, & Inspection IPO/PERM. | Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow |8.81f | PERI Soff Mitigation of Tin Assombily Processes WP-022 = Resuits of an Industry Round-Robin - Final Report by SMT Task Group for Lead-Free an Tin-Leed IPc-wP-023 | IPC Technology Solutions White Paper on V-TSL_—_ | Technology Solutions Supply Chain & Parformanca-Based Prinied Board OEM Commits Business Issues ‘Aooeptanoe: Via Chain Continuity Fellow Test: The Hidden Reliability Threat - Weak Microvia Interface IPO-WP.024 | Smart Textiles Reliability Following Laundering D-70 | E-Textiles Committee Textiles IPC-WP-028 | A Framework for the Enginoaring and Design of |D-70__| E-Taxtles Committee Textiles ETextiles IPC-WP-026 IPC Technology Solutions White Paper on V-TSL_—_ | Technology Solutions Supply Chain & Blookchain and the Electronics industry: A review Committee Business Issues of the current state of the blockchain technology and its potential applications in electronics ‘manufacturing 4J-ST0-030 | Selection and Application of Board Level Underfil |5-24f | Underfil Meterials Task Assembly Processes, Materials Group 4870-033 | Handing, Packing, Shipping and Use of Moisture, |B-10a__| Plastic Chip Carrier Quality, Reliability, Reflow, and Process Sensitive Devices Cracking Task Group Test, & Inspection 4J-870-048 | Customer Notification Stendard for Product/Progess | 2-151 | Obsolete and Discontinued | Supply Chain & Ganges by Flettonc Product Suppliers evsion Product Task Group Businoss Issues of JESDAED) J-ST0-048 | Notification Standard for Product Discontinuance [2-18 | Obsolete and Discontinued | Supply Chain & Produot Task Group Business Issues 1P0-7-60 | Terms and Definitions for interconnecting and 2-30 | Terme and Definitions PCB Fabrication and Packaging Electronic Circuits Committee Materials 7IPC Reference Standards Dee Deen ee err IPC-T-51 | Terms and Definitions for Design and Manufacture | D-84a_—_| Printad Electronics Terms | PCB Fabrication and of Printed Electronics and Definitions Task Group | Materials IPC-CH-65 | Guidelines for Cleaning of Printed Boards and 5-310 | Gleaning Hendbook Task | Cleaning/Coating/ Assemblies Group Contamination IPC-WP-113 | Guidance for the Development and Implementation |7-31k & | Wire Harness Design Task | Quality, Reliability, (of a Red Plague Control Plan (HPCP) 74th Group &1PC-HDBK-820 | Test, & Inspoction Handbook Task Group IPO-WP-114 | Guidance fr the Developrnt and implementation | T-$tk 8 Wire Harnsss Design Tack | Qualiy, Reliability, of a White Plague Gontrol Plan WPCP) : Group &IPC-HDEK-620 Test, &lnspsction Handbook Task Group IPC-WP-116 Guidance forthe Development ang Implementation 7-318 iro Harmess Design Task Quality, Reliab cf @ Foreign Object Debris (FOD) Control Plan 73th Group RIPC-HDEK-620 | Test, & inspection Handbook Task Group IPC-FC-254 | Pressure Sensitive Adhesive (PSA) Assembly D43 | Flexible Gitcuits Base Assembly Processes: ‘Guidelines for Flexible, Rigid or Pigid-Flex Printed Materials Subcommittee Boards IPC-D-325 | Documentation Requitements for Printed Boards, | 2-40 | Electronic Documentation | Design ‘Assamiblies and Support Drawings Technology Committee 1Pc-A-600 | Acceptability of Printed Boards 7-31a& |IPC-A-600 Task Group | PCB Fabrication and, D.3da_ & Rigid Printed Board Materials Performance Spoctications Task Group IPC-A-610 Acceptability of Electronic Assemblies 7-81b | IPC-A-610 Task Group _| Assembly Processes, IPC-A-610-R Fail Transit Adciondum to IPC-A-6100 Acceptabilty |7-31br | IPO-A-610 Addendum for _| Assembly Processes (of Electronic Assemblies High Soeed Railway Task Group IPO-A-610x0 | IPC-A-610xC Telecom Addendum 7-81be | A-610 Telecom Addendum | Assembly Processes: Task Group IPO-D-620 Design and Ctical Process Requirements for Cable |7-31k | Wie Harness Design Task | Quel, Refit ‘and Wieng Harnesses Group Test, Zinspaction poy ‘Acceptability of Electronic Wire Harnesses end | 7-31f_—| IPC WHMA-A-620 Task —_| Design WHMA-A-620 | Cables, Group Poy ‘Space Applications Electronic Hardware Addendum |7-31fs | IPC WHMA-A-620 Space _| Design WHMA-A-620 for |PC/WHMA-A-620. The addendum MUST be ‘and Military Electronic Space used with the same version of the standard e.g. ‘Assomblies Adgendum Hardware 6208 with 6200 ‘Task Group ‘Addendum IPCWWHMA- | Rail Transit Adciondum to IPC/WHMA-A-6200 7attr —|7-S1FR: IPC WHMA.A.620 | Design A.6200R, ‘Addendum for High Speed Railway Task Group IPC Handbook and Guide to IPC-D-620 and 7-81h& | IPC-HDBK-620 Handbook | Design HDBK-620.— IPCIWHMA-A-620, 731k Task Group & Wire Harness Design Task Group IPC-A-680 Acceptability Standard for Manufacture, Inspection 7-31) Electronic Box Assemblies | Assembly Processes, ‘and Testing of Electronic Enclosures Task Group IPC Guidelines for Design, Manufacture, Inspection, and 7-31) Electronic Box Assemblies. | Assembly Processes HDBK-630 Testing of Electronic Enclosures Task Group IPC-A-640 | Acceptance Requitements for Optical Fiber, Optical |7-31m Fiber Optic Cable Quality, Reliability, (Cable, and Hybrid Wiring Harness Assemblies Acceptability Task Group | Test, & inspectionIPC Reference Standards eco Det Ce st scan IPC-0-640 | Design and Critical Procase Requirements for 731m _ | Fiber Optic Cabio Design Optical Fiber, Optical Gable and Hybrid Wiring Acceptability Task Group Haress Assemblies IPO-SM-817 General Requirements for Dielectric Surface 5-21k | IPC-SML817 SMT Adhesive | Assembly Processes Mounting Adhesives Task Group, IPC-AJ-820 | Assembly and Joining Handbook 7-95 | Assembly and Joining | Assembly Processes: Handbook Subcommittee IPO-CC-830 Quaification and Performance of Electrical 5-332 | Conformal Coating Task Cleaning/Coating/ Insulating Compound for Printed Wiring Assemblies Group Contamination Ipc. {Guidelines for Design, Selection and Application of |5-33¢ | Conformal Coating Cleaning/Coating/ HDBK-830 Conformal Coatings Handbook Task Group Contamination IPC-SM-840 | Qualification and Performance Specification of | 5-83b | Solder Mask Performance Quality, Reliability, Permanent Solder Mask and Flexible Cover Task Group Test, & Inspection Materials IPC-1401 Corporate Social Responsibility 4.250n | Corporate Sooial Supply Chain & Responsibilly and Businass Issues Sustainability n the Supply Chain in China 1PC-1602 Standard for Printed Board Handing and Storage | D-35 _| Printed Board Storage and POB Fabriostion and Handling Subcommittee Materials IPC-1781 | Generic Requirements for Declaration Process |E-Sta | Generic Requirements Sunply Chain & Management for Declaration Process Business lesues Management Task Group IPC-1752 | Materials Declaration Management E-3tb | Materials Decleration Task | Supply Chain & Group Business Issues IPO-1758 Laboratory Report Standard E31] [Lab Report Task Group | Supply Chain & Business Issues IPC-1754 | Materials and Substances Declaration for E-3tk | Materials and Substances Supply Chain & Aerospace and Defense and Cther Industries Daolaration for the Business Issues ‘Aorospace, Defense, and Other Industries IPO-1755 Conflict Minerals Data Exchange Standard E-3th | Conflict Minerals Data | Supply Chain & Exchange Task Group Business Issues, IPC-1756 | Manufacturing Process Data Management 2-18 | Manutacturing Process Supply Chain & Declaration Tack Group Business lesuos IPC-1758 Declaration Requirements for Shipping, Packand 2-18 | Supplier Deo'aration Supply Chain & Packing Materials, Suboommittes Business Issu08 IPC-1782 Standard for Manufacturing and Supply Chain 2-192 | Critical Components Supply Chain & ‘Traceability of Electronic Products Traceabilty Task Group Business lesuos IPC-1791 Trusted Electronic Designer, Manufacturer, and 2-19 | Trusted Supplier Task Supply Chain & Assembler Requitemenis Group Businoes Issue8 IPO-1792 Standard for Cybersecurity Managoment in tne. (| 2-12e | Cybersecurity Protection Supply Chain & Manufacturing Industry Supply Chain Standard Task Group Business Issues IPC-2221 Generic Standard on Printed Board Dasign Date — |IPO-2221 2222 Task Group | Design IP0-2222 Sectional Design Standart! for Rigid Organic Printod D-S1b | IPC-2221 2222 Task Group Design BoardsIPC Reference Standards Pets ects Ce a cet aay IPC-2223 _| Sectional Design Standard for Flexible Printed D-11 [Flexible Gircuits Design | Design Boards Subcommittee IPC-2226 Sectional Desion Standard for High Density, D-31b | 1PC-2221 2222 Task Group | Design Interconnect (HD) Printed Boards IPC-2228 | Seotional Design Standard for High Frequency (RF/ |D-21 | High Speed/High Design Microwave) Printed Boards Frequency Design ‘Subcommittee IPO-2231 FX Guidelines 1-14 | DFX Subcommittee Design IPCMPCA- | Design Guideline for Printed Electronics D-81 | Printad Electronics Design | Design 2291 ‘Subcommittae IPC-2292 | Design Standard for Printed Electronica on Flexible |D-61 Printed Electronica Design | Design Substrates Subcommittee IPC-2551 | Intocnational Standard for Digital Twins 2-12a | Generic Flequirements for | Design Dial Twin Task Group IPG/DAC- _| Goneral Electronic Components Mode! Based 2-12 | Model Based Definition | Design 2552 Definition (MED) Standard (MED) for Digital Twine Task Group IPC-2581 | Gonoric Requirements for Printod Board Assembly | 2-16 | Digital Product Model Design Products Manufacturing Description Data and Exchange (DP) ‘Transfer Methodology Subcommittee IPC-2581 Connected Factory Exchange (CFX) 2-17 | Connected Factory Initiative | POB Fabrication and Suboommittae Materials, Assembly Processes IPC-2611 | Generic Requirements for Electronic Product 2-40 | Electronic Documentation | Design Documentation Technology Committee IPC-2612 Sectional Requirements for Electronic Diagramming |2-40 Electronic Documentation | Design Documantation (Schematic and Lagie Descriptions) Technology Commites IPC-2612-1 Sectional Requirements for Electronic Diagramming 2-40 Electronic Documentation | Design ‘Symbol Generation Methodology Technology Committee IPC-2614 Sectional Requirements for Board Fabrication 2-40 | Electronic Documentation | Design Documentation Technology Committee IPC-2615 _ Printed Board Dimensions and Tolerances 1-108 | Dimensioning and Design Tolorancing Task Group IPC/PERM- _Pb-tre0 Dasign & Assembly Implomentation Guide | 8-81D _ lasearch Coordination and | Assombly Processes 2901 Technical Guidance Task for Lead-Free and Group Tin-Lead IPC-4101 Specification for Base Materials for Rigid and sat Laminate Prepreg Materials | PCB Fabrication and Mullayer Printed Boards Subcommittee Materials IPC-4108 | Specification for Base Materials for High Speed/ D283. High Soeed High PCB Febrication and High Frequency Applicstions Frequency Base Materials | Materials ‘Subcommittee 1PC-4202 _| Flaxible Base Dielectrics for Use in Flexible Printed |D-13 | Flexible Circuits Base PCB Fabrication and Wiring Materials Subcommittee | Matarials IPC-4208 | Adhesive Coated Dielectric Fims for Use as Cover |D-13 Flexible Circuits Base PGB Fabrication and Shosts Materials Subcommittee | Materials 10IPC Reference Standards pono Det Ce Mo ect IPC-4412 | Specification for Finished Fabric Woven form “E” | 9-12d | Woven Giass PCB Fabrication and Glass for Printed Boards Reinforcement Task Group Materials 1PC-4552_Spocification for Electroless Nickolmmersion Gold 4-14 Plating Processes PCB Fabrication and (ENIG) Plating for Printed Ciroult Boards Subcommittee Materials IPC-4554 Specification for immersion Tin Plating for Printed 4-14 | Plating Processes PCB Fabrication and Circuit Boards Subcommittee Materials IPC-4555 Performance Specification for High Temperature | 4-140 | Final Finishes for Printed | POB Fabrication and Qrganic Soiderbity Preservatives (OSH) for Preted Boards -OSP Task Group Materials. 1PC-4556 | Spocifiation for Electroless Nickel/Electtoless «| 4-14_—_—| Plating Processes PCB Fabrication and Palladiun/immersion Gold (ENEPIG) Plating for Subcommittee Materials Printed Circuit Boards 1PC-4562 | Metal Foil for Printed Wiring Applications 3-122 | Metallic Foil Task Group | BOB Fabrication and Materials IPC/IPCA- | Requirements for Printed Electronics Functional |D-63 | Printed Electronics PCB Fabrication and 4591 Conductive Materials Functional Materials Materials Subcommittee 1PC-4592 | Roquiroments for Printed Electronics Functional | D-63a__| Printed Electronics PCB Fabrication and Dielectric Materials Functionel Dielectric Materials Materiels Task Group IPo- Handbook on Adhasive Bonding in Electronic S-11e | Electronic Assembly PCB Fabrioation and HDBK-4691 Assembly Operations Adhesives Task Group | Materials 1PC-4821 Specification for Embedded Passive Device D-s2 | Embedded Component | PCE Fabrication and Gapecitor Materials for Rigid and Multiayer Printed Materiels Subcommittees | Materials Boards 1PC-4921 | Requirements for Printed Electronics Base Materials |D-62 | Printed Electronics Base | POB Fabrication and Materials Substrates Materials Subcommittee IPC-5262 Design, Critical Process anc Accsptancs 5-249 | Polymetios Standard Task PCB Fabrication and Fequirements for Polymeric Applications: Group Materials 1PC-8703 | Cleanliness Guidelines for Printed Board Fabricators | 6-320 | Baro Board Cleanliness | Cleaning/Coating/ ‘Assessment Task Group | Gontammination IPC-6012 Qualification and Performance Specification for D-834 Rigid Printed Board PCB Fabrication and Figid Printed Boards Parormance Specifications | Materials Task Group IPC-6012xA Automotive Applications Addendum to IPC-6012 | D-33aa_|IPC-6012 Automotive PCB Fabrioation and (Quaification anal Performance Speciication for ‘Addendum Task Group Materials Rigid Printed Boards 1PC-6012xS | Space and Miltary Applications Addendum to IPC- | D-33as | IPC-6012 Aerospace PCB Fabrioation and 6012 Qualification and Parformance Specification Addendum Task Group Materials Yor Rigid Printed Boars IPC-6012xM Medical Applications Addendum to IPC-6012 D-33am | IPO-6012 Medical PCB Fabrication and Qualification and Performance Spectication for ‘Addendum Task Group Materials, Rigid Printed Boards IPC-6013 Qualification and Performance Specification for 12. Flexible Circuits PCB Fabrioation and Floxibie Printed Boards, Specifications: Materials Subcommittee itIPC Reference Standards Ceo Dect Ce nN IPC-6013xM | Medical Applications Addendum to 1PC-6013, D-3am__|IPC-6012 Medical PCB Fabrication and Qualification and Perfarmanoa Specification for Addendum Task Group | Materials, FloxibleiRigid Flexible Printod Eloctronics. The ‘addendum MUST be used with the samo revision of the standard. IPC-6017 | Quaitfcation and Performance