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Pic 16c57c - JW
Pic 16c57c - JW
Data Sheet
EPROM/ROM-Based 8-bit CMOS
Microcontroller Series
Preliminary
DS30453D
Note the following details of the code protection feature on PICmicro MCUs.
The PICmicro family meets the specifications contained in the Microchip Data Sheet.
Microchip believes that its family of PICmicro microcontrollers is one of the most secure products of its kind on the market today,
when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the PICmicro microcontroller in a manner outside the operating specifications contained in the data sheet.
The person doing so may be engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of
our product.
If you have any further questions about this matter, please contact the local sales office nearest to you.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode
and Total Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
DS30453D - page ii
Preliminary
PIC16C5X
EPROM/ROM-Based 8-bit CMOS Microcontroller Series
Devices Included in this Data Sheet:
PIC16C54
PIC16CR54
PIC16C55
PIC16C56
PIC16CR56
PIC16C57
PIC16CR57
PIC16C58
PIC16CR58
Note:
Peripheral Features:
Pins
I/O
18
18
18
18
18
28
28
18
18
18
28
28
28
18
18
12
12
12
12
12
20
20
12
12
12
20
20
20
12
12
EPROM/
RAM
ROM
512
512
512
512
512
512
512
1K
1K
1K
2K
2K
2K
2K
2K
25
25
25
25
25
24
24
25
25
25
72
72
72
73
73
CMOS Technology:
Low power, high speed CMOS EPROM/ROM technology
Fully static design
Wide operating voltage and temperature range:
- EPROM Commercial/Industrial 2.0V to 6.25V
- ROM Commercial/Industrial 2.0V to 6.25V
- EPROM Extended 2.5V to 6.0V
- ROM Extended 2.5V to 6.0V
Low power consumption
- < 2 mA typical @ 5V, 4 MHz
- 15 A typical @ 3V, 32 kHz
- < 0.6 A typical standby current
(with WDT disabled) @ 3V, 0C to 70C
Note:
Preliminary
DS30453D-page 1
PIC16C5X
Pin Diagrams
PDIP, SOIC, Windowed CERDIP
18
17
16
15
14
RA1
RA0
OSC1/CLKIN
OSC2/CLKOUT
VDD
13
12
RB7
RB6
RB5
RB4
11
10
T0CKI
28
MCLR/VPP
VDD
27
OSC1/CLKIN
N/C
26
VSS
25
OSC2/CLKOUT
RC7
24
RC6
23
21
RC5
RC4
RC3
N/C
RA0
RA1
RA2
RA3
20
RC2
RB0
10
19
RB1
11
18
RC1
RC0
RB2
12
17
RB7
RB3
13
16
RB6
RB4
14
15
RB5
PIC16C55
PIC16C57
PIC16CR57
PIC16C54
PIC16CR54
PIC16C56
PIC16CR56
PIC16C58
PIC16CR58
1
2
3
4
5
6
7
8
9
RA2
RA3
T0CKI
MCLR/VPP
VSS
RB0
RB1
RB2
RB3
22
SSOP
SSOP
20
19
18
17
16
15
14
13
12
11
RA1
RA0
OSC1/CLKIN
OSC2/CLKOUT
VDD
VDD
RB7
RB6
RB5
RB4
VSS
T0CKI
VDD
VDD
RA0
RA1
RA2
RA3
RB0
RB1
RB2
RB3
RB4
VSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PIC16C55
PIC16C57
PIC16CR57
PIC16C54
PIC16CR54
PIC16C56
PIC16CR56
PIC16C58
PIC16CR58
1
2
3
4
5
6
7
8
9
10
RA2
RA3
T0CKI
MCLR/VPP
VSS
VSS
RB0
RB1
RB2
RB3
28
27
26
25
24
23
22
21
20
19
18
17
16
15
MCLR/VPP
OSC1/CLKIN
OSC2/CLKOUT
RC7
RC6
RC5
RC4
RC3
RC2
RC1
RC0
RB7
RB6
RB5
Device Differences
Device
PIC16C54
PIC16C54A
PIC16C54C
PIC16C55
PIC16C55A
PIC16C56
PIC16C56A
PIC16C57
PIC16C57C
PIC16C58B
PIC16CR54A
PIC16CR54C
PIC16CR56A
PIC16CR57C
PIC16CR58B
Voltage
Range
Oscillator
Selection
(Program)
Oscillator
Process
Technology
(Microns)
ROM
Equivalent
MCLR
Filter
2.5-6.25
2.0-6.25
2.5-5.5
2.5-6.25
2.5-5.5
2.5-6.25
2.5-5.5
2.5-6.25
2.5-5.5
2.5-5.5
2.5-6.25
2.5-5.5
2.5-5.5
2.5-5.5
2.5-5.5
Factory
User
User
Factory
User
Factory
User
Factory
User
User
Factory
Factory
Factory
Factory
Factory
See Note 1
See Note 1
See Note 1
See Note 1
See Note 1
See Note 1
See Note 1
See Note 1
See Note 1
See Note 1
See Note 1
See Note 1
See Note 1
See Note 1
See Note 1
1.2
0.9
0.7
1.7
0.7
1.7
0.7
1.2
0.7
0.7
1.2
0.7
0.7
0.7
0.7
PIC16CR54A
PIC16CR54C
PIC16CR56A
PIC16CR57C
PIC16CR58B
N/A
N/A
N/A
N/A
N/A
No
No
Yes
No
Yes
No
Yes
No
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Note 1: If you change from this device to another device, please verify oscillator characteristics in your application.
Note:
The table shown above shows the generic names of the PIC16C5X devices. For device varieties, please
refer to Section 2.0.
DS30453D-page 2
Preliminary
PIC16C5X
Table of Contents
1.0 General Description...................................................................................................................................................................... 5
2.0 PIC16C5X Device Varieties ......................................................................................................................................................... 7
3.0 Architectural Overview ................................................................................................................................................................ 9
4.0 Oscillator Configurations ............................................................................................................................................................ 15
5.0 Reset .......................................................................................................................................................................................... 19
6.0 Memory Organization ................................................................................................................................................................. 25
7.0 I/O Ports ..................................................................................................................................................................................... 35
8.0 Timer0 Module and TMR0 Register ........................................................................................................................................... 37
9.0 Special Features of the CPU...................................................................................................................................................... 43
10.0 Instruction Set Summary ............................................................................................................................................................ 49
11.0 Development Support................................................................................................................................................................. 61
12.0 Electrical Characteristics - PIC16C54/55/56/57 ......................................................................................................................... 67
13.0 Electrical Characteristics - PIC16CR54A ................................................................................................................................... 79
14.0 Device Characterization - PIC16C54/55/56/57/CR54A.............................................................................................................. 91
15.0 Electrical Characteristics - PIC16C54A.................................................................................................................................... 103
16.0 Device Characterization - PIC16C54A ..................................................................................................................................... 117
17.0 Electrical Characteristics - PIC16C54C/CR54C/C55A/C56A/CR56A/C57C/CR57C/C58B/CR58B ........................................ 131
18.0 Device Characterization - PIC16C54C/CR54C/C55A/C56A/CR56A/C57C/CR57C/C58B/CR58B .......................................... 145
19.0 Electrical Characteristics - PIC16C54C/C55A/C56A/C57C/C58B 40MHz ............................................................................... 155
20.0 Device Characterization - PIC16C54C/C55A/C56A/C57C/C58B 40MHz ................................................................................ 165
21.0 Packaging Information.............................................................................................................................................................. 171
Appendix A: Compatibility ............................................................................................................................................................. 183
On-Line Support................................................................................................................................................................................. 189
Reader Response .............................................................................................................................................................................. 190
Product Identification System ............................................................................................................................................................ 191
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
Microchips Worldwide Web site; http://www.microchip.com
Your local Microchip sales office (see last page)
The Microchip Corporate Literature Center; U.S. FAX: (480) 792-7277
When contacting a sales office or the literature center, please specify which device, revision of silicon and data sheet (include literature number) you are using.
Preliminary
DS30453D-page 3
PIC16C5X
NOTES:
DS30453D-page 4
Preliminary
PIC16C5X
8-Bit EPROM/ROM-Based CMOS Microcontrollers
1.0
GENERAL DESCRIPTION
1.1
Applications
The PIC16C5X series fits perfectly in applications ranging from high speed automotive and appliance motor
control to low power remote transmitters/receivers,
pointing devices and telecom processors. The EPROM
technology makes customizing application programs
(transmitter codes, motor speeds, receiver frequencies, etc.) extremely fast and convenient. The small
footprint packages, for through hole or surface mounting, make this microcontroller series perfect for applications with space limitations. Low cost, low power, high
performance ease of use and I/O flexibility make the
PIC16C5X series very versatile even in areas where no
microcontroller use has been considered before (e.g.,
timer functions, replacement of glue logic in larger
systems, co-processor applications).
Preliminary
DS30453D-page 5
PIC16C5X
TABLE 1-1:
PIC16C54
PIC16CR54
PIC16C55
PIC16C56
PIC16CR56
40 MHz
20 MHz
40 MHz
40 MHz
20 MHz
512
512
1K
512
1K
25
25
24
25
25
TMR0
TMR0
TMR0
TMR0
TMR0
I/O Pins
12
12
20
12
12
Number of Instructions
33
33
33
33
33
Timer Module(s)
Packages
18-pin DIP,
18-pin DIP,
28-pin DIP,
18-pin DIP,
18-pin DIP,
SOIC;
SOIC;
SOIC;
SOIC;
SOIC;
20-pin SSOP 20-pin SSOP 28-pin SSOP 20-pin SSOP 20-pin SSOP
All PICmicro Family devices have Power-on Reset, selectable Watchdog Timer, selectable Code Protect and high
I/O current capability.
Features
PIC16C57
PIC16CR57
PIC16C58
PIC16CR58
40 MHz
20 MHz
40 MHz
20 MHz
2K
2K
2K
2K
72
72
73
73
TMR0
TMR0
TMR0
TMR0
20
20
12
12
33
33
33
33
Timer Module(s)
I/O Pins
Number of Instructions
Packages
28-pin DIP, SOIC; 28-pin DIP, SOIC; 18-pin DIP, SOIC; 18-pin DIP, SOIC;
28-pin SSOP
28-pin SSOP
20-pin SSOP
20-pin SSOP
All PICmicro Family devices have Power-on Reset, selectable Watchdog Timer, selectable Code Protect and high
I/O current capability.
DS30453D-page 6
Preliminary
PIC16C5X
2.0
2.
3.
4.
2.1
The UV erasable versions offered in CERDIP packages, are optimal for prototype development and pilot
programs.
UV erasable devices can be programmed for any of the
four oscillator configurations. Microchips
PICSTART Plus(1) and PRO MATE programmers
both support programming of the PIC16C5X. Third
party programmers also are available. Refer to the
Third Party Guide (DS00104) for a list of sources.
2.2
2.3
Quick-Turnaround-Production
(QTP) Devices
Microchip offers a QTP Programming Service for factory production orders. This service is made available
for users who choose not to program a medium to high
quantity of units and whose code patterns have stabilized. The devices are identical to the OTP devices but
with all EPROM locations and configuration bit options
already programmed by the factory. Certain code and
prototype verification procedures apply before production shipments are available. Please contact your
Microchip Technology sales office for more details.
2.4
2.5
One-Time-Programmable (OTP)
Devices
Preliminary
DS30453D-page 7
PIC16C5X
NOTES:
DS30453D-page 8
Preliminary
PIC16C5X
3.0
ARCHITECTURAL OVERVIEW
The PIC16C5X device contains an 8-bit ALU and working register. The ALU is a general purpose arithmetic
unit. It performs arithmetic and Boolean functions
between data in the working register and any register
file.
The ALU is 8 bits wide and capable of addition, subtraction, shift and logical operations. Unless otherwise
mentioned, arithmetic operations are two's complement in nature. In two-operand instructions, typically
one operand is the W (working) register. The other
operand is either a file register or an immediate constant. In single operand instructions, the operand is
either the W register or a file register.
The W register is an 8-bit working register used for ALU
operations. It is not an addressable register.
Depending on the instruction executed, the ALU may
affect the values of the Carry (C), Digit Carry (DC), and
Zero (Z) bits in the STATUS register. The C and DC bits
operate as a borrow and digit borrow out bit, respectively, in subtraction. See the SUBWF and ADDWF
instructions for examples.
A simplified block diagram is shown in Figure 3-1, with
the corresponding device pins described in Table 3-1
(for PIC16C54/56/58) and Table 3-2 (for PIC16C55/
57).
Preliminary
DS30453D-page 9
PIC16C5X
FIGURE 3-1:
EPROM/ROM
512 X 12 TO
2048 X 12
T0CKI
PIN
STACK 1
STACK 2
CONFIGURATION WORD
DISABLE
OSC
SELECT
PC
WATCHDOG
TIMER
12
CODE
PROTECT
2
OSCILLATOR/
TIMING &
CONTROL
INSTRUCTION
REGISTER
WDT TIME
OUT
9
12
CLKOUT
WDT/TMR0
PRESCALER
SLEEP
INSTRUCTION
DECODER
6
OPTION
OPTION REG.
DIRECT ADDRESS
DIRECT RAM
ADDRESS
FROM W
5
5-7
LITERALS
8
STATUS
TMR0
GENERAL
PURPOSE
REGISTER
FILE
(SRAM)
24, 25, 72 or
73 Bytes
FSR
8
DATA BUS
ALU
FROM W
4
TRIS 5
8
TRIS 6
TRISA
PORTA
4
RA<3:0>
DS30453D-page 10
FROM W
Preliminary
TRISB
FROM W
8
PORTB
8
RB<7:0>
8
TRIS 7
TRISC
PORTC
8
RC<7:0>
(28-Pin
Devices Only)
PIC16C5X
TABLE 3-1:
Pin Name
RA0
RA1
RA2
RA3
RB0
RB1
RB2
RB3
RB4
RB5
RB6
RB7
T0CKI
Buffer
Description
Type
17
18
1
2
6
7
8
9
10
11
12
13
3
17
18
1
2
6
7
8
9
10
11
12
13
3
19
20
1
2
7
8
9
10
11
12
13
14
3
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
ST
ST
Preliminary
DS30453D-page 11
PIC16C5X
TABLE 3-2:
PINOUT DESCRIPTION
Pin Number
Pin Name
RA0
RA1
RA2
RA3
RB0
RB1
RB2
RB3
RB4
RB5
RB6
RB7
RC0
RC1
RC2
RC3
RC4
RC5
RC6
RC7
T0CKI
Pin Buffer
SSOP Type Type
DIP
SOIC
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
1
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
1
5
6
7
8
9
10
11
12
13
15
16
17
18
19
20
21
22
23
24
25
2
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
ST
28
28
28
ST
Description
Bi-directional I/O port
DS30453D-page 12
Preliminary
PIC16C5X
3.1
Clocking Scheme/Instruction
Cycle
3.2
Instruction Flow/Pipelining
FIGURE 3-2:
CLOCK/INSTRUCTION CYCLE
Q2
Q1
Q3
Q4
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
OSC1
Q1
Q2
Internal
phase
clock
Q3
Q4
PC
PC
OSC2/CLKOUT
(RC mode)
EXAMPLE 3-1:
PC+1
PC+2
1. MOVLW H55
2. MOVWF PORTB
3. CALL
SUB_1
4. BSF
PORTA, BIT3
Fetch 1
Execute 1
Fetch 2
Execute 2
Fetch 3
Execute 3
Fetch 4
Flush
Fetch SUB_1 Execute SUB_1
All instructions are single cycle, except for any program branches. These take two cycles since the fetch instruction
is flushed from the pipeline, while the new instruction is being fetched and then executed.
Preliminary
DS30453D-page 13
PIC16C5X
NOTES:
DS30453D-page 14
Preliminary
PIC16C5X
4.0
OSCILLATOR
CONFIGURATIONS
4.1
Oscillator Types
FIGURE 4-2:
LP:
XT:
HS:
RC:
Note:
4.2
TABLE 4-1:
Crystal Oscillator/Ceramic
Resonators
CRYSTAL/CERAMIC
RESONATOR OPERATION
(HS, XT OR LP OSC
CONFIGURATION)
OSC1
PIC16C5X
SLEEP
XTAL
OSC2
RF(3)
To internal
logic
RS(2)
C2(1)
Osc
Type
OSC2
Resonator
Freq
Cap. Range
C1
Cap. Range
C2
455 kHz
68-100 pF
68-100 pF
2.0 MHz
15-33 pF
15-33 pF
4.0 MHz
10-22 pF
10-22 pF
HS
8.0 MHz
10-22 pF
10-22 pF
16.0 MHz
10 pF
10 pF
These values are for design guidance only. Since
each resonator has its own characteristics, the user
should consult the resonator manufacturer for
appropriate values of external components.
TABLE 4-2:
Osc
Type
Crystal
Freq
Cap.Range
C1
Cap. Range
C2
15 pF
15 pF
32 kHz(1)
100 kHz
15-30 pF
200-300 pF
200 kHz
15-30 pF
100-200 pF
455 kHz
15-30 pF
15-100 pF
1 MHz
15-30 pF
15-30 pF
2 MHz
15 pF
15 pF
4 MHz
15 pF
15 pF
HS
4 MHz
15 pF
15 pF
8 MHz
15 pF
15 pF
20 MHz
15 pF
15 pF
Note 1: For VDD > 4.5V, C1 = C2 30 pF is
recommended.
These values are for design guidance only. Rs may
be required in HS mode as well as XT mode to avoid
overdriving crystals with low drive level specification.
Since each crystal has its own characteristics, the
user should consult the crystal manufacturer for
appropriate values of external components.
LP
XT
Note:
OSC1
PIC16C5X
XT
C1(1)
Clock from
ext. system
Open
FIGURE 4-1:
Preliminary
DS30453D-page 15
PIC16C5X
4.3
FIGURE 4-4:
Figure 4-3 shows an implementation example of a parallel resonant oscillator circuit. The circuit is designed
to use the fundamental frequency of the crystal. The
74AS04 inverter performs the 180-degree phase shift
that a parallel oscillator requires. The 4.7 k resistor
provides the negative feedback for stability. The 10 k
potentiometers bias the 74AS04 in the linear region.
This circuit could be used for external oscillator
designs.
