Professional Documents
Culture Documents
Slau 318 C
Slau 318 C
User's Guide
Contents
Preface ....................................................................................................................................... 4 1 MSP-EXP430G2 LaunchPad Overview ................................................................................... 5
6 7
.................................................................................................................. 5 .............................................................................................................. 6 1.3 Revisions ................................................................................................................. 7 Installation ......................................................................................................................... 7 2.1 Download the Required Software ..................................................................................... 7 2.2 Install the Software ...................................................................................................... 7 2.3 Install the Hardware ..................................................................................................... 7 Getting Started With MSP-EXP430G2 LaunchPad .................................................................... 8 3.1 Getting Started ........................................................................................................... 8 3.2 Demo Application, Internal Temperature Measurement ............................................................ 8 Develop an Application With the MSP-EXP430G2 LaunchPad ................................................... 9 4.1 Developing an Application .............................................................................................. 9 4.2 Program and Debug the Temperature Measurement Demo Application ........................................ 9 4.3 Disconnect Emulator From Target With Jumper J3 ............................................................... 10 4.4 Program Connected eZ430 Target Boards ......................................................................... 11 4.5 Connecting a Crystal Oscillator ...................................................................................... 11 4.6 Connecting a Satellite Board ......................................................................................... 12 4.7 Supported Devices ..................................................................................................... 12 4.8 MSP-EXP430G2 On-Board Emulator ............................................................................... 13 MSP-EXP430G2 Hardware .................................................................................................. 14 5.1 Device Pinout ........................................................................................................... 14 5.2 Schematics ............................................................................................................. 15 5.3 PCB Layout ............................................................................................................. 21 5.4 Bill of Materials (BOM) ................................................................................................ 24 Suggested Reading ........................................................................................................... 25 Frequently Asked Questions (FAQ) ...................................................................................... 25
1.1 1.2 Overview Kit Contents
Table of Contents
www.ti.com
List of Figures
1 2 3 4 5 6 7 8 9 10 11 12 13 14 MSP-EXP430G2 LaunchPad Overview .................................................................................. 6 Insert Device Into Target Socket .......................................................................................... 9 Code Composer Studio v4 in Debugging Mode .................................................................... 10 MSP-EXP430G2 LaunchPad With Attached eZ430-RF2500 Target Board ....................................... 11 Device Pinout .............................................................................................................. 14 Schematics, MSP-EXP430G2 Emulator (1 of 2), Revision 1.4 ...................................................... 15 Schematics, MSP-EXP430G2 Emulator (2 of 2), Revision 1.4 ...................................................... 16 Schematics, MSP-EXP430G2 Target Socket, Revision 1.4 ......................................................... 17 Schematics, MSP-EXP430G2 Emulator (1 of 2), Revision 1.5 ...................................................... 18 Schematics, MSP-EXP430G2 Emulator (2 of 2), Revision 1.5 ...................................................... 19 Schematics, MSP-EXP430G2 Target Socket, Revision 1.5 ......................................................... 20 Layout, LaunchPad Top Layer ........................................................................................... 21 Layout, LaunchPad Bottom Layer ....................................................................................... 22 Layout, LaunchPad Silkscreen
23
1 2 3 4 5
Jumper Connection J3 Between Emulator and Target ............................................................... 10 eZ430 Debugging Interface .............................................................................................. 11 Supported Devices ........................................................................................................ 12 Features Supported by On-Board Emulator ........................................................................... 13 Bill of Materials............................................................................................................. 24
List of Figures
Preface
SLAU318C July 2010 Revised August 2012
FCC Warning
This equipment is intended for use in a laboratory test environment only. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case, the user will be required to take whatever measures may be required to correct this interference his own expense.
MSP430, Code Composer Studio are trademarks of Texas Instruments. IAR Embedded Workbench is a trademark of IAR Systems. All other trademarks are the property of their respective owners. 4 Preface SLAU318C July 2010 Revised August 2012 Submit Documentation Feedback
Copyright 20102012, Texas Instruments Incorporated
User's Guide
SLAU318C July 2010 Revised August 2012
1 1.1
www.ti.com
Figure 1. MSP-EXP430G2 LaunchPad Overview For latest information on the MSP-EXP430G2 LaunchPad and all the necessary files, visit the MSP430 LaunchPad Wiki page http://processors.wiki.ti.com/index.php/MSP430_LaunchPad_(MSP-EXP430G2). There you can find software examples, more details on the supported software, and where to order the MSP-EXP430G2 LaunchPad.
