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ENGINEERING
AN INTRODUCTORY E-BOOK
Mechanical Metallurgy
George E Dieter
McGraw-Hill Book Company, London (1988)
Review
If failure is considered as change in desired performance*- which could involve changes in
properties and/or shape; then failure can occur by many mechanisms as below.
Fracture
Twinning
Slip
Fatigue
Microstructural
changes
Twinning
Phase transformations
Grain growth
Particle coarsening
Chemical /
Electro-chemical
degradation
Creep
Physical
degradation
Wear
Corrosion
Oxidation
Erosion
Review
Though plasticity by slip is the most important mechanism of plastic deformation, there are
other mechanisms as well (plastic deformation here means permanent deformation in the
absence of external constraints):
Slip
(Dislocation
motion)
Twinning
Phase Transformation
+ Other Mechanisms
Creep Mechanisms
Grain rotation
Dislocation climb
Note: Plastic deformation in amorphous materials occur by other mechanisms including flow (~viscous fluid) and
shear banding
High temperature effects (many of the effects described below are coupled)
Increased vacancy concentration at high temperatures more vacancies are
thermodynamically stabilized (this will further increase the diffusion rate).
Thermal expansion material will expand and in multiphase materials/hybrids thermal
stresses will develop due to differential thermal expansion of the components.
High diffusion rate diffusion controlled processes become important.
Phase transformations can occur this not only can give rise to undesirable
microstructure, but lead to generation of internal stresses.
Precipitates may dissolve.
Grain related:
Grain boundary weakening may lead to grain boundary sliding and wedge cracking.
Grain boundary migration
Recrystallization / grain growth decrease in strength.
Dislocation related these factors will lead to decrease in strength
Climb
New slip systems can become active
Change of slip system
Decrease in dislocation density.
Overaging of precipitates and precipitate coarsening decrease in strength.
The material may creep (time dependent elongation at constant load/stress).
Enhanced oxidation and intergranular penetration of oxygen.
Etc.
Creep
In some sense creep and superplasticity are related phenomena: in creep we can think of
damage accumulation leading to failure of sample; while in superplasticity extended plastic
deformation may be achieved (i.e. damage accumulation leading to failure is delayed).
Creep is permanent deformation (plastic deformation) of a material under constant load (or
constant stress) as a function of time. (Usually at high temperatures lead creeps at RT).
Normally, increased plastic deformation takes place with increasing load (or stress)
In creep plastic strain increases at constant load (or stress)
Usually appreciable only at T > 0.4 Tm High temperature phenomenon.
Mechanisms of creep in crystalline materials is different from that in amorphous materials.
Amorphous materials can creep by flow.
At temperatures where creep is appreciable various other material processes may also
active (e.g. recrystallization, precipitate coarsening, oxidation etc.- as considered before).
Creep experiments are done either at constant load or constant stress and can be classified
based on Phenomenology or underlying Mechanism.
Creep can
be classified
based on
Phenomenology
Harper-Dorn creep
Power Law creep
Mechanism
Constant stress
Strain ()
Stage-I
Creep rate decreases with time.
Effect of work hardening more than recovery.
II
III
A technical term
Stage-II
Stage of minimum creep rate ~ constant.
Work hardening is balanced by recovery.
Stage-III
Absent (/delayed very much) in constant
stress tests (shown later).
Necking of specimen starts in this stage.
Specimen failure processes set in.
II
Strain ()
III
t
Fracture
Strain ()
Elastic strains
Increasing stress
0'
0''
0 increases
0''
0'
t1
t 'f'
t t 'f
t 0f
Effect of temperature
On increasing the temperature at which the experiment is conducted:
(i) the instantaneous strain (elastic = 0) increases (slightly),
(ii) for a given time (say t1) the strain is more, (iii) the time to failure (tf) decreases.
The instantaneous strain 0 increases with increasing T because of the slight decrease in the
Youngs modulus (E) of the material.
Strain ()
As decrease in E
with temperature
is usually small
the 0 increase is
also small
'
0
''
0
0 increases
E as T
Increasing T
t1
t 'f'
'
t tf
t 0f
Cross-slip
Dislocation related
Climb
Glide
Coble creep
Grain boundary diffusion controlled
Creep
Diffusional
Nabarro-Herring creep
Lattice diffusion controlled
Cross-slip
This kind of creep is observed at relatively low temperatures. Herein screw dislocations
cross-slip by thermal activation and give rise to plastic strain as a function of time.
Dislocation climb
Edge dislocations piled up against an obstacle can climb to another slip plane and cause
plastic deformation. In response to stress this gives rise to strain as a function of time. It is
to be noted that at low temperatures these dislocations (being pinned) are sessile and
become glissile only at high temperatures.
Rate controlling step is the diffusion of vacancies.
Diffusional creep
Flow of vacancies
Grains
Wedge crack due to
grain boundary sliding
G Shear modulus
Shear stress
n An exponent having a value between ~ 3 - 10
Dynamic recrystallization
gives rise to strain-free
grains.
At high temperature and
low stress Diffusional creep
dominates
From Deformation Mechanism Maps: The plasticity and creep of Metals and Ceramics by H.J. Frost and M.F.Ashby, Pergamon Press, Oxford, 1982.
From Deformation Mechanism Maps: The plasticity and creep of Metals and Ceramics by H.J. Frost and M.F.Ashby, Pergamon Press, Oxford, 1982.
Creep
resistance
Creep in Nanomaterials
Due to fine grain size nanostructured materials (grain size in the nanoscale regime) are
expected to: (i) show creep at relatively lower temperatures, (ii) display higher creep rates
for a give temperature, (iii) experience predominance of mechanisms like grain boundary
diffusion and grain boundary sliding. We now see what is actually seen in experiments.
