L293D L293DD

PUSH-PULL FOUR CHANNEL DRIVER WITH DIODES

600mA OUTPUT CURRENT CAPABILITY PER CHANNEL 1.2A PEAK OUTPUT CURRENT (non repetitive) PER CHANNEL ENABLE FACILITY OVERTEMPERATURE PROTECTION LOGICAL 0 INPUT VOLTAGE UP TO 1.5 V (HIGH NOISE IMMUNITY) INTERNAL CLAMP DIODES DESCRIPTION The Device is a monolithic integrated high voltage, high current four channel driver designed to accept standard DTL or TTL logic levels and drive inductive loads (such as relays solenoides, DC and stepping motors) and switching power transistors. To simplify use as two bridges each pair of channels is equipped with an enable input. A separate supply input is provided for the logic, allowing operation at a lower voltage and internal clamp diodes are included. This device is suitable for use in switching applications at frequencies up to 5 kHz. BLOCK DIAGRAM

SO(12+4+4)

Powerdip (12+2+2)

ORDERING NUMBERS: L293DD L293D

The L293D is assembled in a 16 lead plastic packaage which has 4 center pins connected together and used for heatsinking The L293DD is assembled in a 20 lead surface mount which has 8 center pins connected together and used for heatsinking.

June 1996

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ABSOLUTE MAXIMUM RATINGS
Symbol VS V SS Vi V en Io P tot Tstg, Tj Supply Voltage Logic Supply Voltage Input Voltage Enable Voltage Peak Output Current (100 s non repetitive) Total Power Dissipation at Tpins = 90 C Storage and Junction Temperature Parameter Value 36 36 7 7 1.2 4 40 to 150 Unit V V V V A W C

PIN CONNECTIONS (Top view)

SO(12+4+4)

Powerdip(12+2+2)

THERMAL DATA
Symbol Rth j-pins Rth j-amb Rth j-case Decription Thermal Resistance Junction-pins Thermal Resistance junction-ambient Thermal Resistance Junction-case max. max. max. DIP 80 14 SO 14 50 (*) Unit C/W C/W

(*) With 6sq. cm on board heatsink.

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ELECTRICAL CHARACTERISTICS (for each channel, VS = 24 V, VSS = 5 V, Tamb = 25 C, unless otherwise specified)
Symbol VS V SS IS Parameter Supply Voltage (pin 10) Logic Supply Voltage (pin 20) Total Quiescent Supply Current (pin 10) Vi = L ; IO = 0 ; Ven = H Vi = H ; IO = 0 ; Ven = H Ven = L ISS Total Quiescent Logic Supply Current (pin 20) Vi = L ; IO = 0 ; Ven = H Vi = H ; IO = 0 ; Ven = H Ven = L V IL VIH IIL IIH Ven L Ven H Ien L Ien H VCE(sat)H VCE(sat)L VF tr tf ton toff
(*) See fig. 1.

Test Conditions

Min. VSS 4.5

Typ.

Max. 36 36

Unit V V mA mA mA mA mA mA V V V A A V V V A A V V V ns ns ns ns

2 16 44 16 16 0.3

6 24 4 60 22 24 1.5 VSS 7 10

Input Low Voltage (pin 2, 9, 12, 19) Input High Voltage (pin 2, 9, 12, 19) Low Voltage Input Current (pin 2, 9, 12, 19) High Voltage Input Current (pin 2, 9, 12, 19) Enable Low Voltage (pin 1, 11) Enable High Voltage (pin 1, 11) Low Voltage Enable Current (pin 1, 11) High Voltage Enable Current (pin 1, 11) Source Output Saturation Voltage (pins 3, 8, 13, 18) Sink Output Saturation Voltage (pins 3, 8, 13, 18) Clamp Diode Forward Voltage Rise Time (*) Fall Time (*) Turn-on Delay (*) Turn-off Delay (*) VSS 7 V VSS > 7 V Ven L = 1.5 V 2.3 V Ven H VSS 0.6 V IO = 0.6 A IO = + 0.6 A IO = 600nA 0.1 to 0.9 VO 0.9 to 0.1 VO 0.5 Vi to 0.5 VO 0.5 Vi to 0.5 VO VSS 7 V VSS > 7 V VIL = 1.5 V 2.3 V VIH VSS 0.6 V

2.3 2.3

30 0.3 2.3 2.3 30

100 1.5 VSS 7 100 10

1.4 1.2 1.3 250 250 750 200

1.8 1.8

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TRUTH TABLE (one channel)
Inpu t H L H L Enable (*) H H L L Output H L Z Z

Figure 1: Switching Times

Z = High output impedance (*) Relative to the considered channel

Figure 2: Junction to ambient thermal resistance vs. area on board heatsink (SO12+4+4 package)

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POWERDIP16 PACKAGE MECHANICAL DATA
DIM. MIN. a1 B b b1 D E e e3 F I L Z 3.30 1.27 8.80 2.54 17.78 7.10 5.10 0.130 0.050 0.38 0.51 0.85 0.50 0.50 20.0 0.346 0.100 0.700 0.280 0.201 0.015 1.40 mm TYP. MAX. MIN. 0.020 0.033 0.020 0.020 0.787 0.055 inch TYP. MAX.

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SO20 PACKAGE MECHANICAL DATA
DIM. MIN. A a1 a2 b b1 C c1 D E e e3 F G L M S 8.8 0.5 10 1.27 11.43 1 7.4 9.15 1.27 0.75 8 (max.) 0.346 0.020 0.35 0.23 0.5 45 1 12.6 10.65 0.394 0.050 0.450 0.039 0.291 0.360 0.050 0.030 0.1 mm TYP. MAX. 2.65 0.2 2.45 0.49 0.32 0.014 0.009 0.020 1.772 0.039 0.496 0.419 0.004 MIN. inch TYP. MAX. 0.104 0.008 0.096 0.019 0.013

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Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as criticalcomponents in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. 1996 SGS-THOMSON Microelectronics Printed in Italy All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.

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