74HC244; 74HCT244

Octal buffer/line driver; 3-state

Rev. 4 24 September 2012 Product data sheet

1. General description
The 74HC244; 74HCT244 is an 8-bit buffer/line driver with 3-state outputs. The device can be used as two 4-bit buffers or one 8-bit buffer. The device features two output enables (1OE and 2OE), each controlling four of the 3-state outputs. A HIGH on nOE causes the outputs to assume a high-impedance OFF-state. Inputs include clamp diodes that enable the use of current limiting resistors to interface inputs to voltages in excess of VCC.

2. Features and benefits

Input levels: For 74HC244: CMOS level For 74HCT244: TTL level Octal bus interface Non-inverting 3-state outputs Complies with JEDEC standard no. 7 A ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V Multiple package options Specified from 40 C to +85 C and 40 C to +125 C

3. Ordering information
Table 1. Ordering information Package Temperature range 74HC244N 74HCT244N 74HC244D 74HCT244D 74HC244DB 74HCT244DB 74HC244PW 74HCT244PW 74HC244BQ 74HCT244BQ 40 C to +125 C 40 C to +125 C TSSOP20 40 C to +125 C SSOP20 40 C to +125 C SO20 plastic small outline package; 20 leads; body width 7.5 mm plastic shrink small outline package; 20 leads; body width 5.3 mm plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT163-1 SOT339-1 SOT360-1 40 C to +125 C Name DIP20 Description plastic dual in-line package; 20 leads (300 mil) Version SOT146-1 Type number

DHVQFN20 plastic dual-in-line compatible thermal enhanced SOT764-1 very thin quad flat package; no leads; 20 terminals; body 2.5 4.5 0.85 mm

NXP Semiconductors

74HC244; 74HCT244
Octal buffer/line driver; 3-state

4. Functional diagram

1A0

1Y0

18

1A1

1Y1

16

1A2

1Y2

14

8 1

1A3 1OE

1Y3

12

17

2A0

2Y0

15

2A1

2Y1

13

2A2

2Y2

11 19

2A3 2OE

2Y3

mna875

Fig 1.

Functional diagram

EN 18 16 14 12

1A0

18

1Y0

2A0

17

2Y0

2 4

1A1

16

1Y1

2A1

15

2Y1

6 8

1A2

14

1Y2

2A2

13

2Y2 19 EN 9 7 5 3
mna873

1A3 1OE

8 1

12

1Y3

2A3 2OE

11 19

2Y3 11 13

mna874

15 17

Fig 2.

Logic symbol

Fig 3.

IEC logic symbol

74HC_HCT244

All information provided in this document is subject to legal disclaimers.

NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 4 24 September 2012

2 of 18

NXP Semiconductors

74HC244; 74HCT244
Octal buffer/line driver; 3-state

5. Pinning information
5.1 Pinning

74HC244 74HCT244
1OE 1A0 2Y0 1A1 2Y1 1A2 2Y2 1A3 2Y3 1 2 3 4 5 6 7 8 9 20 VCC 19 2OE 18 1Y0 17 2A0 16 1Y1 15 2A1 14 1Y2 13 2A2 12 1Y3 11 2A3
001aae011

74HC244 74HCT244
1OE 2 3 4 5 6 7 8 9 GND 10 2A3 11 GND (1) 1 terminal 1 index area 1A0 2Y0 1A1 2Y1 1A2 2Y2 1A3 2Y3 20 VCC 19 2OE 18 1Y0 17 2A0 16 1Y1 15 2A1 14 1Y2 13 2A2 12 1Y3

GND 10

001aae012

Transparent top view

(1) This is not a supply pin. The substrate is attached to this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to GND.

Fig 4.

Pin configuration DIP20, SO20, (T)SSOP20

Fig 5.

