PRODUCT SPECIFICATION

Part Number

PDC284-CAMR21-BW
Details .28 (7.00mm) Quad Digit Display Common Anode Emitting Color: Deep Red AlInGaP chip used

Features Qualified according to JEDEC moisture sensitivity level 2A RoHS Compliant Black Face, White Segment Easy mounting on PCB

Mechanical Dimensions

Notes: 1. Dimension in millimeter [inch], and tolerance is 0.25 [.010] unless otherwise noted. 2. BendingLength*1%.

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 Device Selection Guide Model Number PDC284-CAMR21-BW Material AlInGaP Chip Emitting Color Deep Red Description Common Anode

Absolute Maximum Ratings at Ta=25 Deep Red Parameter Power Dissipation per Dice Derating Liner from 25 per Dice Continuous Forward Current Per Dice Peak Current Per Dice (duty cycle 1/10, 1KHz) Reverse Voltage Per Dice Operating Temperature Storage Temperature Symbol PAD -IAF IPF VR Topr Tstg Rating 70 0.33 25 90 5 -35~+85 -35~+85 Unit mW mA/ mA mA V

Note: Solder Conditions: 1/16 inch below seating plane for 3 seconds at 260 . Or temperature of unit (during assembly) not over max temperature rating above

Electrical and Optical Characteristics at Ta=25 Deep Red Parameter Forward Voltage Per Segment Luminous Intensity Per Segment Peak Emission Wavelength Dominant Wavelength Spectrum Radiation Bandwidth Reverse Current Luminous Intensity Matching Ratio Symbol VF Iv P Ld IR Iv-m Min. -1.6 -----Typ. 2 3,5 660 645 20 --Max. 2.8 Unit V mcd nm nm nm A -Condition IF=20mA IF=10mA IF=20mA IF=20mA IF=20mA VR=5V IF=10mA

100 2:1

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 All Light On Segments Feature & Pad Position

Internal Circuit Diagram

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 Typical Electrical / Optical Characteristic Curves Deep Red

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 Recommended Soldering 1. Wave Soldering a. Basic SPEC. is 5sec. When 260 . If temperature is higher, time should be shorter (+10 -1sec.). b. Power dissipation of iron should be smaller than 15W, and temperature should be controllable. Soldering temperature should be under 260 , time 3sec

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 Packing and Label Specifications

Note: 1. Specifications subject to change without notice.

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