FIGURE 4-3:
EXAMPLE OF EXTERNAL
PARALLEL RESONANT
CRYSTAL OSCILLATOR
CIRCUIT (USING XT, HS
OR LP OSCILLATOR
MODE)
EXAMPLE OF EXTERNAL
SERIES RESONANT
CRYSTAL OSCILLATOR
CIRCUIT (USING XT, HS
OR LP OSCILLATOR
MODE)
330K
330K
74AS04
74AS04
To Other
Devices
74AS04
PIC16C5X
CLKIN
0.1 F
XTAL
Open
OSC2
+5V
To Other
Devices
10K
74AS04
4.7K
PIC16C5X
CLKIN
74AS04
Open
OSC2
10K
XTAL
10K
20 pF
DS30453D-page 16
20 pF
Preliminary
PIC16C5X
4.4
FIGURE 4-5:
RC Oscillator
RC OSCILLATOR MODE
VDD
REXT
Internal
clock
OSC1
N
CEXT
PIC16C5X
VSS
OSC2/CLKOUT
Fosc/4
Note:
Preliminary
DS30453D-page 17
PIC16C5X
NOTES:
DS30453D-page 18
Preliminary
PIC16C5X
5.0
RESET
TABLE 5-1:
Power-On Reset
MCLR Reset (normal operation)
MCLR Wake-up (from SLEEP)
WDT Reset (normal operation)
WDT Wake-up (from SLEEP)
Legend: u = unchanged, x = unknown, = unimplemented read as 0.
TABLE 5-2:
TO
PD
1
u
1
u
0
0
1
0
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
POR
Value on
MCLR and
WDT Reset
03h
STATUS
PA2
PA1
PA0
TO
PD
DC
0001 1xxx
000q quuu
Legend:
Preliminary
DS30453D-page 19
PIC16C5X
TABLE 5-3:
Address
Power-On Reset
W
N/A
xxxx xxxx
TRIS
N/A
1111 1111
OPTION
N/A
--11 1111
INDF
00h
xxxx xxxx
TMR0
01h
xxxx xxxx
PCL
02h
1111 1111
STATUS
03h
0001 1xxx
(1)
FSR
04h
1xxx xxxx
PORTA
05h
---- xxxx
PORTB
06h
xxxx xxxx
PORTC(2)
07h
xxxx xxxx
General Purpose Register Files
07-7Fh
xxxx xxxx
Legend: x = unknown
u = unchanged
- = unimplemented, read as 0
q = see tables in Table 5-1 for possible values.
uuuu
1111
--11
uuuu
uuuu
1111
000q
1uuu
---uuuu
uuuu
uuuu
uuuu
1111
1111
uuuu
uuuu
1111
quuu
uuuu
uuuu
uuuu
uuuu
uuuu
Note 1: These values are valid for PIC16C57/CR57/C58/CR58. For the PIC16C54/CR54/C55/C56/CR56, the
value on RESET is 111x xxxx and for MCLR and WDT Reset, the value is 111u uuuu.
2: General purpose register file on PIC16C54/CR54/C56/CR56/C58/CR58.
FIGURE 5-1:
Power-Up
Detect
POR (Power-On Reset)
VDD
MCLR/VPP pin
WDT Time-out
RESET
WDT
On-Chip
RC OSC
8-bit Asynch
Ripple Counter
(Device Reset
Timer)
Q
CHIP RESET
DS30453D-page 20
Preliminary
PIC16C5X
5.1
FIGURE 5-2:
VDD
EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW VDD POWER-UP)
VDD
R
R1
MCLR
C
PIC16C5X
For more information on PIC16C5X POR, see PowerUp Considerations - AN522 in the Embedded Control
Handbook.
The POR circuit does not produce an internal RESET
when VDD declines.
Preliminary
DS30453D-page 21
PIC16C5X
FIGURE 5-3:
VDD
MCLR
INTERNAL POR
TDRT
DRT TIME-OUT
INTERNAL RESET
FIGURE 5-4:
VDD
MCLR
INTERNAL POR
TDRT
DRT TIME-OUT
INTERNAL RESET
FIGURE 5-5:
V1
VDD
MCLR
INTERNAL POR
TDRT
DRT TIME-OUT
INTERNAL RESET
When VDD rises slowly, the TDRT time-out expires long before VDD has reached its final value. In
this example, the chip will RESET properly if, and only if, V1 VDD min
DS30453D-page 22
Preliminary
PIC16C5X
5.2
FIGURE 5-7:
5.3
EXTERNAL BROWN-OUT
PROTECTION CIRCUIT 2
VDD
VDD
R1
Q1
MCLR
R2
40K
FIGURE 5-8:
Reset on Brown-Out
VDD
VDD
VDD
= 0.7V
EXTERNAL BROWN-OUT
PROTECTION CIRCUIT 3
bypass
capacitor
VDD
MCP809
EXTERNAL BROWN-OUT
PROTECTION CIRCUIT 1
R1
R1 + R2
VDD
FIGURE 5-6:
PIC16C5X
RST
Vss
MCLR
PIC16C5X
33K
10K
Q1
MCLR
40K
PIC16C5X
Preliminary
DS30453D-page 23
PIC16C5X
NOTES:
DS30453D-page 24
Preliminary
PIC16C5X
6.0
MEMORY ORGANIZATION
FIGURE 6-2:
PIC16C56/CR56
PROGRAM MEMORY MAP
AND STACK
PC<9:0>
10
CALL, RETLW
Stack Level 1
Stack Level 2
000h
The PIC16C54, PIC16CR54 and PIC16C55 have a 9bit Program Counter (PC) capable of addressing a 512
x 12 program memory space (Figure 6-1). The
PIC16C56 and PIC16CR56 have a 10-bit Program
Counter (PC) capable of addressing a 1K x 12 program
memory space (Figure 6-2). The PIC16CR57,
PIC16C58 and PIC16CR58 have an 11-bit Program
Counter capable of addressing a 2K x 12 program
memory space (Figure 6-3). Accessing a location
above the physically implemented address will cause a
wraparound.
User Memory
Space
6.1
FIGURE 6-3:
On-chip Program
Memory (Page 0)
0FFh
100h
1FFh
200h
On-chip Program
Memory (Page 1)
2FFh
300h
RESET Vector
3FFh
PIC16C57/CR57/C58/
CR58 PROGRAM
MEMORY MAP AND
STACK
PC<10:0>
11
CALL, RETLW
Stack Level 1
Stack Level 2
000h
FIGURE 6-1:
PIC16C54/CR54/C55
PROGRAM MEMORY MAP
AND STACK
On-chip Program
Memory (Page 0)
1FFh
200h
User Memory
Space
PC<8:0>
9
CALL, RETLW
Stack Level 1
Stack Level 2
User Memory
Space
000h
On-chip
Program
Memory
0FFh
100h
RESET Vector
1FFh
0FFh
100h
On-chip Program
Memory (Page 1)
2FFh
300h
3FFh
400h
On-chip Program
Memory (Page 2)
4FFh
500h
5FFh
600h
Preliminary
On-chip Program
Memory (Page 3)
6FFh
700h
RESET Vector
7FFh
DS30453D-page 25
PIC16C5X
6.2
FIGURE 6-4:
PIC16C54, PIC16CR54,
PIC16C55, PIC16C56,
PIC16CR56 REGISTER
FILE MAP
File Address
The Special Function Registers include the TMR0 register, the Program Counter (PC), the Status Register,
the I/O registers (ports) and the File Select Register
(FSR). In addition, Special Purpose Registers are used
to control the I/O port configuration and prescaler
options.
00h
INDF(1)
01h
TMR0
02h
PCL
03h
STATUS
04h
FSR
05h
PORTA
06h
PORTB
07h
PORTC(2)
08h
General
Purpose
Registers
6.2.1
1Fh
DS30453D-page 26
Preliminary
PIC16C5X
FIGURE 6-5:
FSR<6:5>
00
01
10
11
File Address
00h
INDF(1)
01h
TMR0
02h
PCL
03h
STATUS
04h
FSR
05h
PORTA
06h
PORTB
07h
PORTC
08h
General
Purpose
Registers
0Fh
10h
20h
60h
2Fh
4Fh
6Fh
30h
50h
70h
General
Purpose
Registers
1Fh
40h
General
Purpose
Registers
3Fh
Bank 0
General
Purpose
Registers
5Fh
Bank 1
General
Purpose
Registers
7Fh
Bank 2
Bank 3
FIGURE 6-6:
FSR<6:5>
00
01
10
11
File Address
00h
INDF(1)
01h
TMR0
02h
PCL
03h
STATUS
04h
FSR
05h
PORTA
06h
PORTB
20h
40h
60h
07h
General
Purpose
Registers
2Fh
0Fh
10h
4Fh
30h
General
Purpose
Registers
1Fh
General
Purpose
Registers
3Fh
Bank 0
6Fh
50h
70h
General
Purpose
Registers
5Fh
Bank 1
General
Purpose
Registers
7Fh
Bank 2
Bank 3
Preliminary
DS30453D-page 27
PIC16C5X
6.2.2
TABLE 6-1:
Address
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
Power-on
Reset
Details
on Page
N/A
TRIS
1111 1111
35
N/A
OPTION
--11 1111
30
00h
INDF
xxxx xxxx
32
01h
TMR0
xxxx xxxx
38
PCL
1111 1111
31
0001 1xxx
29
02h
(1)
03h
04h
STATUS
FSR
PA2
PA1
PA0
TO
PD
DC
1xxx
xxxx(3)
32
05h
PORTA
RA3
RA2
RA1
RA0
---- xxxx
35
06h
PORTB
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0
xxxx xxxx
35
07h(2)
PORTC
RC7
RC6
RC5
RC4
RC3
RC2
RC1
RC0
xxxx xxxx
35
Legend: x = unknown, u = unchanged, = unimplemented, read as '0' (if applicable). Shaded cells = unimplemented or unused
Note 1: The upper byte of the Program Counter is not directly accessible. See Section 6.5 for an explanation of how to access
these bits.
2: File address 07h is a General Purpose Register on the PIC16C54, PIC16CR54, PIC16C56, PIC16CR56, PIC16C58 and
PIC16CR58.
3: These values are valid for PIC16C57/CR57/C58/CR58. For the PIC16C54/CR54/C55/C56/CR56, the value on RESET is
111x xxxx and for MCLR and WDT Reset, the value is 111u uuuu.
DS30453D-page 28
Preliminary
PIC16C5X
6.3
STATUS Register
REGISTER 6-1:
R/W-0
PA2
bit 7
R/W-0
PA0
R-1
TO
R-1
PD
R/W-x
Z
R/W-x
DC
R/W-x
C
bit 0
bit 7:
bit 6-5:
bit 4:
bit 3:
bit 2:
Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1:
bit 0:
Legend:
R = Readable bit
W = Writable bit
-n = Value at POR
1 = bit is set
0 = bit is cleared
Preliminary
x = bit is unknown
DS30453D-page 29
PIC16C5X
6.4
OPTION Register
The OPTION Register is a 6-bit wide, write-only register which contains various control bits to configure the
Timer0/WDT prescaler and Timer0.
By executing the OPTION instruction, the contents of
the W Register will be transferred to the OPTION Register. A RESET sets the OPTION<5:0> bits.
REGISTER 6-2:
OPTION REGISTER
U-0
bit 7
U-0
W-1
T0CS
W-1
TOSE
W-1
PSA
bit 7-6:
Unimplemented: Read as 0
bit 5:
bit 4:
bit 3:
bit 2-0:
Timer0 Rate
WDT Rate
000
001
010
011
100
101
110
111
1:2
1:4
1:8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
1:1
1:2
1:4
1:8
1 : 16
1 : 32
1 : 64
1 : 128
W-1
PS2
W-1
PS1
W-1
PS0
bit 0
Legend:
R = Readable bit
W = Writable bit
-n = Value at POR
1 = bit is set
0 = bit is cleared
DS30453D-page 30
Preliminary
x = bit is unknown
PIC16C5X
6.5
FIGURE 6-8:
Program Counter
GOTO Instruction
PC
FIGURE 6-7:
PA<1:0>
0
STATUS
0
PCL
Reset to 0
PA<1:0>
0
0
STATUS
FIGURE 6-9:
LOADING OF PC
BRANCH INSTRUCTIONS
- PIC16C57/PIC16CR57,
AND PIC16C58/
PIC16CR58
GOTO Instruction
10
8 7
PC
PCL
Instruction Word
PA<1:0>
0
PCL
STATUS
Instruction Word
10
Reset to 0
8 7
Instruction Word
PC
PC
GOTO Instruction
PC
0
PCL
LOADING OF PC
BRANCH INSTRUCTIONS
- PIC16C54, PIC16CR54,
PIC16C55
Note:
8 7
10
0
Instruction Word
LOADING OF PC
BRANCH INSTRUCTIONS
- PIC16C56/PIC16CR56
8 7
PC
PCL
0
PCL
Instruction Word
Instruction Word
Reset to 0
PA<1:0>
STATUS
Preliminary
DS30453D-page 31
PIC16C5X
6.5.1
PAGING CONSIDERATIONS
PIC16C56/CR56, PIC16C57/CR57
AND PIC16C58/CR58
6.5.2
EFFECTS OF RESET
6.6
Stack
PIC16C5X devices have a 10-bit or 11-bit wide, twolevel hardware push/pop stack.
A CALL instruction will push the current value of stack
1 into stack 2 and then push the current program
counter value, incremented by one, into stack level 1. If
more than two sequential CALLs are executed, only
the most recent two return addresses are stored.
A RETLW instruction will pop the contents of stack level
1 into the program counter and then copy stack level 2
contents into level 1. If more than two sequential
RETLWs are executed, the stack will be filled with the
address previously stored in level 2. Note that the
W Register will be loaded with the literal value specified
in the instruction. This is particularly useful for the
implementation of data look-up tables within the program memory.
For the RETLW instruction, the PC is loaded with the
Top of Stack (TOS) contents. All of the devices covered
in this data sheet have a two-level stack. The stack has
the same bit width as the device PC, therefore, paging
is not an issue when returning from a subroutine.
DS30453D-page 32
Preliminary
PIC16C5X
6.7
EXAMPLE 6-2:
EXAMPLE 6-1:
MOVLW
MOVWF
CLRF
INCF
BTFSC
GOTO
NEXT
INDIRECT ADDRESSING
;initialize pointer
; to RAM
;clear INDF Register
;inc pointer
;all done?
;NO, clear next
CONTINUE
FIGURE 6-10:
(FSR)
6
;YES, continue
DIRECT/INDIRECT ADDRESSING
Direct Addressing
(opcode)
bank select
Indirect Addressing
(FSR)
0
location select
bank
00
01
10
location select
11
00h
Addresses map back to
addresses in Bank 0.
Data
Memory(1)
0Fh
10h
1Fh
3Fh
Bank 0
5Fh
Bank 1
7Fh
Bank 2
Bank 3
Preliminary
DS30453D-page 33
PIC16C5X
NOTES:
DS30453D-page 34
Preliminary
PIC16C5X
7.0
I/O PORTS
7.5
7.1
PORTA
7.2
I/O Interfacing
FIGURE 7-1:
PORTB
EQUIVALENT CIRCUIT
FOR A SINGLE I/O PIN
7.3
Data
Bus
PORTC
WR
Port
7.4
W
Reg
TRIS Registers
CK
VDD
Q
N
D
TRIS f
I/O
pin(1)
Q
TRIS
Latch
Q
Data
Latch
CK
VSS
Q
RESET
RD Port
Note 1: I/O pins have protection diodes to VDD and VSS.
TABLE 7-1:
Address
Name
N/A
TRIS
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
Power-On
Reset
Value on
MCLR and
WDT Reset
1111 1111
1111 1111
05h
PORTA
RA3
RA2
RA1
RA0
---- xxxx
---- uuuu
06h
PORTB
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0
xxxx xxxx
uuuu uuuu
07h
PORTC
RC7
RC6
RC5
RC4
RC3
RC2
RC1
RC0
xxxx xxxx
uuuu uuuu
Legend: x = unknown, u = unchanged, = unimplemented, read as '0', Shaded cells = unimplemented, read as 0
Preliminary
DS30453D-page 35
PIC16C5X
7.6
7.6.1
EXAMPLE 7-1:
READ-MODIFY-WRITE
INSTRUCTIONS ON AN I/O
PORT
Example 7-1 shows the effect of two sequential readmodify-write instructions (e.g., BCF, BSF, etc.) on an
I/O port.
7.6.2
FIGURE 7-2:
Instruction
fetched
MOVWF PORTB
PC + 1
MOVF PORTB,W
Q1 Q2 Q3 Q4
PC + 2
PC + 3
NOP
NOP
RB<7:0>
Instruction
executed
DS30453D-page 36
Port pin
written here
Port pin
sampled here
MOVWF PORTB
(Write to
PORTB)
MOVF PORTB,W
(Read
PORTB)
Preliminary
NOP
PIC16C5X
8.0
Note:
FIGURE 8-1:
PSout
1
Sync with
Internal
Clocks
1
T0CKI
pin
Programmable
Prescaler(2)
T0SE(1)
TMR0 reg
PSout
(2 cycle delay) Sync
3
T0CS(1)
PSA(1)
Note 1: Bits T0CS, T0SE, PSA, PS2, PS1 and PS0 are located in the OPTION register
(Section 6.4).
2: The prescaler is shared with the Watchdog Timer (Figure 8-6).
FIGURE 8-2:
(1)
VSS
(1)
Schmitt Trigger
Input Buffer
VSS
Preliminary
DS30453D-page 37
PIC16C5X
FIGURE 8-3:
PC
(Program
Counter)
PC-1
Instruction
Fetch
PC
PC+1
MOVWF TMR0
T0
Timer0
T0+1
Instruction
Executed
FIGURE 8-4:
PC
(Program
Counter)
T0+2
NT0
NT0
Write TMR0
executed
Read TMR0
reads NT0
Read TMR0
reads NT0
PC+4
PC+5
MOVF TMR0,W
NT0
PC+6
MOVF TMR0,W
NT0+1
Read TMR0
reads NT0 + 1
Read TMR0
reads NT0
NT0+2
Read TMR0
reads NT0 + 2
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
PC-1
PC
PC+1
MOVWF TMR0
T0
PC+3
PC+4
PC+5
MOVF TMR0,W
Read TMR0
reads NT0
Read TMR0
reads NT0
PC+6
MOVF TMR0,W
NT0+1
NT0
Write TMR0
executed
TABLE 8-1:
PC+2
T0+1
Instruction
Execute
Address
PC+3
Instruction
Fetch
Timer0
PC+2
Read TMR0
reads NT0
Read TMR0
reads NT0
T0
Read TMR0
reads NT0 + 1
01h
TMR0
N/A
OPTION
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
Power-on
Reset
xxxx xxxx
uuuu uuuu
PSA
PS2
PS1
PS0
--11 1111
--11 1111
T0CS
T0SE
Value on
MCLR and
WDT Reset
DS30453D-page 38
Preliminary
PIC16C5X
8.1
8.1.1
EXTERNAL CLOCK
SYNCHRONIZATION
FIGURE 8-5:
8.1.2
Q1 Q2 Q3 Q4
Q1 Q2 Q3 Q4
Q1 Q2 Q3 Q4
Small pulse
misses sampling
(3)
External Clock/Prescaler
Output After Sampling
(2)
T0
T0 + 1
T0 + 2
Preliminary
DS30453D-page 39
PIC16C5X
8.2
EXAMPLE 8-1:
Prescaler
8.2.1
;Clear WDT
;Clear TMR0 & Prescaler
;Last 3 instructions in
this example
OPTION
;are required only if
;desired
CLRWDT
;PS<2:0> are 000 or
;001
MOVLW B'00xx1xxx ;Set Prescaler to
OPTION
;desired WDT rate
To change prescaler from the WDT to the Timer0 module, use the sequence shown in Example 8-2. This
sequence must be used even if the WDT is disabled. A
CLRWDT instruction should be executed before switching the prescaler.