1.2
Kit Contents
The MSP-EXP430G2 experimenter kit includes the following hardware: LaunchPad emulator socket board (MSP-EXP430G2) Mini USB-B cable, 0.5 m Two MSP430 flash devices MSP430G2553: Low-power 16-bit MSP430 microcontroller with an 8-channel 10-bit ADC, on-chip comparator, touch-sense enabled I/Os, universal serial communication interface, 16kB flash memory, and 512 bytes of RAM (preloaded with a sample program) MSP430G2452: Low-power 16-bit MSP430 microcontroller with an 8-channel 10-bit ADC, on-chip comparator, touch-sense enabled I/Os, universal serial interface, 8kB flash memory, and 256 bytes of SRAM Two 10-pin PCB connectors female 32.768-kHz clock crystal from Micro Crystal (http://www.microcrystal.com) Quick start guide Two LaunchPad stickers
www.ti.com
Installation
1.3
Revisions
The first production revision of the LaunchPad in 2010 was 1.3. In 2012 the LaunchPad board revision changed from 1.4 to 1.5 to align with the new release of Value Line devices. The differences in the schematic and the kit contents are: Layout and Schematic: Voltage feedback in the emulator changed to increase startup stability (Rev 1.3 to Rev 1.4) Rearranged jumper J3 to support a vertical jumpers position for the UART lines VCC on the connector J4 can now be disconnected from the emulator VCC by J3 Pullup resistor R34 and capacitor C24 on P1.3 removed to reduce the current consumption Presoldered male headers J1 and J2
Installation
The MSP-EXP430G2 LaunchPad installation consists of three easy steps: 1. Download the required software. 2. Install the selected IDE. 3. Connect the LaunchPad to the PC. Then the LaunchPad is ready to develop applications or to use the pre-programmed demo application.
2.1
2.2
2.3
www.ti.com
3 3.1
3.2
www.ti.com
4 4.1
Figure 2. Insert Device Into Target Socket The following example for Code Composer Studio v4 shows how to download and debug the demo application described in Section 3.2.
4.2
www.ti.com
4.3
Jumpers 4 and 5 connect the UART interface of the emulator to the target device pins P1.1 and P1.2. The direction of the UART signal lines can be selected by the orientation of the attached jumpers. In horizontal orientation, the jumpers connect TXD to P1.1 and RXD to P1.2, as they are used for the software UART communication on the demo application (see Section 3.2). In vertical orientation, the jumpers connect the TXD signal to P1.2 and the RXD signal to P1.1, as required for the MSP430G2553 USCI.
10 MSP-EXP430G2 LaunchPad Experimenter Board SLAU318C July 2010 Revised August 2012 Submit Documentation Feedback
www.ti.com
4.4
Figure 4. MSP-EXP430G2 LaunchPad With Attached eZ430-RF2500 Target Board To program the attached target without interfering with the LaunchPad socket board, jumper connections TEST and RST of J3 must be open. The interface to the eZ430 target board is always connected to the MSP-EXP430G2 emulator, so the programming and debugging of a connected LaunchPad target device is possible only if the eZ430 target is not connected on the same time. The application UART, on the other hand, is connected directly to the LaunchPad