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HC/HCT240 Inverting
[ /Title (CD74 HC240 , CD74 HCT24 0, CD74 HC241 , CD74 HCT24 1, CD74 HC244 , CD74
HC/HCT241 Non-Inverting HC/HCT244 Non-Inverting Typical Propagation Delay = 8ns at VCC = 5V, CL = 15pF, TA = 25oC for HC240 Three-State Outputs Buffered Inputs High-Current Bus Driver Outputs Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads Wide Operating Temperature Range . . . -55oC to 125oC Balanced Propagation Delay and Transition Times Signicant Power Reduction Compared to LSTTL Logic ICs HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il 1A at VOL, VOH
Ordering Information
PART NUMBER CD54HC240F3A CD74HC240E CD74HC240M CD54HCT240F3A CD74HCT240E CD74HCT240M CD74HC241E CD54HCT241F3A CD74HCT241E CD74HCT241M CD54HC244F CD54HC244F3A CD74HC244E CD74HC244M CD54HCT244F CD54HCT244F3A CD74HCT244E CD74HCT244M NOTES: 1. When ordering, use the entire part number. Add the sufx 96 to obtain the variant in the tape and reel. 2. Wafer and die for this part number is available which meets all electrical specifications. Please contact your local TI sales office or customer service for ordering information. TEMP. RANGE (oC) -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 PACKAGE 20 Ld CERDIP 20 Ld PDIP 20 Ld SOIC 20 Ld CERDIP 20 Ld PDIP 20 Ld SOIC 20 Ld PDIP 20 Ld CERDIP 20 Ld PDIP 20 Ld SOIC 20 Ld CERDIP 20 Ld CERDIP 20 Ld PDIP 20 Ld SOIC 20 Ld CERDIP 20 Ld CERDIP 20 Ld PDIP 20 Ld SOIC
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright
Pinout
CD54HC240, CD54HCT240, CD54HCT241, CD54HC244, CD54HCT244 (CERDIP) CD74HC240, CD74HCT240, CD74HC241, CD74HCT241, CD74HC244, CD74HCT244 (PDIP, SOIC) TOP VIEW
240 1OE 1A0 2Y3 1A1 2Y2 1A2 2Y1 1A3 2Y0 GND 241 244 1OE 1A0 2Y3 1A1 2Y2 1A2 2Y1 1A3 2Y0 1 2 3 4 5 6 7 8 9 241 244 20 VCC 18 1Y0 17 2A3 16 1Y1 15 2A2 14 1Y2 13 2A1 12 1Y3 11 2A0 240 VCC 1Y0 2A3 1Y1 2A2 1Y2 2A1 1Y3 2A0
GND 10
Functional Diagram
241 AND 244 240 1A0 1A1 1A2 1A3 2A0 2A1 2A2 2 4 6 8 11 13 15 18 16 14 12 9 7 5 3 1 1OE 1OE 2OE 2OE 19 1Y0 1Y1 1Y2 1Y3 2Y0 2Y1 2Y2 2Y3 1Y0 1Y1 1Y2 1Y3 2Y0 2Y1 2Y2 2Y3
VCC = 20 GND = 10
Thermal Information
Thermal Resistance (Typical, Note 3) JA (oC/W) PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only)
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specication is not implied.
NOTE: 3. JA is measured with the component mounted on an evaluation PC board in free air.
DC Electrical Specications
TEST CONDITIONS PARAMETER HC TYPES High Level Input Voltage VIH 2 4.5 6 Low Level Input Voltage VIL 2 4.5 6 High Level Output Voltage CMOS Loads High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current II ICC VCC or GND VCC or GND VOL VIH or VIL VOH VIH or VIL -0.02 -0.02 -0.02 -6 -7.8 0.02 0.02 0.02 6 7.8 0 2 4.5 6 4.5 6 2 4.5 6 4.5 6 6 6 1.5 3.15 4.2 1.9 4.4 5.9 3.98 5.48 0.5 1.35 1.8 0.1 0.1 0.1 0.26 0.26 0.1 8 1.5 3.15 4.2 1.9 4.4 5.9 3.84 5.34 0.5 1.35 1.8 0.1 0.1 0.1 0.33 0.33 1 80 1.5 3.15 4.2 1.9 4.4 5.9 3.7 5.2 0.5 1.35 1.8 0.1 0.1 0.1 0.4 0.4 1 160 V V V V V V V V V V V V V V V V A A SYMBOL VI (V) IO (mA) VCC (V) MIN 25oC TYP MAX -40oC TO 85oC MIN MAX -55oC TO 125oC MIN MAX UNITS
-6
4.5
3.98
3.84
3.7
0.02
4.5
0.1
0.1
0.1
4.5
0.26
0.33
0.4
0 0 -
100
0.1 8 360
1 80 450
1 160 490
A A A
IOZ
VIL or VIH
5.5
0.5
10
NOTE: Unit Load is ICC limit specied in DC Electrical Specications table, e.g., 360A max at 25oC.
SYMBOL
tPLH, tPHL
CL = 50pF 2 4.5 CL = 15pF CL = 50pF 5 6 2 4.5 CL = 15pF CL = 50pF 5 6 2 4.5 CL = 15pF CL = 50pF 5 6 2 4.5 5 6 10 8 9 9 12 100 20 17 110 22 19 110 22 19 150 30 26 60 12 10 10 20 125 25 21 140 28 24 140 28 24 190 38 33 75 15 13 10 20 150 30 26 165 33 28 165 33 28 225 45 38 90 18 15 10 20 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns pF pF
tPLH, tPHL
CL = 50pF
tPLH, tPHL
CL = 50pF
tTHL, tTLH
CL = 50pF
tTLH, tTHL
CL = 50pF
2 4.5 6
Input Capacitance Three-State Output Capacitance Power Dissipation Capacitance (Notes 5, 6) HC240 HC241 HC244 HCT TYPES Propagation Delay Data to Outputs HCT240 Data to Outputs HCT241 Data to Outputs HCT244
CI CO CPD
5 5 5
38 34 46
pF pF pF
tPHL, tPLH
CL = 50pF CL = 15pF
9 10 10
22 25 25 -
28 31 31 -
33 38 38 -
ns ns ns ns ns ns
tPHL, tPLH
CL = 50pF CL = 15pF
tPHL, tPLH
CL = 50pF CL = 15pF
PARAMETER Output Enable and Disable Times Output Transition Time Input Capacitance Power Dissipation Capacitance (Notes 5, 6)) HCT240 HCT241 HCT244 NOTES:
5 5 5
40 38 40
pF pF pF
5. CPD is used to determine the dynamic power consumption, per channel. 6. PD = VCC2 fi (CPD + CL) where fi = Input Frequency, fO = Output Frequency, CL = Output Load Capacitance, VCC = Supply Voltage.
GND
tTHL
INVERTING OUTPUT
FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC
tr OUTPUT DISABLE 6ns tf 2.7 1.3 tPLZ OUTPUT LOW TO OFF tPHZ OUTPUT HIGH TO OFF OUTPUTS ENABLED 90% 6ns 3V 0.3 tPZL GND
10% tPZH
1.3V
(Continued)
OUTPUT RL = 1k CL 50pF
VCC FOR tPLZ AND tPZL GND FOR tPHZ AND tPZH
NOTE: Open drain waveforms tPLZ and tPZL are the same as those for three-state shown on the left. The test circuit is Output RL = 1k to VCC, CL = 50pF. FIGURE 5. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT
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