DT IRS2106 DataSheet v01 - 00 EN

dt
Data Sheet No. PD60246
IRS2106/IRS21064(S)PbF
HIGH AND LOW SIDE DRIVER
Features
• Floating channel designed for bootstrap operation Packages
• Fully operational to +600 V
• Tolerant to negative transient voltage, dV/dt immune 8-Lead PDIP
• Gate drive supply range from 10 V to 20 V
• Undervoltage lockout for both channels 14-Lead PDIP
• 3.3 V, 5 V, and 15 V input logic compatible
• Matched propagation delay for both channels
• Logic and power ground +/- 5 V offset 14-Lead PDIP
• Lower di/dt gate driver for better noise immunity
• Outputs in phase with inputs (IRS2106)
• RoHS compliant 8-Lead SOIC 14-Lead SOIC
Description Feature Comparison

The IRS2106/IRS21064 are high
Cross-
voltage, high speed power MOSFET Input conduction Deadtime ton/toff
Part Ground Pins
and IGBT drivers with independent logic prevention (ns) (ns)
high- and low-side referenced output logic
2106/2301 COM
channels. Proprietary HVIC and 21064
HIN/LIN no none
VSS/COM
220/200
latch immune CMOS technologies 2108
HIN/LIN yes
Internal 540 COM
220/200
enable ruggedized monolithic con- 21084 Programmable 540 - 5000 VSS/COM
2109/2302 Internal 540 COM
struction. The logic input is 21094
IN/SD yes
Programmable 540 - 5000 VSS/COM
750/200
compatible with standard CMOS or 2304 HIN/LIN yes Internal 100 COM 160/140
LSTTL output, down to 3.3 V logic.
The output drivers feature a high pulse current buffer stage designed for minimum driver cross-conduction.
The floating channel can be used to drive an N-channel power MOSFET or IGBT in the high side configuration
which operates up to 600 V.
Typical Connection up to 600 V
VCC
V CC VB
HIN
HIN HO
LIN LIN VS TO
LOAD
COM LO
IRS2106 up to 600 V
HO
VCC VCC VB
HIN HIN VS
TO
(Refer to Lead Assignments for correct pin LIN LIN LOAD
IRS21064
configuration). These diagrams show electri-
cal connections only. Please refer to our VSS VSS COM
Application Notes and DesignTips for proper
LO
circuit board layout.
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Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions.
Symbol Definition Min. Max. Units

VB High-side floating absolute voltage -0.3 625
VS High-side floating supply offset voltage VB - 25 VB + 0.3
VHO High-side floating output voltage VS - 0.3 VB + 0.3
VCC Low-side and logic fixed supply voltage -0.3 25
V
VLO Low-side output voltage -0.3 VCC + 0.3
VIN Logic input voltage VSS - 0.3 VCC + 0.3
VSS Logic ground (IRS21064 only) VCC - 25 VCC + 0.3
dVS/dt Allowable offset supply voltage transient — 50 V/ns
(8 lead PDIP) — 1.0
(8 lead SOIC) — 0.625
PD Package power dissipation @ TA ≤ +25 °C
(14 lead PDIP) — 1.6 W
(14 lead SOIC) — 1.0
(8 lead PDIP) — 125
(8 lead SOIC) — 200
RthJA Thermal resistance, junction to ambient °C/W
(14 lead PDIP) — 75
(14 lead SOIC) — 120
TJ Junction temperature — 150
TS Storage temperature -50 150 °C
TL Lead temperature (soldering, 10 seconds) — 300
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Recommended Operating Conditions

The input/output logic timing diagram is shown in Fig. 1. For proper operation the device should be used within the
recommended conditions. The VS and VSS offset rating are tested with all supplies biased at a 15 V differential.
Symbol Definition Min. Max. Units

VB High-side floating supply absolute voltage VS + 10 VS + 20
VS High-side floating supply offset voltage Note 1 600
VHO High-side floating output voltage VS VB
VCC Low-side and logic fixed supply voltage 10 20 V
VLO Low-side output voltage 0 VCC
VIN Logic input voltage VSS VCC
VSS Logic ground (IRS21064 only) -5 5
TA Ambient temperature -40 125 °C
Note 1: Logic operational for VS of -5 V to +600 V. Logic state held for VS of -5 V to -VBS. (Please refer to the Design Tip
DT97-3 for more details).
Dynamic Electrical Characteristics

