Application Note AN-10-001

Revision: Issue Date: Prepared by: 0 2010-03-30 Dieter Esau

Key Words: Thermal paste

THERMAL PASTE APPLICATION

Designated use of thermal interface material (TIM) .................................................................................................. 1 Procedures for thermal paste application .................................................................................................................. 3 Quality control check on thermal paste layer............................................................................................................. 4 Determining the optimum thermal paste layer thickness .................................................................................................................................................................... 5 References................................................................................................................................................................. 6

Designated use of thermal interface material (TIM)

When in operation, power modules produce losses which increase the module temperature and impair module efficiency and/or functionality. To dissipate the heat that builds up in power modules, the power modules are mounted onto heat sinks. The heat is then dissipated from the power module via the heat sink. Heat transfer between the heat-dissipating surface of the power module and the heat sink surface depends on the surface quality of the different surfaces. Both the heat sink surface and the heat-dissipating surface of the power module are uneven. As a result, air is trapped between the two surfaces, preventing direct heat transfer. As air is a poor thermal conductor (the specific thermal conductivity of air is air 0.03 W/mK), only very little heat can be conducted to the heat sink (see Fig. 1).

baseplate or DCB of power module

Heat sink air gaps
Fig. 1: Heat transfer from a power module to a heat sink without TIM

A suitable way of improving heat transfer is to fill up the air pockets with a TIM (see Fig. 2).

baseplate or DCB of power module

Heat sink thermal interface material
Fig. 2: Heat transfer from a power module to a heat sink using TIM

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Application Note AN-10-001

TIM normally consist of a plastic carrier material (e.g. silicon oil) and thermal conductive filler substances such 1 as zinc oxide, graphite or silver. They are available in the form of pastes, adhesives, phase-change materials and foils. TIMs conduct heat better than air and typically have a specific thermal conductivity of 0.5 - 6 W/mK. The thermal conductivity of TIM is thus approx. 20 - 200 times better than that of air. To enable the thermal conductivity properties of TIMs to be categorised, table 1 shows the specific thermal conductivity of materials commonly used in power modules. The thermal paste P12 from the company Wacker has been taken by way of example. The R(th) values shown are based on the module-specific thermal spreading.
Material Specific Thermal Conductivity [W/(m*K)] Thickness [m] Portion of R(th) for SKiM modules

Rthcs

Minimum

Maximum

Thickness of TIM

Fig. 3: Dependence of thermal resistance on thermal paste layer thickness

Chip Chip solder DBC (copper) DBC (Al2O3) DBC (copper) Thermal paste (P12 from WACKER2)

106 57 394 24 394 0.81

120 70 300 380 300 30

2.92% 3.65% 1.94% 32.91% 1.31% 57.26%

Too thin a thermal paste layer results in air pockets between the underside of the module and the top of the heat sink, causing a high thermal resistance Rthcs. Once the optimum has been reached, the thermal resistance Rthcs increases quickly again in line with the increase in thermal paste layer thickness; this happens because the specific thermal conductivity of thermal conductive media is very low compared with other materials in a power semiconductor module. The minimum value as shown in the diagram above is different in each system (module on heat sink) and has to be defined in tests. The thickness of the thermal paste layer is different for different module types. This is why the mounting instructions of power modules specify the given thermal paste layer thickness and describe the quality of the surface of the heat sink. The thermal paste used and recommended by SEMIKRON is P12 thermal paste from the company Wacker and is at the lower end of the specific thermal conductivity range. The following factors are the key arguments in favour of this thermal paste: R(th) tests have shown that the thermal conductivity of a thermal paste in actual application does not only depend on its specific thermal conductivity , but also on it its structure (see Tab. 2). The larger the filler particles in a thermal paste are, the higher the specific thermal conductivity. The particle size of the filler determines the minimum layer thickness. In other words, the thermal paste layer applied cannot be thinner than the largest particles in the paste. After several temperature cycles, a paste with small particles (e.g. P12: particle size 0.04m - 4m) allows almost for metal-to-metal contact at points where the pressure is particularly high, resulting in a substantial reduction in Rthcs. The paste is highly resistant to bleeding and drying out.

Tab. 1: Specific thermal conductivity of materials commonly used in a power semiconductor module

If the thermal conductivity of thermal paste is compared with the thermal conductivity of other components in a power module (see Tab. 1), the thermal paste does not rate particularly well. The extent to which thermal paste contributes to the overall thermal resistance R(thjs) of the 3 module amounts to around 20-65% , depending on the module with the combination of the heat sink. The thermal paste layer therefore has to be as thin as possible but as thick as necessary (see Fig. 3).

1
2

These materials are electrically conductive.

The filler particles (ZnO) of Wacker P12 thermal paste are between 0.04m and 4m in diameter, which is why this thermal paste is very good for achieving very thin thermal paste layers.

A thermal paste with a higher specific thermal conductivity will not normally result in much improvement here, since this would normally mean a considerable increase in thermal paste layer thickness, too.

The table below shows an excerpt from a series of thermal conductive media which have undergone testing at SEMIKRON.