EXAMPLE 8-2:
MOVLW
The prescaler assignment is fully under software control (i.e., it can be changed on the fly during program
execution). To avoid an unintended device RESET, the
following instruction sequence (Example 8-1) must be
executed when changing the prescaler assignment
from Timer0 to the WDT.
DS30453D-page 40
CLRWDT
CLRF
TMR0
MOVLW B'00xx1111
CLRWDT
SWITCHING PRESCALER
ASSIGNMENT
CHANGING PRESCALER
(TIMER0WDT)
B'xxxx0xxx'
CHANGING PRESCALER
(WDTTIMER0)
;Clear WDT and
;prescaler
;Select TMR0, new
;prescale value and
;clock source
OPTION
Preliminary
PIC16C5X
FIGURE 8-6:
TCY ( = FOSC/4)
Data Bus
0
T0CKI
pin
M
U
X
1
M
U
X
Sync
2
Cycles
TMR0 reg
T0SE
T0CS
PSA
Watchdog
Timer
M
U
X
8-bit Prescaler
8
8 - to - 1MUX
PS<2:0>
PSA
WDT Enable bit
0
MUX
PSA
WDT
Time-Out
Note: T0CS, T0SE, PSA, PS<2:0> are bits in the OPTION register.
Preliminary
DS30453D-page 41
PIC16C5X
NOTES:
DS30453D-page 42
Preliminary
PIC16C5X
9.0
What sets a microcontroller apart from other processors are special circuits that deal with the needs of realtime applications. The PIC16C5X family of microcontrollers have a host of such features intended to maximize system reliability, minimize cost through
elimination of external components, provide power saving operating modes and offer code protection. These
features are:
Preliminary
DS30453D-page 43
PIC16C5X
9.1
Configuration Bits
REGISTER 9-1:
CP
CP
CP
CP
CP
CP
CP
CP
WDTE
FOSC1
bit 11
FOSC0
bit 0
bit 1-0:
Note 1: Refer to the PIC16C5X Programming Specification (Literature Number DS30190) to determine how to
access the configuration word.
Legend:
R = Readable bit
W = Writable bit
-n = Value at POR
1 = bit is set
0 = bit is cleared
DS30453D-page 44
Preliminary
x = bit is unknown
PIC16C5X
REGISTER 9-2:
CP
WDTE
FOSC1
bit 11
FOSC0
bit 0
bit 2:
bit 1-0:
Note 1: Refer to the PIC16C5X Programming Specifications (Literature Number DS30190) to determine how to
access the configuration word.
2: PIC16LV54A supports XT, RC and LP oscillator only.
Legend:
R = Readable bit
W = Writable bit
-n = Value at POR
1 = bit is set
0 = bit is cleared
Preliminary
x = bit is unknown
DS30453D-page 45
PIC16C5X
9.2
The TO bit (STATUS<4>) will be cleared upon a Watchdog Timer Reset (Section 6.3).
The WDT can be permanently disabled by programming the configuration bit WDTE as a 0 (Section 9.1).
Refer to the PIC16C5X Programming Specifications
(Literature Number DS30190) to determine how to
access the configuration word.
9.2.1
9.2.2
WDT PROGRAMMING
CONSIDERATIONS
WDT PERIOD
The CLRWDT instruction clears the WDT and the prescaler, if assigned to the WDT, and prevents it from timing out and generating a device RESET.
FIGURE 9-1:
The SLEEP instruction RESETS the WDT and the prescaler, if assigned to the WDT. This gives the maximum
SLEEP time before a WDT Wake-up Reset.
Watchdog
Timer
Prescaler
U
X
8 - to - 1 MUX
PS2:PS0
PSA
WDT Enable
EPROM Bit
To TMR0
1
0
MUX
Note:
TABLE 9-1:
PSA
WDT
Time-out
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
Value on
Power-On MCLR and
Reset
WDT Reset
N/A
OPTION
Tosc
Tose
PSA
PS2
PS1
PS0
Legend: u = unchanged, - = unimplemented, read as '0'. Shaded cells not used by Watchdog Timer.
DS30453D-page 46
Preliminary
PIC16C5X
9.3
9.4
9.3.1
SLEEP
9.3.2
Program Verification/Code
Protection
If the code protection bit(s) have not been programmed, the on-chip program memory can be read
out for verification purposes.
Note:
9.5
ID Locations
Preliminary
DS30453D-page 47
PIC16C5X
NOTES:
DS30453D-page 48
Preliminary
PIC16C5X
10.0
All instructions are executed within one single instruction cycle, unless a conditional test is true or the program counter is changed as a result of an instruction.
In this case, the execution takes two instruction cycles.
One instruction cycle consists of four oscillator periods.
Thus, for an oscillator frequency of 4 MHz, the normal
instruction execution time would be 1 s. If a conditional test is true or the program counter is changed as
a result of an instruction, the instruction execution time
would be 2 s.
Figure 10-1 shows the three general formats that the
instructions can have. All examples in the figure use
the following format to represent a hexadecimal number:
0xhhh
FIGURE 10-1:
11
TABLE 10-1:
Field
OPCODE FIELD
DESCRIPTIONS
0
f (FILE #)
Assigned to
< >
Register bit field
In the set of
italics User defined term (font is courier)
5
d
d = 0 for destination W
d = 1 for destination f
f = 5-bit file register address
Description
f
W
b
k
x
6
OPCODE
OPCODE
8 7
5 4
b (BIT #)
f (FILE #)
OPCODE
0
k (literal)
Preliminary
11
OPCODE
0
k (literal)
DS30453D-page 49
PIC16C5X
TABLE 10-2:
Mnemonic,
Operands
Cycles
MSb
LSb
Status
Notes
Affected
Clear W
Z
1
0010 01df ffff
COMF
f, d
Complement f
Z
1
0000 11df ffff
DECF
f, d
Decrement f
Z
1
2,4
0010 11df ffff
DECFSZ
f, d
Decrement f, Skip if 0
None
1(2)
2,4
1
0010 10df ffff
INCF
f, d
Increment f
Z
2,4
1(2)
0011 11df ffff
INCFSZ
f, d
Increment f, Skip if 0
None
2,4
1
0001 00df ffff
IORWF
f, d
Inclusive OR W with f
Z
2,4
1
0010 00df ffff
MOVF
f, d
Move f
Z
2,4
1
0000 001f ffff
MOVWF
f
Move W to f
None
1,4
1
0000 0000 0000
NOP
No Operation
None
1
0011 01df ffff
RLF
f, d
Rotate left f through Carry
C
2,4
1
0011 00df ffff
RRF
f, d
Rotate right f through Carry
C
2,4
1
0000 10df ffff C,DC,Z
SUBWF
f, d
Subtract W from f
1,2,4
1
0011 10df ffff
SWAPF
f, d
Swap f
None
2,4
1
0001 10df ffff
XORWF
f, d
Exclusive OR W with f
Z
2,4
BIT-ORIENTED FILE REGISTER OPERATIONS
0100 bbbf ffff
None
2,4
BCF
f, b
Bit Clear f
1
0101 bbbf ffff
None
2,4
BSF
f, b
Bit Set f
1
0110 bbbf ffff
None
f, b
Bit Test f, Skip if Clear
1 (2)
BTFSC
1 (2)
0111 bbbf ffff
None
BTFSS
f, b
Bit Test f, Skip if Set
LITERAL AND CONTROL OPERATIONS
ANDLW
k
AND literal with W
1
1110 kkkk kkkk
Z
CALL
1
k
Call subroutine
2
1001 kkkk kkkk
None
CLRWDT
k
Clear Watchdog Timer
1
0000 0000 0100 TO, PD
None
GOTO
k
Unconditional branch
2
101k kkkk kkkk
Z
IORLW
k
Inclusive OR Literal with W
1
1101 kkkk kkkk
None
MOVLW
k
Move Literal to W
1
1100 kkkk kkkk
None
OPTION
k
Load OPTION register
1
0000 0000 0010
None
RETLW
k
Return, place Literal in W
2
1000 kkkk kkkk
SLEEP
DS30453D-page 50
Preliminary
PIC16C5X
ADDWF
Add W and f
ANDWF
AND W with f
Syntax:
[ label ] ADDWF
Syntax:
[ label ] ANDWF
Operands:
0 f 31
d [0,1]
Operands:
0 f 31
d [0,1]
Operation:
Operation:
Status Affected:
C, DC, Z
Status Affected:
Encoding:
0001
11df
f,d
Encoding:
ffff
0001
f,d
01df
ffff
Description:
Description:
Words:
Words:
Cycles:
Cycles:
Example:
ADDWF
Example:
ANDWF
Before Instruction
W
=
TEMP_REG =
After Instruction
W
=
TEMP_REG =
TEMP_REG, 0
Before Instruction
W
=
TEMP_REG =
After Instruction
W
=
TEMP_REG =
0x17
0xC2
0xD9
0xC2
ANDLW
Syntax:
[ label ] ANDLW
Operands:
0 k 255
Operation:
Status Affected:
Encoding:
Description:
1110
kkkk
kkkk
Words:
Cycles:
Example:
ANDLW
0x17
0xC2
0x17
0x02
BCF
Bit Clear f
Syntax:
[ label ] BCF
Operands:
0 f 31
0b7
Operation:
0 (f<b>)
Status Affected:
None
Encoding:
Description:
0100
1
Cycles:
Example:
BCF
Before Instruction
FLAG_REG =
After Instruction
FLAG_REG =
Before Instruction
W
= 0xA3
After Instruction
W
= 0x03
Preliminary
bbbf
f,b
ffff
Words:
H5F
TEMP_REG, 1
FLAG_REG,
0xC7
0x47
DS30453D-page 51
PIC16C5X
BSF
Bit Set f
BTFSS
Syntax:
[ label ] BSF
Syntax:
Operands:
0 f 31
0b7
Operands:
0 f 31
0b<7
Operation:
1 (f<b>)
Operation:
skip if (f<b>) = 1
Status Affected:
None
Status Affected:
None
Encoding:
0101
f,b
bbbf
Encoding:
ffff
Description:
Words:
Cycles:
Example:
BSF
FLAG_REG,
BTFSC
Syntax:
Operands:
0 f 31
0b7
Operation:
skip if (f<b>) = 0
Status Affected:
None
Encoding:
Description:
0110
bbbf
1
1(2)
Example:
HERE
BTFSC FLAG,1
FALSE GOTO
PROCESS_CODE
TRUE
Before Instruction
PC
After Instruction
if FLAG<1>
PC
if FLAG<1>
PC
DS30453D-page 52
Words:
Cycles:
1(2)
Example:
HERE
FALSE
TRUE
ffff
Cycles:
ffff
Words:
bbbf
Description:
Before Instruction
FLAG_REG = 0x0A
After Instruction
FLAG_REG = 0x8A
0111
Before Instruction
PC
After Instruction
If FLAG<1>
PC
if FLAG<1>
PC
BTFSS FLAG,1
GOTO
PROCESS_CODE
address (HERE)
=
=
=
=
0,
address (FALSE);
1,
address (TRUE)
= address (HERE)
=
=
=
=
0,
address (TRUE);
1,
address(FALSE)
Preliminary
PIC16C5X
CALL
Subroutine Call
CLRW
Clear W
Syntax:
[ label ] CALL k
Syntax:
[ label ] CLRW
Operands:
0 k 255
Operands:
None
Operation:
(PC) + 1 TOS;
k PC<7:0>;
(STATUS<6:5>) PC<10:9>;
0 PC<8>
Operation:
00h (W);
1Z
Status Affected:
Status Affected:
Encoding:
Description:
None
1001
kkkk
Description:
kkkk
Words:
Cycles:
Example:
HERE
CALL
CLRF
Clear f
Syntax:
[ label ] CLRF
Operands:
0 f 31
Operation:
00h (f);
1Z
Status Affected:
Z
0000
011f
Words:
Example:
CLRF
Before Instruction
FLAG_REG =
After Instruction
FLAG_REG =
Z
=
Cycles:
Example:
CLRW
CLRWDT
Syntax:
[ label ] CLRWDT
Operands:
None
Operation:
00h WDT;
0 WDT prescaler (if assigned);
1 TO;
1 PD
Status Affected:
TO, PD
0000
0000
0100
Description:
Words:
Cycles:
Example:
CLRWDT
Before Instruction
WDT counter
After Instruction
WDT counter
WDT prescaler
TO
PD
FLAG_REG
0x5A
0x00
1
0000
Before Instruction
W
= 0x5A
After Instruction
W
= 0x00
Z
= 1
ffff
0100
Words:
Encoding:
Description:
Cycles:
0000
THERE
Before Instruction
PC
= address (HERE)
After Instruction
PC
= address (THERE)
TOS = address (HERE + 1)
Encoding:
Encoding:
Preliminary
=
=
=
=
0x00
0
1
1
DS30453D-page 53
PIC16C5X
COMF
Complement f
DECFSZ
Decrement f, Skip if 0
Syntax:
[ label ] COMF
Syntax:
Operands:
0 f 31
d [0,1]
Operands:
0 f 31
d [0,1]
Operation:
(f) (dest)
Operation:
(f) 1 d;
Status Affected:
Status Affected:
None
Encoding:
0010
f,d
01df
Encoding:
ffff
Description:
Words:
Cycles:
Example:
COMF
Before Instruction
REG1
=
After Instruction
REG1
=
W
=
DECF
REG1,0
0x13
0x13
0xEC
Syntax:
Operation:
(f) 1 (dest)
Status Affected:
Z
0000
11df
Description:
Words:
Cycles:
Example:
DECF
Before Instruction
CNT
=
Z
=
After Instruction
CNT
=
Z
=
DS30453D-page 54
Cycles:
1(2)
Example:
HERE
ffff
11df
ffff
Words:
Decrement f
Operands:
Encoding:
Description:
0010
skip if result = 0
DECFSZ
GOTO
CONTINUE
Before Instruction
PC
=
After Instruction
CNT
=
if CNT
=
PC
=
if CNT
PC
=
CNT, 1
LOOP
address(HERE)
CNT - 1;
0,
address (CONTINUE);
0,
address (HERE+1)
CNT, 1
0x01
0
0x00
1
Preliminary
PIC16C5X
GOTO
Unconditional Branch
INCFSZ
Increment f, Skip if 0
Syntax:
[ label ]
Syntax:
[ label ]
Operands:
0 k 511
Operands:
Operation:
k PC<8:0>;
STATUS<6:5> PC<10:9>
0 f 31
d [0,1]
Operation:
None
Status Affected:
None
Status Affected:
Encoding:
Description:
GOTO k
101k
kkkk
Encoding:
kkkk
Words:
Cycles:
Example:
GOTO THERE
After Instruction
PC =
address (THERE)
INCF
Increment f
Syntax:
[ label ]
Operands:
0 f 31
d [0,1]
Operation:
(f) + 1 (dest)
Status Affected:
Encoding:
10df
Cycles:
1(2)
Example:
HERE
ffff
Description:
Words:
Cycles:
Example:
INCF
CNT,
11df
ffff
Words:
INCF f,d
0010
Before Instruction
CNT
=
Z
=
After Instruction
CNT
=
Z
=
Description:
0011
INCFSZ f,d
INCFSZ
GOTO
CONTINUE
Before Instruction
PC
=
After Instruction
CNT
=
if CNT
=
PC
=
if CNT
PC
=
CNT, 1
LOOP
address (HERE)
CNT + 1;
0,
address (CONTINUE);
0,
address (HERE +1)
0xFF
0
0x00
1
Preliminary
DS30453D-page 55
PIC16C5X
IORLW
Syntax:
[ label ]
Operands:
0 k 255
Operation:
Status Affected:
Encoding:
Description:
1101
MOVF
IORLW k
kkkk
kkkk
Words:
Cycles:
Example:
IORLW 0x35
Before Instruction
W = 0x9A
After Instruction
W = 0xBF
Z = 0
Move f
Syntax:
[ label ]
Operands:
0 f 31
d [0,1]
Operation:
(f) (dest)
Status Affected:
Encoding:
0010
Inclusive OR W with f
Syntax:
[ label ]
Operands:
0 f 31
d [0,1]
Words:
Cycles:
Example:
MOVF
FSR,
IORWF
f,d
MOVLW
Syntax:
[ label ]
0 k 255
Status Affected:
Operation:
k (W)
Status Affected:
None
0001
00df
ffff
Words:
Cycles:
Example:
IORWF
DS30453D-page 56
Move Literal to W
Operation:
Before Instruction
RESULT =
W
=
After Instruction
RESULT =
W
=
Z
=
ffff
Description:
Operands:
Description:
00df
After Instruction
W
= value in FSR register
IORWF
Encoding:
MOVF f,d
Encoding:
1100
MOVLW k
kkkk
kkkk
Description:
Words:
Cycles:
Example:
MOVLW
0x5A
After Instruction
W
= 0x5A
RESULT, 0
0x13
0x91
0x13
0x93
0
Preliminary
PIC16C5X
MOVWF
Move W to f
Syntax:
[ label ]
Operands:
0 f 31
Operands:
None
Operation:
(W) (f)
Operation:
(W) OPTION
Status Affected:
None
Status Affected:
None
Encoding:
0000
MOVWF
001f
Syntax:
[ label ]
Encoding:
ffff
Description:
Words:
Cycles:
Example:
MOVWF
Before Instruction
TEMP_REG
W
After Instruction
TEMP_REG
W
OPTION
0xFF
0x4F
=
=
0x4F
0x4F
0000
Words:
Cycles:
Example
OPTION
Before Instruction
W
=
After Instruction
OPTION =
0x07
0x07
RETLW
Syntax:
[ label ]
RETLW k
NOP
No Operation
Operands:
0 k 255
Syntax:
[ label ]
Operation:
Operands:
None
k (W);
TOS PC
Operation:
No operation
Status Affected:
None
Status Affected:
None
Encoding:
0000
NOP
0000
Description:
No operation.
Words:
Cycles:
Example:
NOP
Encoding:
0000
1000
kkkk
kkkk
Description:
Words:
Cycles:
Example:
;value.