target device, and jumper J3 can be closed to monitor the transmission from the LaunchPad target to the attached eZ430. This way both possible connections, from the device to the PC and from the device to the eZ430, can be established without changing the direction of the UART pins. The VCC connection to the eZ430 interface is directly connected to the LaunchPad target VCC and can be separated with jumper J3, if the LaunchPad itself should be powered via a connected battery on J4. To supply the eZ430 interface with the onboard emulator the jumper J3 VCC needs to be closed. Table 2 shows the pinout of the eZ430 debugging interface J4, the first pin is the left pin located on the emulator part of the LaunchPad. Table 2. eZ430 Debugging Interface
Pin 1 2 3 4 5 6 Signal TXD VCC TEST / SBWTCK RST / SBWTDIO GND RXD Description UART transmit data output (UART communication from PC or MSP430G2xx to eZ430 target board) Power supply voltage (J3 VCC needs to be closed to supply via onboard emulator) Test mode for JTAG pins and Spy-Bi-Wire test clock input during programming and test Reset, Spy-Bi-Wire test data input/output during programming and test Power supply ground UART receive data input (UART communication from eZ430 target board to PC or MSP430G2xx)
4.5
11
www.ti.com
4.6
4.7
Supported Devices
Texas Instruments offers several MSP430 devices in a PDIP package that is compatible with LaunchPad. Table 3 shows the supported devices. Table 3. Supported Devices
Part Number MSP430F2001 MSP430F2002 MSP430F2003 MSP430F2011 MSP430F2012 MSP430F2013 MSP430G2001 MSP430G2101 MSP430G2111 MSP430G2121 MSP430G2131 MSP430G2201 MSP430G2211 MSP430G2221 MSP430G2231 MSP430G2102 MSP430G2202 MSP430G2302 MSP430G2402 MSP430G2112 MSP430G2212 MSP430G2312 MSP430G2412 MSP430G2132 MSP430G2232 MSP430G2332 MSP430G2432 Family F2xx F2xx F2xx F2xx F2xx F2xx G2xx G2xx G2xx G2xx G2xx G2xx G2xx G2xx G2xx G2xx G2xx G2xx G2xx G2xx G2xx G2xx G2xx G2xx G2xx G2xx G2xx Description 16-bit Ultra-Low-Power Microcontroller, 1kB Flash, 128B RAM, Comparator 16-bit Ultra-Low-Power Microcontroller, 1kB Flash, 128B RAM, 10-Bit SAR A/D, USI for SPI/I2C 16-bit Ultra-Low-Power Microcontroller, 1kB Flash, 128B RAM, 16-Bit Sigma-Delta A/D, USI for SPI/I2C 16-bit Ultra-Low-Power Microcontroller, 2kB Flash, 128B RAM, Comparator 16-bit Ultra-Low-Power Microcontroller, 2kB Flash, 128B RAM, 10-Bit SAR A/D, USI for SPI/I2C 16-bit Ultra-Low-Power Microcontroller, 2kB Flash, 128B RAM, 16-Bit Sigma-Delta A/D, USI for SPI/I2C 16-bit Ultra-Low-Power Microcontroller, 512B Flash, 128B RAM 16-bit Ultra-Low-Power Microcontroller, 1kB Flash, 128B RAM 16-bit Ultra-Low-Power Microcontroller, 1kB Flash, 128B RAM, Comparator 16-bit Ultra-Low-Power Microcontroller, 1kB Flash, 128B RAM, USI for SPI/I2C 16-bit Ultra-Low-Power Microcontroller, 1kB Flash, 128B RAM, 10-Bit SAR A/D, USI for SPI/I2C 16-bit Ultra-Low-Power Microcontroller, 2kB Flash, 128B RAM 16-bit Ultra-Low-Power Microcontroller, 2kB Flash, 128B RAM, Comparator 16-bit Ultra-Low-Power Microcontroller, 2kB Flash, 128B RAM, USI for SPI/I2C 16-bit Ultra-Low-Power Microcontroller, 