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Application Note AN-10-001

Name; Producer

Description

Filled with silicon

Conductive

Possible Application process

Applicable thickness of TIM in m

Thermal Resistance

Thermal resistance W/(m*K) (Data sheet)

P12, Wacker

Paste, Filler: Al2O3

Yes

No

Roller, stencil-/ screen-printing

10-100

0,81

HTC, Electrolube PSX-P8, Hala Contec GmbH TIC 1000A, Bergquist TIC 4000, Bergquist KU ALC-5, Kunze

Paste, Filler: AL2O3 Phase-Changer, Filler: aluminium powder Paste, Filler: Al2O3 Paste, Filler: fluid metal Phase-Changer; Aluminium foil with wax coating

No No

No No

Roller, stencil-/ screen-printing Roller, stencil-/ screen-printing Roller, stencil-/ screen-printing Roller, stencil-/ screen-printing Manually

10-100 10-100

+ +

0,9 3,4

Yes Yes No

Yes Yes Yes

15-100 ca. 100 ca. 76

O + O

1,5 4,0 220

KU ALF, Kunze

Phase-Changer; Aluminium foil with wax and graphite coating

No

Yes

Manually

ca. 76

220

Keratherm 86/50, Kerafoil Q2-Pad, Bergquist

Foil, Filler: boron nitride Aluminium foil with graphite coating

Yes Yes

No Yes

Manually Manually

120 152

2,9 2,5

Tab. 2: Selection of tested TIMs

Procedures for thermal paste application

Thermal paste can be applied either to the module or to the heat sink. This is done using a roller or in printing processes. In roller application, a rubber roller is normally used (see Fig. 4), while the printing process is normally silk screen printing or stencil printing. Applying thermal paste with a rubber roller can lead to sufficient results provided this assembly step is performed by experienced professional staff that are properly trained in this critical process. This process also has disadvantages, however, for instance inhomogeneity, poor reproducibility and the risk of contamination.

In stencil printing, a stainless steel stencil and stainless steel scraper are normally used. The effective thermal paste layer thickness, however, is determined by the ratio of filled area to non-filled area, as well as by the height of the dots applied, which in turn are determined by the thickness of the stencil itself. In screen printing, Monolen-PET meshes and a polyurethane scraper with a shore hardness of 75 are used. The thickness of the yarn and the number of yarns per unit of length determine the thickness of the thermal paste layer. In stencil and screen printing, far better results can be achieved than in the roller process, provided the printing is done automatically. Performing this process manually can lead to considerable process fluctuations. The development of a process with an automatic stencil printer that features continuous process monitoring, as is the case at SEMIKON, requires substantial investments, however, which in economic terms only makes sense for large production quantities. The stencil and screen printing process exists in all automated stages. An example of a manual screen printing process used to print onto a heat sink is explained below:

Fig. 4: Paste application using a rubber roller

Thermal paste application using manual screen printing (Fig. 5):

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a) Clean the surface with a cleansing agent to remove all grease. Position the heat sink in the device. Here, it is important that the screen does not touch the surface of the heat sink. To ensure this happens, the clearance between the screen/mesh and heat sink has to be 4 - 7 mm. b) The screen is flooded with thermal paste (lowpressure application). c) The thermal paste is spread using the polyurethane scraper; here, sufficient pressure must be applied to ensure that the mesh is pressed onto the print surface. d) Visual inspection.

Quality control check on thermal paste layer

The thickness of a thermal paste layer can be measured directly or indirectly. An indirect way of measuring the thickness is, for example, to weigh the thermal paste by performing a Tara weight measurement using suitable scales. An example of a direct contact-free measurement of the thermal paste layer is a measurement using an optical profilometer such as the SCAN from Nano Focus. Other measurement equipment that can be used to measure the thermal paste layer directly includes, for example, thickness gauges such as wet film combs or wet film wheels; the downside of these, however, is that they may destroy the layer in places. The edges of the wet film comb (e.g. from Zehntner (ZND 2051) or Elcometer Instruments or BYK Gardner (PG3504)) have support teeth and measurement teeth which have a defined distance to the surface. The comb is held perpendicular to the surface and run across the surface horizontally (see Fig. 7); when this is done, some paste residue will be left on the teeth of the comb that are beneath the surface of the paste layer. As shown in Fig. 8, the thickness of the layer measured in this example lies in the range of between 25m and 30 m. This measurement can be very easily distorted, however, through improper handling, surface unevenness or even by raised points in the thermal paste surface. Measurement comb

Fig. 5: Thermal paste application using manual screen printing

Scrape direction 90 Heat sink

Thermal paste

In addition to complying with recommended layer thickness, care should be taken when applying the thermal paste to ensure that the thermal paste layer is evenly and homogenously spread on the underside of the module or the heat sink surface. An inhomogeneous thermal paste layer (extreme case: application of one or more thermal paste blobs) (Fig. 6) can result in fractures or breakage in the DBC ceramic substrate. This applies to modules with and without a base plate alike. In addition to this, thermal paste inhomogeneity can also lead to local overheating resulting from the air pockets between the underside of the module and the upper side of the heat sink surface.