VBIAS (VCC, VBS) = 15 V, VSS = COM, CL = 1000 pF, TA = 25 °C.
Symbol Definition Min. Typ. Max. Units Test Conditions

ton Turn-on propagation delay — 220 300 VS = 0 V
toff Turn-off propagation delay — 200 280 VS = 0 V or 600 V
MT Delay matching, HS & LS turn-on/off — 0 30 ns
tr Turn-on rise time — 100 220
VS = 0 V
tf Turn-off fall time — 35 80
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Static Electrical Characteristics

VBIAS (VCC, VBS) = 15 V, VSS = COM and TA = 25 °C unless otherwise specified. The VIL, VIH, and IIN parameters are
referenced to VSS/COM and are applicable to the respective input leads. The VO, IO, and Ron parameters are referenced
to COM and are applicable to the respective output leads: HO and LO.
Symbol Definition Min. Typ. Max. Units Test Conditions

VIH Logic “1” input voltage 2.5 — —
VCC = 10 V to 20 V
VIL Logic “0” input voltage — — 0.8
V
VOH High level output voltage, VBIAS - VO — 0.05 0.2
IO = 2 mA
VOL Low level output voltage, VO — 0.02 0.1
ILK Offset supply leakage current — — 50 VB = VS = 600 V
IQBS Quiescent VBS supply current 20 75 130
VIN = 0 V or 5 V
IQCC Quiescent VCC supply current 60 120 180
IIN+ Logic “1” input bias current VIN = 5 V — 5 20 µA
IIN- Logic “0” input bias current VIN = 0 V — — 5
VCCUV+ VCC and VBS supply undervoltage positive going
8.0 8.9 9.8
VBSUV+ threshold
VCCUV- VCC and VBS supply undervoltage negative going
7.4 8.2 9.0 V
VBSUV- threshold
VCCUVH
Hysteresis 0.3 0.7 —
VBSUVH
VO = 0 V,
IO+ Output high short circuit pulsed current 130 290 —
PW ≤ 10 µs
mA
VO = 15 V,
IO- Output low short circuit pulsed current 270 600 —
PW ≤ 10 µs
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Functional Block Diagrams
VB
UV
IRS2106 DETECT
R HO
R Q
PULSE
HV
FILTER
LEVEL S
VSS/COM SHIFTER
HIN LEVEL VS
PULSE
SHIFT
GENERATOR
VCC
UV
DETECT
LO
VSS/COM
LIN LEVEL DELAY
SHIFT COM
VB
IRS21064 UV
DETECT
R HO
R Q
PULSE
HV
FILTER
LEVEL S
VSS/COM SHIFTER
HIN LEVEL VS
PULSE
SHIFT
GENERATOR
VCC
UV
DETECT
LO
VSS/COM
LIN LEVEL DELAY
SHIFT COM
VSS
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Lead Definitions
Symbol Description
HIN Logic input for high-side gate driver output (HO), in phase
LIN Logic input for low-side gate driver output (LO), in phase
VSS Logic ground (IRS21064 only)
VB High-side floating supply
HO High-side gate drive output
VS High-side floating supply return
VCC Low-side and logic fixed supply
LO Low-side gate drive output
COM Low-side return
Lead Assignments
1 VCC VB 8 1 VCC VB 8
2 HIN HO 7 2 HIN HO 7
3 LIN VS 6 3 LIN VS 6
4 COM LO 5 4 COM LO 5
8 Lead PDIP 8 Lead SOIC
IRS2106PbF IRS2106SPbF
1 VCC 14 1 VCC 14
2 HIN VB 13 2 HIN VB 13
3 LIN HO 12 3 LIN HO 12
4 VS 11 4 VS 11
5 VSS 10 5 VSS 10
6 COM 9 6 COM 9
7 LO 8 7 LO 8
14 Lead PDIP 14 Lead SOIC
IRS21064PbF IRS21064SPbF
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HIN
LIN
HO
LO
Figure 1. Input/Output Timing Diagram
HIN 50% 50%

LIN
ton tr toff tf
90% 90%
HO
LO 10% 10%
Figure 2. Switching Time Waveform Definitions
HIN 50% 50%

LIN
LO HO
10%
MT MT
90%
LO HO
Figure 3. Delay Matching Waveform Definitions
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500 500
Turn-On Propagation Delay (ns)
Turn-On Propagation Delay (ns)

