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  • Graphics Memory Part Numbering: X XX X X X X X XX X

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    This document provides specifications for Hynix memory products including: 1) Product families include DDR3 SDRAM, GDDR5, and GDDR5M graphics memory. 2) Memory densities range from 1Gb to 64Gb and are organized into banks with refresh rates. 3) Packages include FBGA in single, dual, and quad die configurations supporting speeds up to 3.5GHz and operating temperatures from 0-85°C.

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    This document provides specifications for Hynix memory products including: 1) Product families include DDR3 SDRAM, GDDR5, and GDDR5M graphics memory. 2) Memory densities range from 1Gb to 64Gb and are organized into banks with refresh rates. 3) Packages include FBGA in single, dual, and quad die configurations supporting speeds up to 3.5GHz and operating temperatures from 0-85°C.

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    9 views1 page

    Graphics Memory Part Numbering: X XX X X X X X XX X

    Uploaded by

    eranmm
    This document provides specifications for Hynix memory products including: 1) Product families include DDR3 SDRAM, GDDR5, and GDDR5M graphics memory. 2) Memory densities range from 1Gb to 64Gb and are organized into banks with refresh rates. 3) Packages include FBGA in single, dual, and quad die configurations supporting speeds up to 3.5GHz and operating temperatures from 0-85°C.

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    © All Rights Reserved
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    of 1

    Last Updated: Sep.

    2012
    H 5 T X XX X X X X X - XX X
    HYNIX MEMORY
    PRODUCT FAMILY
    POWER SUPPLY
    DENSITY & REFRESH
    ORGANIZATION
    NUMBER OF BANKS
    OPERATING TEMPERATURE &
    POWER CONSUMPTION
    SPEED
    PACKAGE TYPE
    DIE GENERATION
    : VDD=1.35V & VDDQ=1.35V
    : VDD=1.5V & VDDQ=1.5V
    : VDD=1.8V & VDDQ=1.8V
    5 : DRAM
    C
    Q
    S
    : 1Gb, 8K/64ms Refresh
    : 2Gb, 8K/64ms Refresh
    : 4Gb, 8K/64ms Refresh
    : 8Gb, 8K/64ms Refresh
    : 16Gb
    : 32Gb
    : 64Gb
    1G
    2G
    4G
    8G
    16
    32
    64
    8
    6
    2
    : x8
    : x16
    : x32
    : 8 Banks
    : 16 Banks
    3
    4
    C
    : Commercial Temp
    1)
    & Normal Power
    N3
    N4
    N5
    N6
    N7
    N8
    : 1.3GHz
    : 1.4GHz
    : 1.5GHz
    : 1.6GHz
    : 1.75GHz
    : 1.8GHz
    F
    L
    M
    H
    : FBGA SDP
    (Single Die Package)
    : FBGA DDP 1CS
    (Dual Die Package)
    : FBGA DDP 2CS
    (Dual Die Package)
    : FBGA QDP
    (Quad Die Package)
    : 1st
    : 2nd
    : 3rd
    : 4th
    M
    A
    B
    C
    Note:
    1) Commercial Temperature: 0C ~ 85C
    2) ROHS : Restriction Of Hazardous Substances
    : 5th
    : 6th
    : 7th
    : 8th
    D
    E
    F
    G
    PACKAGE MATERIAL
    R : Lead Free & Halogen Free
    (ROHS
    2)
    compliant)
    1 2 3 4 5 6 7 8 9 10 11 12 13 14
    PRODUCT MODE
    T
    H
    : DDR3 SDRAM
    : GDDR5M
    GRAPHICS MEMORY PART NUMBERING
    T0
    T1
    T2
    T3
    R0
    R1
    R2
    : 2.0GHz
    : 2.25GHz
    : 2.5GHz
    : 2.75GHz
    : 3.0GHz
    : 3.25GHz
    : 3.5GHz
    : 1Gb, 8K/32ms Refresh
    : 2Gb, 16K/32ms Refresh
    : 4Gb, 16K/32ms Refresh
    : 8Gb, 16K/32ms Refresh
    1H
    2H
    4H
    8H
    R
    G
    : GDDR3
    : GDDR5
    : 700MHz
    : 800MHz
    : 900MHz
    : 1.0GHz
    : 1.1GHz
    : 1.2GHz
    14
    12
    11
    N0
    N1
    N2

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