ADDWF PC ;W = offset
RETLW k1 ;Begin table
RETLW k2 ;
TABLE
Before Instruction
W
=
After Instruction
W
=
0010
Description:
TEMP_REG
=
=
0000
OPTION
Preliminary
0x07
value of k8
DS30453D-page 57
PIC16C5X
RLF
RRF
Syntax:
[ label ] RLF
Syntax:
[ label ]
Operands:
0 f 31
d [0,1]
Operands:
0 f 31
d [0,1]
Operation:
Operation:
Status Affected:
Status Affected:
Encoding:
Description:
0011
f,d
01df
Encoding:
ffff
Description:
0011
register f
Words:
Cycles:
Cycles:
Example:
RLF
Example:
RRF
REG1,0
1110 0110
1100 1100
1
ffff
register f
REG1,0
Before Instruction
REG1
=
C
=
After Instruction
REG1
=
W
=
C
=
1110 0110
0
SLEEP
1110 0110
0
1110 0110
0111 0011
0
Syntax:
[label]
Operands:
None
Operation:
00h WDT;
0 WDT prescaler; if assigned
1 TO;
0 PD
Status Affected:
TO, PD
Encoding:
Description:
DS30453D-page 58
00df
Words:
Before Instruction
REG1
=
C
=
After Instruction
REG1
=
W
=
C
=
RRF f,d
0000
0000
0011
Words:
Cycles:
Example:
SLEEP
Preliminary
SLEEP
PIC16C5X
SUBWF
Subtract W from f
SWAPF
Swap Nibbles in f
Syntax:
[label]
Syntax:
Operands:
0 f 31
d [0,1]
Operands:
0 f 31
d [0,1]
Operation:
Operation:
Status Affected:
C, DC, Z
(f<3:0>) (dest<7:4>);
(f<7:4>) (dest<3:0>)
Status Affected:
None
Encoding:
Description:
0000
SUBWF f,d
10df
ffff
Encoding:
Description:
0011
Cycles:
Words:
SUBWF
Cycles:
Example
SWAPF
REG1, 1
Before Instruction
REG1
=
3
W
=
2
C
=
?
After Instruction
REG1
=
1
W
=
2
C
=
1
; result is positive
Example 2:
Before Instruction
REG1
=
2
W
=
2
C
=
?
After Instruction
REG1
=
0
W
=
2
C
=
1
; result is zero
Example 3:
Before Instruction
REG1
=
1
W
=
2
C
=
?
After Instruction
REG1
=
0xFF
W
=
2
C
=
0
; result is negative
ffff
Words:
Example 1:
10df
Before Instruction
REG1
=
After Instruction
REG1
=
W
=
REG1,
0xA5
0xA5
0x5A
TRIS
Syntax:
[ label ] TRIS
Operands:
f = 5, 6 or 7
Operation:
Status Affected:
None
Encoding:
Description:
0000
0000
0fff
Words:
Cycles:
Example
TRIS
PORTB
Before Instruction
W
= 0xA5
After Instruction
TRISB = 0xA5
Preliminary
DS30453D-page 59
PIC16C5X
XORLW
Syntax:
[label]
Operands:
0 k 255
Operation:
Status Affected:
Encoding:
XORLW k
1111
kkkk
kkkk
Description:
Words:
Cycles:
Example:
XORLW 0xAF
Before Instruction
W
= 0xB5
After Instruction
W
= 0x1A
XORWF
Exclusive OR W with f
Syntax:
[ label ] XORWF
Operands:
0 f 31
d [0,1]
Operation:
Status Affected:
Encoding:
Description:
0001
ffff
Words:
Cycles:
Example
XORWF
Before Instruction
REG
=
W
=
After Instruction
REG
=
W
=
DS30453D-page 60
10df
f,d
REG,1
0xAF
0xB5
0x1A
0xB5
Preliminary
PIC16C5X
11.0
DEVELOPMENT SUPPORT
11.1
11.2
MPASM Assembler
11.3
Preliminary
DS30453D-page 61
PIC16C5X
11.4
11.6
11.5
11.7
The MPLAB SIM software simulator allows code development in a PC-hosted environment by simulating the
PICmicro series microcontrollers on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a file, or user-defined key press, to any of the pins. The
execution can be performed in single step, execute
until break, or trace mode.
The MPLAB SIM simulator fully supports symbolic debugging using the MPLAB C17 and the MPLAB C18 C compilers and the MPASM assembler. The software simulator
offers the flexibility to develop and debug code outside of
the laboratory environment, making it an excellent multiproject software development tool.
DS30453D-page 62
Preliminary
PIC16C5X
11.8
Microchips In-Circuit Debugger, MPLAB ICD, is a powerful, low cost, run-time development tool. This tool is
based on the FLASH PICmicro MCUs and can be used
to develop for this and other PICmicro microcontrollers.
The MPLAB ICD utilizes the in-circuit debugging capability built into the FLASH devices. This feature, along
with Microchips In-Circuit Serial ProgrammingTM protocol, offers cost-effective in-circuit FLASH debugging
from the graphical user interface of the MPLAB
Integrated Development Environment. This enables a
designer to develop and debug source code by watching variables, single-stepping and setting break points.
Running at full speed enables testing hardware in realtime.
11.9
Preliminary
DS30453D-page 63
PIC16C5X
11.13 PICDEM 3 Low Cost PIC16CXXX
Demonstration Board
The PICDEM 3 demonstration board is a simple demonstration board that supports the PIC16C923 and
PIC16C924 in the PLCC package. It will also support
future 44-pin PLCC microcontrollers with an LCD Module. All the necessary hardware and software is
included to run the basic demonstration programs. The
user can program the sample microcontrollers provided with the PICDEM 3 demonstration board on a
PRO MATE II device programmer, or a PICSTART Plus
development programmer with an adapter socket, and
easily test firmware. The MPLAB ICE in-circuit emulator may also be used with the PICDEM 3 demonstration
board to test firmware. A prototype area has been provided to the user for adding hardware and connecting it
to the microcontroller socket(s). Some of the features
include a RS-232 interface, push button switches, a
potentiometer for simulated analog input, a thermistor
and separate headers for connection to an external
LCD module and a keypad. Also provided on the
PICDEM 3 demonstration board is a LCD panel, with 4
commons and 12 segments, that is capable of displaying time, temperature and day of the week. The
PICDEM 3 demonstration board provides an additional
RS-232 interface and Windows software for showing
the demultiplexed LCD signals on a PC. A simple serial
interface allows the user to construct a hardware
demultiplexer for the LCD signals.
DS30453D-page 64
Preliminary
Software Tools
9 9 9
9
9
9
PIC17C7XX
9 9
9 9
9
9
PIC17C4X
9 9
9 9
9
9
PIC16C9XX
9
9 9
9
9
PIC16F8XX
9
9 9
9
9
PIC16C8X
9
9 9
9
9
9
PIC16C7XX
9
9 9
9
9
9
PIC16C7X
9
9 9
9
9
9
PIC16F62X
9
9 9
PIC16CXXX
9
9 9
9
PIC16C6X
9
9 9
9
PIC16C5X
9
9 9
9
PIC14000
9
9 9
PIC12CXXX
9
9 9
9
9
9
9
9
9
9
9
9
9
9
Preliminary
MCRFXXX
9 9
9
9
9
9
MCP2510
* Contact the Microchip Technology Inc. web site at www.microchip.com for information on how to use the MPLAB ICD In-Circuit Debugger (DV164001) with PIC16C62, 63, 64, 65, 72, 73, 74, 76, 77.
** Contact Microchip Technology Inc. for availability date.
9 9
9
9
PICDEMTM 17 Demonstration
Board
9
9
9
9
PICDEMTM 3 Demonstration
Board
24CXX/
25CXX/
93CXX
PICDEMTM 2 Demonstration
Board
HCSXXX
PICDEMTM 1 Demonstration
Board
**
PRO MATE II
Universal Device Programmer
**
PIC18FXXX
PIC18CXX2
9 9 9
**
MPASMTM Assembler/
MPLINKTM Object Linker
TABLE 11-1:
MPLAB Integrated
Development Environment
PIC16C5X
DS30453D-page 65
PIC16C5X
NOTES:
DS30453D-page 66
Preliminary
PIC16C5X
12.0
Preliminary
DS30453D-page 67
PIC16C5X
12.1
VDD
Characteristic/Device
Supply Voltage
PIC16C5X-RC
PIC16C5X-XT
PIC16C5X-10
PIC16C5X-HS
PIC16C5X-LP
Min
Typ
Max
Units
3.0
3.0
4.5
4.5
2.5
6.25
6.25
5.5
5.5
6.25
V
V
V
V
V
Conditions
D002
VDR
1.5*
D003
VPOR
VSS
D004
SVDD
0.05*
V/ms
D010
IDD
1.8
1.8
4.8
4.8
9.0
15
3.3
3.3
10
10
20
32
mA
mA
mA
mA
mA
A
4.0
0.6
12
9
A
A
D020
IPD
*
Supply Current(2)
PIC16C5X-RC(3)
PIC16C5X-XT
PIC16C5X-10
PIC16C5X-HS
PIC16C5X-HS
PIC16C5X-LP
Power-down Current(2)
Data in Typ column is based on characterization results at 25C. This data is for design guidance only and is
not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
a) The test conditions for all IDD measurements in active Operation mode are: OSC1 = external square
wave, from rail-to-rail; all I/O pins tristated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT
enabled/disabled as specified.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP
mode. The power-down current in SLEEP mode does not depend on the oscillator type.
3: Does not include current through REXT. The current through the resistor can be estimated by the formula:
IR = VDD/2REXT (mA) with REXT in k.
DS30453D-page 68
Preliminary
PIC16C5X
12.2
VDD
Characteristic/Device
Min
Typ
Max
Units
Supply Voltage
PIC16C5X-RCI
PIC16C5X-XTI
PIC16C5X-10I
PIC16C5X-HSI
PIC16C5X-LPI
3.0
3.0
4.5
4.5
2.5
6.25
6.25
5.5
5.5
6.25
V
V
V
V
V
Conditions
D002
VDR
1.5*
D003
VPOR
VSS
D004
SVDD
0.05*
V/ms
D010
IDD
1.8
1.8
4.8
4.8
9.0
15
3.3
3.3
10
10
20
40
mA
mA
mA
mA
mA
A
4.0
0.6
14
12
A
A
D020
IPD
*
Supply Current(2)
PIC16C5X-RCI(3)
PIC16C5X-XTI
PIC16C5X-10I
PIC16C5X-HSI
PIC16C5X-HSI
PIC16C5X-LPI
Power-down Current(2)
Data in Typ column is based on characterization results at 25C. This data is for design guidance only and is
not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
a) The test conditions for all IDD measurements in active Operation mode are: OSC1 = external square
wave, from rail-to-rail; all I/O pins tristated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT
enabled/disabled as specified.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP
mode. The power-down current in SLEEP mode does not depend on the oscillator type.
3: Does not include current through REXT. The current through the resistor can be estimated by the formula:
IR = VDD/2REXT (mA) with REXT in k.
Preliminary
DS30453D-page 69
PIC16C5X
12.3
VDD
Characteristic/Device
Supply Voltage
PIC16C5X-RCE
PIC16C5X-XTE
PIC16C5X-10E
PIC16C5X-HSE
PIC16C5X-LPE
Min
Typ
Max
Units
3.25
3.25
4.5
4.5
2.5
6.0
6.0
5.5
5.5
6.0
V
V
V
V
V
Conditions
D002
VDR
1.5*
D003
VPOR
VSS
D004
SVDD
0.05*
V/ms
D010
IDD
1.8
1.8
4.8
4.8
9.0
19
3.3
3.3
10
10
20
55
mA
mA
mA
mA
mA
A
5.0
0.8
22
18
A
A
D020
IPD
*
Supply Current(2)
PIC16C5X-RCE(3)
PIC16C5X-XTE
PIC16C5X-10E
PIC16C5X-HSE
PIC16C5X-HSE
PIC16C5X-LPE
Power-down Current(2)
Data in Typ column is based on characterization results at 25C. This data is for design guidance only and is
not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
a) The test conditions for all IDD measurements in active Operation mode are: OSC1 = external square
wave, from rail-to-rail; all I/O pins tristated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT
enabled/disabled as specified.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP
mode. The power-down current in SLEEP mode does not depend on the oscillator type.
3: Does not include current through REXT. The current through the resistor can be estimated by the formula:
IR = VDD/2REXT (mA) with REXT in k.
DS30453D-page 70
Preliminary
PIC16C5X
12.4
DC CHARACTERISTICS
Param
Symbol
No.
D030
D040
VIL
VIH
D050
VHYS
D060
IIL
D080
D090
VOL
VOH
Characteristic/Device
Typ
Max
Units
VSS
VSS
VSS
VSS
VSS
0.2 VDD
0.15 VDD
0.15 VDD
0.15 VDD
0.3 VDD
V
V
V
V
V
0.45 VDD
2.0
0.36 VDD
0.85 VDD
0.85 VDD
0.85 VDD
0.7 VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
V
V
V
V
V
V
V
0.15 VDD*
0.5
+1
MCLR
MCLR
T0CKI
OSC1
3
3
0.5
0.5
0.5
+5
+3
+3
A
A
A
A
0.6
0.6
V
V
VDD 0.7
VDD 0.7
V
V
Hysteresis of Schmitt
Trigger inputs
Conditions
Pin at hi-impedance
PIC16C5X-RC only(3)
PIC16C5X-XT, 10, HS, LP
For all VDD(4)
4.0V < VDD 5.5V(4)
VDD > 5.5V
PIC16C5X-RC only(3)
PIC16C5X-XT, 10, HS, LP
Preliminary
DS30453D-page 71
PIC16C5X
12.5
DC CHARACTERISTICS
Param
Symbol
No.
D030
D040
VIL
VIH
D050
VHYS
D060
IIL
D080
D090
VOL
VOH
Characteristic
Typ
Max
Units
Vss
Vss
Vss
Vss
Vss
0.15 VDD
0.15 VDD
0.15 VDD
0.15 VDD
0.3 VDD
V
V
V
V
V
Pin at hi-impedance
0.45 VDD
2.0
0.36 VDD
0.85 VDD
0.85 VDD
0.85 VDD
0.7 VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
V
V
V
V
V
V
V
0.15 VDD*
0.5
+1
MCLR
MCLR
T0CKI
OSC1
3
3
0.5
0.5
0.5
+5
+3
+3
A
A
A
A
0.6
0.6
V
V
VDD 0.7
VDD 0.7
V
V
Hysteresis of Schmitt
Trigger inputs
Conditions
PIC16C5X-RC only(3)
PIC16C5X-XT, 10, HS, LP
PIC16C5X-RC only(3)
PIC16C5X-XT, 10, HS, LP
DS30453D-page 72
Preliminary
PIC16C5X
12.6
The timing parameter symbols have been created with one of the following formats:
1. TppS2ppS
2. TppS
T
F Frequency
Lowercase letters (pp) and their meanings:
pp
2
to
ck CLKOUT
cy cycle time
drt device reset timer
io I/O port
Uppercase letters and their meanings:
S
F Fall
H High
I
Invalid (Hi-impedance)
L Low
FIGURE 12-1:
Time
mc
osc
os
t0
wdt
MCLR
oscillator
OSC1
T0CKI
watchdog timer
P
R
V
Z
Period
Rise
Valid
Hi-impedance
Pin
CL =
CL
50 pF
VSS
Preliminary
DS30453D-page 73
PIC16C5X
12.7
FIGURE 12-2:
Q1
Q3
Q2
Q4
Q1
OSC1
1
2
CLKOUT
TABLE 12-1:
AC Characteristics
Param
No.
1A
Symbol
FOSC
Min
Typ
Max
Units
DC
4.0
DC
10
DC
20
DC
16
DC
40
kHz
Oscillator
Frequency(1)
Conditions
LP OSC mode
DC
4.0
0.1
4.0
4.0
10
4.0
20
4.0
16
DC
40
kHz
LP OSC mode
DS30453D-page 74
Preliminary
PIC16C5X
TABLE 12-1:
AC Characteristics
Param
No.
1
Symbol
TOSC
Characteristic
External CLKIN Period(1)
Oscillator
Period(1)
Time(2)
Tcy
Instruction Cycle
TosL,
TosH
TosR,
TosF
Min
Typ
Max
Units
Conditions
250
ns
XT OSC mode
100
ns
10 MHz mode
50
ns
62.5
ns
25
LP OSC mode
250
ns
RC OSC mode
250
10,000
ns
XT OSC mode
100
250
ns
10 MHz mode
50
250
ns
62.5
250
ns
25
LP OSC mode
4/FOSC
85*
ns
XT oscillator
20*
ns
HS oscillator
2.0*
LP oscillator
25*
ns
XT oscillator
25*
ns
HS oscillator
50*
ns
LP oscillator
Preliminary
DS30453D-page 75
PIC16C5X
FIGURE 12-3:
Q4
Q2
Q3
OSC1
11
10
CLKOUT
13
19
14
12
18
16
I/O Pin
(input)
15
17
I/O Pin
(output)
New Value
Old Value
20, 21
Note: Please refer to Figure 12-1 for load conditions.
TABLE 12-2:
AC Characteristics
Param
No.
10
11
12
13
14
15
16
Symbol
Characteristic
Min
Typ
Max
Units
TosH2ckL
OSC1 to CLKOUT(1)
15
30**
ns
TosH2ckH
CLKOUT(1)
15
30**
ns
time(1)
5.0
15**
ns
TckR
TckF
TckL2ioV
TioV2ckH
TckH2ioI
OSC1 to
CLKOUT rise
(1)
5.0
15**
ns
valid(1)
40**
ns
CLKOUT(1)
0.25 TCY+30*
ns
0*
ns
100*
ns
(1)
valid(2)
17
TosH2ioV
18
TosH2ioI
TBD
ns
19
TioV2osH
TBD
ns
20
TioR
10
25**
ns
21
TioF
10
25**
ns
DS30453D-page 76
Preliminary
PIC16C5X
FIGURE 12-4:
VDD
MCLR
30
Internal
POR
32
32
32
DRT
Time-out
Internal
RESET
Watchdog
Timer
Reset
31
34
34
I/O pin
(Note 1)
Note 1: Please refer to Figure 12-1 for load conditions.
TABLE 12-3:
AC Characteristics
Param
No.
Symbol
Characteristic
Min
Typ
Max
Units
Conditions
30
TmcL
100*
ns
VDD = 5.0V
31
Twdt
9.0*
18*
30*
ms
32
TDRT
9.0*
18*
30*
ms
34
TioZ
100*
ns
Preliminary
DS30453D-page 77
PIC16C5X
FIGURE 12-5:
T0CKI
40
41
42
Note: Please refer to Figure 12-1 for load conditions.