2kB Flash, 128B RAM, 10-Bit SAR A/D, USI for SPI/I2C 16-bit Ultra-Low-Power Microcontroller, 1kB Flash, 256B RAM, USI for SPI/I2C, 16 Touch-Sense Enabled I/O Pins 16-bit Ultra-Low-Power Microcontroller, 2kB Flash, 256B RAM, USI for SPI/I2C, 16 Touch-Sense Enabled I/O Pins 16-bit Ultra-Low-Power Microcontroller, 4kB Flash, 256B RAM, USI for SPI/I2C, 16 Touch-Sense Enabled I/O Pins 16-bit Ultra-Low-Power Microcontroller, 8kB Flash, 256B RAM, USI for SPI/I2C, 16 Touch-Sense Enabled I/O Pins 16-bit Ultra-Low-Power Microcontroller, 1kB Flash, 256B RAM, Comparator, USI for SPI/I2C, 16 TouchSense Enabled I/O Pins 16-bit Ultra-Low-Power Microcontroller, 2kB Flash, 256B RAM, Comparator, USI for SPI/I2C, 16 TouchSense Enabled I/O Pins 16-bit Ultra-Low-Power Microcontroller, 4kB Flash, 256B RAM, Comparator, USI for SPI/I2C, 16 TouchSense Enabled I/O Pins 16-bit Ultra-Low-Power Microcontroller, 8kB Flash, 256B RAM, Comparator, USI for SPI/I2C, 16 TouchSense Enabled I/O Pins 16-bit Ultra-Low-Power Microcontroller, 1kB Flash, 256B RAM, 10-Bit SAR A/D, USI for SPI/I2C, 16 Touch-Sense Enabled I/O Pins 16-bit Ultra-Low-Power Microcontroller, 2kB Flash, 256B RAM, 10-Bit SAR A/D, USI for SPI/I2C, 16 Touch-Sense Enabled I/O Pins 16-bit Ultra-Low-Power Microcontroller, 4kB Flash, 256B RAM, 10-Bit SAR A/D, USI for SPI/I2C, 16 Touch-Sense Enabled I/O Pins 16-bit Ultra-Low-Power Microcontroller, 8kB Flash, 256B RAM, 10-Bit SAR A/D, USI for SPI/I2C, 16 Touch-Sense Enabled I/O Pins SLAU318C July 2010 Revised August 2012 Submit Documentation Feedback
12
www.ti.com
4.8
13
MSP-EXP430G2 Hardware
www.ti.com
5 5.1
14
MSP-EXP430G2 Hardware
C1
TP6TP4TP2 TP7TP5TP3TP1
EZ_VBUS RESET
10n R1 47k
RESET EZ_VCC
C2 16p C3
GND
Q1 12MHz
16p
GND
GND
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
CLK3410 EZ_VCC
R2 47k R3 47k
C4 1u/6.3V 100n
C5
15
EZ_VCC GND
R26 270 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
SBW & UART I/F to Argon SBWTCK 10 SBWTDIO 8 6 BTXD 4 BRXD EZ_VCC 2 RST3410 J3
9 7 5 3 1
SBW & UART I/F to external Target BRXDI BTXDI URXD UTXD
R6 R7 100R 100R
1 2 3 4 5 6
SL127L6TH
SCL SDA
1.4
SLAU318C July 2010 Revised August 2012 Submit Documentation Feedback www.ti.com
5.2
Schematics
LED0 green
www.ti.com
U2 EZ_VBUS
C7 100n 5 6 3 4 IN1 OUT1 IN2 OUT2 GND RES EN FB 8 7 2 1
VCC = +3.6V
R8 61k5
C6
1u/6.3V
EZ_VCC
R10 10k R11 15k R12 1u/6.3V C8 33k VREGEN RESET WAKEUP SUSPEND CLKOUT SIN SOUT SDA SCL P3.0 P3.1 P3.3 P3.4 X1 X2 CTS DSR DCD RI/CP RTS DTR TEST0 TEST1 VCC VCC1 VDD18 GND GND1 GND2 13 14 15 16 20 21 23 24 3 25 4 8 18 28 PUR DP DM 1 9 12 2 22 17 19 10 11 32 31 30 29 R19 3k3 R22 3k3 27 26 5 6 7 R13 1k5
RST3410
D1 1N4148
EZ_VBUS
R15 33R R14 33R
VBUS
EZ_DEZ_D+
D-
R16 47k
D+
ID
GND
SHIELD1
CLK3410
SHIELD2
S3
GND NC IO2 IO1 VCC
TUSB3410VF
100n
SHIELD3
S4
GND
GND
U5
1 2 3 E0 E1 E2 4 SDA SCL WC VSS VCC 5 6 7 8
MSP-EXP430G2 Hardware
EZ_VCC
EZ_VCC CAT24FC32UI
C13 100n
GND
GND
1.4
16
R23 100R
SHIELD4
GND
GND
GND
USB_MINI_B5
GND
GND
EZ_VCC
MSP-EXP430G2 Hardware
Ext_PWR J6
1 2 3
17
P1.3
S1 S2
2
GND VCC
C20 100nF
C23 10uF/10V
R29 1 2 3 4 5 6 7 8 9 10
R34 47K
C21 12pF
XIN
0R
DNP DNP
