Z Z Z Z: General Remarks

Sources of Partial Discharges in Rotating Machines:
General Interpretation Scheme for Partial Discharge Pattern Monitoring (PDM-3 and older Versions)
General Remarks
All stresses act as a TEAM on the insulation system Partial discharges are plasma processes which take place generally
in a gas. Whenever the electrical field in a gas space exceeds the
z Thermal inception field of the gas, partial discharges are created: on the
surface of an insulator, due to conductive contamination, in air
z Electrical inclusions of the insulation as a result of mechanical forces. The
z Ambient (Environmental) gas plasma accelerates ageing and corrosive substances as ozone
and NO2 are created. However the mechanical wear or a surface
z Mechanical
contamination is usually more harmful than the partial discharge
Very often Partial Discharges indicate above stresses, they are action. As the presence of partial discharges cannot be avoided in
often not the cause but the result of the problem rotating machines insulation, mica is applied as a partial discharge
resistant medium.
often defects occur in specific locations, there is no overall average By-products of the partial discharge are commonly white powders
ageing, e.g. using a hammer for placing only one bar might harm which can be found in many locations of the machines.
that specific bar.
Single weak points in the insulation system are indicated by partial Typical Partial Discharge Phenomena in Rotating Machines
discharges. Partial Discharge Patterns represent the best way to • loose wedges/bar vibration/slot discharges
identify the defect type. • cracked and broken conductors
• end winding surface contamination
This application note gives an overview about typical partial • damage and corrosion of the corona suppression system
discharge patterns and their physical origin. • connection ring external discharge due to vibration
• interphase discharge
Conventional test methods as tanδ as well are sensitive to partial • insulation degradation
discharges, but, they represent an integral value as the loss created • collector ring, brush sparking
by the partial discharge pulses must be very high. • faults in generator high voltage accessories
Im Stetterfeld 1 z CH-5608 Stetten z +41 (56) 496 62 80 z +41 (56) 496 6578 interpretation E Bernd Fruth Datum: 11.11.99 Seite 1 von 11
© PD Power Engineering AG
Partial discharge locations: 1. internal discharges, discharge sources in the slot sections
A: highest el.field - usually pd - e.g. field calc.

E = 20 to 30 kV/mm
B: delamination: winding - main
insulation, E = εE0 = 10 kV/mm
A C: delamination of tape layers, E see C
D: treeing in layers, unknown, very high locally
E: broken strands
G: voids, E = 1.3xE0,
F: slot discharge, semicon paint abrasion,
E see C
E Result: Field Strength is generally higher than typical

inception fields of gases, the complex structure with all the
B differential thermal expansion always shows partial discharge
Slot / iron
C Semiconducting Layer
(corona protection paint or
paper)
F conductors
D mica paper layers

(main insulation)
G winding insulation
(and/or inner corona
protection)
Partial discharge locations: 2. external discharges, discharge sources in the endwinding
H: Discharges in Cooling Duct, mainly created by vibration and

abrasion of corona protection layers
I: Delamination of Insulation in Elbow (Especially when
manually manufactured)
J: endwinding surface discharge (contamination etc.)
K: Insufficient Spacing, Tracking, especially between bars with big
voltage difference, different phases
H I
L: Connection area between slot corona protection and endwinding
corona protection
Typical partial discharge patterns (applies to on- and off-line tests)
SLOT DISCHARGES: F-Location This pattern is asymmetric: the discharge magnitude is higher in the
negative halfcycle than in the positive.
The most harmful defect is called slot discharge. They are usually
caused by vibration of the insulation in the slot. This vibration can The pattern in the negative half-cycle has a distinct triangular shape
be caused by loose wedges. Therefore the presence of slot with a sharp rise around the negative voltage zero.
discharges indicates loose wedges and can therefore be verified by Typical Discharge Magnitudes around 10 nC.
wedge tightness tests and ozone detection in air-cooled machines.
SLOT DISCHARGES + ENDWINDING DISCHARGES: F + J

Typical Pattern
Sometimes two defects occur at the same time: in the following slot
discharge F and sparking in the endwinding due to a light
contamination with conductive remnants.
So called sparking can occur between conductors which are not

connected to a potential these conductors are capacitively charged
and whenever the voltage between these conductors exceed the
inception voltage a spark occurs.
Typical is a discharge at nearly constant amplitude in both

halfcycles as shown in the next Figure.
Spark PD: J
Slot PD: F
Typical values for sparking are around 20 nC and higher. The endwinding discharge pattern characteristics are explained in
the next chapter
SLOT DISCHARGES + ENDWINDING DISCHARGES: F + J
ENDWINDING DISCHARGES: J
A further typical superimposal of different discharge sources is
given in the next example which shows the presence of slot endwinding discharges are created by a surface contamination or
discharges and discharges due to an eroded endwinding corona ageing or inadequate design of the potential grading in the
protection: endwinding. This ist usually indicted by white powders on the
surface or within the layers of the endwinding tape.
The next Figure shows such deposits: The corresponding partial discharge pattern is shown in the next
Figure:
Typical is the asymmetry, negative halfcycle discharges are higher.

