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EVALUATION

OF
PROTECTIVE
RELAYS
PREPARED BY
GOPALA KRISHNA PALEPU
ADE/MRT(PROTECTION)
1 ST GENERATION
FIRST GENERATION RELAYS :
THESE ARE ELECTRO MAGNETIC RELAYS
IN THIS NO OF ELECTROMAGNETIC RELAYS PROVIDED FOR ARRIVING
A SPECIFIC FUNCTION i.e EACH FUNCTION OF THE SCHEME HAVING A
SEPARATE RELAY. COMBINING ALL IS CALLED ONE PROTECTION
FUNCTION. NO OF RELAYS ARE MORE AND SPACE OCUPATION IS
MORE AND INTER CONNECTION WIRING DIAGRAM IS MORE.
DISADVANTAGES: ELECTROMECHANICAL RELAYS HAVE A LOT OF
MECHANICAL PARTS, WHICH MAY BECOME CLOGGED WITH DIRT OR
CORRODED DUE TO ENVIRONMENTAL CONDITIONS, AFFECTING BOTH
OPERATION, CALIBRATION AND MOVEMENT OF THE DISKS. IT
REQUIRES PERIODICAL MAINTANENCE AND ADJUSTMENT.
1 ST GENERATION
NEXT MODIFICATION :
ELECTRO MAGNETIC RELAYS WITH STATIC COMPONENTS
IN THIS SOME OF THE FUNCTIONS ARE DERIVED FROM STATIC
COMPONENTS PROVIDED ON THE PCB. IN THIS QUANTITY OF
ELECTROMAGNETIC RELAYS ARE REDUCED. COMBINING ALL IS
CALLED ONE PROTECTION FUNCTION. QUANTITY OF RELAYS ARE
REDUCED AND SPACE OCUPATION IS REDUCED SOME WHAT.
DISADVANTAGES: THE PCBs ARE MADE WITH TRANSISTORS AND ARE
BROUGHTOUT ITEMS WITH DIFFERENT MAKE. AFTER SOME TIME
THESE ARE TO BE REPLACED FOR CORRECT OPERATION WITHOUT
DRIFT. THE PCBs & COMPONENTS PERFORMANCE MAY BE AFFECTED
DUE TO DIST & DIRT. IT REQUIRES PERIODICAL MAINTANENCE AND
ADJUSTMENT.
2 ND GENERATION
SECOND GENERATION RELAYS :
STATIC RELAYS WITH TRANSISTORS
IN THIS ALL OF THE FUNCTIONS ARE DERIVED FROM STATIC
COMPONENTS PROVIDED ON THE PCB. IN THIS INITIALLY EACH
FUNCTION IS DERIVED WITH SEPATATE STATIC RELAY. QUANTITY OF
STATIC RELAYS ARE MORE BUT SPACE OCCUPATION IS LESS.
COMBINING ALL IS CALLED ONE PROTECTION FUNCTION. INTER
CONNECTION WIRING DIAGRAM IS STILL NOT REDUCED.
DISADVANTAGES: Static relays generally employ a lot of electronic components
made by other manufacturers. If these electronic components are not tested with
rigorous quality control, the chances of failure of components during the relay life time
may exist. A reliable DC power source within the relay, to electronically measure
circuits has to be generated from available external power sources. Most of the static
relays employ series, shunt, or switched mode power supply designs. For a variety of
reasons, if these power supplies fail, the measuring circuits are inoperative and the
relay is dead for any measurements. No protection is available to the network. Most of
the static relays in use do not have the means to detect the failure of power supply and
initiate an alarm. It requires periodical Maintanence.
2 ND GENERATION
NEXT MODIFICATION :
STATIC RELAYS ON SINGLE PCB
IN THIS ALL OF THE FUNCTIONS ARE DERIVED FROM STATIC
COMPONENTS PROVIDED ON THE PCB. IN THIS ALL STATIC RELAYS
ARE TAKEN TO ONE MASTER PCB AND EACH FUNCTION PCB WILL BE
ADD ON CARD TYPE. SO TOTAL RELAY IS ONE BUT FOR EVERY
FUNCTION IS PCB IS AVAILABLE AND CONNECTED TO MAIN PCB.
SPACE OCCUPATION IS LESS. COMBINING ALL IS CALLED ONE
PROTECTION FUNCTION. NO INTER CONECTION WIRING. THIS IS PART
OF MAIN PCB.
DISADVANTAGES:
DISADVANTAGES ARE SAME AS ABOVE.