400 400
M ax.
300 300
Typ.
M ax
200 200
Typ.
100 100
0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature ( oC) VBIAS Supply Voltage (V)
Figure 4A. Turn-On Propagation Delay Figure 4B. Turn-On Propagation Delay
vs. Temperature vs. Supply Voltage
500 500
Turn-Off Propagation Delay (ns)
Turn-Off Propagation Delay (ns)
400 400
M ax.
300 300
M ax. Typ.
200 200
Typ.
100 100
0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (oC) VBIAS Supply Voltage (V)
Figure 5A. Turn-Off Propagation Delay Figure 5B. Turn-Off Propagation Delay
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500 500
400 400
Turn-On Rise Time (ns)

Turn-On Rise Time (ns)
300 300
Max.
200 200
Max.
100 100
Typ.
Typ.
0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (oC) V BIAS Supply Voltage (V)
Figure 6A. Turn-On Rise Time Figure 6B. Turn-On Rise Time
200 200
Turn-Off Rise Time (ns)
Turn-Off Rise Time (ns)
150 150
100 100
Max. Max.
50 50
Typ.
Typ.
0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (oC) Input Voltage (V)
Figure 7A. Turn-Off Fall Time Figure 7B. Turn-Off Fall Time
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8 8
7 7
6 6
Input Voltage (V)
Input Vo lta ge (V)

Mi n .
5 5
Mi n.
4 4
3 3
p
Max. Max.
2 2
1 1
0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
o
Temperature ( C) VBIAS Supply Voltage (V)
Figure 8A. Logic “1” Input Voltage Figure 8B. Logic “1” Input Voltage
4.0
4.0
3.2
3.2
Input Voltage (V )
Input Voltage (V)
2.4
2.4
1.6
1.6
M in.
M in.
0.8
0.8
0.0 0.0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (oC) VCC Supply Voltage (V)
FigureFigure
9A. Logic "0" Input Voltage
9A. Logic “0” Input Voltage Figure 9B. Logic “0” Input Voltage
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0.5 0.5
Voltage(V(V)
Voltage(V(V)
)
)
0.4 0.4
utput Voltage
utput Voltage
0.3 0.3
Level OOutput
Output
Max.
0.2 0.2
Level O
Max.
High Level
High Level
0.1 0.1
High
High
Typ.
Typ.
0.0 0.0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Figure 10A. High Level Output Voltage Figure 10B. High Level Output Voltage
0.5 0.5
(V)(V)
Voltage(V)(V)
Voltage
0.4 0.4
utput Voltage
utput Voltage
0.3 0.3
LevelOOutput
LevelOOutput
0.2 0.2
Low Level
LowLevel
Max.
0.1 Max.
0.1
Low
Low
Typ. Typ.
0.0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Figure 11A. Low Level Output Voltage Figure 11B. Low Level Output Voltage
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500 500
Offset Supply Leakage Current (µA)

Offset Supply Leakage Current (µA)
400 400
300 300
200 200
100 100
M ax.
M ax.
0 0
-50 -25 0 25 50 75 100 125 0 100 200 300 400 500 600
Temperature ( oC) VB Boost Voltage (V)

Figure 12A. Offset Supply Leakage Current Figure 12B. Offset Supply Leakage Current
400 400
V BS Supply Current (µA)
V BS Supply Current (µA)
300 300
200 200
M ax.
M ax.
100 100
Typ.
Typ.
M in. M in.
0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
o
Temperature ( C) VBS Supply Voltage (V)
Figure 13A. VBS Supply Current Figure 13B. VBS Supply Current
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400 400
Vcc Supply Current ( µ A )
V CC Supply Current (µA)

300 300
M ax.
200 M ax. 200

Typ.
Typ.
100 100 M in.
M in.
0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature ( o C) VCC Supply Voltage (V)
Figure 14A. Quiescent V CC Supply Current Figure 14B. Quiescent VCC Supply Current
vs. Temperature vs. VCC Supply Voltage
60 60
Logic "1" Input Current ( µ A)
Logic "1" Input Current (µA)
50 50
40 40
30 30
M ax.
20 20
M ax.
10 10
Typ. Typ.
0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (oC) VCC Supply Voltage (V)
Figure 15A. Logic “1” Input Current Figure 15B. Logic “1” Bias Current
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6 6
Logic "0" Input Bias C urrent (µA)

