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e japan nrk sustrate therma conductive substrate 3 >100*10g 6k 300 ,1min,no soldering/m bubble;no thermal conductivity w/m-k thermal resistance /w combustibility dielectric constant1mhz dielectric loss angle(tangent) fv-o 6 0.02 fv-o 6 0.02 fv-o 5 0.02 fv-o 4 0.03 fv-o 5 0.02 <0.45 <0.45 <1 <1.2 <0.45 >1.8 >1.8 >1.2 >0.8 >1.8 3 >10*10g 5.5k 300 ,1min,no bubble,no 2.2 >10*10g 5k 300 ,1min,no bubble,no
domestic 1060 substrate 1.8 >1*10g 4k 280 ,1min,no bubble,no 2.2 >10*10g 6k 288 ,1min,no bubble,no our substrate
items product model material model surface disposal layers al substrate domestic al
a1100 a5052 a6061 a6063 c1100 spray tin/ chemical tin/chemical gold/osp/ immersion tin single-side al substrate / double-side al substrate /four-layer al substrate
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maximum measurement minimum measurement line width/space warp and twist processing thickness copper foil thickness molding dimension tolerance
1100mm*480mm 5mm*5mm 0.1mm 0.5%(thickness:1.6mm, measurement:300mm300mm) 0.34.5mm 35um 70um 105um 140um 0.15mm
v-cut positioning accuracy 0.1mm processing capability cu thickness of inner aperture aperture location deviation 0.076mm minimum diameter of piercing lower than1.0mm 1.2-3.0mm 1.5mm 1.0mm 6000m2 20-25um
minimum specification of plate thickness lower than1.0mm 0.8mm0.8mm the square groove circuit printing deviation scope of molding dimension tolerance mini aperture 0.8mm not limited to the maximum aperture diameter gold plating ni 2.5-5um au 0.05-0.1um 0.0250.075um coating thickness immersion goldni 5-8um au0.08-0.1um spray tin 3-30um 4-30um vcut angle deviation scope of v-cut plates marking font of the smallest component smallest windowing of pad 0.01mm 5 0.6mm-3.2mm 0.15mm plate thickness 1.2-3.0mm 1.01.0mm 0.076mm cnc0.1mm punching the shape0.15mm
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