Pin configuration DHVQFN20

5.2 Pin description

Table 2. Symbol 1OE, 2OE 1A0, 1A1, 1A2, 1A3 2Y0, 2Y1, 2Y2, 2Y3 GND 2A0, 2A1, 2A2, 2A3 1Y0, 1Y1, 1Y2, 1Y3 VCC Pin description Pin 1, 19 2, 4, 6, 8 3, 5, 7, 9 10 17, 15, 13, 11 18, 16, 14, 12 20 Description output enable input (active LOW) data input bus output ground (0 V) data input bus output supply voltage

74HC_HCT244

All information provided in this document is subject to legal disclaimers.

NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 4 24 September 2012

3 of 18

NXP Semiconductors

74HC244; 74HCT244
Octal buffer/line driver; 3-state

6. Functional description
Table 3. Input nOE L L H
[1]

Function table[1] Output nAn L H X nYn L H Z

H = HIGH voltage level; L = LOW voltage level; X = dont care; Z = high-impedance OFF-state.

7. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK IOK IO ICC IGND Tstg Ptot Parameter supply voltage input clamping current output clamping current output current supply current ground current storage temperature total power dissipation DIP20 package SO20, SSOP20, TSSOP20 and DHVQFN20 packages
[1] [2] For DIP20 package: Ptot derates linearly with 12 mW/K above 70 C. For SO20 packages: Ptot derates linearly with 8 mW/K above 70 C. For SSOP20 and TSSOP20 packages: Ptot derates linearly with 5.5 mW/K above 60 C. For DHVQFN20 packages: above 60 C, Ptot derates linearly with 4.5 mW/K.
[1] [2]

Conditions VI < 0.5 V or VI > VCC + 0.5 V VO < 0.5 V or VO > VCC + 0.5 V 0.5 V < VO < VCC + 0.5 V

Min 0.5 70 65 -

Max +7 20 20 35 70 +150 750 500

Unit V mA mA mA mA mA C mW mW

8. Recommended operating conditions

Table 5. Symbol 74HC244 VCC VI VO t/V supply voltage input voltage output voltage input transition rise and fall rate VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V Tamb ambient temperature 2.0 0 0 40 5.0 1.67 6.0 VCC VCC 625 139 83 +125 V V V ns/V ns/V ns/V C Recommended operating conditions Parameter Conditions Min Typ Max Unit

74HC_HCT244

All information provided in this document is subject to legal disclaimers.

NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 4 24 September 2012

4 of 18

NXP Semiconductors

74HC244; 74HCT244
Octal buffer/line driver; 3-state

Table 5. Symbol 74HCT244 VCC VI VO t/V Tamb

Recommended operating conditions continued Parameter supply voltage input voltage output voltage input transition rise and fall rate VCC = 4.5 V ambient temperature Conditions Min 4.5 0 0 40 Typ 5.0 1.67 Max 5.5 VCC VCC 139 +125 Unit V V V ns/V C

9. Static characteristics
Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 74HC244 VIH HIGH-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VIL LOW-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VOH HIGH-level VI = VIH or VIL output voltage IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 6.0 mA; VCC = 4.5 V IO = 7.8 mA; VCC = 6.0 V VOL LOW-level VI = VIH or VIL output voltage IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 6.0 mA; VCC = 4.5 V IO = 7.8 mA; VCC = 6.0 V II IOZ input leakage current OFF-state output current VI = VCC or GND; VCC = 6.0 V per input pin; VI = VIH or VIL; VO = VCC or GND; other inputs at VCC or GND; VCC = 6.0 V; IO = 0 A 1.5 3.15 4.2 1.9 4.4 5.9 1.2 2.4 3.2 0.8 2.1 2.8 2.0 4.5 6.0 0.5 1.35 1.8 0.1 0.1 0.1 0.26 0.26 0.1 0.5 1.5 3.15 4.2 1.9 4.4 5.9 3.84 5.34 0.5 1.35 1.8 0.1 0.1 0.1 0.33 0.33 1.0 5.0 1.5 3.15 4.2 1.9 4.4 5.9 3.7 5.2 0.5 1.35 1.8 0.1 0.1 0.1 0.4 0.4 1.0 10 V V V V V V V V V V V V V V V V A A Conditions Min 25 C Typ Max 40 C to +85 C 40 C to +125 C Unit Min Max Min Max

3.98 4.32 5.48 5.81 0 0 0 0.15 0.16 -

ICC CI

supply current VI = VCC or GND; IO = 0 A; VCC = 6.0 V input capacitance

3.5

8.0 -

80 -

160 -

A pF

74HC_HCT244

All information provided in this document is subject to legal disclaimers.

NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 4 24 September 2012

5 of 18

NXP Semiconductors

74HC244; 74HCT244
Octal buffer/line driver; 3-state

Table 6. Static characteristics continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 74HCT244 VIH VIL VOH HIGH-level input voltage LOW-level input voltage VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V 2.0 1.6 1.2 0.8 2.0 0.8 2.0 0.8 V V Conditions Min 25 C Typ Max 40 C to +85 C 40 C to +125 C Unit Min Max Min Max

HIGH-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = 20 A IO = 6 mA LOW-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = 20 A IO = 6.0 mA input leakage current OFF-state output current VI = VCC or GND; VCC = 5.5 V per input pin; VI = VIH or VIL; VO = VCC or GND; other inputs at VCC or GND; VCC = 5.5 V; IO = 0 A

4.4

4.5

0.1 0.26 0.1 0.5

4.4 3.84 -

0.1 0.33 1.0 5.0

4.4 3.7 -

0.1 0.4 1.0 10

V V V V A A

3.98 4.32 0 0.16 -

VOL

II IOZ

ICC ICC

supply current VI = VCC or GND; VCC = 5.5 V; IO = 0 A additional per input pin; supply current VI = VCC 2.1 V; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V; IO = 0 A input capacitance

70

8.0 252

80 315

160 343

A A

CI

3.5

pF

10. Dynamic characteristics

Table 7. Dynamic characteristics GND = 0 V; for load circuit see Figure 8. Symbol Parameter Conditions Min 74HC244 tpd propagation delay nAn to nYn; see Figure 6 VCC = 2.0 V VCC = 4.5 V VCC = 5.0 V; CL = 15 pF VCC = 6.0 V 30 11 9 9 110 22 19 145 28 24 165 33 28 ns ns ns ns
[1]

25 C Typ Max

40 C to +125 C Unit Max (85 C) Max (125 C)

74HC_HCT244

All information provided in this document is subject to legal disclaimers.

NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 4 24 September 2012

6 of 18

NXP Semiconductors

74HC244; 74HCT244
Octal buffer/line driver; 3-state

Table 7. Dynamic characteristics continued GND = 0 V; for load circuit see Figure 8. Symbol Parameter Conditions Min ten enable time nOE to nYn; see Figure 7 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V tdis disable time nOE to nYn or see Figure 7 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V tt transition time see Figure 6 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V CPD power dissipation capacitance per buffer; VI = GND to VCC
[5] [4] [3] [2]

25 C Typ Max

40 C to +125 C Unit Max (85 C) 190 38 33 190 38 33 75 15 13 Max (125 C) 225 45 38 225 45 38 90 18 15 ns ns ns ns ns ns ns ns ns pF

36 13 10 39 14 11 14 5 4 35

150 30 26 150 30 26 60 12 10 -

74HCT244 tpd propagation delay nAn to nYn; see Figure 6 VCC = 4.5 V VCC = 5.0 V; CL = 15 pF ten tdis tt CPD enable time disable time transition time power dissipation capacitance nOE to nYn; VCC = 4.5 V; see Figure 7 nOE to nYn; VCC = 4.5 V; see Figure 7 VCC = 4.5 V; see Figure 6 per buffer; VI = GND to VCC 1.5 V
[2] [1]

13 11 15 15 5 35

22 30 25 12 -

28 38 31 15 -

33 45 38 18 -

ns ns ns ns ns pF

[3]

[4] [5]

[1] [2] [3] [4] [5]

tpd is the same as tPHL and tPLH. ten is the same as tPZH and tPZL. tdis is the same as tPHZ and tPLZ. tt is the same as tTHL and tTLH. CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs.