Specification for |D-63._| Embedded Devices PCB Fabrication and Printad Boards Containing Embedded Passive, Porformance Subcommittee | Materials Devices IPO-6018 | Quaifcetion and Pertormanoe Speofication for |D-22 High Speed High Frequency | POB Fabrication and High Frequency (Microwave) Printed Boards Board Performance Sub | Materials committee IPC-6018xS | Space and Miltary Avionics Applications Addendum |D-22 | High Speed High Frequency | PCB Fabrication and {16 1PC.6018, Qualifeation and Perormance Board Performance Sub | Materials ‘Spactication for High Frequoncy (Microwave) committee Phted Boards: TH ecoencum MUST be used with the same revision of the standard IPCJPCA- | Application Categories for Printed Electronics | D-G4a_ Printed Electronios Terms | PCB Febrication and 6901 and Definitions Task Group | Mterala 1PC-6902 | Quaifcation and Portormance Spectication for |D-64 Printed Elactorios Final | Assombly Procossos Printag Electronics on Flexible Substrates ‘Assombly Suboommittes IPC-6908 Terms and Dafintions for the Design and D-64a | Printed Elactronios Terms | PCB Fabrication and Manufacture of Printed Electronics (Additive and Definitions Task Group | Materials Giouity) IPC-7081 | Desiga and Assembly Procass Implomeniction of |B-ta 9:0 Eloctronio Paokages | Design, Assembly 8D Components Subcommittee Processes: IPO-7082 Design and Assembly Procass Implementation for |D-55 | Embexided Devices Quality, Relebilty, Embedded Components, Process implementation | Test, Subcommittee inspection IPO-TO93 Design and Assombly Progoos Implementation or 5-21h Bottom Tengen Design, Assomoly Bottom Tenminat'on $Id" Components Components (STC) Task | Processes Group IPC-7084 _Desiga and Assembly Procass Implomentton for |5-219 Flip Chip Mounting Task | Design, Assembly Flip Chip and Die Size Components Group Processes: IPC-7085 Design and Assembiy Process Imolementetion for 5-21 Ball Grid Atay Taske Grou Design, Assembly BGAS Processes: IPC-7952 | Generic Guideline for Land Patter Design 4414 | DPX Standards Design ‘Subcommittee IPC-7525 | Guidelines for Stencil Design 5-212 | Solder Stencil Task Group | PCB Fabrication and Materials 1PC-7526 | Stencil and Misprintod Board Cleaning Handbook |5-31g Flip Chip Mounting Task | Design, Assembly (Group Processes 1PC-7527 | Requirements for Solder Paste Printing 5:2tind | Solder Pasta Printing Task | POB Fabrication and Group Matorale. IPC-7580 Guidelines for Temperature Proling for Mass 5-22h | Thermal Profiling Guido | POB Fabrication and Soldering Processes (Wave and Reiow) Task Group Materials IPC-7535 | Solder Dross Raiuction in Wave Soldering Process |5-22jen | Solder Dross Reduction | Assembly Processes ‘Ghomical Tesk Group China 12IPC Reference Standards Dec nL nay Dent eee oe Cs IPC-7621 | Guideline for Design, Material Seloction anct 5-339 | Low Pressure Molding Task | Assembly Processes General Application of Encapsulation ot Electronic Group Girouit Assembly by Low Pressure Molding with, Thermoplastics IPC-7711/21 | Rework, Modification and Repair of Electronic 7-24 | Repairablty Subcommittee | POB Fabrication and Assemblies Materials IPC-7801 Reflow Oven Process Control Standard 5-45 | Reflow Oven Process PCB Fabrioation and Control Subcommittee Materials. IPC-8701 Final Acseptanoe Criteria Standard for PV Modulas- E15 | Visual Acceptance ‘Assembly Processes Final Medule Assembly Gritoria for Solar Panol- Final Module Assembly Subcommittee 1PC-8921 | Requirements for Woven and Knitted Electronic «| D-72.