TABLE 12-4:
AC Characteristics
Param
No.
40
Symbol
Tt0H
41
Tt0L
42
Tt0P
T0CKI Period
Min
Typ
Max
Units
ns
10*
ns
ns
10*
ns
20 or TCY + 40*
N
ns
Conditions
Whichever is greater.
N = Prescale Value
(1, 2, 4,..., 256)
DS30453D-page 78
Preliminary
PIC16C5X
13.0
Preliminary
DS30453D-page 79
PIC16C5X
13.1
PIC16LCR54A-04
PIC16LCR54A-04I
(Commercial, Industrial)
PIC16CR54A-04, 10, 20
PIC16CR54A-04I, 10I, 20I
(Commercial, Industrial)
Param
No.
Symbol
VDD
D001
D001
D001A
Characteristic/Device
Min
Typ
Max
Units
Conditions
Supply Voltage
PIC16LCR54A
2.0
6.25
PIC16CR54A
2.5
4.5
6.25
5.5
V
V
RC and XT modes
HS mode
D002
VDR
1.5*
D003
VPOR
VSS
D004
SVDD
0.05*
V/ms
10
20
70
A
A
IDD
D005
Supply Current(2)
PICLCR54A
D005A
PIC16CR54A
2.0
0.8
90
3.6
1.8
350
mA
mA
A
4.8
9.0
10
20
mA
mA
Legend: Rows with standard voltage device data only are shaded for improved readability.
*
Data in Typ column is at 5V, 25C, unless otherwise stated. These parameters are for design guidance only,
and are not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
a) The test conditions for all IDD measurements in active Operation mode are: OSC1 = external square
wave, from rail-to-rail; all I/O pins tristated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/
disabled as specified.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP
mode. The power-down current in SLEEP mode does not depend on the oscillator type.
3: Does not include current through REXT. The current through the resistor can be estimated by the formula:
IR = VDD/2REXT (mA) with REXT in k.
DS30453D-page 80
Preliminary
PIC16C5X
13.1
PIC16LCR54A-04
PIC16LCR54A-04I
(Commercial, Industrial)
PIC16CR54A-04, 10, 20
PIC16CR54A-04I, 10I, 20I
(Commercial, Industrial)
Param
No.
Symbol
IPD
D006
D006A
D007
D007A
Characteristic/Device
Min
Typ
Max
Units
Conditions
PIC16LCR54A-Commercial
1.0
2.0
3.0
5.0
6.0
8.0*
15
25
A
A
A
A
PIC16CR54A-Commercial
1.0
2.0
3.0
5.0
6.0
8.0*
15
25
A
A
A
A
PIC16LCR54A-Industrial
1.0
2.0
3.0
3.0
5.0
8.0
10*
20*
18
45
A
A
A
A
A
PIC16CR54A-Industrial
1.0
2.0
3.0
3.0
5.0
8.0
10*
20*
18
45
A
A
A
A
A
Power-down Current(2)
Legend: Rows with standard voltage device data only are shaded for improved readability.
*
Data in Typ column is at 5V, 25C, unless otherwise stated. These parameters are for design guidance only,
and are not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
a) The test conditions for all IDD measurements in active Operation mode are: OSC1 = external square
wave, from rail-to-rail; all I/O pins tristated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/
disabled as specified.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP
mode. The power-down current in SLEEP mode does not depend on the oscillator type.
3: Does not include current through REXT. The current through the resistor can be estimated by the formula:
IR = VDD/2REXT (mA) with REXT in k.
Preliminary
DS30453D-page 81
PIC16C5X
13.2
VDD
Characteristic
Supply Voltage
RC, XT and LP modes
HS mode
Min
Typ
Max
Units
3.25
4.5
6.0
5.5
V
V
Conditions
D002
VDR
1.5*
D003
VPOR
VSS
D004
SVDD
V/ms
D010
IDD
1.8
4.8
9.0
3.3
10
20
mA
mA
mA
5.0
0.8
22
18
A
A
D020
IPD
Supply Current(2)
RC(3) and XT modes
HS mode
HS mode
Power-down Current(2)
Data in the Typical (Typ) column is based on characterization results at 25C. This data is for design
guidance only and is not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
a) The test conditions for all IDD measurements in active Operation mode are: OSC1 = external square
wave, from rail-to-rail; all I/O pins tristated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/
disabled as specified.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP
mode.The power-down current in SLEEP mode does not depend on the oscillator type.
3: Does not include current through REXT. The current through the resistor can be estimated by the
formula: IR = VDD/2REXT (mA) with REXT in k.
DS30453D-page 82
Preliminary
PIC16C5X
13.3
DC CHARACTERISTICS
Param
Symbol
No.
D030
VIL
D040
VIH
D050
VHYS
D060
IIL
D080
VOL
D090
VOH
Characteristic
Typ
Max
Units
VSS
VSS
VSS
VSS
VSS
0.2 VDD
0.15 VDD
0.15 VDD
0.15 VDD
0.15 VDD
V
V
V
V
V
2.0
0.6 VDD
0.85 VDD
0.85 VDD
0.85 VDD
0.85 VDD
VDD
VDD
VDD
VDD
VDD
VDD
V
V
V
V
V
V
0.15 VDD*
1.0
+1.0
MCLR
MCLR
T0CKI
OSC1
5.0
3.0
3.0
0.5
0.5
0.5
+5.0
+3.0
+3.0
A
A
A
A
0.5
0.5
V
V
VDD 0.5
VDD 0.5
V
V
Hysteresis of Schmitt
Trigger inputs
Conditions
Pin at hi-impedance
RC mode only(3)
XT, HS and LP modes
VDD = 3.0V to 5.5V(4)
Full VDD range(4)
RC mode only(3)
XT, HS and LP modes
Data in the Typical (Typ) column is based on characterization results at 25C. This data is for design guidance only and is not tested.
Note 1: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltage.
2: Negative current is defined as coming out of the pin.
3: For the RC mode, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C5X
be driven with external clock in RC mode.
4: The user may use the better of the two specifications.
Preliminary
DS30453D-page 83
PIC16C5X
13.4
DC CHARACTERISTICS
Param
Symbol
No.
D030
VIL
D040
VIH
D050
VHYS
D060
IIL
D080
VOL
D090
VOH
Characteristic
Typ
Max
Units
Vss
Vss
Vss
Vss
Vss
0.15 VDD
0.15 VDD
0.15 VDD
0.15 VDD
0.3 VDD
V
V
V
V
V
Pin at hi-impedance
0.45 VDD
2.0
0.36 VDD
0.85 VDD
0.85 VDD
0.85 VDD
0.7 VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
V
V
V
V
V
V
V
0.15 VDD*
1.0
0.5
+1.0
MCLR
MCLR
T0CKI
OSC1
5.0
3.0
3.0
0.5
0.5
0.5
+5.0
+3.0
+3.0
A
A
A
A
0.6
0.6
V
V
VDD 0.7
VDD 0.7
V
V
Hysteresis of Schmitt
Trigger inputs
Conditions
RC mode only(3)
XT, HS and LP modes
RC mode only(3)
XT, HS and LP modes
Data in the Typical (Typ) column is based on characterization results at 25C. This data is for design guidance only and is not tested.
Note 1: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltage.
2: Negative current is defined as coming out of the pin.
3: For the RC mode, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C5X
be driven with external clock in RC mode.
4: The user may use the better of the two specifications.
DS30453D-page 84
Preliminary
PIC16C5X
13.5
The timing parameter symbols have been created with one of the following formats:
1. TppS2ppS
2. TppS
T
F Frequency
Lowercase letters (pp) and their meanings:
pp
2 to
ck CLKOUT
cy cycle time
drt device reset timer
io I/O port
Uppercase letters and their meanings:
S
F Fall
H High
I
Invalid (Hi-impedance)
L
Low
FIGURE 13-1:
Time
mc
osc
os
t0
wdt
MCLR
oscillator
OSC1
T0CKI
watchdog timer
P
R
V
Z
Period
Rise
Valid
Hi-impedance
Pin
CL = 50 pF
CL
0 -15 pF
VSS
Preliminary
DS30453D-page 85
PIC16C5X
13.6
FIGURE 13-2:
Q1
Q3
Q2
Q4
Q1
OSC1
1
2
CLKOUT
TABLE 13-1:
AC Characteristics
Param
No.
Symbol
FOSC
(1)
Oscillator Frequency
Min
Typ
Max
Units
Conditions
DC
4.0
DC
4.0
DC
10
DC
20
DC
200
DC
4.0
0.1
4.0
4.0
4.0
4.0
10
4.0
20
5.0
200
Data in the Typical (Typ) column is based on characterization results at 25C. This data is for design guidance only and is not tested.
Note 1: All specified values are based on characterization data for that particular oscillator type under standard
operating conditions with the device executing code. Exceeding these specified limits may result in an
unstable oscillator operation and/or higher than expected current consumption.
When an external clock input is used, the max cycle time limit is DC (no clock) for all devices.
2: Instruction cycle period (TCY) equals four times the input oscillator time base period.
DS30453D-page 86
Preliminary
PIC16C5X
TABLE 13-1:
AC Characteristics
Param
No.
Symbol
TOSC
Min
Oscillator Period(1)
2
3
Tcy
(2)
Typ
Max
Units
Conditions
250
ns
XT OSC mode
250
ns
100
ns
50
ns
5.0
LP OSC mode
250
ns
RC OSC mode
250
10,000
ns
XT OSC mode
250
250
ns
100
250
ns
50
250
ns
5.0
200
LP OSC mode
4/FOSC
50*
ns
XT oscillator
20*
ns
HS oscillator
2.0*
LP oscillator
25*
ns
XT oscillator
25*
ns
HS oscillator
50*
ns
LP oscillator
Data in the Typical (Typ) column is based on characterization results at 25C. This data is for design guidance only and is not tested.
Note 1: All specified values are based on characterization data for that particular oscillator type under standard
operating conditions with the device executing code. Exceeding these specified limits may result in an
unstable oscillator operation and/or higher than expected current consumption.
When an external clock input is used, the max cycle time limit is DC (no clock) for all devices.
2: Instruction cycle period (TCY) equals four times the input oscillator time base period.
Preliminary
DS30453D-page 87
PIC16C5X
FIGURE 13-3:
Q4
Q2
Q3
OSC1
10
11
CLKOUT
13
12
18
19
16
14
I/O Pin
(input)
15
17
I/O Pin
(output)
New Value
Old Value
20, 21
TABLE 13-2:
AC Characteristics
Param
No.
Symbol
Min
Typ
Max
Units
10
TosH2ckL
OSC1 to CLKOUT(1)
15
30**
ns
11
TosH2ckH
OSC1 to CLKOUT(1)
15
30**
ns
5.0
15**
ns
5.0
15**
ns
12
13
TckR
TckF
(1)
(1)
(1)
14
TckL2ioV
15
TioV2ckH
16
TckH2ioI
(1)
(2)
40**
ns
0.25 TCY+30*
ns
0*
ns
100*
ns
17
TosH2ioV
18
TosH2ioI
TBD
ns
19
TioV2osH
TBD
ns
20
TioR
10
25**
ns
21
TioF
10
25**
ns
*
**
Data in the Typical (Typ) column is based on characterization results at 25C. This data is for design guidance only and is not tested.
DS30453D-page 88
Preliminary
PIC16C5X
FIGURE 13-4:
VDD
MCLR
30
Internal
POR
32
32
32
DRT
Time-out
Internal
RESET
Watchdog
Timer
RESET
31
34
34
I/O pin
(Note 1)
Note 1: Please refer to Figure 13.1 for load conditions.
TABLE 13-3:
Symbol
30
Characteristic
Min
Typ
Max
Units
TmcL
1.0*
VDD = 5.0V
31
Twdt
7.0*
18*
40*
ms
32
TDRT
7.0*
18*
30*
ms
34
TioZ
1.0*
Conditions
Data in the Typical (Typ) column is at 5.0V, 25C unless otherwise stated. These parameters are for design
guidance only and are not tested.
Preliminary
DS30453D-page 89
PIC16C5X
FIGURE 13-5:
T0CKI
40
41
42
Note: Please refer to Figure 13.1 for load conditions.
TABLE 13-4:
AC Characteristics
Param
Symbol
No.
40
Tt0H
41
Tt0L
42
Tt0P
Min
ns
ns
ns
ns
ns
Conditions
Whichever is greater.
N = Prescale Value
(1, 2, 4,..., 256)
Data in the Typical (Typ) column is at 5.0V, 25C unless otherwise stated. These parameters are for design
guidance only and are not tested.
DS30453D-page 90
Preliminary
PIC16C5X
14.0
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and
are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified
power supply range) and therefore outside the warranted range.
Typical represents the mean of the distribution at 25C. Maximum or minimum represents (mean + 3) or (mean
3) respectively, where is a standard deviation, over the whole temperature range.
FIGURE 14-1:
FOSC
FOSC (25C)
1.10
REXT 10 k
CEXT = 100 pF
1.08
1.06
1.04
1.02
1.00
0.98
VDD = 5.5V
0.96
0.94
VDD = 3.5V
0.92
0.90
0.88
0
10
20
25
30
40
50
60
70
T(C)
TABLE 14-1:
RC OSCILLATOR FREQUENCIES
Average
FOSC @ 5 V, 25C
CEXT
REXT
20 pF
3.3K
5 MHz
27%
5K
3.8 MHz
21%
10K
2.2 MHz
21%
100K
262 kHz
31%
100 pF
300 pF
3.3K
1.6 MHz
13%
5K
1.2 MHz
13%
10K
684 kHz
18%
100K
71 kHz
25%
10%
3.3K
660 kHz
5.0K
484 kHz
14%
10K
267 kHz
15%
100K
29 kHz
19%
Preliminary
DS30453D-page 91
PIC16C5X
FIGURE 14-2:
TYPICAL RC OSC
FREQUENCY vs. VDD,
CEXT = 20 PF
FIGURE 14-3:
TYPICAL RC OSC
FREQUENCY vs. VDD,
CEXT = 100 PF
5.5
1.8
R = 3.3K
R = 3.3K
5.0
1.6
4.5
1.4
R = 5K
4.0
Fosc (MHz)
3.5
Fosc (MHz)
R = 5K
1.2
3.0
R = 10K
1.0
0.8
R = 10K
2.5
0.6
Measured on DIP Packages, T = 25C
2.0
0.4
0.2
R = 100K
1.0
0.0
3.0
R = 100K
0.5
0.0
3.0
3.5
4.0
4.5
5.0
5.5
3.5
4.0
4.5
5.0
VDD (Volts)
5.5
6.0
6.0
VDD (Volts)
DS30453D-page 92
Preliminary
PIC16C5X
FIGURE 14-4:
TYPICAL RC OSC
FREQUENCY vs. VDD,
CEXT = 300 PF
FIGURE 14-5:
2.5
800
700
2.0
R = 3.3K
T = 25C
600
1.5
Fosc (kHz)
IPD (A)
R = 5K
500
1.0
400
0.5
R = 10K
300
200
0.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5 6.0
VDD (Volts)
100
R = 100K
0
3.0
3.5
4.0
4.5
VDD (Volts)
5.0
5.5
6.0
Preliminary
DS30453D-page 93
PIC16C5X
FIGURE 14-6:
FIGURE 14-8:
60
100
50
+125C
10
+85C
40
+70C
55C
Ipd (A)
0C
+85C
30
IPD (A)
40C
55C
+125C
40C
+70C
20
0C
10
0
2.5 3.0
3.5
4.0
4.5 5.0
5.5 6.0
6.5
0
2.5
7.0
VDD (Volts)
FIGURE 14-7:
3.0
3.5
5.5
6.0
6.5 7.0
20
18
16
14
T = 25C
IPD (A)
12
10
8
6
4
2
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (Volts)
DS30453D-page 94
Preliminary
PIC16C5X
FIGURE 14-9:
2.00
1.80
40 C
M ax (
VTH (Volts)
1.60
1.40
to +85
25
Typ (+
C )
C )
1.20
1.00
40
Min (
C to +
85 C )
0.80
0.60
2.5
3.0
3.5
4.0
4.5
5.5
5.0
6.0
VDD (Volts)
FIGURE 14-10:
VIH, VIL OF MCLR, T0CKI AND OSC1 (RC MODE) vs. VDD
Typical: statistical mean @ 25C
Maximum: mean + 3s (-40C to 125C)
Minimum: mean 3s (-40C to 125C)
4.5
4.0
3.5
VIH
3.0
to
40C
ax (
V IH
2.5
VIH
min
+
typ
+8 5
25C
C to
(40
C)
C
+85
2.0
to +85C)
VIL max (40C
VIH typ +25C
1.5
1.0
0.5
C)
0.0
2.5
Note:
3.0
3.5
4.0
4.5
VDD (Volts)
5.0
5.5
6.0
Preliminary
DS30453D-page 95
PIC16C5X
FIGURE 14-11:
3.4
3.2
3.0
2.8
VTH (Volts)
2.6
Ma x
2.4
0
( 4
85
o+
C t
(+
Typ
2.2
2.0
Min
1.8
C)
)
25C
5
o +8
C t
0
4
(
C)
1.6
1.4
1.4
1.2
1.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (Volts)
FIGURE 14-12:
10
IDD (mA)
1.0
0.1
7.0
6.5
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
0.01
10K
100K
1M
10M
100M
DS30453D-page 96
Preliminary
PIC16C5X
FIGURE 14-13:
10
IDD (mA)
1.0
7.0
6.5
6.0
5.5
5.0
4.5
4.0
3.5
0.1
3.0
2.5
0.01
10K
100K
1M
10M
100M
FIGURE 14-14:
10
IDD (mA)
1.0
7.0
6.5
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
0.1
0.01
10K
100K
1M
10M
100M
Preliminary
DS30453D-page 97
PIC16C5X
FIGURE 14-15:
FIGURE 14-16:
TRANSCONDUCTANCE
(gm) OF HS OSCILLATOR
vs. VDD
50
9000
45
8000
Max 40C
40
7000
6000
30
Max +85C
gm (A/V)
35
25
Max +70C
5000
Typ +25C
4000
20
Typ +25C
3000
15
Min +85C
MIn 0C
2000
10
MIn 40C
5
2.0
3.0
4.0
5.0
6.0
100
7.0
VDD (Volts)
2.0
DS30453D-page 98
3.0
4.0
5.0
6.0
7.0
VDD (Volts)
Preliminary
PIC16C5X
FIGURE 14-17:
TRANSCONDUCTANCE
(gm) OF LP OSCILLATOR
vs. VDD
FIGURE 14-18:
TRANSCONDUCTANCE
(gm) OF XT OSCILLATOR
vs. VDD
45
2500
40
Max 40C
Max 40C
2000
35
30
25
gm (A/V)
gm (A/V)
1500
Typ +25C
20
Typ +25C
1000
15
Min +85C
500
10
Min +85C
5
0
2.0
0
2.0
3.0
4.0
5.0
6.0
7.0
3.0
4.0
5.0
6.0
7.0
VDD (Volts)
VDD (Volts)
Preliminary
DS30453D-page 99
PIC16C5X
FIGURE 14-19:
FIGURE 14-20:
Min +85C
5
10
10
IOH (mA)
IOH (mA)
Min +85C
Typ +25C
20
Typ +25C
15
Max 40C
30
Max 40C
20
40
25
1.5
0
0.5
1.0
1.5
2.0
2.5
2.5
3.0
3.5
4.0
4.5
5.0
VOH (Volts)
VOH (Volts)
DS30453D-page 100
2.0
3.0
Preliminary
PIC16C5X
FIGURE 14-21:
FIGURE 14-22:
45
90
Max 40C
40
Max 40C
80
35
70
30
60
25
50
IOL (mA)
IOL (mA)
Typ +25C
Typ +25C
20
40
Min +85C
15
30
Min +85C
10
20
10
0
0.0
0
0.5
1.0
1.5
2.0
2.5
3.0
VOL (Volts)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VOL (Volts)
Preliminary
DS30453D-page 101
PIC16C5X
TABLE 14-2:
Pin
18L PDIP
18L SOIC
RA port
5.0
4.3
RB port
5.0
4.3
MCLR
17.0
17.0
OSC1
4.0
3.5
OSC2/CLKOUT
4.3
3.5
T0CKI
3.2
2.8
TABLE 14-3:
Pin
28L PDIP
(600 mil)
28L SOIC
RA port
5.2
4.8
RB port
5.6
4.7
RC port
5.0
4.1
MCLR
17.0
17.0
OSC1
6.6
3.5
OSC2/CLKOUT
4.6
3.5
T0CKI
4.5
3.5
DS30453D-page 102
Preliminary
PIC16C5X
15.0
Preliminary
DS30453D-page 103
PIC16C5X
15.1
PIC16LC54A-04
PIC16LC54A-04I
(Commercial, Industrial)
PIC16C54A-04, 10, 20
PIC16C54A-04I, 10I, 20I
(Commercial, Industrial)
Param
Symbol
No.
