 The Architecture .

 The Memory Endurance .

 Packaging .
 Single Cycle Execution Instruction(orders in assembly
language) : It executes a single order every single
pulse(doesn’t exceed 131 order) .
 Mega Instruction Per Second(Atmel) : It executes 16M
order in second when operated on 16MHz .
 One Chip 2-Cycle Multiplier .
 Self Programmable Flash Memory(32KB) .
 EPROM(512 Byte).
 SRAM(2KB) .
 True Read While Write Operation : Read from ROM and
write to RAM simultaneously .
 Programming Locks .
 Flash memory can be programmed for 10K times .
 EPROM can be programmed for 100K times.
 It can keep the program for 100 years on 25 C or for 25
years on 80 C .
 DIP(Dual In Line Package)

 SMD (Surface Mount Device)

o PIN 9 (Reset): Its an active low pin which means a low
level activates it and make the program executes again
from the start , so we must connect always this pin to
VCC by a 10KΩ resistor.
o PIN 10 (VCC): It receives the external power which must
be 2.7<VCC<5.5 v .
o PIN 11,31 (GND): It must be connected by the ground of
the source .
- The reason of existing 2 GND pins is to kill the noise
especially when we operate on high frequencies .
o PIN 12,13 (XTAL 1, XTAL 2): They must be connected to
the two terminals of the oscillator circuit .
o PIN 30 (AVCC): we connect it to VCC when we want to
activate the internal ADC of the MCU .