PLANT LAYOUT

PLANT LAYOUT

• Design and Output

• From File to Film
• Printing the Inner layers
• Removing the Unwanted Copper
• Layer Alignment and Optical Inspection
• Layer-up and Bond
• Drill
• Plating and Copper Deposition
• Outer Layer Imaging
• Plating
• Final Etching
• Solder Mask Application
• Surface Finish
• Silkscreen
• Electrical Test
• Profiling and V-Scoring
INVENTORIES
 INVENTORIES

• Raw Material (PCB)

• Work in process
• Finish good
SWOT ANALYSIS
 SWOT ANALYSIS

• Strengths
• Weaknesses
• Opportunities
• Threats
FSA- FINANCIAL STATEMENT
ANALYSIS
INCOME STATEMENT
BALANCE SHEET