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August 1992
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Efficient high density cell design approaching (3 million in2) Voltage controlled small signal switch Rugged High saturation current Low RDS(on)
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MMBF170
Units V V V
500 800
mA mA mW mW C C C
PD
Total Power Dissipation Derate above 25 C Operating and Storage Temperature Range Maximum Lead Temperature for Soldering from Case for 10 Seconds Purposes
830 66
b 55 to 150
300 24
TJ TSTG TL
300
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RRD-B30M115 Printed in U S A
ON CHARACTERISTICS (Note 1) VGS(th) RDS(on) gFS Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance VDS e VGS ID e 1 mA VGS e 10V ID e 200 mA VDS e 10V ID e 200 mA 08 21 12 320 3 5 V X mS
DYNAMIC CHARACTERISTICS Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS e 10V VGS e 0V f e 1 0 MHz 24 17 7 40 30 10 pF pF pF
SWITCHING CHARACTERISTICS (Note 1) ton toff Turn-On Time Turn-Off Time VDD e 25V ID e 200 mA VGS e 10V RG e 25X 10 10 ns ns
ON CHARACTERISTICS (Note 1) VGS(th) RDS(on) gFS Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance VDS e VGS ID e 1 0 mA VGS e 10V ID e 200 mA VDS t 2 VDS(on) ID e 200 mA 08 21 12 320 3 5 V X mS
DYNAMIC CHARACTERISTICS Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS e 10V VGS e 0V f e 1 0 MHz 24 17 7 40 30 10 pF pF pF
SWITCHING CHARACTERISTICS (Note 1) ton toff Turn-On Time Turn-Off Time VDD e 25V ID e 500 mA VGS e 10V RG e 50X 10 10 ns ns
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FIGURE 8 Body Diode Forward Voltage Variation with Current and Temperature
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Note All 1 transistors are load formed to this configuration prior to bulk shipment
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Note 1 Meets all JEDEC dimensional requirements for TO-236AB Note 2 Controlling dimension millimeters Note 3 Available also in TO-236AA Contact your local National Semiconductor representative for delivery and ordering information Note 4 Tape and reel is the standard packing method for TO-236
LIFE SUPPORT POLICY NATIONALS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user
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2 A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness
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National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications
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