Integrated Circuits (EE334)

1. Define slew rate

Slew rate can vbe defined as the maximum change of output voltage with respect to
time.
2. what causes slew rate?
The rate at which the internal or external capacitance of an op-amp charges causes
slew rate.
3. how can slew rate can be made faster?
the slew rate can be faster by having a high charge current or a small capacitance
value.
4.what are the characteristics of ideal op-amp?
• Open loop vpltage gain(AOL) = infinity
• Input impedance (Ri) = infinity
• Output impedance (Ro) =0
• Band width = infinity
5. define input offset voltage.
It is defined as the voltage that must be applied between the terminals of an op- amp
to nulloify the input.
6.define input offset current
it is defined asd the algeberic difference between the current entering in the
inverting and non inverting terminal of the op-amp.
7.define input bias current
it is defined as the average currents entering into 6the input terminals of an op-
amp.
8. what are the two compensating used in the frequency compensation
• External compensation
• Internal compensation
9.what is compensated op-a mp?
op-amp which uses a capacitor internally for comoensat is called the compensated
op-amp.
10. what are the methods used imn external compensation technique?
• Dominant pole compensation
• Pole- zero compensation
11 .what are the AC characteristics of an op-amp?
• Frequency response
• Slew rate
12 . what are the DC characteristics of an op-amp?
• Input bias current
• Input offset current
• Input offset voltage
• Thermal drift
13.what is an 9nverting amplifier?
Inverting amplifier is one, which amplifies the given signal with negetiyve
gain.
14.list the applications of instrumentation amploifier.
• Temperature indicator
• Temperature controller

• light intensity meter

• water flow meter

15. what is meant by comparator?
It is a circuit which compares the signal voltage on one input of with known

Reference voltage on the other input.

16. what are the basic requirements of instrumentation anmplifier?
• High gain
• High CMRR
• High gain stability
• Low DC offset
17. what are the characteristics of the comparator?
• Speed of operation
• Accuracy
• Compatibility of the output
18. give the applications of comparator?
• Zero crossing detector
• Window detector
• Time marker generator
• phase meter
19. List the different types of comparator?
• Inverting comparators
• Non- Inverting comparators
20. What is a multivibrator?
Multivibrator is a wave shaping circuit which gives symmetric or
asymmetric square output. It has two states.
21. mention four applications of 555 timer
• FSK generator
• Pulse position modulator
• monostable multivibrator
• Schmitt trigger
22. what are the applications of integrator?
• Analog computers
• ADC
• signal wave-shaping circuit
23. what do you meant by linear circuits?
Linear circuits are the circuits in which the output signal varies
with the input signal in a linear manner.
24. what do you meant by non- linear circuits?
 Non- Linear circuits are the circuits in which the output signal varies with
the input signal in a linear manner.
24. define non-invertying amplifier
the input is applied to the non- invertingh input terminal and inverting
terminal connected to the ground.

Unit4

1.write the classifications of digital integrated circuits.

1. Sequential logic circuit
2. Combinational logic circuit
2.what does CMOS inverter mean?
CMOS inverter is the combination of both NMOS and PMOS.
3.Write advantages of CMOS inverter
• Low power consumption
• In either, the output impedance is only few hundred ohms
4.give some disadvantages of CMOS inverter
• Slow speed
• Propagation delay time high typically 25 nanoseconds
(ns) to more than 100ns.
5.applications of CMOS inverters
o It is used in packet calculators
o Digital watches
o Portable micro computers
6.what is meant by NAND gate?
The NAND gate consists of two PMOS and two NMOS
transistors.
7.draw the truth table for CMOS NAND gate .

A B C

LOW LOW HIGH

LOW HIGH HIGH

HIGH LOW HIGH

HIGH HIGH LOW

8. What is meant by NOR gate?

NOR gate also consists of two NMOS and two PMOS transistors.
9.what does sequential circuit mean?
In the sequential circuit memory element are connected to the
combinational logic circuit as a feed back path.
10. how the sequential cirvcuit can be classified?
 The sequential circuit can be classified depending on the eiming of
their soignals. Ie., synchronous sequential circuit, asynchronous sequential circuit.
11. define synchronous sequential circuit
signals can affect memory elements only at discrete instant of time
12. define asynchronous sequential circuit
signals can affect memory elements only at instant of time.the memory
elements used in both circuits are flip-flops which are capable of storing 1-bit memory
information.
13. write some examples of sequential circuit
• Flip-flops
• Counters
• Shift registers
14. define combinational logic circuit
a combinational logic circuit can be defined as a circuit built from
various logic gate combinationbs.so, when input combination changes ouput also
changes.
15. . write some examples of combinational logic circuit
• Arithmetic building block
• Decoder
• Demultiplexer
• Encoder
16.write the basic arithmetic operations
• Addition
• Subtraction
• Multiplication
• Division
17.define read only memory
it is a device that includes both the decoder and the or gates within a single IC
packages.
18. draw the block diagram of ROM

