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DATA SHEET
Philips Semiconductors
Product specication
BSS84
PINNING - SOT23 PIN 1 2 3 SYMBOL g s d DESCRIPTION gate source drain
3 d
s 1 Top view 2
MAM188
UNIT V V V mA mW
1997 Jun 18
Philips Semiconductors
Product specication
BSS84
UNIT V V mA mA mW C C
THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient CONDITIONS note 1 VALUE 500 UNIT K/W
Note to the Limiting values and Thermal characteristics 1. Device mounted on a printed-circuit board. CHARACTERISTICS Tj = 25 C unless otherwise specied. SYMBOL V(BR)DSS VGSth IDSS PARAMETER drain-source breakdown voltage gate-source threshold voltage drain-source leakage current CONDITIONS VGS = 0; ID = 10 A VDS = VGS ; ID = 1 mA VGS = 0; VDS = 40 V VGS = 0; VDS = 50 V VGS = 0; VDS = 50 V; Tj = 125 C IGSS RDSon yfs Ciss Coss Crss ton toff gate leakage current drain-source on-state resistance forward transfer admittance input capacitance output capacitance reverse transfer capacitance VDS = 0; VGS = 20 V VGS = 10 V; ID = 130 mA VDS = 25 V; ID = 130 mA VGS = 0; VDS = 25 V; f = 1 MHz VGS = 0; VDS = 25 V; f = 1 MHz VGS = 0; VDS = 25 V; f = 1 MHz VGS = 0 to 10 V; VDD = 40 V; ID = 200 mA VGS = 10 to 0 V; VDD = 40 V; ID = 200 mA MIN. 50 0.8 50 TYP. 25 15 3.5 MAX. 2 100 10 60 10 10 45 25 12 UNIT V V nA A A nA mS pF pF pF
1997 Jun 18
Philips Semiconductors
Product specication
BSS84
handbook, halfpage
VDD = 40 V
handbook, halfpage
10 %
INPUT 90 %
10 %
0V 10 V ID 50
MLD189
handbook, halfpage
300
MLD199
MLD251
Ptot (mW)
tp = 10 s 100 s 1 ms
200
10 ms
100
10
tp T
DC
100 ms
tp
0 0 50 100 150 200 Tamb (C)
t T
10
VDS (V)
102
Fig.5 DC SOAR.
1997 Jun 18
Philips Semiconductors
Product specication
BSS84
handbook, halfpage
80
MLD191
handbook, halfpage
600 ID
MLD197
C (pF) 60
VGS = 10 V 7.5 V
6 V
(mA) 400 5 V
40 Ciss 20 Coss
200
4 V
3 V
Crss 0 0 10 20 VDS (V) 30
VGS = 0; Tj = 25 C; f = 1 MHz. Tj = 25 C.
Fig.6
handbook, halfpage
600
MLD196
handbook, halfpage
60
MLD198
ID (mA) 400
RDSon () 40
VGS = 2.5 V 3 V 4 V 5 V
200
20 7.5 V 10 V
0 0
8 10 VGS (V)
0 1
10
102
ID (mA)
103
Tj = 25 C. VDS = 10 V; Tj = 25 C.
1997 Jun 18
Philips Semiconductors
Product specication
BSS84
handbook, halfpage
1.2
handbook, halfpage
(1)
1.8
MLD194
k
(2)
1.0
1.4
0.8
1.0
0.6 50
50
100
Tj (C)
150
0.6
50
50
100
Tj (C)
150
R DSon at T j k = ---------------------------------------R DSon at 25 C (1) ID = 130 mA; VGS = 10 V. (2) ID = 20 mA; VGS = 2.4 V.
103 handbook, full pagewidth Rth j-a (K/W) 102 = 0.75 0.5 0.2 0.1 0.05 10 0.02 0.01
MLD250
tp T
tp (s)
103
Tamb = 25 C.
Fig.12 Thermal resistance from junction to ambient as a function of pulse time; typical values.
1997 Jun 18
Philips Semiconductors
Product specication
BSS84
SOT23
HE
v M A
Q A A1
1
e1 e bp
2
w M B detail X Lp
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 max. 0.1 bp 0.48 0.38 c 0.15 0.09 D 3.0 2.8 E 1.4 1.2 e 1.9 e1 0.95 HE 2.5 2.1 Lp 0.45 0.15 Q 0.55 0.45 v 0.2 w 0.1
EUROPEAN PROJECTION
1997 Jun 18
Philips Semiconductors
Product specication
BSS84
This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1997 Jun 18
Philips Semiconductors
Product specication
BSS84
1997 Jun 18
Philips Semiconductors
Product specication
BSS84
1997 Jun 18
10
Philips Semiconductors
Product specication
BSS84
1997 Jun 18
11
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA54
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
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