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Module 1: Worked Out Problems: Problem 1
Module 1: Worked Out Problems: Problem 1
Problem1: A cold storage consists of a cubical chamber of dimension 2m x 2m x 2m, maintained at 10C inside temperature.The outside wall temperature is 35C. Thetopand side walls are coveredbyalowconductinginsulationwiththermalconductivityk=0.06W/mK.Thereis noheatlossfromthebottom.Ifheatlossthroughthetopandsidewallsistoberestrictedto 500W, whatistheminimumthicknessof insulation required? Solution: Known: Dimensionsof thecoldstorage,innerandoutersurfacestemperatures,thermal conductivityoftheinsulationmaterial. Tofind: Schematic: Thicknessofinsulation neededtomaintainheatlossbelow 500W.
insulation
Analysis: UsingFourierslaw,theheatrateisgivenby
DT q =q''. A= k Atotal L 2 SolvingforLandrecognizingthatAtotal=5*W L= L= 5 k DTW2 q
Problem2: AsquaresiliconchipisofwidthW=5mmonasideandofthicknesst=1mm. Thechipis mountedinasubstratesuchthatthereisnoheatlossfromitssideandbacksurfaces.Thetop surfaceisexposedtoacoolant.Thethermalconductivityofthechipis200W/m.K.If5Ware beingdissipatedby thechip,whatisthetemperaturedifferencebetween itsbackandfront surfaces? Known:Dimensionsandthermalconductivityofachip.Powerdissipatedononesurface. Find:temperaturedropacrossthechip
Schematic:
Assumptions: (1) steadystate conditions, (2) constant properties, (3) uniform dissipation, (4)negligibleheatlossfrombackandsides,(5)onedimensionalconductioninchip. Analysis:Alloftheelectricalpowerdissipatedatthebacksurfaceofthechipistransferred byconductionthroughthechip.Hence,Fourierslaw, DT P= q= kA t t .P 0 . 001 m*5 W DT = = 2 2 kW 200 W/m . K( 0 . 005 m )
0 DT = 1 . 0 C
Comments: for fixed P, the temperature drop across the chip decreases with increasing k andW,aswellaswithdecreasingt.
Problem3: Air flows over a rectangular plate having dimensions 0.5 m x 0.25 m. The free stream temperature of the air is 300C. At steady state, the plate temperature is 40C. If the 2 convectiveheattransfercoefficientis250W/m .K,determinetheheattransferratefromthe airtoonesideoftheplate.
Known: airflowoveraplatewithprescribedairandsurfacetemperatureandconvection
heattransfercoefficient.
Find:heattransferratefromtheairtotheplate Schematic:
Assumptions: (1)temperatureisuniformoverplatearea,(2)heattransfercoefficient is
uniformoverplatearea
Comments: recognize that Newtowns law of cooling implies a direction for the
convectionheattransferrate.Writtenintheformabove,theheatrateisfromtheairtoplate.
Assumptions:(1)ovenwallscompletelysurroundsphericalobject,(2)steadystate
condition,(3)uniformtemperatureforareasofsphereandovenwalls,(4)ovenenclosureis evacuatedandlargecomparedtosphere.
Analysis:heattransferratewillbeonlyduetotheradiationmode.Therateequationis
4 4 qrad =eAss( T sur - T s ) 2 WhereAs=pD ,theareaofthesphere - 3 2 2 -8 qrad = 0 . 9*p( 10* 10 ) m *5 . 67* 10 W/m2. K [( 400+ 273 )4 - ( 80+ 273 )4] K4
qrad = 3 . 04 W
Discussions:
(1)thisrateequationisapplicablewhenwearecalculatingthenetheatexchangebetweena smallobjectandlargersurface thatcompletelysurroundsthesmallerone. (2) When performing radiant heat transfer calculations, it is always necessary to have temperaturesinKelvin(K)units.
Find: (a)rateofsurfaceradiationemission,(b)netrateofradiationexchangebetweenthe
surfaceandchamberwalls.
Schematic:
Assumptions:(1)areaoftheenclosedsurfaceismuchlessthanthatofchamberwalls. Analysis(a)therateatwhichradiationisemittedbythesurfaceisemitted
qemit = qemit.A= eA sTs4
- 8 4 qemit = 0 . 8 ( 0 . 5 m2) 5 . 67* 10 W/m2. K4[( 150+ 273 ) K ] qemit = 726 W
(b)Thenetrateatwhichradiationistransferredfromthesurfacetothechamberwallsis
q = eA s( Ts 4- Tsurr4 ) q = 0 . 8 ( 0 . 5 m2 ) 5 . 67* 10-8W/m2. K4[( 423 K)4 - ( 298 K)4 q = 547 W
Problem6: A solid aluminium sphere of emissivity e, initially at a high temperature, is cooled by convection and radiation in a chamber having walls at a lower temperature. Convective coolingisachievedwithagaspassingthroughthechamber.Writeadifferentialequationto predictthevariationofspheretemperature withtimeduringthecooling process.
Find: equationwhichcouldbeusedtodeterminethealuminiumtemperatureasafunction
oftimeduringthecoolingprocess.
Schematic:
Assumptions:(1)atanytimet,thetemperatureTofthesphereisuniform,(2)constant
properties(3)chamberwallsarelargerelativetosphere.
E st = - Eout
IdentifyingtheheatratesoutoftheCVduetoconvectionandradiation,theenergybalance hastheform d ( rVcT )= -( qconv + qrad) dt dT A 4 =[ h ( T- T T4 - T )+ es( surr )] dt rVc dT 6 4 = [ h ( T- T T4 - T )+ es( surr )] dt rcD
2 3 WhereA=pD ,V=pD /6andA/V=6/Dfor thesphere.
2 Problem7:Anelectronicpackagedissipating1kWhasasurfacearea1m .Thepackageis mountedonaspacecraft,suchthat theheatgeneratedistransferredfromtheexposedsurface by radiation into space. The surface emissivityof the package is 1.0. Calculate the steady statetemperatureofthepackagesurfaceforthefollowingtwoconditions: (a) thesurfaceisnotexposedtothesun 2 (b)The surface is exposed to a solar flux of 750W/m and its absorptivity to solar radiation is0.25?
Known: surface area of electronic package and power dissipation by the electronics.
Surfaceemissivity andabsorptivitytosolarradiation.Solarflux.
Find:surfacetemperaturewithoutandwithincidentsolarradiation. Schematic:
Inthesun,
1