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Boundary-Scan DFT Strategy for Multi-Chip Module Targeted Designs by Shiva Kumar K

in partial fulfillment of the requirements for the degree of Master of Technology in VLSI and Embedded systems Design

Abstract
With the limited accessibility in the Multi Chip Module (MCM) based design circuitry, Boundary-Scan plays a key role in testing of Interconnects and I/Os of MCM at Printed Circuit Board (PCB) level. With advances in MCM technology, more and more JTAG compatible cores with Boundary-Scan Description Language (BSDL) file describing its Boundary-Scan test logic are being integrated in MCM.This poses challenge in making the MCM as a single IEEE 1149.1 JTAG standard compliant device with single BSDL file. This necessitates in developing a generic Boundary-Scan insertion methodology for MCM based designs making it a Boundary-Scan compatible device. In this thesis, a Boundary-Scan insertion methodology is presented for two cores MCM which includes generating BSDL file with less manual intervention. The methodology is then extended to four cores MCM and verified for Boundary-Scan compliancy. Several issues encountered were examined and solution to overcome the issues with the proposed methodology was developed. Finally a Generic Boundary-scan insertion methodology is developed for MCM based designs making it a Boundary-Scan compatible device with a single BSDL file. This methodology can be implemented for any number of cores in the MCM environment.

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