N inputs

2n * m
ROM

M outputs

19. What is meant by PROM

PROM which can be programmed at the site ROM is a matrix of
AND array and on OR array.
20what is meant by PLA
in PLA the decoder is replaced by group of AND gates each of which can be
programmed to generate a product term of input variables.
21.what is meant by PAL
 PAL is a matrix comprising AND array and an OR array . however the OR array
in a PAL is fixed and the AND is programmable.
22.write the different types of meeemories used in the computing system
• High speed memory
• Main memory
23.define RAM
a RAM is the array of storage with each cell capable of storing 1-bit data. it is a
volatile memory.
• Static RAM
• Dynamic RAM

24.What is meant TTL RAM cell

a TTL RAM cell consists of a pair of multiple emitter transistors which are cross
coupled to form a flip[-flop.
25.write the constructions of dynamic MOS RAM.
A dynamic RAM cell comprises four transistors in place for six
for the SRAM. this reduction is brought by making T3 and T4 act simultaneously as loads
and row select transistors thus bringing about the savings of two transistors.

Unit 5
1.give a s application of a sample and hold circuit.
• Digital interfacing
• Adc
• Pulse code modulation systems
2.give a few areas of applications where a dual slope ADC iois used.
Dual slope ADC is suitable for precise measurement of slow variation signals like the
output of thermocouples and weighting scales. Hence they are used in diogital panel
meters, multimeters and monitoring systems.
3.where do you used successive approximation type ADC/
successive approximation type ADC is used in application where conversion
speed is important parameter. Hence it is used in data loggher and instruments.
4.what is DAC?
a digital to analog converter is used to convert a digital to an annalog signal.
hence the output is an n-bit binary word d and is combined with a reference volitage VR
to give an analog output signal.
5.what is ADC?
the circuit accepts an analog input vopltage Va and produces the output word
d1, d2, d3,………… dn functional value D, so that
D= d12-1+ d22-2 +………………….. + dn 2-n
Where d1 is the MSB
d2 is the LSB
6. give the advantages of DAC over ADC
• It is simpler than ADC
• It can be used to from the ADC
7. list the various types of ADC techniques.
• Direct type
 • Indirect type
8.what is meant by direct type ADC?
Direct type ADC compares a given analog signal with the internally
generated equivalent signal
9.what is meant by integrting type ADC?
This type performs conversions in an indirect manner by first changing
the analog input to the time or frequency and then to a digital code.
10. what are the advantages of integrting type ADC?
• It is possible to transmit frequency even in noisy environment
• Used for precision measure of slow varying signals
11.mention the types of DACs techniques
• Weighted resistance DAC
• Inverted R-2R ladder DAC
• R-2R ladder DAC
• Multiplying DAC
12.Write the important specifications DAC and ADC.
• Resolution
• Linearity
• Accuracy
• Monotonic
• Stability
13. Advantage of inverted R-2R ladder.
• Ladder node voltage remains constant
• The stray capacitance not able to produce slow down
effects
14. what are switches used in DAC?
• The switches used in DAC are series with
resistors
• Switch used in DAC mosfet
15. what are the advantages of dual slope ADC?
• Accrurate measurement of slowly varying signals
• Used in digital panel meters
16. what is VTC?
Linear ramp is used to convert an analog signal in to a front panel
digital representation.
17. give the advantage of
• Linearity
• Accuracy
• Absolute slope of the ramp and the frequency setting
• Stability of the oscillator
18. what is VFC?
These converters convetrts the applied input voltage to an output
frequency. Using 2 capacitors,3 resistors and reference voltage can form a complete
circuit.
19. what are the control lines of ADC?
 • START
• EOC
20. what is a resolution for a DAC?
The resolution of DAC is the smaller change in voltage which may
be produced at the output or input of the converter.
21.write the output of the switched capacitor integrator

f0= (c1 / 2∏ c2 ) fclk

22.Write some disadvantages of binary weighted R-DAC.