Fig. 7: Measuring the thermal paste layer with wet film comb

25

30 m

Thermal Thermal paste paste

Heat sink

Screw holes thermal paste blobs

Screw holes

Edges Measurement teeth Fig. 8: Measuring the thermal paste layer with wet film comb (here PG-3504 from BYK Gardner)

Fig. 6: Module underside showing problematic thermal paste layer application

A wet film wheel (e.g. from Zehntner (ZWW 2100-2102), see Fig. 9 or BYK Gardner) produces more accurate results in thermal paste layer thickness tests than a wet film comb. The wet film wheel consists of two support discs which are positioned at the outer edges, and one measurement disc located between the support discs. The measurement wheel is rolled across the surface that has been coated with thermal paste (see Fig. 9). The thermal paste layer thickness can be read from the scale,

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Application Note AN-10-001

taken from the end of the wet segment of the middle measurement disc (see Fig. 10).
100 C

Temperaturzyklus Temperature Cycle

Temperature

Fig. 9: Measuring the thermal paste layer with a wet film wheel (here ZWW 2102 from Zehntner)

Temperatur

One Cycle

20 C

60 t [min]

120

180

Area with less contact to the measurement disk

Fig. 11: Thermal cycling performed to determine optimum thermal paste layer thickness

The layer thickness can be read here

As the module is pressed onto the heat sink/aluminium plate and sticky thermal paste distributed in the space between, once the screws have been undone, a module without base plate can not be easily removed without causing destruction. To ensure non-destructive removal, the module should be left untouched at room temperature for 12 hours after the screw has been loosened or should undergo 1-2 thermal cycles. The remaining thermal paste can then normally be easily removed using a clean, solvent-free, lint-free cloth (where applicable, thermal paste manufacturer specifications are to be complied with). Each module should be used just once, as repeated loosening and tightening of the screws can alter the pressure properties. For each thermal paste layer thickness to be tested, a minimum of two modules should be used. When module underside surface is fully covered with paste, the thermal paste layer application is optimum. (see Fig. 12).

Fig. 10: Measuring the thermal paste layer with a wet film wheel (here ZWW 2102 from Zehntner)

Determining the optimum thermal paste layer thickness

Thermal paste layer thickness is different for different module types. This is why the mounting instructions of power modules specify the given thermal paste layer thickness and describe the quality of the surface of the heat sink. In most cases, however, the specified layer thicknesses apply to the thermal paste Wacker P12. If other thermal pastes are being used, we recommend observing the following procedures: Varying, pre-defined thermal paste layer thicknesses are applied to the modules or the heat sink. A module can be screwed onto a standard module or onto an aluminium plate in accordance with the given mounting instructions. When tightening the mounting screws, the tightening torques specified in the given mounting instructions must be observed. To achieve a relaxed system state, i.e. with no mechanical load, the mounted and secured module should undergo three thermal cycles (20 C/100 C/1h) (see Fig. 11).

Fig. 12: Optimum thermal paste layer thickness

If the visual inspection reveals areas on the contact surface of the module which havent been filled, then the thermal paste layer is too thin (see Fig. 13).

Fig. 13: Too little thermal paste

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References
1. Freyberg, M.: Application of thermal paste for power modules without base plate. SEMIKRON International, 1999. Kolpakov, A. I.: SKiiP intellektualnye silovye IGBT moduli SEMIKRON in Komponenty i technologii Nr. 1, 2003 Kolpakov, A. I.: SKiM novoe pokolenie intellektualnych silovych modulej SEMIKRON. In lektronnye komponenty, Nr. 1, 2003 Kolpakov, A. I.: SEMITOP kak alternativa TO. In: Silovaja lektronika, Nr. 2, 2004 Goldman, W. E.: An Introduction to the Art of Heat Sinking. In: Electronic Packaging and Production, 1966 Strube M (2007) Wrmeleitpastenauftrag als Dienstleistung. Elektronik Praxis Nr.10, S. 24 Strube M (2007) Thermal Paste Spread and Ready for Use. Bodo's Power System May 2007, S. 24

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6. 7.

DISCLAIMER
SEMIKRON reserves the right to make changes without further notice herein to improve reliability, function or design. Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is given and no liability is assumed with respect to the accuracy or use of such information. SEMIKRON does not assume any liability arising out of the application or use of any product or circuit described herein. Furthermore, this technical information may not be considered as an assurance of component characteristics. No warranty or guarantee expressed or implied is made regarding delivery, performance or suitability. This document supersedes and replaces all information previously supplied and may be superseded by updates without further notice. SEMIKRON products are not authorized for use in life support appliances and systems without express written approval by SEMIKRON.

SEMIKRON INTERNATIONAL GmbH P.O. Box 820251 90253 Nrnberg Deutschland Tel: +49 911-65 59-234 Fax: +49 911-65 59-262 sales.skd@semikron.com www.semikron.com

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