Lo gic "0" Input Bias Current (µA)
5 Max 5 Max
4 4
3 3
2 2
1 1
0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Temperature (°C) Supply Voltage (V)
Figure 16A. Logic "0" Input Bias Current Figure 16B. Logic "0" Input Bias Current
vs. Temperature vs. Voltage
12
11
V CC UVLO Threshold (+) (V)
V CC UVLO Threshold (-) (V)
11
10
M ax.
10 M ax.
9
Typ.
Typ.
9 8
M in.
M in.
8 7
7 6
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature ( oC) o
Temperature ( C)
Figure 17. VCC Undervoltage Threshold (+) Figure 18. VCC Undervoltage Threshold (-)
vs. Temperature vs. Temperature
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12 11
V BS UVLO Threshold (+) (V)
V BS UVLO Threshold (-) (V)

11 10
M ax. M ax.
10 9
Typ. Typ.
9 8
M in.
M in.
8 7
7 6
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
o
Temperature ( C) Temperature ( oC)
Figure 19. VBS Undervoltage Threshold (+) Figure 20. VBS Undervoltage Threshold (-)
vs. Temperature vs. Temperature
500 500
Output Source Current (mA)
400 400
Output Source Current (mA)
Typ.
300 300
200 200
Typ.
Max.
100 100
Max.
0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
o
Temperature( C) VBIAS S u p p l y V o l t a g e ( V )
Figure 21A. Output Source Current Figure 21B. Output Source Current
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1000 1000
800 800
Output Sink Current (mA)
Output Sink Current (mA)

Typ.
600 600
400 400
Typ.
Max.
200 200
Max.
0 0
-50 -25 0 25 50 75 100 125 10 12 14 16 18 20
Te m p e ra t u re ( o C) V BIAS S upply V oltage ( V )
Figure 22A. Output Sink Current Figure 22B. Output Sink Currentt
0 140
V Offset Supply Voltage (V)
-2
120
Temprature ( oC)
Typ. 100
-4
80 140 V
70 V
-6
60 0 V
-8 40
S
20
-10
10 12 14 16 18 20 1 10 100 1000
V BS Floating Supply Voltage (V) Frequency (kHz)
Figure 23. Maximum VS Negative Offset Figure 24. IRS2106 vs. Frequency (IRFBC20),
vs. Supply Voltage Rgate=33 Ω, VCC=15 V
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140
140
120 120
Temperature (oC)
100 100
Temperature (oC)
140 V
140 V
80 80 70 V
70 V 0 V
60
60 0 V
40
40
20
20 1 10 100 1000
1 10 100 1000
Frequency (kHz) Frequency (kHz)
Figure 25. IRS2106 vs. Frequency (IRFBC30), Figure 26. IRS2106 vs. Frequency (IRFBC40),
Rgate=22 Ω , V CC=15 V Rgate=15 Ω , V CC=15 V
140 V 70 V
140 140
0 V
120 120
Temperature (oC)
Temperature (oC)
100 100
80 80
60 60 140 V
70 V
40 40
0 V
20 20
1 10 100 1000 1 10 100 1000
Figure 27. IRS2106 vs. Frequency (IRFPE50), Figure 28. IRS21064 vs. Frequency (IRFBC20),
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140 140
120 120
Temperature (oC)
Temperature (oC)
100 100
140 V
80 80 70 V
140 V 0 V
60 70 V
60
0 V
40 40
20 20
1 10 100 1000 1 10 100 1000
Figure 29. IRS21064 vs. Frequency (IRFBC30), Figure 30. IRS21064 vs. Frequency (IRFBC40),
140 V 140
140
70 V
120 120
Temperature (oC)
Temperature (oC)
100 0 V
100
80 80 140 V
70 V
60 60 0 V
40 40
20 20
1 10 100 1000 1 10 100 1000
Figure 31. IRS21064 vs. Frequency (IRFPE50), Figure 32. IRS2106S vs. Frequency (IRFBC20),
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140 V 70 V
140 140
120 120
140 V
0 V
Temperature (oC)
Temperature (oC)
100 70 V 100
0 V
80 80
60 60
40 40
20 20
1 10 100 1000 1 10 100 1000