VDD
D001
D001A
Characteristic/Device
Min
Typ
Max Units
Conditions
PIC16LC54A
3.0
2.5
6.25
6.25
V
V
XT and RC modes
LP mode
PIC16C54A
3.0
4.5
6.25
5.5
V
V
Supply Voltage
D002
VDR
1.5*
D003
VPOR
Vss
D004
SVDD
0.05*
0.5
2.5
mA
11
27
11
35
1.8
2.4
mA
2.4
4.5
14
8.0
16
29
mA
mA
A
17
37
IDD
D005
D005A
Supply Current(2)
PIC16LC5X
PIC16C5X
Legend:
*
Rows with standard voltage device data only are shaded for improved readability.
These parameters are characterized but not tested.
Data in Typ column is based on characterization results at 25C. This data is for design guidance only and
is not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
a) The test conditions for all IDD measurements in active Operation mode are: OSC1 = external square
wave, from rail-to-rail; all I/O pins tristated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/
disabled as specified.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP
mode. The power-down current in SLEEP mode does not depend on the oscillator type.
3: Does not include current through REXT. The current through the resistor can be estimated by the formula:
IR = VDD/2REXT (mA) with REXT in k.
DS30453D-page 104
Preliminary
PIC16C5X
15.1
PIC16LC54A-04
PIC16LC54A-04I
(Commercial, Industrial)
PIC16C54A-04, 10, 20
PIC16C54A-04I, 10I, 20I
(Commercial, Industrial)
Param
Symbol
No.
IPD
Characteristic/Device
Min
Typ
Max Units
Conditions
PIC16LC5X
2.5
0.25
2.5
0.25
12
4.0
14
5.0
A
A
A
A
PIC16C5X
4.0
0.25
5.0
0.3
12
4.0
14
5.0
A
A
A
A
Power-down Current(2)
D006
D006A
Legend:
*
Rows with standard voltage device data only are shaded for improved readability.
These parameters are characterized but not tested.
Data in Typ column is based on characterization results at 25C. This data is for design guidance only and
is not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
a) The test conditions for all IDD measurements in active Operation mode are: OSC1 = external square
wave, from rail-to-rail; all I/O pins tristated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/
disabled as specified.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP
mode. The power-down current in SLEEP mode does not depend on the oscillator type.
3: Does not include current through REXT. The current through the resistor can be estimated by the formula:
IR = VDD/2REXT (mA) with REXT in k.
Preliminary
DS30453D-page 105
PIC16C5X
15.2
DC Characteristics:
PIC16LC54A-04E
(Extended)
Param
Symbol
No.
VDD
Characteristic
Min
Typ
Max Units
Conditions
PIC16LC54A
3.0
2.5
6.25
6.25
V
V
XT and RC modes
LP mode
PIC16C54A
3.5
4.5
5.5
5.5
V
V
RC and XT modes
HS mode
Supply Voltage
D001
D001A
D002
VDR
1.5*
D003
VPOR
Vss
D004
SVDD
0.05*
0.5
25
mA
11
27
11
35
11
37
1.8
3.3
mA
4.8
10
mA
9.0
20
mA
IDD
D010
Supply Current(2)
PIC16LC54A
D010A
PIC16C54A
Legend:
Rows with standard voltage device data only are shaded for improved readability.
Data in the Typical (Typ) column is based on characterization results at 25C. This data is for design guidance only and is not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
a) The test conditions for all IDD measurements in active Operation mode are: OSC1 = external square
wave, from rail-to-rail; all I/O pins tristated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/
disabled as specified.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP
mode. The power-down current in SLEEP mode does not depend on the oscillator type.
3: Does not include current through REXT. The current through the resistor can be estimated by the formula:
IR = VDD/2REXT (mA) with REXT in k.
DS30453D-page 106
Preliminary
PIC16C5X
15.2
DC Characteristics:
PIC16LC54A-04E
(Extended)
Param
Symbol
No.
IPD
Characteristic
Typ
Max Units
2.5
15
0.25
7.0
5.0
0.8
22
18*
A
A
Conditions
Power-down Current(2)
D020
PIC16LC54A
D020A
PIC16C54A
Legend:
Min
Rows with standard voltage device data only are shaded for improved readability.
Data in the Typical (Typ) column is based on characterization results at 25C. This data is for design guidance only and is not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
a) The test conditions for all IDD measurements in active Operation mode are: OSC1 = external square
wave, from rail-to-rail; all I/O pins tristated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/
disabled as specified.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP
mode. The power-down current in SLEEP mode does not depend on the oscillator type.
3: Does not include current through REXT. The current through the resistor can be estimated by the formula:
IR = VDD/2REXT (mA) with REXT in k.
Preliminary
DS30453D-page 107
PIC16C5X
15.3
PIC16LV54A-02
PIC16LV54A-02I
(Commercial, Industrial)
Param
Symbol
No.
D001
VDD
Characteristic
Supply Voltage
RC and XT modes
2.0
3.8
Conditions
D002
VDR
1.5*
D003
VPOR
Vss
D004
SVDD
0.05*
D010
IDD
Supply Current(2)
RC(3) and XT modes
LP mode, Commercial
LP mode, Industrial
0.5
11
14
27
35
mA
A
A
Power-down Current(2,4)
Commercial
Commercial
Industrial
Industrial
2.5
0.25
3.5
0.3
12
4.0
14
5.0
A
A
A
A
D020
IPD
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
a) The test conditions for all IDD measurements in active Operation mode are: OSC1 = external square
wave, from rail-to-rail; all I/O pins tristated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/
disabled as specified.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP
mode. The power-down current in SLEEP mode does not depend on the oscillator type.
3: Does not include current through REXT. The current through the resistor can be estimated by the formula:
IR = VDD/2REXT (mA) with REXT in k.
4: The oscillator start-up time can be as much as 8 seconds for XT and LP oscillator selection on wake-up from
SLEEP mode or during initial power-up.
DS30453D-page 108
Preliminary
PIC16C5X
15.4
DC Characteristics:
DC CHARACTERISTICS
Param
Symbol
No.
D030
VIL
D040
VIH
D050
VHYS
D060
IIL
D080
VOL
VOH
Characteristic
Typ
Max
VSS
VSS
VSS
VSS
VSS
0.2 VDD
0.15 VDD
0.15 VDD
0.15 VDD
0.3 VDD
V
V
V
V
0.2 VDD + 1
2.0
0.85 VDD
0.85 VDD
0.85 VDD
0.7 VDD
VDD
VDD
VDD
VDD
VDD
VDD
V
V
V
V
V
V
0.15 VDD*
-1.0
0.5
+1.0
MCLR
MCLR
T0CKI
OSC1
-5.0
-3.0
-3.0
0.5
0.5
0.5
+5.0
+3.0
+3.0
A
A
A
A
0.6
0.6
V
V
VDD - 0.7
VDD - 0.7
V
V
Hysteresis of Schmitt
Trigger inputs
Units Conditions
Pin at hi-impedance
RC mode only(3)
XT, HS and LP modes
For all VDD(4)
4.0V < VDD 5.5V(4)
RC mode only(3)
XT, HS and LP modes
Data in the Typical (Typ) column is based on characterization results at 25C. This data is for design guidance only
and is not tested.
Note 1: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified levels
represent normal operating conditions. Higher leakage current may be measured at different input voltage.
2: Negative current is defined as coming out of the pin.
3: For the RC mode, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C5X be
driven with external clock in RC mode.
Preliminary
DS30453D-page 109
PIC16C5X
15.5
The timing parameter symbols have been created with one of the following formats:
1. TppS2ppS
2. TppS
T
F Frequency
Lowercase letters (pp) and their meanings:
pp
2 to
ck CLKOUT
cy cycle time
drt device reset timer
io I/O port
Uppercase letters and their meanings:
S
F Fall
H High
I
Invalid (Hi-impedance)
L
Low
FIGURE 15-1:
Time
mc
osc
os
t0
wdt
MCLR
oscillator
OSC1
T0CKI
watchdog timer
P
R
V
Z
Period
Rise
Valid
Hi-impedance
Pin
CL = 50 pF
CL
VSS
DS30453D-page 110
Preliminary
PIC16C5X
15.6
Q1
Q3
Q2
Q4
Q1
OSC1
1
2
CLKOUT
TABLE 15-1:
AC Characteristics
Param
No.
Symbol
FOSC
Characteristic
Min
Typ
Max
Units
DC
4.0
Oscillator Frequency(1)
Conditions
DC
2.0
DC
4.0
DC
10
DC
20
DC
200
DC
4.0
DC
2.0
0.1
4.0
0.1
2.0
4.0
4.0
4.0
10
4.0
20
5.0
200
Data in the Typical (Typ) column is based on characterization results at 25C. This data is for design guidance only and is not tested.
Note 1: All specified values are based on characterization data for that particular oscillator type under standard
operating conditions with the device executing code. Exceeding these specified limits may result in an
unstable oscillator operation and/or higher than expected current consumption.
When an external clock input is used, the max cycle time limit is DC (no clock) for all devices.
2: Instruction cycle period (TCY) equals four times the input oscillator time base period.
Preliminary
DS30453D-page 111
PIC16C5X
TABLE 15-1:
AC Characteristics
Param
No.
Symbol
Characteristic
Min
Typ
Max
Units
TOSC
250
ns
XT OSC mode
500
ns
250
ns
100
ns
50
ns
5.0
LP OSC mode
250
ns
RC OSC mode
(1)
Oscillator Period
Tcy
(2)
Conditions
500
ns
250
10,000
ns
XT OSC mode
500
ns
250
250
ns
100
250
ns
50
250
ns
5.0
200
LP OSC mode
4/FOSC
85*
ns
XT oscillator
20*
ns
HS oscillator
2.0*
LP oscillator
25*
ns
XT oscillator
25*
ns
HS oscillator
50*
ns
LP oscillator
Data in the Typical (Typ) column is based on characterization results at 25C. This data is for design guidance only and is not tested.
Note 1: All specified values are based on characterization data for that particular oscillator type under standard
operating conditions with the device executing code. Exceeding these specified limits may result in an
unstable oscillator operation and/or higher than expected current consumption.
When an external clock input is used, the max cycle time limit is DC (no clock) for all devices.
2: Instruction cycle period (TCY) equals four times the input oscillator time base period.
DS30453D-page 112
Preliminary
PIC16C5X
FIGURE 15-3:
Q4
Q2
Q3
OSC1
10
11
CLKOUT
13
14
12
18
19
16
I/O Pin
(input)
15
17
I/O Pin
(output)
New Value
Old Value
20, 21
Note: Please refer to Figure 15-1 for load conditions.
TABLE 15-2:
AC Characteristics
Param
No.
Symbol
10
TosH2ckL
TosH2ckH
11
12
TckR
13
TckF
14
TckL2ioV
15
16
Min
Typ
Max
Units
OSC1 to CLKOUT(1)
15
30**
ns
(1)
OSC1 to CLKOUT
15
30**
ns
(1)
5.0
15**
ns
5.0
15**
ns
40**
ns
0.25 TCY+30*
ns
0*
ns
(1)
(1)
TioV2ckH
TckH2ioI
(1)
(2)
17
TosH2ioV
100*
ns
18
TosH2ioI
TBD
ns
19
TioV2osH
TBD
ns
20
TioR
10
25**
ns
10
25**
ns
21
TioF
Data in the Typical (Typ) column is based on characterization results at 25C. This data is for design guidance only and is not tested.
Preliminary
DS30453D-page 113
PIC16C5X
FIGURE 15-4:
VDD
MCLR
30
Internal
POR
32
32
32
DRT
Time-out
Internal
RESET
Watchdog
Timer
RESET
31
34
34
I/O pin
(Note 1)
Note 1: Please refer to Figure 15-1 for load conditions.
TABLE 15-3:
Symbol
30
TmcL
31
Min
Typ
Max
Units
Conditions
100*
1
ns
s
VDD = 5.0V
VDD = 5.0V (PIC16LV54A only)
Twdt
9.0*
18*
30*
ms
32
TDRT
9.0*
18*
30*
ms
34
TioZ
100*
1s
ns
(PIC16LV54A only)
Characteristic
Data in the Typical (Typ) column is at 5V, 25C unless otherwise stated. These parameters are for design
guidance only and are not tested.
DS30453D-page 114
Preliminary
PIC16C5X
FIGURE 15-5:
T0CKI
40
41
42
Note: Please refer to Figure 15-1 for load conditions.
TABLE 15-4:
AC Characteristics
Param
Symbol
No.
40
41
42
Tt0H
Tt0L
Tt0P
Min
ns
ns
ns
ns
ns
Conditions
Whichever is greater.
N = Prescale Value
(1, 2, 4,..., 256)
Preliminary
DS30453D-page 115
PIC16C5X
NOTES:
DS30453D-page 116
Preliminary
PIC16C5X
16.0
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and
are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified
power supply range) and therefore outside the warranted range.
Typical represents the mean of the distribution at 25C. Maximum or minimum represents (mean + 3) or (mean
3) respectively, where is a standard deviation, over the whole temperature range.