74HC_HCT244

All information provided in this document is subject to legal disclaimers.

NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 4 24 September 2012

7 of 18

NXP Semiconductors

74HC244; 74HCT244
Octal buffer/line driver; 3-state

11. Waveforms
VI nAn input GND t PHL VOH nYn output VOL t THL 90 % VM 10 % t TLH
001aae013

VM

VM

t PLH

VM

Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load.

Fig 6.

Input (nAn) to output (nYn) propagation delays and output transition times

VI nOE input GND t PLZ VCC nYn output LOW-to-OFF OFF-to-LOW VOL t PHZ VOH nYn output HIGH-to-OFF OFF-to-HIGH GND outputs enabled outputs disabled outputs enabled
001aae014

VM

t PZL

VM VX t PZH VY VM

Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load.

Fig 7. Table 8. Type 74HC244

3-state enable and disable times Measurement points Input VM 0.5 VCC 1.3 V Output VM 0.5 VCC 1.3 V VX 0.1 VCC 0.1 VCC VY 0.9 VCC 0.9 VCC

74HCT244

74HC_HCT244

All information provided in this document is subject to legal disclaimers.

NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 4 24 September 2012

8 of 18

NXP Semiconductors

74HC244; 74HCT244
Octal buffer/line driver; 3-state

VI negative pulse 0V

tW 90 % VM 10 % tf tr tr tf 90 % VM 10 % tW VM VM

VI positive pulse 0V

VCC

VCC

VI

VO

RL

S1

DUT
RT CL

open

001aad983

Test data is given in Table 9. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. S1 = Test selection switch.

Fig 8. Table 9. Type 74HC244

Test circuit for measuring switching times Test data Input VI VCC 3V tr, tf 6 ns 6 ns Load CL 15 pF, 50 pF 15 pF, 50 pF RL 1 k 1 k S1 position tPHL, tPLH open open tPZH, tPHZ GND GND tPZL, tPLZ VCC VCC

74HCT244

74HC_HCT244

All information provided in this document is subject to legal disclaimers.

NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 4 24 September 2012

9 of 18

NXP Semiconductors

74HC244; 74HCT244
Octal buffer/line driver; 3-state

12. Package outline

DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1

D seating plane

ME

A2

A1

c Z e b1 b 20 11 MH w M (e 1)

pin 1 index E

10

5 scale

10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D
(1)

(1)

e 2.54 0.1

e1 7.62 0.3

L 3.60 3.05 0.14 0.12

ME 8.25 7.80 0.32 0.31

MH 10.0 8.3 0.39 0.33

w 0.254 0.01

Z (1) max. 2 0.078

26.92 26.54 1.060 1.045

6.40 6.22 0.25 0.24

Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT146-1 REFERENCES IEC JEDEC MS-001 JEITA SC-603 EUROPEAN PROJECTION

ISSUE DATE 99-12-27 03-02-13

Fig 9.
74HC_HCT244

Package outline SOT146-1 (DIP20)

All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 4 24 September 2012

10 of 18

NXP Semiconductors

74HC244; 74HCT244
Octal buffer/line driver; 3-state

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

A X

c y HE v M A

Z 20 11

Q A2 A1 pin 1 index Lp L 1 e bp 10 w M detail X (A 3) A

5 scale

10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.1 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.05 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)

8o o 0

0.9 0.4

0.012 0.096 0.004 0.089

0.019 0.013 0.014 0.009

0.419 0.043 0.055 0.394 0.016

0.035 0.004 0.016

Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013 JEITA EUROPEAN PROJECTION

ISSUE DATE 99-12-27 03-02-19

Fig 10. Package outline SOT163-1 (SO20)

74HC_HCT244 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 4 24 September 2012