—_—| E-Textiles Msterals E Textiles Textiles (E-Textilos) Integrated with Conductive Subcommittee Fibers, Conductive Yarne and/or Wires 1PC-8952 | Design Standard for Printad Electronics on Coated |D-r3a | E-Textlles Printed E-Textiles oF Treated Taxties and E-Textiles Eleotronios Design Standard Task Group 1P0-8971 | Requirements for Electrical Testing of Printed D-74a_—_| Printed Electronics ETextiles Electronies on E-Textllg E-Textlles Electrical Test Task Group IPC-9111 Troubleshooting for Printed Board Assombiy 7-23 | Assembly Process Effects Assembly Processes Processes Handbook Subcommittees IPC-9121 Troubleshooting for Printed Board Fabrication 7-24 | Printed Board Fabrication POB Fabrication and Processes and Assembly Process Materials, Assembly Effects Subcommittes_ Processes 1PC-9202 Material and Process Cheracterization/Qualification 5-426 | SiRand Electrachemical _Cieaning/Coating/ Test Protocol for Assessing E’ectrochemical Migration Task Group Contamination Performance 1PC-9203 | Users Guide to IPC-9202 and the IPC-B-52 5-32) | SlRand Electrochemical Gleaning/Coatingy ‘Standard Test Vehicle Migration Task Group Contamination 1PC-9241 | Guidelines for Microsection Preparation 7-12 | Microsestion Subcommittee | Quality, Reliability, ‘Test, & Inspection 1PC-9252 | Requirements for Elecrical Testing of Unpopulated |7-2e | Electrical Continuity Testing | Quality, Reliability Printed Boards, Task Group | ‘Tast, & Inspection 1P0-9262 | Spocifiation for Characterization and Verfication | 7-320n | Automatic Optical Quality, Reliability, (of Assembly Level Aulomatic Optical Inspection Inspection Characterization | Tas, & Inspection Equipment and Verification Subcommittee Poy Numerical Analysis Guidelines for Microslectronics 610d | SMT Attachment Ralizbilty | Assembly Processes JEDEC-9301 Packaging Design and Roliaoilty Test Methods Task Group IPC-9505 Guideline Mathodology for Assassing Component 5-21] Cleaning Compatibility Task | Cleaning/Coating/ and Cleaning Materials Compatibility Group Contamination 1PC-9631 User Guide for IPC-TM-650, Method 2.6.27, D382 | Thermal Stross Quality, Rei, ‘Thermal Sttess, Convection Retlow Assembly Test Methodology Test, & Inspection Simulation Subcommittee 1PC-9641 High Temperature Printed Board Flatnass Guideline |6-11 | Printed Board Coplanerity | Quality, Reliabilty Subcommittee Tesi, & Inspection 13IPC Reference Standards Decay ects ee Cot 1P0-9691 | User Guide for the IPC-TM-850, Method 2.6.25, [5-328 | Conductive Anodic PGB Fabrication and Conductive Anodic Filament (CAF) Resistanco Test Filament (CAF) Task Group | Materials (Electrochemical Migration Testing) IPC-9701 | Qualification and Pertormanos Test Methods for | 6-10d_—_| SMT Attachment Feliabilly | Assembly Processes ‘Surlace Mount Soldar Attachments Test Mothods Task Group IPOs Monotonic Bend Characterization of Board-Level 610d SMT Attachment Roliability | Assembly Processos JEDEC-9702 Interconnects, Test Methods Task Group Ipoh Printed Ciroult Assembly Strain Gage Tes! Guidalina 610d | SMT Attachmant Reliability | Assembly Processes JEDEC-9704 Test Mothods Task Group IPOs Mechanical Shook in-situ Electrical Metrology Test | 6-10d | SMT Attachment Reliability | Assembly Processes UEDEC-9706 Guidelines for FCBGA SMT Component Solder Test Methods Task Group rack and Pad Grater/Trace Crack Detection Poy, ‘Spherical Bend Tost Method for Charactorization of |6-10d | SMT Attachment Reliabilty | Assombly Processes JEDEC-9707 Board Level interecnnacts Tost Mothads Task Group IPC-9708 Test Methads for Characterization of Printed Board |6-0d | SMT Attachment Reliability | Assembly Processes Assembly Pad Cratering Test Methods Task Group IPC-9709 Tost Guidelines for Acoustic Emission Measurement 6-100 SMT