FIGURE 16-1:
Fosc
Fosc (25C)
1.10
REXt 10 kW
1.08
CEXT = 100 pF
1.06
1.04
1.02
1.00
0.98
VDD = 5.5V
0.96
0.94
VDD = 3.5V
0.92
0.90
0.88
0
20
10
25
30
40
50
70
60
T(C)
TABLE 16-1:
RC OSCILLATOR FREQUENCIES
Average
Fosc @ 5 V, 25C
CEXT
REXT
20 pF
3.3K
5 MHz
27%
5K
3.8 MHz
21%
10K
2.2 MHz
21%
100K
262 kHz
31%
100 pF
300 pF
3.3K
1.6 MHz
13%
5K
1.2 MHz
13%
10K
684 kHz
18%
100K
71 kHz
25%
10%
3.3K
660 kHz
5.0K
484 kHz
14%
10K
267 kHz
15%
100K
29 kHz
19%
Preliminary
DS30453D-page 117
PIC16C5X
FIGURE 16-2:
6
R=3.3K
5
R=5K
FOSC (MHz)
3
R=10K
1
R=100K
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (Volts)
FIGURE 16-3:
R=3.3K
5
R=5K
FOSC (MHz)
3
R=10K
1
R=100K
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VDD (Volts)
DS30453D-page 118
Preliminary
6.0
PIC16C5X
FIGURE 16-4:
700
R=3.3K
600
500
FOSC (kHz)
R=5K
400
300
R=10K
200
100
R=100K
0
2.5
3.0
3.5
4.0
4.5
VDD (Volts)
Preliminary
5.0
5.5
6.0
DS30453D-page 119
PIC16C5X
FIGURE 16-5:
2.5
2.0
IPD (A)
1.5
1.0
0.5
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (Volts)
FIGURE 16-6:
25.00
20.00
15.00
10.00
5.00
0.00
2.5
3.5
4.5
5.5
VDD (Volts)
DS30453D-page 120
Preliminary
PIC16C5X
FIGURE 16-7:
2.0
1.8
4
Max (
VTH (Volts)
1.6
1.4
0C to
+ 85 C
25
Typ (+
C )
1.2
1.0
4
Min (
0C to
+ 85 C
0.8
0.6
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (Volts)
FIGURE 16-8:
VTH (INPUT THRESHOLD VOLTAGE) OF OSC1 INPUT (IN XT, HS, AND LP
MODES) vs. VDD
Typical: statistical mean @ 25C
Maximum: mean + 3s (-40C to 125C)
Minimum: mean 3s (-40C to 125C)
3.4
3.2
3.0
2.8
VTH (Volts)
2.6
Ma x
2.4
0
( 4
o +8
C t
(+
Typ
2.2
2.0
Min
1.8
5 C
)
25 C
o
C t
( 4 0
+85
C)
1.6
1.4
1.2
1.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (Volts)
Preliminary
DS30453D-page 121
PIC16C5X
FIGURE 16-9:
VIH, VIL OF MCLR, T0CKI AND OSC1 (IN RC MODE) vs. VDD
Typical: statistical mean @ 25C
Maximum: mean + 3s (-40C to 125C)
Minimum: mean 3s (-40C to 125C)
4.5
4.0
3.5
VIH
3.0
to
40C
ax (
VIH
2.5
VIH
+
typ
C
+85
25C
o
C t
(40
n
i
m
+8 5
C)
2.0
1.5
C to +85C)
1.0
0.5
5C)
0.0
2.5
Note:
3.0
3.5
4.0
4.5
VDD (Volts)
5.0
5.5
6.0
DS30453D-page 122
Preliminary
PIC16C5X
FIGURE 16-10:
10000
IDD (A)
1000
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
100
10
0.1
FIGURE 16-11:
1
Freq (MHz)
10
10000
IDD (A)
1000
100
10
0.1
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
1
Freq (MHz)
Preliminary
10
DS30453D-page 123
PIC16C5X
FIGURE 16-12:
TYPICAL IDD vs. FREQUENCY (WDT DISABLED, RC MODE @ 100 PF, 25C)
Typical: statistical mean @ 25C
Maximum: mean + 3s (-40C to 125C)
Minimum: mean 3s (-40C to 125C)
10000
IDD (A)
1000
100
10
0.01
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
0.1
10
Freq (MHz)
FIGURE 16-13:
10000
IDD (A)
1000
100
10
0.01
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
0.1
10
Freq (MHz)
DS30453D-page 124
Preliminary
PIC16C5X
FIGURE 16-14:
TYPICAL IDD vs. FREQUENCY (WDT DISABLED, RC MODE @ 300 PF, 25C)
Typical: statistical mean @ 25C
Maximum: mean + 3s (-40C to 125C)
Minimum: mean 3s (-40C to 125C)
10000
IDD (A)
1000
100
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
10
0.01
FIGURE 16-15:
0.1
Freq (MHz)
10000
IDD (A)
1000
100
10
0.01
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
0.1
Freq (MHz)
Preliminary
DS30453D-page 125
PIC16C5X
FIGURE 16-16:
FIGURE 16-17:
TRANSCONDUCTANCE
(gm) OF HS OSCILLATOR
vs. VDD
50
9000
45
8000
Max 40C
40
7000
6000
30
Max +85C
gm (A/W)
35
25
Max +70C
20
5000
Typ +25C
4000
Typ +25C
3000
MIn 0C
2000
Min +85C
15
10
MIn 40C
5
2.0
3.0
4.0
5.0
6.0
100
7.0
0
2.0
VDD (Volts)
4.0
5.0
6.0
7.0
VDD (Volts)
DS30453D-page 126
3.0
Preliminary
PIC16C5X
FIGURE 16-18:
TRANSCONDUCTANCE
(gm) OF LP OSCILLATOR
vs. VDD
FIGURE 16-19:
TRANSCONDUCTANCE
(gm) OF XT OSCILLATOR
vs. VDD
2500
45
40
Max 40C
Max 40C
2000
35
30
25
gm (A/V)
gm (A/V)
1500
Typ +25C
20
Typ +25C
1000
15
Min +85C
500
10
Min +85C
5
0
0
2.0
3.0
4.0
5.0
6.0
2.0
3.0
4.0
5.0
6.0
7.0
VDD (Volts)
7.0
VDD (Volts)
Preliminary
DS30453D-page 127
PIC16C5X
FIGURE 16-20:
Min +85C
5
10
10
IOH (mA)
IOH (mA)
Min +85C
Typ +25C
20
Typ +25C
15
Max 40C
30
Max 40C
20
40
25
1.5
0
0.5
1.0
1.5
2.0
2.5
2.5
3.0
3.5
4.0
4.5
5.0
VOH (Volts)
VOH (Volts)
DS30453D-page 128
2.0
3.0
Preliminary
PIC16C5X
FIGURE 16-22:
FIGURE 16-23:
45
90
Max 40C
40
Max 40C
80
35
70
30
60
IOL (mA)
IOL (mA)
Typ +25C
25
Typ +25C
20
50
40
Min +85C
15
30
Min +85C
10
20
10
0
0.0
0
0.5
1.0
1.5
2.0
2.5
3.0
VOL (Volts)
TABLE 16-2:
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VOL (Volts)
Pin
18L PDIP
18L SOIC
RA port
5.0
4.3
RB port
5.0
4.3
MCLR
17.0
17.0
OSC1
4.0
3.5
OSC2/CLKOUT
4.3
3.5
T0CKI
3.2
2.8
Preliminary
DS30453D-page 129
PIC16C5X
NOTES:
DS30453D-page 130
Preliminary
PIC16C5X
17.0
Preliminary
DS30453D-page 131
PIC16C5X
FIGURE 17-1:
6.0
5.5
5.0
VDD
(Volts)
4.5
4.0
3.5
3.0
2.5
0
10
20
25
Frequency (MHz)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency.
Please reference the Product Identification System section for the maximum rated speed of the parts.
FIGURE 17-2:
6.0
5.5
5.0
VDD
(Volts)
4.5
4.0
3.5
3.0
2.5
2.0
0
10
Frequency (MHz)
20
25
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency.
Please reference the Product Identification System section for the maximum rated speed of the parts.
DS30453D-page 132
Preliminary
PIC16C5X
FIGURE 17-3:
6.0
5.5
5.0
VDD
(Volts)
4.5
4.0
3.5
3.0
2.5
2.0
0
10
20
25
Frequency (MHz)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency.
Please reference the Product Identification System section for the maximum rated speed of the parts.
FIGURE 17-4:
6.0
5.5
5.0
VDD
(Volts)
4.5
4.0
3.5
3.0
2.7
2.5
2.0
0
10
20
25
Frequency (MHz)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency.
Please reference the Product Identification System section for the maximum rated speed of the parts.
Preliminary
DS30453D-page 133
PIC16C5X
17.1
PIC16LC5X
PIC16LCR5X
(Commercial, Industrial)
PIC16C5X
PIC16CR5X
(Commercial, Industrial)
Param
Symbol
No.
VDD
D001
Characteristic/Device
Min
Conditions
Supply Voltage
PIC16LC5X
2.5
2.7
2.5
5.5
5.5
5.5
V
V
V
3.0
4.5
5.5
5.5
V
V
PIC16C5X
D001A
D002
VDR
1.5*
D003
VPOR
VSS
D004
SVDD
0.05*
V/ms
Legend:
Rows with standard voltage device data only are shaded for improved readability.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading,
oscillator type, bus rate, internal code execution pattern and temperature also have an impact on the current consumption.
a) The test conditions for all IDD measurements in active Operation mode are: OSC1 = external square wave,
from rail-to-rail; all I/O pins tristated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled
as specified.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode.
The power-down current in SLEEP mode does not depend on the oscillator type.
3: Does not include current through REXT. The current through the resistor can be estimated by the formula:
IR = VDD/2REXT (mA) with REXT in k.
DS30453D-page 134
Preliminary
PIC16C5X
17.1
PIC16LC5X
PIC16LCR5X
(Commercial, Industrial)
PIC16C5X
PIC16CR5X
(Commercial, Industrial)
Param
Symbol
No.
IDD
Characteristic/Device
PIC16LC5X
D010A
Conditions
Supply Current(2,3)
D010
Legend:
Min
PIC16C5X
0.5
11
2.4
27
mA
A
14
35
1.8
2.6
4.5
14
2.4
3.6*
16
32
mA
mA
mA
A
17
40
Rows with standard voltage device data only are shaded for improved readability.
These parameters are characterized but not tested.
Data in Typ column is at 5V, 25C, unless otherwise stated. These parameters are for design guidance only, and
are not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading,
oscillator type, bus rate, internal code execution pattern and temperature also have an impact on the current consumption.
a) The test conditions for all IDD measurements in active Operation mode are: OSC1 = external square wave,
from rail-to-rail; all I/O pins tristated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled
as specified.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode.
The power-down current in SLEEP mode does not depend on the oscillator type.
3: Does not include current through REXT. The current through the resistor can be estimated by the formula:
IR = VDD/2REXT (mA) with REXT in k.
Preliminary
DS30453D-page 135
PIC16C5X
17.1
PIC16LC5X
PIC16LCR5X
(Commercial, Industrial)
PIC16C5X
PIC16CR5X
(Commercial, Industrial)
Param
Symbol
No.
IPD
D020
D020A
Legend:
Characteristic/Device
Min
Conditions
Power-down Current(2)
PIC16LC5X
0.25
0.25
1
1.25
2
3
5
8
A
A
A
A
PIC16C5X
0.25
0.25
1.8
2.0
4
4
9.8
12
4.0
5.0
7.0*
8.0*
12*
14*
27*
30*
A
A
A
A
A
A
A
A
Rows with standard voltage device data only are shaded for improved readability.
Data in Typ column is at 5V, 25C, unless otherwise stated. These parameters are for design guidance only, and
are not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading,
oscillator type, bus rate, internal code execution pattern and temperature also have an impact on the current consumption.
a) The test conditions for all IDD measurements in active Operation mode are: OSC1 = external square wave,
from rail-to-rail; all I/O pins tristated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled
as specified.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode.
The power-down current in SLEEP mode does not depend on the oscillator type.
3: Does not include current through REXT. The current through the resistor can be estimated by the formula:
IR = VDD/2REXT (mA) with REXT in k.
DS30453D-page 136
Preliminary
PIC16C5X
17.2
PIC16C54C/C55A/C56A/C57C/C58B-04E, 20E
PIC16CR54C/CR56A/CR57C/CR58B-04E, 20E
(Extended)
Param
Symbol
No.
D001
VDD
Characteristic
Min
Typ
Max Units
3.0
4.5
5.5
5.5
Supply Voltage
V
V
Conditions
RC, XT, LP, and HS mode
from 0 - 10 MHz
from 10 - 20 MHz
D002
VDR
1.5*
D003
VPOR
Vss
D004
SVDD
0.05*
D010
IDD
1.8
9.0
3.3
20
mA
mA
0.3
10
12
4.8
18
26
17
50*
60*
31*
68*
90*
A
A
A
A
A
A
D020
IPD
Supply Current(2)
XT and RC(3) modes
HS mode
Power-down Current(2)
Data in Typ column is at 5V, 25C, unless otherwise stated. These parameters are for design guidance only,
and are not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on
the current consumption.
a) The test conditions for all IDD measurements in active Operation mode are: OSC1 = external square
wave, from rail-to-rail; all I/O pins tristated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/
disabled as specified.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP
mode. The power-down current in SLEEP mode does not depend on the oscillator type.
3: Does not include current through REXT. The current through the resistor can be estimated by the formula:
IR = VDD/2REXT (mA) with REXT in k.
Preliminary
DS30453D-page 137
PIC16C5X
17.3
DC CHARACTERISTICS
Param
Symbol
No.
D030
D040
VIL
VIH
D050
VHYS
D060
IIL
Characteristic
Min
Typ
Max
Units
VSS
VSS
VSS
VSS
VSS
VSS
0.8 V
0.15 VDD
0.15 VDD
0.15 VDD
0.15 VDD
0.3 VDD
V
V
V
V
V
V
2.0
0.25 VDD+0.8
0.85 VDD
0.85 VDD
0.85 VDD
0.7 VDD
VDD
VDD
VDD
VDD
VDD
VDD
V
V
V
V
V
V
0.15 VDD*
-1.0
0.5
+1.0
-5.0
-3.0
-3.0
0.5
0.5
0.5
+5.0
+3.0
+3.0
A
A
A
A
0.6
0.6
V
V
VDD - 0.7
VDD - 0.7
V
V
Hysteresis of Schmitt
Trigger inputs
Input Leakage Current(1,2)
I/O ports
MCLR
MCLR
T0CKI
OSC1
D080
D090
VOL
VOH
Conditions
RC mode only(3)
XT, HS and LP modes
RC mode only(3)
XT, HS and LP modes
DS30453D-page 138
Preliminary
PIC16C5X
17.4
The timing parameter symbols have been created with one of the following formats:
1. TppS2ppS
2. TppS
T
F Frequency
Lowercase letters (pp) and their meanings:
pp
2 to
ck CLKOUT
cy cycle time
drt device reset timer
io I/O port
Uppercase letters and their meanings:
S
F Fall
H High
I
Invalid (Hi-impedance)
L
Low
FIGURE 17-5:
Time
mc
osc
os
t0
wdt
MCLR
oscillator
OSC1
T0CKI
watchdog timer
P
R
V
Z
Period
Rise
Valid
Hi-impedance
CL = 50 pF
Pin
CL
0 -15 pF
VSS
Preliminary
DS30453D-page 139
PIC16C5X
17.5
FIGURE 17-6:
Q1
Q3
Q2
Q4
Q1
OSC1
1
2
CLKOUT
TABLE 17-1:
AC Characteristics
Param
No.
Symbol
FOSC
(1)
Oscillator Frequency
TOSC
External CLKIN
Period(1)
(1)
Oscillator Period
Min
Typ
Max Units
Conditions
DC
4.0
DC
4.0
DC
20
DC
200
DC
4.0
0.45
4.0
4.0
4.0
4.0
20
5.0
200
250
ns
XT OSC mode
250
ns
50
ns
5.0
LP OSC mode
250
ns
RC OSC mode
250
2,200
ns
XT OSC mode
250
250
ns
50
250
ns
5.0
200
LP OSC mode
DS30453D-page 140
Preliminary
PIC16C5X
TABLE 17-1:
AC Characteristics
Param
No.
Symbol
Tcy
Min
Typ
Max Units
Conditions
4/FOSC
50*
ns
XT oscillator
20*
ns
HS oscillator
2.0*
LP oscillator
25*
ns
XT oscillator
25*
ns
HS oscillator
50*
ns
LP oscillator
Preliminary
DS30453D-page 141
PIC16C5X
FIGURE 17-7:
Q4
Q2
Q3
OSC1
10
11
CLKOUT
13
14
19
12
18
16
I/O Pin
(input)
15
17
I/O Pin
(output)
New Value
Old Value
20, 21
Note:
TABLE 17-2:
AC Characteristics
Param
No.
Symbol
10
TosH2ckL
TosH2ckH
11
12
TckR
13
TckF
14
TckL2ioV
15
16
TioV2ckH
TckH2ioI
Min
Typ
Max
Units
OSC1 to CLKOUT(1)
15
30**
ns
(1)
15
30**
ns
5.0
15**
ns
5.0
15**
ns
40**
ns
0.25 TCY+30*
ns
0*
ns
OSC1 to CLKOUT
(1)
(1)
(1)
(2)
17
TosH2ioV
100*
ns
18
TosH2ioI
TBD
ns
19
TioV2osH
TBD
ns
20
TioR
10
25**
ns
10
25**
ns
21
*
TioF
** These parameters are design targets and are not tested. No characterization data available at this time.
Data in the Typical (Typ) column is at 5V, 25C unless otherwise stated. These parameters are for design
guidance only and are not tested.
DS30453D-page 142
Preliminary
PIC16C5X
FIGURE 17-8:
VDD
MCLR
30
Internal
POR
32
32
32
DRT
Time-out
Internal
RESET
Watchdog
Timer
RESET
31
34
34
I/O pin
(Note 1)
TABLE 17-3:
Symbol
30
TmcL
31
Twdt
32
34
*
Characteristic
Min
Typ
Max
Units
Conditions
1000*
ns
VDD = 5.0V
9.0*
18*
30*
ms
TDRT
9.0*
18*
30*
ms
TioZ
100*
300*
1000*
ns
Data in the Typical (Typ) column is at 5V, 25C unless otherwise stated. These parameters are for design
guidance only and are not tested.
Preliminary
DS30453D-page 143
PIC16C5X
FIGURE 17-9:
T0CKI
40
41
42
Note: Please refer to Figure 17-5 for load conditions.
TABLE 17-4:
AC Characteristics
Param
Symbol Characteristic
No.
40
Tt0H
Min
ns
10*
ns
ns
10*
ns
20 or TCY + 40*
N
ns
- With Prescaler
41
Tt0L
42
Tt0P
T0CKI Period
Whichever is greater.
N = Prescale Value
(1, 2, 4,..., 256)
DS30453D-page 144
Preliminary
PIC16C5X
18.0
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and
are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified
power supply range) and therefore outside the warranted range.
Typical represents the mean of the distribution at 25C. Maximum or minimum represents (mean + 3) or (mean
3) respectively, where is a standard deviation, over the whole temperature range.
