You are on page 1of 25

1

Raj Nagarajan, Ph.D.



Professor
Electronics and Advanced Technologies
Austin Community College
2
Objective
The objective of the module is to introduce micro- and nano -
electromechanical systems to two year community college students
with special emphasis on the development, processing, applications,
and materials that are currently in use to produce MEMS/NEMS.
3
Topics
Introduction
Brief History
Electromechanical Systems
MEMS
Current Applications
NEMS and Nanotechnology
Impact of Miniaturization
Challenges and Possibilities
References
4
Introduction
Figure 5.1: Jonathan Swift.

Courtesy Sandia National Laboratories, SUMMiT Technologies, www.sandia.gov/mstc.
Figure 5.1: Drive gear chain and linkages, with a grain of
pollen (top right) and coagulated red blood cells (lower right,
top left) to demonstrate scale.
5
Figure 5.2: The Scale of Things.
Introduction, Continued
6
MST - Microsystems Technology (European)
MEMS - Microelectromechanical Systems (U.S.)
Manmade devices created using compatible microfabrication
techniques that are capable of
Converting physical stimuli, events and parameters to
electrical, mechanical & optical signals
Performing actuation, sensing and other functions


Introduction, Continued
Definition and Terms
7
Figure 5.3: Spider mite with legs on a mirror drive assembly.
Introduction, Continued
Image Courtesy of Sandia National Laboratories, SUMMiTTM Technologies, www.mems.sandia.gov
8
1962 Silicon Integrated piezo actuators BY O.N. Tufte et al.
1967 Anisotropic deep silicon etching H.A. Waggener
1967 The resonant gate transistor by H. Nathanson, et.al
1972 National Semiconductor - Pressure Sensor
1979 Thermal inkjet technology is invented at HP laboratories
1982 Silicon as a Mechanical Material K. Peterson
1982 Liga Process (KFIK, Germany)
1983 Infinitesimal Machinery R. Feynman
1983 Silicon Micromechanical devices J.B.Angel etc.
1983 Integrated Pressure Sensor Honeywell
1985 Airbag Crash Sensor
1987 Dr. Hornbeck Digital Micromirror Device or DMD (DLP by Texas Instruments)
Later in 1990s micromachining begins leveraging microelectronics industry
1993 Accelerometer integrated with electronics Analog devices
1994 DRIE Etching (Bosch process is patented)
1999 Optical network switch - Lucent
Brief History
9
Figure 5.4: Electromechanical Systems functional block diagram.
Electromechanical Systems
Functional Block Diagram
10
Materials
Crystallography Forms of Silicon
Amorphous
Polycrystalline
Crystalline
Miller Planes

Figure 5.5: Miller Indices, Direction Examples
MEMS
Microstructure Fabrication
11
Pattern definition
Photolithography
Deposition
Oxidation, chemical-vapor deposition,
ion implantation
Removal
Etching, evaporation
-Structural layer
-Sacrificial layer
deposit
pattern
etch
Figure 5.6: Microstructure Fabrication
MEMS, Continued
Microstructure Fabrication, Continued
12
MEMS, Continued
Processing Techniques
Deep Reactive Ion Etching (DRIE)
Surface Micromachining
LIGA process Lithography / Electroplating / Molding
SUMMIT process
Microstructure Fabrication, Continued
13
MEMS Advantages
The advantages of MEMS devices include
Size
High sensitivity
Low noise
Reduced cost
Batch Processing
The applications for MEMS are so far reaching that a multi-billion
dollar market is forecast. Key industry applications include
transportation, telecommunications and healthcare.
MEMS, Continued
14
Worldwide MEMS Markets
(in Millions of $)
2002 2007
Microfluidics 1401 2241
Optical MEMS 702 1826
RF MEMS 39 249
Other actuators 117 415
Inertial sensors 819 1826
Pressure sensors 546 917
Other sensors 273 830
Total 3900 8300
Figure 5.7: Worldwide MEMS Market (2002 vs. 2007)
MEMS Economy
MEMS, Continued
15
Accelerometers
Micro Optical Electro Mechanical Systems (MOEMS)
Digital Mirror Devices (DMD) used in Projection Devices
Deformable mirrors
Optical Switches
Inkjet Print heads (Microfluidics)
Pressure Sensors
Gyrometers
Magnetic RW heads for hard drives
Seismic Activities - Thermal transfer