Attachment Reliability | Assembly Processos during Mechanical Test Test Methods Task Group IPC-9797 _Pross-ft Standard for Automotive Requirements and |5-21m | Gold Joining Press-ft Task | Assombly Processes ‘other High-Faliabilty Applications Group IPo- Handbook for Pross-fit Standard for Automotive $-21n__ Cole! Joining Pross-fit ‘Assembly Processes HDBK-9798 Requirements and Other High-Reliablity Handbook Task Group Aplications IPC-9850 —_Suriace Mount Equipment Performance 5-41 | SMT Component ‘Assembly Processas Characterization Placement Equipment ‘Subcommittee IPC ‘The Global Standard for Machine-to-Machine Hormes |The Hermes Standard | PCB Fabrication and. HERMES- Communication in SMT Assembly Initiative | rtiative Materials, Assembly 9852 | Processes IPC-TM-650 | Test Methods Manual Verious | Various Quality, Reliability, Test, Binspection IPC-ORG-PTH | Through-Hole Solder Joint Evaluation Desk IPC Education Quality, Reliability, Raferance Manual Test, & Inspection IPC-ORG- | Surface Mount Solder Joint Evaluation Desk IPC Education Quality, Reliability, SMT Reference Manual Test, & inspection IPC-DRM- | Wire Preparation & Crimping IPC Education Quality, Reliability, WHA Test, & Inspection IPC-DRM-18 | Component Identification Desk Reference Manual IPC Education Quality, Reliability, Test, & inspection Italicized locument tes refer to industry-spaciic document addendums that must be used with the same revision of their respective document. For more information on IPCS library, pleass contact answers@ipe.org, 4IPC Standards — Everything You Need from Start to Finish ‘Advanced Packaging 1PC-STD-030 C700 SMT Reiabiiy pore. Po-s7o1-IPO-9704 eo 7083 1PC-9708-1PC-9709 Po-70%8 PC-7085, Repair Storage & Handing Pe-rritr21 IPO JSTD-020 Solderabity Povsrb ors apse IPO JSTD-075 IPC JSTD-008, poten Stencil Design Test Methods Guidelines Twess0 1PO-7525 "oun 1Po-7526 IPC-963t Po-7827 IPC-9681 “ssemby Electical Test Materials Poem IPC J-STD-008 IPC JSTD-005 Surfece Fishes IPCHDBK-005 IPcass2 IPC JsTD-008 1PC-4553 POSMSI7 PC4554 IPo-00-830, IPC-4555 HOBK-320 Poaes HDBK-350 — ———— igh Speed) Sever ask ‘eee IPC-Sw-340 ozs Po-z254 Copper Fais 1Pc-4562 Materials Declaraton IPo7st IPo-t752 IPo-t755 TPC Tems and Defnons IPo-T-80, PCTS! Leam about IPC standards at ww.ipc-orglstendards 15Phenomena in Cross Section of Plated Through Holes 1. Underout 20 Burt Pushed nto Hole 8 Outgrown 21 Glass Fiber Proton © Ovetnang 22 Innerayar Post Separation 23 Wicking 1 (Rese) Bisterng 24 Over Patng Resist Void 2 Laminate vers 25. (Postwe) Etroack 8. (Reem) Oslamnation 2 Barrel Crack 4 Pad Crating 2 Shadowng 5 Lites Lana Crack 28 Node 5 Bun 22 Resin Sear 7 Bond Enhangement 80 Copper & Over Pate Void remavad — "Pink Ring 31 Burned Plating 8 Negative Etehback 582. Copper Fal Contamination 9 Fall rack 9 Lite Land 10. Hole Plating Vo 34. Resin Greck Deteminaton 11 Wesge Vos 33 carn 12 Glass Fiber Void 38. Foregm inclusion 13 Glass uncle Vad SF promea Vad 1S. Severe Etonoack 38. Copper Cad Laminate Void 15 Naltoading 89 Messing 18. Dil Wall Tearing 420. Racin Recession 17 Hole Wal Pul Away 21, Glass Weave Texts 18 Coma’ Crack 42 Glass Weave Exposure 38 (Conner Bistenng 16CAD Text Standards — Design Tesr-odi (s)o19%-0d LL zsu\-oai 01 soe-aist 6 s60L-Odi 8 [esa] plepuels 5, aeoa aed earoul| Wed! Lo pIepUeIS Od fenrnneererenOn eg i — uBisag 91U0}99/5 onsen Tape SITS 7PCB with IPC Standards iPo-4853 ]| ec-ass« ||IPC-0565) [IPC-ASEE ipo-9601 | [iPc-a562 |[iPo-458s | |iPC4Tz21PCBA with IPC Standards —Soldering and Assembly Zeti-o| 19Cleaning and Coating with IPC StandardsLab — Board/Assembly Quality Check iN]NotesNotes