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15
13
4
1
3
5
6
7
8
9
10
11
12
14
16
2
AMMIX_INN
IF_REF2
IFBUF_OUT_0
IF_IN1
IF_VREF1
AMNB_TC
MIX_OUTN
MIX_OUTP
IF_REF3
AMMIX_INP
IF_IN30
GND_IFPGA
VCC8.5_IF
24 26 31 30 29 28 27 25 23 18 19 17 20 21 22 32
59 64 63 62 61 60 58 57 56 55 54 53 52 51 50 49
35
40
36
34
33
39
41
44
42
43
38
37
45
46
47
48
VTUNE
BUS_ENABLE
AF_SAMPLE
AF_HOLD
SCL
SDA
XTAL_BUF_OUTN
VCC8.5_VCO
VCO_COLL
VCO_BASE
GND_VCO
VCC5.0_PLL_
GND_PLL
VCC8.5_PLL
CP1_OUT
CP2_OUT
VCC8.5_RF
IF_IN180
IFBUF_OUT_1
F
M
M
I
X
_
I
N
N
C
A
S
_
B
A
S
E
C
A
S
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B
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64-PINHTQFP (PAP)
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SDA
SCL
AF=1 AF=1
AFChannel MainChannel
LoadPLL
AF_HOLD
AF_SAMPLE
t
2
t
1
8ms 7 6 5 4 3 2 1 0
SCL
SDA
LoadPLL
AF_HOLD
AF_SAMPLE
AF=0,PRESET=1
AF=0,PRESET=0
0 1 n n+1 n+2ms
PLL Jump
t
1 t
1

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IFPGA_D_C0
IFPGA_CN1
IFPGA_CN2
IFPGA_CN3
IFPGA_SEL
Internal
registerbus
IFPGA_CN0

28
24
20
16
12
8
32
0 1.0
Keyed AGCInput(V)
R
F
A
G
C

S
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t

(
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PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
SN761631PAPR PREVIEW HTQFP PAP 64 1000 TBD Call TI Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 13-Dec-2006
Addendum-Page 1