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EE466: VLSI Design: Power Dissipation
EE466: VLSI Design: Power Dissipation
Power Dissipation
Outline
Leakage
Leaking diodes and transistors
Node Transition Activity and Power
Due to charging and discharging of capacitance
EN n N 2
= lim -------- f = lim ------------ C V
dd clk
P f
avg N N clk N N L
n N
0 1 = lim ------------
N N
[1 ( p A pB 2 p A pB )]( p A pB 2 p A pB )
XOR
Dynamic Power dissipation
Istat
Vout
CL
Vin =5V
Temperature
Sub-threshold current increases exponentially
Reduction in Vt
Increase in thermal voltage
BTBT increases due to band gap narrowing
Gate leakage is insensitive to temperature change
Factors affecting leakage power
MTCMOS
Dual Vt
Dual Vt domino logic
Adaptive Body Bias
Transistor stacking
Metrics