R28 0R R32 J5-1 270R R33 J5-2 470R
3 4
DNP
C22 12pF
GND XOUT
VCC P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P2.0 P2.1 P2.2
1 2
GND XIN XINR XOUTR XOUT TEST/SBWTCK RST/SBWTDIO P1.7 P1.6 P2.5 P2.4 P2.3 P1.0
C14 1nF
20 19 18 17 16 15 14 13 12 11
J1
J2
C24 100nF
P1.6
GND DNP
1.4
www.ti.com
QUARZ5 Q2
www.ti.com
C1
TP6TP4TP2 TP7TP5TP3TP1
EZ_VBUS RESET
10n R1 47k
RESET EZ_VCC
C2 16p C3
GND
Q1 12MHz
16p
GND
GND
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
CLK3410 EZ_VCC
R2 47k R3 47k
C4 1u/6.3V 100n
C5
9 7 5 3 1
LED0 green
SBW & UART I/F to external Target BRXDI BTXDI URXD UTXD
R6 R7 100R 100R
J4
1 2 3 4 5 6
SL127L6TH
SCL SDA
MSP-EXP430G2 Hardware
1.5
18
MSP-EXP430G2 Hardware
U2 EZ_VBUS
C7 100n 5 6 3 4 IN1 OUT1 IN2 OUT2 GND RES EN FB 8 7 2 1
VCC = +3.6V
R8 61k5
C6
1u/6.3V
EZ_VCC
R10 10k R11 15k R12 1u/6.3V C8 33k VREGEN RESET WAKEUP SUSPEND CLKOUT PUR DP DM CTS DSR DCD RI/CP RTS DTR TEST0 TEST1 VCC VCC1 VDD18 GND GND1 GND2 13 14 15 16 20 21 23 24 3 25 4 8 18 28 SIN SOUT SDA SCL P3.0 P3.1 P3.3 P3.4 X1 X2 1 9 12 2 22 5 6 7 17 19 10 11 32 31 30 29 R19 3k3 R22 3k3 27 26 R13 1k5
RST3410
D1 1N4148
EZ_VBUS
R15 33R R14 33R
VBUS
EZ_DEZ_D+
D-
R16 47k
D+
ID
GND
SHIELD1
CLK3410
SHIELD2
S3
GND NC IO2 IO1 VCC
TUSB3410VF
100n
SHIELD3
S4
R23 100R
SHIELD4
GND
GND GND
GND GND
GND
USB_MINI_B5
R24 1k5
R25 1k5
U5
1 2 3 E0 E1 E2 4 SDA SCL WC VSS VCC 5 6 7 8
EZ_VCC
EZ_VCC CAT24FC32UI
C13 100n
GND
GND
1.5
SLAU318C July 2010 Revised August 2012 Submit Documentation Feedback www.ti.com
SCL SDA
GND
GND
EZ_VCC
19
www.ti.com
Ext_PWR J6
1 2 3
RST/SBWTDIO
2
P1.3
S1 S2
2
C23 10uF/10V
R29 1 2 3 4 5 6 7 8 9 10
R34 47K
R27 47K
C21 12pF
XIN
0R
DNP DNP
R28 0R R32 J5-1
DNP
C22 12pF
GND XOUT J1
VCC P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P2.0 P2.1 P2.2
C24 100nF
GND XIN XINR XOUTR XOUT TEST/SBWTCK RST/SBWTDIO P1.7 P1.6 P2.5 P2.4 P2.3
C14 1nF
20 19 18 17 16 15 14 13 12 11
J2
P1.6
GND
GND
MSP-EXP430G2 Hardware
1.5
20
www.ti.com
MSP-EXP430G2 Hardware
5.3
PCB Layout
21
MSP-EXP430G2 Hardware
www.ti.com
22
www.ti.com
MSP-EXP430G2 Hardware
23
MSP-EXP430G2 Hardware
www.ti.com
5.4
24
www.ti.com
Suggested Reading
Suggested Reading
The primary sources of MSP430 information are the device-specific data sheets and the family user's guides. The most up-to-date versions of those documents can be found at the Texas Instruments MSP430 page or the MSP430 LaunchPad wiki. http://www.ti.com/msp430, http://processors.wiki.ti.com/index.php/MSP430_LaunchPad_(MSP-EXP430G2) To get an inside view of the supporting IDEs like CCS and IAR, download the latest version from the web pages above and read the included user's guides and documentation inside the installation folder. Documents describing the IAR tools (Workbench/C-SPY, the assembler, the C compiler, the linker, and the library) are located in common\doc and 430\doc. All necessary CCS documents can be found in the msp430\doc folder in the CCS installation path. The FET user's guide also includes detailed information on how to set up a project for the MSP430 using IAR or CCS, and it is included in most of the IDE releases and on the TI MSP430 side.