Current Applications
16
Micro-arrayed biosensors
Virus detection
DNA Chip PCR (Polymerase Chain Reaction)
Neuron probes (nerve damage/repair)
Retina/Cochlear Implants
Micro Needles
ChemLab
Micro Fluidic Pumps
- Insulin Pump (drug delivery)

Biomedical
Current Applications, Continued
17
Hand held detectors biological & chemical microsensors
Chems Lab on a Chip (security applications)
Micro and Radio Frequency (RF) Switches
RFID Technologies
Modern bar-coding system increasingly used on toll roads and
materials handling applications
Data Storage Systems
IBM Millipede storage system AFM tip writes data bit by
melting a depression into polymer mediaum and reads data by
sensing depressions.
Detection systems
Current Applications, Continued
18
Nanotechnology
manipulation of matter at the
nanometer scale.
Nanomaterials
Started with carbon.
Behavior depends on
morphology.
Figure 5.8: Eight allotropes of carbon:
Diamond, graphite, lonsdaleite, C60, C540,
C70, amorphous carbon and carbon nanotube
NEMS and Nanotechnology
19
Quantum dots
Nanowires
Quantum films
Figure 5.9: Quantum Dots.
NEMS and Nanotechnology,
Continued
20

Electrostatic manipulation
Moving one electron or molecule at a time
Patterning
Dip Pen Lithography
Electron Beam Lithography
Self assembly
Nano Fabrication
NEMS and Nanotechnology,
Continued
21
Cantilever Sensors
Mass Storage
(IBM) Millipede chip
Nanochip
Molecular Electronics
Transistors
Memory cells
Nanowires
Nanoswitches
Merging of technologies
NEMS and Nanotechnology,
Continued
22
Cantilever sensors are essentially
MEMS cantilevers with chemical
arrays attached. The cantilevers,
acting much like tuning forks,
have a natural frequency of
vibration which changes as more
mass is attached (nano function).
The change in frequency is
sensed by the MEMS device
indicating a measurable presence
in the system of particular reacting
compound.
Selective chemical
layer
Reacting compound
cantilever
Figure 5.10: Cantilever sensor
Merging of technologies
NEMS and Nanotechnology,
Continued
23
Potential Positive Impacts
Reduction of disease.
Job opportunities in new fields.
Low-cost energy.
Cost reductions with improved efficiencies.
Improved product and building materials.
Transportation improvements
Potential Negative Impacts
Material toxicity
Non-biodegradable materials.
Unanticipated consequences.
Job losses due to increased manufacturing efficiencies.

Impact of Miniaturization
24
Fundamental and applied research
Engineering and technological developments
High Fidelity Modeling
High Yield / Low Cost Fabrication
Molecular manufacturing
Challenges and Possibilities
25
References
Gad-el-Hak, M. MEMS, Design and Fabrication, Second Edition.
(2005)
Lyshevski, S., MEMS and NEMS, CRC Press LLC. (2002)
Maluf, N. and Williams, K., An Introduction to Micromechanical
Systems Engineering, Second Edition, Artechouse, Inc. (2004)
Microsytems, Same-Tec 2005 Preconference Workshop, July 25
&26, 2005.
Taylor and Francis, MEMS Introductory Course, Sandia National
Laboratories, June 13-15, 2006.
What is MEMS technology? MEMS and Nanotechnology
Clearinghouse. http://www.memsnet.org/mems/what-is.html.

You might also like