Figure 33. IRS2106S vs. Frequency (IRFBC30), Figure 34. IRS2106S vs. Frequency (IRFBC40),
140 V 70 V 0 V
140 140
120 120
Tempreture (oC)
Temperature (oC)
100 100
80 80
60
60 140 V
70 V
40 0 V
40
20
1 10 100 1000 20
1 10 100 1000
Frequency (kHz)
Frequency (kHz)
Figure 35. IRS2106S vs. Frequency (IRFPE50), Figure 36. IRS21064S vs. Frequency (IRFBC20),
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140 140
120 120
Temperature (oC)
100
Temperature (oC)
100 140 V
70 V
80
80 140 V 0 V
70 V
60
60 0 V
40
40
20
20 1 10 100 1000
1 10 100 1000
Figure 37. IRS21064S vs. Freque ncy (IRFBC30), Figure 38. IRS21064S vs. Frequency (IRFBC40),
Rg a t e =22 Ω , V CC=15 V Rgate=15 Ω , V CC=15 V
140 V 70V
140
0 V
120
Temperature (oC)
100
80
60
40
20
1 10 100 1000
Frequency (kHz)
Figure 39. IRS21064S vs. Frequency (IRFPE50),
Rgate=10 Ω , V CC=15 V
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Case Outlines
01-6014
8 Lead PDIP 01-3003 01 (MS-001AB)
INCHES MILLIMETERS
D B DIM
MIN MAX MIN MAX
A 5 FOOTPRINT A .0532 .0688 1.35 1.75
A1 .0040 .0098 0.10 0.25
8X 0.72 [.028]
b .013 .020 0.33 0.51
8 7 6 5 c .0075 .0098 0.19 0.25
6 H D .189 .1968 4.80 5.00
E E .1497 .1574 3.80 4.00
0.25 [.010] A
1 2 3 4 6.46 [.255] e .050 BASIC 1.27 BASIC
e1 .025 BASIC 0.635 BASIC
H .2284 .2440 5.80 6.20
K .0099 .0196 0.25 0.50
L .016 .050 0.40 1.27
6X e 3X 1.27 [.050]
8X 1.78 [.070] y 0° 8° 0° 8°
e1 K x 45°
A
C y
0.10 [.004]
A1 8X L 8X c
8X b
7
0.25 [.010] C A B
NOTES: 5 DIMENSION DOES NOT INC LUDE MOLD PROTRUSIONS.

1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. MOLD PROTRUSIONS NOT TO EXC EED 0.15 [.006].
2. CONTROLLING DIMENSION: MILLIMETER 6 DIMENSION DOES NOT INC LUDE MOLD PROTRUSIONS.
MOLD PROTRUSIONS NOT TO EXC EED 0.25 [.010].
3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].
7 DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO
4. OUTLINE C ONFORMS TO JEDEC OUTLINE MS-012AA.
A SUBSTRATE.
01-6027
8 Lead SOIC 01-0021 11 (MS-012AA)
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01-6010
14 Lead PDIP 01-3002 03 (MS-001AC)
01-6019
14 Lead SOIC (narrow body) 01-3063 00 (MS-012AB)
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Tape & Reel LOAD ED TA PE FEED DIRECTION
8-lead SOIC
B A H
F C
N OT E : CO NTROLLING
D IM ENSION IN MM E
C A R R I E R T A P E D IM E N S I O N F O R 8 S O I C N
M etr ic Im p er i al
Co d e M in M ax M in M ax
A 7 .9 0 8.1 0 0. 31 1 0 .3 18
B 3 .9 0 4.1 0 0. 15 3 0 .1 61
C 11 .7 0 1 2. 30 0 .4 6 0 .4 84
D 5 .4 5 5.5 5 0. 21 4 0 .2 18
E 6 .3 0 6.5 0 0. 24 8 0 .2 55
F 5 .1 0 5.3 0 0. 20 0 0 .2 08
G 1 .5 0 n/ a 0. 05 9 n/ a
H 1 .5 0 1.6 0 0. 05 9 0 .0 62
B
C
A
E
R E E L D IM E N S I O N S F O R 8 S O IC N
A 32 9. 60 3 30 .2 5 1 2 .9 76 13 .0 0 1
B 20 .9 5 2 1. 45 0. 82 4 0 .8 44
C 12 .8 0 1 3. 20 0. 50 3 0 .5 19
D 1 .9 5 2.4 5 0. 76 7 0 .0 96
E 98 .0 0 1 02 .0 0 3. 85 8 4 .0 15
F n /a 1 8. 40 n /a 0 .7 24
G 14 .5 0 1 7. 10 0. 57 0 0 .6 73
H 12 .4 0 1 4. 40 0. 48 8 0 .5 66
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Tape & Reel