25
www.ti.com
Experimenter Board and restarting the communicating application. Also make sure that all the jumpers on J3 are connected properly between the emulator and the target device. On revision 1.5 and newer, the orientation of the UART jumpers must align with the software implementation on the target device. 7. I soldered the 32-kHz crystal to the board and the oscillation is not starting. The MSP430 driving capabilities for the low-frequency crystal is limited, because it is designed for lowpower applications. To ensure proper operation, the load on these pins must be as small as possible, the matching capacitors (12.5 pF for 32.768 kHz) for the crystal must be soldered to the board, and the resistors R28 and R29 must be removed. Measuring the frequency of the oscillation with an oscilloscope typically disturbs the oscillation. 8. The power consumption of the board is much higher than specified in the device data sheet, or I am not measuring a current at all. The MSP430 device inside of the LaunchPad socket can be powered with an external power supply at header J6 or J4. To measure the power consumption in this mode, the VCC jumper, usually used to measure the power consumption, must be removed, and the current must be measured directly at the power supply. If the jumper J3 is not removed, the emulator circuitry of the LaunchPad is powered as well. Measuring the current consumption during a debug session is not possible, because the cross current through the JTAG connection influences the measurement. The most accurate results are achieved with all jumpers on J3 removed. If the measurement is still not matching the data sheet parameters, make sure that the code is aligned with all the power saving recommendations on the web site MSP430 - The World's Lowest Power MCU. LaunchPad revisions 1.3 and 1.4 come with R34 populated. The 47-k resistor is used as a pullup for the button S2. If the port P1.3 is driven to ground, as suggested to keep the power consumption down, the pullup resistor generates an additional current of approximately 77 A. To reduce the power consumption, the port should stay in input mode or the resistor should be removed if button S2 is not used. The internal pullup of the MSP430G2xx can be used instead.
26
FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. For EVMs annotated as IC INDUSTRY CANADA Compliant This Class A or B digital apparatus complies with Canadian ICES-003. Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. Concerning EVMs including radio transmitters This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concerning EVMs including detachable antennas Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Cet appareil numrique de la classe A ou B est conforme la norme NMB-003 du Canada. Les changements ou les modifications pas expressment approuvs par la partie responsable de la conformit ont pu vider lautorit de l'utilisateur pour actionner l'quipement. Concernant les EVMs avec appareils radio Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Concernant les EVMs avec antennes dtachables Conformment la rglementation d'Industrie Canada, le prsent metteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur) approuv pour l'metteur par Industrie Canada. Dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) ne dpasse pas l'intensit ncessaire l'tablissement d'une communication satisfaisante. Le prsent metteur radio a t approuv par Industrie Canada pour fonctionner avec les types d'antenne numrs dans le manuel dusage et ayant un gain admissible maximal et l'impdance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est suprieur au gain maximal indiqu, sont strictement interdits pour l'exploitation de l'metteur.
2. 3.
http://www.tij.co.jp
SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER
2.
3. 4.
Certain Instructions. It is important to operate this EVM within TIs recommended specifications and environmental considerations per the user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 60C as long as the input and output are maintained at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use these EVMs. Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected. Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2012, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Audio Amplifiers Data Converters DLP Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID OMAP Mobile Processors Wireless Connectivity www.ti.com/audio amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/omap www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2012, Texas Instruments Incorporated TI E2E Community e2e.ti.com Applications Automotive and Transportation www.ti.com/automotive Communications and Telecom www.ti.com/communications Computers and Peripherals Consumer Electronics Energy and Lighting Industrial Medical Security Space, Avionics and Defense Video and Imaging www.ti.com/computers www.ti.com/consumer-apps www.ti.com/energy www.ti.com/industrial www.ti.com/medical www.ti.com/security www.ti.com/space-avionics-defense www.ti.com/video