But compared to slot discharges the triangular shape is different
and more oriented to the voltage maximum.
Discharge magnitudes are around 10 nC.
It is very typical that the traces of partial discharge can be seen at
the edges of the semiconducting tapes or under the tape layers. Another modification of endwinding discharges is shown in next
example, which is a superimposal of internal discharges in the main
insulation (C-location) and surface discharges in an initial state.
endwinding
discharge
internal
discharge
external and internal PD internal PD alone
INTERNAL DISCHARGES: C INTERNAL DISCHARGES: A, B, C
If discharges prevail mainly in the mica paper layers and many The next Figures show internal discharges of A, B, C type in their
discharge sites are presents usually a pattern depicted in the next initial state , these patterns are often encountered in new insulation
Figure is created. The main characteristics are its symmetry with (bars and machines and they exist in various similar patterns.
respect to voltage half-cycle and its centre of gravity which lies
around 30 deg.
Small defects in A, B and C Location

Initial or birth state, characteristic is the symmetry and sine
shaped lines and envelopes:
No asymetry: probably C Rather Symmetrical: Maybe C, probably slight thermal ageing
Slight asymmetry, positive higher: probably A or B
ENDWINDING DISCHARGES: C DEFECT INTERNAL STRESS GRADING: I

Very strong sparking (200nC) at low repetition rate due to
badly contacted internal corona shield
Weak endwinding discharge: one or few sites maybe Poor contact stress grading: L
associated to surface tracking
Poor contact between slot corona protection and stress

grading, capacitive charging effect. Looks like a contact
problem, high magnitudes, 30 to 100nC
INTERNAL DISCHARGES: C This may lead to a strong degradation and consequently to a

deposition of pd by-products between main insulation and
One of the most prominent defects occurs when the main insulation conductors:
detaches from the conductors. This is mainly caused by the
differential thermal expansion of copper and the insulation material
especially if no internal corona shield is applied and the machine is
subjected to many load and temperature cycles.
Typical is a pattern which is similar to the slot discharge but the big
partial discharge signals occur in the positive half-cycle.
Some general remarks
The patterns may vary in amplitude. If no drastic changes surface discharges

changes are detected over time and the shape remains similar • good: < 1 nC, medium < 10 nC, Bad > 30 nC
the pd process is stable and the risk is usually low.
slot and near-conductor discharges
Patterns or signal amplitudes may vary with load and • good: < 1 nC, medium < 10 nC, Bad > 15
temperature: Special attention: the nC calibration is ambiguous due to the
attenuation of partial discharge pulses in the winding.
Decrease of PD with load/temperature:
• normal, statistical time lag decreases > lower amplitude
• insulation expands with temperature > closing of Use of this report:
delaminations > lower amplitudes In no event shall PDTech GmbH be liable for special, indirect or consequential
loss or damages.
Increase with Load alone
• wedge loosens
• overhangs loose, bar vibration
Generally one might say that:

• Maximum Charge Level: reacts on defect size mainly,
attention, depends on machine type!!!

Z Z Z Z: General Remarks

Uploaded by

Document Information

Original Description:

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Z Z Z Z: General Remarks

Uploaded by

Copyright:

Available Formats

Sources of Partial Discharges in Rotating Machines:

A: highest el.field - usually pd - e.g. field calc.

E Result: Field Strength is generally higher than typical

D mica paper layers

Partial discharge locations: 2. external discharges, discharge sources in the endwinding

H: Discharges in Cooling Duct, mainly created by vibration and

Typical partial discharge patterns (applies to on- and off-line tests)

SLOT DISCHARGES + ENDWINDING DISCHARGES: F + J

So called sparking can occur between conductors which are not

Typical is a discharge at nearly constant amplitude in both

Typical partial discharge patterns (applies to on- and off-line tests)

Typical partial discharge patterns (applies to on- and off-line tests)

Typical is the asymmetry, negative halfcycle discharges are higher.

Typical partial discharge patterns (applies to on- and off-line tests)

external and internal PD internal PD alone

INTERNAL DISCHARGES: C INTERNAL DISCHARGES: A, B, C

Typical partial discharge patterns (applies to on- and off-line tests)

Small defects in A, B and C Location

No asymetry: probably C Rather Symmetrical: Maybe C, probably slight thermal ageing

Slight asymmetry, positive higher: probably A or B

Typical partial discharge patterns (applies to on- and off-line tests)

ENDWINDING DISCHARGES: C DEFECT INTERNAL STRESS GRADING: I

Poor contact between slot corona protection and stress

Typical partial discharge patterns (applies to on- and off-line tests)

INTERNAL DISCHARGES: C This may lead to a strong degradation and consequently to a

Some general remarks

The patterns may vary in amplitude. If no drastic changes surface discharges

Generally one might say that:

You might also like