11 of 18

NXP Semiconductors

74HC244; 74HCT244
Octal buffer/line driver; 3-state

SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm

SOT339-1

A X

c y HE v M A

Z
20 11

Q A2 pin 1 index A1 (A 3) Lp L
1 10

detail X

bp

w M

2.5 scale

5 mm

DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 7.4 7.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 0.9 0.5 8o o 0

Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT339-1 REFERENCES IEC JEDEC MO-150 JEITA EUROPEAN PROJECTION

ISSUE DATE 99-12-27 03-02-19

Fig 11. Package outline SOT339-1 (SSOP20)

74HC_HCT244 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 4 24 September 2012

12 of 18

NXP Semiconductors

74HC244; 74HCT244
Octal buffer/line driver; 3-state

TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm

SOT360-1

c y HE v M A

20

11

Q A2 pin 1 index A1 (A 3) A

Lp L

1
e bp

10
w M detail X

2.5 scale

5 mm

DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 6.6 6.4 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.5 0.2 8o o 0

Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19

Fig 12. Package outline SOT360-1 (TSSOP20)

74HC_HCT244 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 4 24 September 2012

13 of 18

NXP Semiconductors

74HC244; 74HCT244
Octal buffer/line driver; 3-state

DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm

A A1 E c

terminal 1 index area

detail X

terminal 1 index area e 2 L

e1 b 9 v M C A B w M C y1 C

C y

1 Eh 20

10 e 11

19 Dh 0

12 X 2.5 scale 5 mm

DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 4.6 4.4 Dh 3.15 2.85 E (1) 2.6 2.4 Eh 1.15 0.85 e 0.5 e1 3.5 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1

Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT764-1 REFERENCES IEC --JEDEC MO-241 JEITA --EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27

Fig 13. Package outline SOT764-1 (DHVQFN20)

74HC_HCT244 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 4 24 September 2012

14 of 18

NXP Semiconductors

74HC244; 74HCT244
Octal buffer/line driver; 3-state

13. Abbreviations
Table 10. Acronym CMOS DUT ESD HBM MM TTL Abbreviations Description Complementary Metal Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Machine Model Transistor-Transistor Logic

14. Revision history

Table 11. Revision history Release date 20120924 Data sheet status Product data sheet Change notice Supersedes 74HC_HCT244 v.3 Document ID 74HC_HCT244 v.4 Modifications:

The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Product data sheet Product specification 74HC_HCT244_CNV v.2 -

74HC_HCT244 v.3 74HC_HCT244_CNV v.2

20051222 19901201

74HC_HCT244

All information provided in this document is subject to legal disclaimers.

NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 4 24 September 2012

15 of 18

NXP Semiconductors

74HC244; 74HCT244
Octal buffer/line driver; 3-state

15. Legal information

15.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]

Product status[3] Development Qualification Production

Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.

Please consult the most recently issued document before initiating or completing a design. The term short data sheet is explained in section Definitions. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

15.2 Definitions
Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customers sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customers applications and products planned, as well as for the planned application and use of customers third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customers applications or products, or the application or use by customers third party customer(s). Customer is responsible for doing all necessary testing for the customers applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customers third party customer(s). NXP does not accept any liability in this respect. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customers general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP B.V. 2012. All rights reserved.

15.3 Disclaimers
Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

74HC_HCT244

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 24 September 2012

16 of 18

NXP Semiconductors

74HC244; 74HCT244
Octal buffer/line driver; 3-state
NXP Semiconductors specifications such use shall be solely at customers own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors standard warranty and NXP Semiconductors product specifications. Translations A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.

Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond

15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

16. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

74HC_HCT244

All information provided in this document is subject to legal disclaimers.

NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 4 24 September 2012

17 of 18

NXP Semiconductors

74HC244; 74HCT244
Octal buffer/line driver; 3-state

17. Contents
1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information.

NXP B.V. 2012.

All rights reserved.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 24 September 2012 Document identifier: 74HC_HCT244