LOAD ED TA PE FEED DIRECTION
14-lead SOIC
B A H
F C
N OT E : CO NTROLLING
D IM ENSION IN MM E
C A R R I E R T A P E D IM E N S I O N F O R 1 4 S O IC N
A 7 .9 0 8.1 0 0. 31 1 0 .3 18
B 3 .9 0 4.1 0 0. 15 3 0 .1 61
C 15 .7 0 1 6. 30 0. 61 8 0 .6 41
D 7 .4 0 7.6 0 0. 29 1 0 .2 99
E 6 .4 0 6.6 0 0. 25 2 0 .2 60
F 9 .4 0 9.6 0 0. 37 0 0 .3 78
G 1 .5 0 n/ a 0. 05 9 n/ a
H 1 .5 0 1.6 0 0. 05 9 0 .0 62
B
C
A
E
R E E L D IM E N S I O N S F O R 1 4 SO IC N
A 32 9. 60 3 30 .2 5 1 2 .9 76 13 .0 0 1
B 20 .9 5 2 1. 45 0. 82 4 0 .8 44
C 12 .8 0 1 3. 20 0. 50 3 0 .5 19
D 1 .9 5 2.4 5 0. 76 7 0 .0 96
E 98 .0 0 1 02 .0 0 3. 85 8 4 .0 15
F n /a 2 2. 40 n /a 0 .8 81
G 18 .5 0 2 1. 10 0. 72 8 0 .8 30
H 16 .4 0 1 8. 40 0. 64 5 0 .7 24
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LEADFREE PART MARKING INFORMATION
Part number IRSxxxxx

Date code YWW? IR logo
Pin 1 ?XXXX
Identifier
Lot Code
? MARKING CODE (Prod mode - 4 digit SPN code)
P Lead Free Released
Non-Lead Free
Released
Assembly site code
Per SCOP 200-002
ORDER INFORMATION
8-Lead PDIP IRS2106PbF 14-Lead PDIP IRS21064PbF
8-Lead SOIC IRS2106SPbF 14-Lead SOIC IRS21064SPbF
8-Lead SOIC Tape & Reel IRS2106STRPbF 14-Lead SOIC Tape & Reel IRS21064STRPbF
SOIC8 & 14 are MSL2 qualified.

This product has been designed and qualified for the industrial level.
Qualification standards can be found at www.irf.com
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105
Data and specifications subject to change without notice. 12/4/2006
www.irf.com 25

DT IRS2106 DataSheet v01 - 00 EN

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Data Sheet No. PD60246

Description Feature Comparison

Typical Connection up to 600 V

Absolute Maximum Ratings

Symbol Definition Min. Max. Units

Recommended Operating Conditions

Symbol Definition Min. Max. Units

Dynamic Electrical Characteristics

Symbol Definition Min. Typ. Max. Units Test Conditions

Static Electrical Characteristics

Symbol Definition Min. Typ. Max. Units Test Conditions

Functional Block Diagrams

8 Lead PDIP 8 Lead SOIC

14 Lead PDIP 14 Lead SOIC

Figure 1. Input/Output Timing Diagram

HIN 50% 50%

Figure 2. Switching Time Waveform Definitions

HIN 50% 50%

Figure 3. Delay Matching Waveform Definitions

Turn-On Propagation Delay (ns)

Turn-Off Propagation Delay (ns)

Temperature (oC) VBIAS Supply Voltage (V)

Turn-On Rise Time (ns)

Turn-Off Rise Time (ns)

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Input Vo lta ge (V)

Input Voltage (V)

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Offset Supply Leakage Current (µA)

Temperature ( oC) VB Boost Voltage (V)

V BS Supply Current (µA)

V CC Supply Current (µA)

200 M ax. 200

Logic "0" Input Bias C urrent (µA)

Temperature (°C) Supply Voltage (V)

V CC UVLO Threshold (-) (V)

V BS UVLO Threshold (-) (V)

Output Sink Current (mA)

Frequency (kHz) Frequency (kHz)

Frequency (kHz) Frequency (kHz)

Frequency (kHz) Frequency (kHz)

NOTES: 5 DIMENSION DOES NOT INC LUDE MOLD PROTRUSIONS.

Tape & Reel LOAD ED TA PE FEED DIRECTION

Tape & Reel

LEADFREE PART MARKING INFORMATION

Part number IRSxxxxx

SOIC8 & 14 are MSL2 qualified.

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