Analysis of mechanical and

electrical properties of
epoxy/PANI.DBSA composite
Supervisor: Project Members:
Miss Iqra Abdul Rashid Fahad Ali (14-NTU-1008)
Toseeq Haider (14-NTU-1010)
Abuzar Ahmad (14-NTU-1039)

Department of Polymer Engineering

NATIONAL TEXTILE UNIVERSITY, FAISALABAD
Objectives and Goals of Research:

 To study the effect of Polyaniline concentration on the

dielectric property of composite.
 To acquire easily processable conductive composite for
better stability with low cost raw materials.
Raw Materials:
Epoxy

APS Aniline DBSA

Chloroform
Introduction of Materials:
• High environmental stability,
Electrical Properties and ease
Polyaniline of Synthesis.
• Low cost

• A thermoset with Superlative

Epoxy mechanical properties, High
dielectric constant, thermal
[DGEBA] stability.
• Ease of processing.
 Proposed Methodology:
In-Situ
Polymeri Physical
zation Mixing
Epoxy Dissolved in Pani.DBSA prepared as
Solvent. Powder.

Fixed Amount of
Aniline, DBSA and Mechanically
APS addition with dispersion in Epoxy
Stirring. Resin.

Casting by Addition of
Casting by Addition of Hardener With
Hardener with catalyst Catalyst.
Sample Testing:
4-prob • Electrical conductivity
device • (Conventionally)

• Morphology
SEM • ASTM E986-04, ASTM F1372-93

• Mechanical Properties
UTM • ASTM D3039, D3479
 Sample Testing:
• Identification of peaks due to
reaction B/W active sites for
FTIR quantitative analysis.
• ASTM E168, E1252

• Linear Thermal Expansion

Dilatometer • ASTM E228, E831
Implementation Areas:
Electromagnetic Shielding
Conducting Glues
Sensor materials
Microwave absorption
Conductive Coatings
Anticorrosion protection
Electromagnetic Shielding:
Electromagnetic Shielding:
Thank You
Question
Please