• Requires wide range of resisters
23. Write some advantages of R-2R ladder DAC
• Requires 2 value of resisters
• Whatever may be the input 2 value of resisters used
24.give some advantages of switched capacitor filter
• Low system cost
• High accuracy
• High value of resisters simulated by using small value of
capacitors
• Excellent temperature stability.
25.what is meant by switched capacitor filter?
• It require no external components, capacitor or inductors
• It consists of two MOS switches and 1 capacitor
• The switches are controlled by external clock

Unit1
1.define an integrated circuit
complete electronic circuit in which both active and passive
components are fabricated on the single crystal chip of silicon.
2.what are applications of Ics?
• Audio and radio communications
• Medical electronics
• Instrumentation control

3.what are the types of Ics?

• Based on the mode of operation
1. linear
2. digital
• based on fabrication
1. monolithic
2. hybrid

4.write the level of integration

1. SSI(small scale integration)
 2. MSI(medium scale integration)
3. LSI(large scale integration)
4. VSI(very large scale integration)

5.list the advantages of Ics

• Increased equipment density
• Cost reduction
• Highly reliable
• Increased operating speeds

6.list the disadvantages of ICs

• Inductors cannot be fabricated
• IC function at very low voltage
• Limited amount of power
• Excessive heat

7.what is planar technology?

• Used for fabrication of monolithic Ics
• IC is manufactured through single planar

8. give the different types of IC packages

• Metal can package
• Dual inline package
• Flat package

9.write some limitations of monolithic Ics

• Large value of resisters used
• No method available to fabricate transformer

10.what do yoi mean by monolithic process?

• Monolithic means one stone
• Transistors and passive elements fabricated on a single piece of
semiconductor material

11.write the steps used for silicon wafer preparation

• Crystal growth and doping
• Ingot trimming and grinding
• Ingot slicing
• Wafer polishing and etching
• Wafer cleaning
12. Define epitaxial growth
• Epi means upon
• Arranged atom in singie crystal fashion upon single crystal substrate
13.write about silicon wafer
• It contains several hundred rectangular chips
• Each IC chip having hundreds oif components

14.what is meant by oxidation?

• Sio2 is the oxidizing agent
• Sio2 has the property of prevent the diffusion of all impuritiesd through it.

15. write the chemical reaction done in the oxidation process.

Si + 2H2O SiO2 + 2H2
16.List the steps used in the photolithographic process
• Wafer first coated with thin layer of photo resistive material
• The mask is removed
• Polymerized
• Polymerized photo resist is removed

17. define diffusion

• Slected arean is to be doped
• The process of junction formation

18.define solid solubility

• Maximum concentration of the Impurity which can be dissolved in the solid
diffusant
• Essential to know no of atoms per unit volume

19. write about diffusion temperature

• At higher temperature diffused impurityu atoms acquire high thermal
energies
• Diffusion apparatus may have higher tolerances

20. what is meant by diffusion time

the time required for diffusion. Increase is diffusion time affect the junction depth

21.what is meant by ion implantation

ion implantation is an alternative to a derposition diffusion and is used to produce a
shallow surface region of dopant atom deposited into a silicon wafer.

22.define metalization
the purpose of thois process is to produce a thin metal film layer then will serve
to make interconnection of the various components on the chip. Al is used for
metalization.
23. Write some advantages of metalization using Al .
• Good conductor
• Easy to deposit
• It make good mechanical bond with Si
 • Al forms low resistance

24.write the different types of package configuration.

• Ceramic flat package
• Dual inline package
• To-5 glass metal
25.write the classifications of monoliothic resistors.
• Diffused resistors.
• Epitaxial resistors.
• Pinched resistors.
• Ion implantation resistors.

Unit3
1.name the types of MOS transistors
1. nMOS
2. Pmos

2. different types of nMOS transistor.

• nMOS enhancement mode
• nMOS depletion mode

3.write the important points in the enhancement mode transistor action

• Vds=0
• Vg = Vgs - Vt
• Vds= Vgs - Vt

4.write some important steps used in the nMOS fabrication.

