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.460(11.68) .420(10.6)
KBP
UL Recognized File # E-96005 Glass passivated junction Ideal for printed circuit board Reliable low cost construction technique results in inexpensive product High temperature soldering guaranteed: 260 / 10 seconds at 5 lbs. ( 2.3 Kg ) tension Small size, simple installation Leads solderable per MIL-STD-202, Method 208
AC .5 (12.7) MIN
.035(0.9) .028(0.7)
.600(15.24) .560(14.22)
.153(3.9) .146(3.7)
.050(1.27)
KBP 204
KBP 205
KBP 206
KBP 207
Units V V V A A V uA uA /W
50 35 50
100 70 100
TSTG Note: Thermal Resistance from Junction to Ambient and from Junction to Lead Mounted on P.C.B. With 0.47 x 0.47 (12 x 12mm) Copper Pads.
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60
50 40 30
1.5
1.0
20 10 0
0.5
10
20
40
60
100
20
40
60
80
100
o
120
140 150
AMBIENT TEMPERATURE. ( C)
TJ=125 0C
10
0.1
1 TJ=25 0C
0.01 0.6
Tj=25 C PULSE WIDTH-300 S 1% DUTY CYCLE 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4
0.1 0
20
40
60
80
100
120
140
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