3 ND GENERATION
THIRD GENERATION RELAYS :
STATIC RELAYS WITH ICs
IN THIS NO OF COMPONENTS ARE REDUCED AND BROUGHT OR BUILT
IN ONE INTEGRATED CHIP. DUE TO THIS THE RELAY SIZE IS REDUCED
AND SOME OF THE FUNCTIONS ALSO TAKEN IN TO ONE INTEGRATED
CHIP. THIS ALSO BUILT IN ONE PCB. ALL OF THE FUNCTIONS ARE
DERIVED FROM STATIC COMPONENTS PROVIDED ON THE PCB. IN THIS
ONLY MASTER PCB IS AVAILABLE, NO SEPARATE PCB FOR EACH
FUNCTION , ALL ARE INTEGRATED IN ONE PCB. PROBLEMS ARE SOME
WHAT REDUCED. SPACE OCCUPATION IS LESS. ONE PROTECTION
FUNCTION ONLY ONE RELAY AND ALL FUNCTIONS ARE INTEGRATED.
NO INTER CONNECTION WIRING DIAGRAM.
3 ND GENERATION
NEXT MODIFICATION :
SEMI NUMERIC RELAYS
IN THIS SOME FUNCTIONS ARE CAN BE PROGRAMMABLE AND
INTERFACE THROUGH PC. SOME ICs ARE HAVING THE FACILITY TO
INTERACT THROUGH COMMUNICATION PORT. IT IS SOME WHAT
MODIFICATION TO IC BASED RELAYS. IN THIS SOME FUNCTION CAN BE
ENABLED AND DISABLED, BASED ON THE REQUIREMENT.
4 ND GENERATION
ƒ MICROPROCESSOR BASED NUMERICAL
RELAYS
ƒ IN THIS ALL OF THE FUNCTIONS ARE
BROUGHT ON ONE IC. THE FOURTH
GENERATION PROCESSOR-BASED RELAYS
DO HAVE THE WATCHDOG FEATURE WHICH
FACILITATES THE CHECKING OF POWER
SUPPLY FAILS, CLOCK FREQUENCIES, AND
OTHER PATTERNS. MOST OF THESE RELAYS
HAVE AUTO TEST FEATURES WHICH TEST
THE ELECTRONIC CIRCUIT FUNCTIONS.
4 ND GENERATION
ƒ 1ST DEVELOPMENT: SOFTWARE
DEVELOPMENT IS APPLICATION BASED
RELAYS i.e EACH PROTECTION
FUNCTION HAVING SEPARATE
SOFTWARE & HARDWARE.
ƒ Example: LINE PROTECTION,
TRANSFORMER PROTECTION, BUSBAR
PROTECTION, GENERATOR
PROTECTION
4 ND GENERATION
ƒ 2ND DEVELOPMENT: SOFTWARE
DEVELOPMENT IS SOME GROUP BASED
RELAYS i.e SOME PROTECTION FUNCTIONS
ARE TAKEN IN TO ONE FLATFORM AND
PROVIDED COMMON SOFTWARE. FROM THIS
INBUILT FACILITY OF EVENT RECORDER AND
DISTURBANCE RECORDER IS DEVELOPED.
ƒ Example:
ƒ ABB: 1. REX 5XX SERIES FLATFORM
2. REX 316 SERIES FLATFORM
3. REX 670 SERIES FLATFORM
4. RED 500 SERIES FLATFORM
5. RED 600 SERIES FLATFORM
4 ND GENERATION
ƒ 3RD DEVELOPMENT: UNIVERSAL
SOFTWARE FOR ALL TYPES OF RELAYS
FOR PARTICULAR MANUFACTURER.
ONE SOFTWARE ONE MANUFACTURER.
ƒ Example:
ƒ SIEMENS: SIPROTEC SERIES – DIGSI
ƒ GE MULTILIN: ENERVISTA
ƒ AREVA : MICOM S1
4 ND GENERATION
ƒ 4TH DEVELOPMENT:
ƒ UNIVERSAL HARDWARE FOR ALL TYPES
OF RELAYS FOR PARTICULAR
MANUFACTURER. ONE HARDWARE FOR
ONE MANUFACTURER. BUT IT IS
MODULAR DESIGN. RELAY IS COMMON
HARDWARE BASED ON PROTECTION
FUNCTION, PARTICULAR CARD IS ADDED.
ƒ Example:
ƒ GE MULTILIN: UR SERIES & SR SERIES
4 ND GENERATION
ƒ 5TH DEVELOPMENT:
ƒ UNIVERSAL PROTOCOL FOR
COMMUNICATION, INTERFACING AND
NETWORKING. ALL MANUFACTURERS ARE
FORM A GROUP AND PROTOCOLS ARE
STANDARDIZED. ANY RELAY CAN BE
COMMUNICATED FOR COMMON
COMMUNICATION PROTOCOL. THIS IS
SPECIAL FOR AUTOMATION OF STATIONS.
ƒ Example:
ƒ IEC 61850
ƒ IEC 60870

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