In nanocrystalline Pd (~40 nm) and Cu (~20 nm), there seemed to be no increase in creep
rate as compared to micron grain sized materials (in some temperature regimes even a lower
creep rate was observed for Pd). This is in direct contradiction with the expectation that
nanocrystalline materials will experience a higher creep rate.
Studies on Cu (10-25 nm GS), Pd (35-55 nm GS) (TEM showed porocity in sample) [1]
creep in the low T regime (0.24-0.33 Tm) low creep rate, low grain growth
creep in the medium T regime (0.33-0.48 Tm) creep rate decreasing even after long
testing time, grain growth (25 nm 100s of nm)
Cu creep rates of nc sample was
comparable to micron GS sample
Pd nc sample exhibited lower creep rates
[1] P.G. Sanders, M. Rittner, E. Kiedaisch, J.R. Weertman, H.Kung, Y.C. Lu, Nanostruct. Mater. 9 (1997) 433.
[2] D.L. Wang, Q.P. Kong, J.P. Shui, Scr. Metall. Mater. 31 (1994) 47.
In some cases the creep rate increased with a decrease in grain size in the nanoscale
regime of grain sizes (e.g. in Ni-P nanocrystalline material the creep rate of ~30 nm grain
sized material was higher than that of 250 nm material [2]).
In cases where high creep rate expected for nanocrystalline materials (e.g. Pd, Cu) was not
observed, the reason attributed are:
(i) presence of low angle grain boundaries and twin boundaries (which are not prone to
sliding and have low diffusivity for vacancies),
(ii) reduced dislocation activity in nanocrystalline samples.
[1] N. Wang, Z. Wang, K.T. Aust, U. Erb, Mater. Sci. Eng., A 237 (1997) 150.
Superplasticity
Superplasticity
The phenomenon of extensive plastic deformation without necking is termed as structural
superplasticity. Superplastic deformation in tension can be >300% (up to even 2000%).
Typically superplastic deformation occurs when:
(i) T > 0.5Tm
(ii) grain size is < 10 m
(iii) grains are equiaxed (which usually remain so after deformation)
(iv) grain boundaries are glissile (with a large fraction of high angle grain boundaries).
Presence of a second phase (of similar strength to the matrix- reduces cavitation during
deformation), which can inhibit grain growth at elevated temperatures helps (e.g. Al33%Cu, Zn-22% Al)).
Many superplastic alloys have compositions are close to eutectic or eutectoid points.
Superplastic flow is diffusion controlled (can be grain boundary or lattice diffusion
controlled).
(i) Region-I- low stress, low strain rate regime ( &<105 /s) m (0.2,0.33)
Sensitive to the purity of the sample. Lower ductility and grain boundary diffusion.
(ii) Region-II- intermediate stress & strain rate regime [ (105, 102)] m (0.4,0.67)
&
Extended region covering several orders of magnitude in strain rate. Region of maximum
ductility. Strain rate insensitive to grain size and insensitive to purity.
Often referred to as the superplastic region.
Mechanism predominantly grain boundary sliding accommodated by dislocation
activity (Activation energy (Q) corresponding to grain boundary diffusion (Q gb)).
(iii) Region-III- high stress & strain rate regime ( > 102 /s) m > 0.33
&
Creep rates sensitive to grain size.
Mechanism intragranular dislocation process (interacting with grain boundaries).
m
&
,T
A plot of stress versus strain rate is often sigmoidal and shows three regions:
Superplasticity in Nanomaterials
In most cases the superplasticity has not fulfilled the initial expectations.
In many cases superplasticity is only observed in nanocrystalline samples, where it is
already observed in their microcrystalline counterparts.
Superplasticity was observed in nanocrystalline Ni (20 nm grain size) at 0.36Tm (more than
450C lower than that for the bulk material) [1].
Nanocrystalline Ni3Al (grain size 50 nm) also became superplastic about 450C below its
microcrystalline counterparts.
Ni3Al had a ductility of 350% at 650C (strain rate of 103 /s).
1420-Al alloy showed superplasticity at a high strain rate of 101 /s. High amount work
hardening and higher flow stress for superplastic deformation as compared to micron grain
sized material is observed in these cases.
Superplasticity was observed in ~40 nm grain size Zn-Al alloy at 373 K, tested at a strain
rate of 104 /s [2]. Microcrystalline samples showed no superplasticity!
Superplasticity at low temperature (or equivalently Superplasticity at high strain rates (>
102 /s) at a given temperature in the superplastic regime) is caused by:
increased diffusion, grain boundary sliding and dislocation activity.
Grain growth is a serious issue during superplasticity experiments. In the case of nc-Ni it
was seen that the grain size could increase to micron sizes, from the starting grain size of
the order of 20 nm. In other materials the grain growth could be less. Grain growth is
expected to be less is two phase mixtures (2nd phase as a precipitate preferred) and
intermetallic compounds. In two phase mixtures the 2 nd phase has a pinning effect on the
grain boundaries; while in intermetallics (like Ni 3Al) order (with respect to the sublattices)
has to be maintained during grain growth, which restrains the process.
In cases where grain boundary sliding is the predominant mechanism for superplasticity
(e.g. in some Mg alloys), it is seen that non-equilibrium grain boundaries give lower
elongation as compared to equilibrium grain boundaries (due to the long range stress
fields associated with non-equilibrium grain boundaries, which is expected to hamper
grain boundary sliding).
In Ni3Al the high flow stresses and extensive strain hardening during superplastic
deformation has been attributed to depletion of dislocations and high stresses required for
the nucleation of new ones [1].
[1] R.S. Mishra, R.Z. Valiev, S.X. McFadden, A.K. Mukherjee, Mater. Sci. Eng., A 252 (1998) 174.