• Process is carried out single crystal of Si
• Apply the layer of SiO2
• Apply photoresist
• Interconnection patteren

5.list the types of CMOS fabrications

• The p-well process
• The n-well process
• Twin tub process

6.List the steps used in p-well processes

• Defne areas
• Define thinox region
• Apply p+ mask
• Made contact cuts
7. List the steps used in n-well processes
• Formation of n-well region
• Patteren polysilicon
• Contact cuts

8. List the steps used in twin-tub processes

• Take high resistivity n type material
• Form p-well and n-well
• Made contact cuts

9.write some advantages of Bipolar IC technology

• High speed applications
• Transit time was determined by base width

10.write the fabrication steps used in the Bipolar IC technology

• Select the starting material ie., Si

• Apply thinox
• Apply oxide isolation between the devices
• Formation of base ,emitter and collector region
11.what is meant by I2L
• It is the application of Bipolar IC
• Used in high density application
• Lower power consumption

12.write the process steps used in the IC fabrication

• Fabrication facilities
• Clean room
• Process monitoring
13. Write about Fabrication facilities

• Use large quantity of water

• Clean water is must
• Bacterial content is minimized by continuously circulating water

14. list the different package types used in IC

• Dual inline package
• Pin grid array
• Flat pack

15. list the different types mounting used

• Through hole mounting

• Surface mounting
 • Direct mounting

16.write the reliability requirements in VLSI

Failure rate to failure unit

17.name the crystl orientation used in the BiPolar IC

• <100>
• <111>

18. How many oxides are used in the BiPolar IC

• SiO2
• Si3 N4

19. write about self aligned BiPolar IC

• Formation of self aligned stucture
• Make contact to the heavily doped

20.write about clean room

• Air is maintained at well controlled temperature

• Air in the clean room is monitored and classified
21. write about process monitoring
• The electrical , mechanical and visual tests used to evaluate
and characterize the various process step and an integral part
of IC process development and manufacture.

22.which type of material is used for manufacturing of packages

• Ceramic
• Hermetic
23.write the use of aluminium nitrate

• Enhance thermal performance

• Power applications

24. list the advantages of plastic packages

• Low cost
• Reliability

25.write some variations of IC packages

• Single in line pack(SIP)

• Zig zag pack(ZIP)
• Tape automated bonding(TAB)
Big questions
1.briefly explain the nmos fabrication process.
1. Process is carried out from a single crystal of silicon with high
purity
2. Apply SiO2 layer all over the surface
3. Apply photo resist
4. the photo resist then exp0osed to ultra violet light through a
mask
5. Then the areas are etched away
6. Photo resist is removed, apply SiO2 layer all over the surface
7. Pattern the polysilicon layer
8. Contact cuts is to be made
9. Deposit the whole chip over Al
10. Form required interconnection pattern

2.explain the cmos fabrication process.

1. Formation of n-well region
2. Define nmos and pmos active area
3. field and gate oxidation
4. form and pattern poluy silicon
5. p+ diffusion
6. n+ diffusion
7. contact cuts
8. deposit and pttern metallization
9. over glass with cuts for bonding pads

unit 1
big questions
1.briefly explain about silicon wafer preparation
1. Crystal growth and doping
2. Ingot trimming and grinding
3. Ingot slicing
4. Wafer polishing and etching
5. Wafer cleaning
6. A highly purified polysilicon is the starting material
7. Polysilicon and do pant is put in to the crucible and then placed in to
a furnace
8. The material is then heated
9. Solid type silicon is produced
10. Cut the silicon in to several hundred rectangular chips, each one
containing a complete integrated circuit

2.explain about photolithographic process and diffusion

1. wafer is first coated with thin layer of photosensitive material
2. a large black and white layout of windows is prepared
3. apply mask
 4. mask is removed, the chemical dissolves the unpolymrised pattern
5. polymerized pjhotoresist is removed
6. the impurities diffused through windows
7. in epitaxy a large area is doped by closed controlled amount of impurity
8. the maximum amount of impurity which can be dissolved in the solid diffusant
9. diffusion depends upon temperature
10. diffusion time affects the junction depth

unit2
1.briefly explain about non-ideal characteristics of op-amp
1. input bias current
2. input offset current
3. inputr offset voltage
4. total offset voltage
5. the above are D.C characteristics
6. the important A.C characteristics are
7. frequency response
8. slew rate

2.explain about