FIGURE 18-1:
FOSC
FOSC (25C)
1.10
REXT 10 kW
CEXT = 100 pF
1.08
1.06
1.04
1.02
1.00
0.98
VDD = 5.5V
0.96
0.94
VDD = 3.5V
0.92
0.90
0.88
0
TABLE 18-1:
10
20
25
30
T(C)
40
50
60
70
RC OSCILLATOR FREQUENCIES
Average
Fosc @ 5V, 25C
CEXT
REXT
20 pF
3.3K
5 MHz
27%
5K
3.8 MHz
21%
21%
100 pF
300 pF
10K
2.2 MHz
100K
262 kHz
31%
3.3K
1.63 MHz
13%
13%
5K
1.2 MHz
10K
684 kHz
18%
100K
71 kHz
25%
3.3K
660 kHz
10%
5.0K
484 kHz
14%
10K
267 kHz
15%
100K
29 kHz
19%
Preliminary
DS30453D-page 145
PIC16C5X
FIGURE 18-2:
6
R=3.3K
5
R=5K
4
3
R=10K
2
R=100K
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (Volts)
FIGURE 18-3:
1.8
R=3.3K
1.6
FOSC (MHz)
1.4
R=5K
1.0
R=10K
0.6
0.2
R=100K
0
2.5
DS30453D-page 146
3.0
3.5
4.0
4.5
VDD (Volts)
Preliminary
5.0
5.5
6
6.0
PIC16C5X
FIGURE 18-4:
700
R=3.3K
600
500
FOSC (kHz)
R=5K
400
300
R=10K
200
100
R=100K
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (Volts)
FIGURE 18-5:
25
20
IPD (uA)
15
10
0
2.5
3.0
3.5
4.0
4.5
VDD (Volts)
Preliminary
5.0
5.5
6.0
DS30453D-page 147
PIC16C5X
FIGURE 18-6:
25
20
IPD (uA)
15
10
5.0
2.5
3.5
3.0
4.0
4.5
5.0
5.5
6.0
VDD (Volts)
FIGURE 18-7:
35
30
25
IPD (uA)
20
15
10
(-40C)
5.0
(+85C)
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (Volts)
DS30453D-page 148
Preliminary
PIC16C5X
FIGURE 18-8:
VTH (INPUT THRESHOLD TRIP POINT VOLTAGE) OF I/O PINS vs. VDD
Typical: statistical mean @ 25C
Maximum: mean + 3s (-40C to 125C)
Minimum: mean 3s (-40C to 125C)
2.0
1.8
VTH (Volts)
1.6
1.4
25
Typ (+
C )
1.2
1.0
0.8
0.6
2.5
3.0
3.5
4.0
4.5
5.5
5.0
6.0
VDD (Volts)
FIGURE 18-9:
VIH, VIL OF MCLR, T0CKI AND OSC1 (IN RC MODE) vs. VDD
Typical: statistical mean @ 25C
Maximum: mean + 3s (-40C to 125C)
Minimum: mean 3s (-40C to 125C)
4.5
4.0
3.5
VIH
3.0
to
40C
ax (
VIH
2.5
VIH
+
typ
+85
C)
25C
to
40C
in (
+8 5
C)
2.0
1.5
C to +85C)
1.0
0.5
C)
0.0
2.5
Note:
3.0
3.5
4.0
4.5
VDD (Volts)
5.0
5.5
6.0
Preliminary
DS30453D-page 149
PIC16C5X
FIGURE 18-10:
VTH (INPUT THRESHOLD TRIP POINT VOLTAGE) OF OSC1 INPUT (IN XT, HS
AND LP MODES) vs. VDD
Typical: statistical mean @ 25C
Maximum: mean + 3s (-40C to 125C)
Minimum: mean 3s (-40C to 125C)
3.4
3.2
3.0
2.8
2.6
VTH (Volts)
2.4
(+
Typ
2.2
)
25C
2.0
1.8
1.6
1.4
1.2
1.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (Volts)
FIGURE 18-11:
10000
IDD(A)
1000
100
5.5V
4.5V
3.5V
2.5V
10
0.1
DS30453D-page 150
1
FREQ(MHz)
Preliminary
10
PIC16C5X
FIGURE 18-12:
TYPICAL IDD vs. FREQUENCY (WDT DISABLED, RC MODE @ 100 PF, 25C)
TYPICAL IDD vs FREQ(RC MODE @ 100 pF/25C)
10000
IDD(A)
1000
5.5V
100
4.5V
3.5V
2.5V
10
0.1
FIGURE 18-13:
FREQ(MHz)
10
TYPICAL IDD vs. FREQUENCY (WDT DISABLED, RC MODE @ 300 PF, 25C)
TYPICAL IDD vs FREQ (RC MODE @ 300 pF/25C)
10000
IDD(A)
1000
100
5.5V
4.5V
3.5V
2.5V
10
0.01
0.1
FREQ(MHz)
Preliminary
DS30453D-page 151
PIC16C5X
FIGURE 18-14:
FIGURE 18-15:
50
45
5
40
Min +85C
IOH (mA)
35
30
Typ +125C
25
10
Typ +25C
15
Typ +85C
Max 40C
20
Typ +25C
20
15
Typ 40C
10
25
0
5.0
2.0
3.0
4.0
0.5
1.0
1.5
2.0
2.5
3.0
VOH (Volts)
5.0
6.0
7.0
VDD (Volts)
DS30453D-page 152
Preliminary
PIC16C5X
FIGURE 18-16:
FIGURE 18-17:
45
Max 40C
40
35
10
30
20
IOL (mA)
IOH (mA)
Typ +125C
Typ +85C
Typ +25C
Typ 40C
25
Typ +25C
20
15
30
Min +85C
10
40
5
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VOH (Volts)
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VOL (Volts)
Preliminary
DS30453D-page 153
PIC16C5X
FIGURE 18-18:
90
Max 40C
80
70
60
IOL (mA)
Typ +25C
50
40
Min +85C
30
20
10
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VOL (Volts)
TABLE 18-2:
INPUT CAPACITANCE
Typical Capacitance (pF)
Pin
18L PDIP
18L SOIC
RA port
5.0
4.3
RB port
5.0
4.3
MCLR
17.0
17.0
OSC1
4.0
3.5
OSC2/CLKOUT
4.3
3.5
T0CKI
3.2
2.8
DS30453D-page 154
Preliminary
PIC16C5X
19.0
Preliminary
DS30453D-page 155
PIC16C5X
FIGURE 19-1:
6.0
5.5
5.0
VDD
(Volts)
4.5
4.0
3.5
3.0
2.5
0
10
20
25
40
Frequency (MHz)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency.
Please reference the Product Identification System section for the maximum rated speed of the parts.
3: Operation between 20 to 40 MHz requires the following:
VDD between 4.5V. and 5.5V
OSC1 externally driven
OSC2 not connected
HS mode
Commercial temperatures
Devices qualified for 40 MHz operation have -40 designation (ex: PIC16C54C-40/P).
4: For operation between DC and 20 MHz, see Section 17.1.
DS30453D-page 156
Preliminary
PIC16C5X
19.1
PIC16C54C/C55A/C56A/C57C/C58B-40
(Commercial)
Param
Symbol
No.
D001
VDD
Characteristic
Supply Voltage
(2)
Min
Typ
Max Units
Conditions
4.5
5.5
1.5*
Vss
D002
VDR
D003
VPOR
D004
SVDD
D010
IDD
Supply Current(3)
5.2
6.8
12.3
16
mA
mA
D020
IPD
Power-down Current(3)
1.8
9.8
7.0
27*
A
A
Preliminary
DS30453D-page 157
PIC16C5X
DC Characteristics: PIC16C54C/C55A/C56A/C57C/C58B-40 (Commercial)(1)
19.2
DC CHARACTERISTICS
Param
Symbol
No.
D030
VIL
D040
VIH
D050
VHYS
D060
IIL
D080
VOL
D090
VOH
Characteristic
Min
Typ
Max
Units
VSS
VSS
VSS
VSS
0.8
0.15 VDD
0.15 VDD
0.2 VDD
V
V
V
V
2.0
0.85 VDD
0.85 VDD
0.8 VDD
VDD
VDD
VDD
VDD
V
V
V
V
0.15 VDD*
-1.0
0.5
+1.0
MCLR
MCLR
T0CKI
OSC1
-5.0
-3.0
-3.0
0.5
0.5
0.5
+5.0
+3.0
+3.0
A
A
A
A
0.6
VDD - 0.7
Hysteresis of Schmitt
Trigger inputs
Conditions
Voltage(3)
Data in the Typical (Typ) column is based on characterization results at 25C. This data is for design guidance
only and is not tested.
Note 1: Device operation between 20 MHz to 40 MHz requires the following: VDD between 4.5V to 5.5V, OSC1 pin
externally driven, OSC2 pin not connected and HS oscillator mode and commercial temperatures. For operation between DC and 20 MHz, See Section 17.3.
2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input voltage.
3: Negative current is defined as coming out of the pin.
DS30453D-page 158
Preliminary
PIC16C5X
19.3
The timing parameter symbols have been created with one of the following formats:
1. TppS2ppS
2. TppS
T
F Frequency
Lowercase letters (pp) and their meanings:
pp
2 to
ck CLKOUT
cy cycle time
drt device reset timer
io I/O port
Uppercase letters and their meanings:
S
F Fall
H High
I
Invalid (Hi-impedance)
L
Low
FIGURE 19-2:
Time
mc
osc
os
t0
wdt
MCLR
oscillator
OSC1
T0CKI
watchdog timer
P
R
V
Z
Period
Rise
Valid
Hi-impedance
Pin
CL
VSS
Preliminary
DS30453D-page 159
PIC16C5X
19.4
FIGURE 19-3:
Q1
Q3
Q2
Q4
Q1
OSC1
1
2
CLKOUT
TABLE 19-1:
AC Characteristics
Param
No.
1
2
Symbol
Min
Typ
Max Units
FOSC
20
40
TOSC
25
ns
(2)
4/FOSC
Tcy
Conditions
6.0*
ns
HS oscillator
6.5*
ns
HS oscillator
Data in the Typical (Typ) column is at 5V, 25C unless otherwise stated. These parameters are for design
guidance only and are not tested.
Note 1: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable
oscillator operation and/or higher than expected current consumption.
When an external clock input is used, the max cycle time limit is DC (no clock) for all devices.
2: Instruction cycle period (TCY) equals four times the input oscillator time base period.
DS30453D-page 160
Preliminary
PIC16C5X
FIGURE 19-4:
Q4
Q2
Q3
OSC1
11
10
CLKOUT
13
19
14
12
18
16
I/O Pin
(input)
15
17
I/O Pin
(output)
New Value
Old Value
20, 21
.
Note:
TABLE 19-2:
AC Characteristics
Param
No.
Symbol
10
TosH2ckL
TosH2ckH
11
Min
Typ
Max
Units
OSC1 to CLKOUT(1,2)
15
30**
ns
(1,2)
15
30**
ns
OSC1 to CLKOUT
(1,2)
12
TckR
5.0
15**
ns
13
TckF
5.0
15**
ns
40**
ns
0.25 TCY+30*
ns
14
15
TckL2ioV
TioV2ckH
(1,2)
(1,2)
(1,2)
16
TckH2ioI
0*
ns
17
TosH2ioV
100
ns
18
TosH2ioI
TBD
ns
19
TioV2osH
TBD
ns
20
TioR
10
25**
ns
10
25**
ns
21
*
TioF
** These parameters are design targets and are not tested. No characterization data available at this time.
Data in the Typical (Typ) column is at 5V, 25C unless otherwise stated. These parameters are for design
guidance only and are not tested.
Preliminary
DS30453D-page 161
PIC16C5X
FIGURE 19-5:
VDD
MCLR
30
Internal
POR
32
32
32
DRT
Time-out
Internal
RESET
Watchdog
Timer
RESET
31
34
34
I/O pin(1)
TABLE 19-3:
Symbol
30
TmcL
1000*
ns
VDD = 5.0V
31
Twdt
9.0*
18*
30*
ms
32
TDRT
9.0*
18*
30*
ms
34
TioZ
100*
300*
1000*
ns
Characteristic
Min
Typ
Max
Units
Conditions
Data in the Typical (Typ) column is at 5V, 25C unless otherwise stated. These parameters are for design
guidance only and are not tested.
DS30453D-page 162
Preliminary
PIC16C5X
FIGURE 19-6:
T0CKI
40
41
42
Note:
TABLE 19-4:
AC Characteristics
Param
No.
40
Symbol Characteristic
Tt0H
Min
ns
10*
ns
ns
10*
ns
20 or TCY + 40*
N
ns
- With Prescaler
41
Tt0L
42
Tt0P
T0CKI Period
Whichever is greater.
N = Prescale Value
(1, 2, 4,..., 256)
Preliminary
DS30453D-page 163
PIC16C5X
NOTES:
DS30453D-page 164
Preliminary
PIC16C5X
20.0
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and
are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified
power supply range) and therefore outside the warranted range.
Typical represents the mean of the distribution at 25C. Maximum or minimum represents (mean + 3) or (mean
3) respectively, where is a standard deviation, over the whole temperature range.
FIGURE 20-1:
25
20
IPD (uA)
15
10
5.0
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (Volts)
Preliminary
DS30453D-page 165
PIC16C5X
FIGURE 20-2:
25
20
IPD (uA)
15
10
5.0
2.5
3.5
3.0
4.0
4.5
5.0
5.5
6.0
VDD (Volts)
FIGURE 20-3:
35
30
25
IPD (uA)
20
15
10
(-40C)
5.0
(+85C)
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (Volts)
DS30453D-page 166
Preliminary
PIC16C5X
FIGURE 20-4:
VTH (INPUT THRESHOLD TRIP POINT VOLTAGE) OF I/O PINS vs. VDD
Typical: statistical mean @ 25C
Maximum: mean + 3s (-40C to 125C)
Minimum: mean 3s (-40C to 125C)
2.0
1.8
VTH (Volts)
1.6
1.4
2
Typ (+
5 C )
1.2
1.0
0.8
0.6
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (Volts)
FIGURE 20-5:
3.4
3.2
3.0
2.8
VTH (Volts)
2.6
2.4
(+
Typ
2.2
)
25 C
2.0
1.8
1.6
1.4
1.2
1.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (Volts)
Preliminary
DS30453D-page 167
PIC16C5X
FIGURE 20-6:
TYPICAL IDD vs. VDD (40 MHZ, WDT DISABLED, HS MODE, 70C)
Typical: statistical mean @ 25C
Maximum: mean + 3s (-40C to 125C)
Minimum: mean 3s (-40C to 125C)
12
11
10
IDD (mA)
9.0
8.0
7.0
6.0
5.0
4.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
VDD (Volts)
DS30453D-page 168
Preliminary
PIC16C5X
FIGURE 20-7:
FIGURE 20-8:
50
45
10
40
Typ +125C
IOH (mA)
35
30
20
Typ +85C
Typ +25C
Typ +125C
25
Typ 40C
Typ +85C
30
20
Typ +25C
15
Typ 40C
40
1.5
10
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VOH (Volts)
5.0
2.0
3.0
4.0
5.0
6.0
7.0
VDD (Volts)
TABLE 20-1:
INPUT CAPACITANCE
Typical Capacitance (pF)
Pin
18L PDIP
18L SOIC
RA port
5.0
4.3
RB port
5.0
4.3
MCLR
17.0
17.0
OSC1
4.0
3.5
OSC2/CLKOUT
4.3
3.5
T0CKI
3.2
2.8
Preliminary
DS30453D-page 169
PIC16C5X
FIGURE 20-9:
90
Max 40C
80
70
60
IOL (mA)
Typ +25C
50
40
Min +85C
30
20
10
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VOL (Volts)
DS30453D-page 170
Preliminary
PIC16C5X
21.0
PACKAGING INFORMATION
21.1
18-Lead PDIP
Example
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
PIC16C56A
-04I/P456
YYWWNNN
0023CBA
Example
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
PIC16C55A
-04I/SP456
YYWWNNN
0023CBA
Example
XXXXXXXXXXXXXXX
XXXXXXXXXXXXXXX
XXXXXXXXXXXXXXX
YYWWNNN
18-Lead SOIC
PIC16C55A
-04/P126
0042CDA
Example
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
PIC16C54C
-04/S0218
YYWWNNN
28-Lead SOIC
0018CDK
Example
PIC16C57C
-04/SO
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
20-Lead SSOP
0015CBK
Example
PIC16C54C
-04/SS218
0020CBP
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
28-Lead SSOP
Example
PIC16C57C
-04/SS123
XXXXXXXXXXXX
XXXXXXXXXXXX
0025CBK
YYWWNNN
Preliminary
DS30453D-page 171
PIC16C5X
Package Marking Information (Contd)
18-Lead CERDIP Windowed
Example
XXXXXXXX
XXXXXXXX
YYWWNNN
PIC16C54C
/JW
0001CBA
Example
XXXXXXXXXXX
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
Legend:
Note:
XX...X
Y
YY
WW
NNN
PIC16C57C
/JW
0038CBA
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Standard PICmicro device marking consists of Microchip part number, year code, week code, and
traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check
with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP
price.
DS30453D-page 172
Preliminary
PIC16C5X
18-Lead Plastic Dual In-line (P) 300 mil (PDIP)
E1
2
n
A2
A
L
c
A1
B1
B
eB
Units
Dimension Limits
n
p
MIN
INCHES*
NOM
18
.100
.155
.130
MAX
MILLIMETERS
NOM
18
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
22.61
22.80
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
Number of Pins
Pitch
Top to Seating Plane
A
.140
.170
Molded Package Thickness
A2
.115
.145
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.300
.313
.325
Molded Package Width
E1
.240
.250
.260
Overall Length
D
.890
.898
.905
Tip to Seating Plane
L
.125
.130
.135
c
Lead Thickness
.008
.012
.015
Upper Lead Width
B1
.045
.058
.070
Lower Lead Width
B
.014
.018
.022
eB
Overall Row Spacing
.310
.370
.430
Preliminary
MAX
4.32
3.68
8.26
6.60
22.99
3.43
0.38
1.78
0.56
10.92
15
15
DS30453D-page 173
PIC16C5X
28-Lead Skinny Plastic Dual In-line (SP) 300 mil (PDIP)
E1
2
n
A2
A
L
B1
A1
eB
Units
Number of Pins
Pitch
Dimension Limits
n
p
INCHES*
MIN
NOM
MILLIMETERS
MAX
MIN
NOM
28
MAX
28
.100
2.54
.140
.150
.160
3.56
3.81
4.06
A2
.125
.130
.135
3.18
3.30
3.43
8.26
A1
.015
.300
.310
.325
7.62
7.87
E1
.275
.285
.295
6.99
7.24
7.49
Overall Length
1.345
1.365
1.385
34.16
34.67
35.18
L
c
.125
.130
.135
3.18
3.30
3.43
.008
.012
.015
0.20
0.29
0.38
B1
.040
.053
.065
1.02
1.33
1.65
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
0.38
.016
.019
.022
0.41
0.48
0.56
eB
.320
.350
.430
8.13
8.89
10.92
10
15
10
15
10
15
10
15
* Controlling Parameter
Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MO-095
DS30453D-page 174
Preliminary
PIC16C5X
28-Lead Plastic Dual In-line (P) 600 mil (PDIP)
E1
2
n
E
A2
B1
A1
eB
Units
Dimension Limits
n
p
MIN
INCHES*
NOM
28
.100
.175
.150
MAX
MILLIMETERS
NOM
28
2.54
4.06
4.45
3.56
3.81
0.38
15.11
15.24
12.83
13.84
35.43
36.32
3.05
3.30
0.20
0.29
0.76
1.27
0.36
0.46
15.75
16.51
5
10
5
10
MIN
Number of Pins
Pitch
Top to Seating Plane
A
.160
.190
Molded Package Thickness
A2
.140
.160
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.595
.600
.625
Molded Package Width
E1
.505
.545
.560
Overall Length
D
1.395
1.430
1.465
Tip to Seating Plane
L
.120
.130
.135
c
Lead Thickness
.008
.012
.015
Upper Lead Width
B1
.030
.050
.070
Lower Lead Width
B
.014
.018
.022
Overall Row Spacing
eB
.620
.650
.680
Preliminary
MAX
4.83
4.06
15.88
14.22
37.21
3.43
0.38
1.78
0.56
17.27
15
15
DS30453D-page 175
PIC16C5X
18-Lead Plastic Small Outline (SO) Wide, 300 mil (SOIC)
E
p
E1
2
B
45
c
A2
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A2
A1
E
E1
D
h
L
c
B
MIN
.093
.088
.004
.394
.291
.446
.010
.016
0
.009
.014
0
0
A1
INCHES*
NOM
18
.050
.099
.091
.008
.407
.295
.454
.020
.033
4
.011
.017
12
12
MAX
.104
.094
.012
.420
.299
.462
.029
.050
8
.012
.020
15
15
MILLIMETERS
NOM
18
1.27
2.36
2.50
2.24
2.31
0.10
0.20
10.01
10.34
7.39
7.49
11.33
11.53
0.25
0.50
0.41
0.84
0
4
0.23
0.27
0.36
0.42
0
12
0
12
MIN
MAX
2.64
2.39
0.30
10.67
7.59
11.73
0.74
1.27
8
0.30
0.51
15
15
* Controlling Parameter
Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-051
DS30453D-page 176
Preliminary
PIC16C5X
28-Lead Plastic Small Outline (SO) Wide, 300 mil (SOIC)
E
E1
p
B
2
1
n
h
45
c
A2
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Significant Characteristic
A
A2
A1
E
E1
D
h
L
c
B
A1
MIN
.093
.088
.004
.394
.288
.695
.010
.016
0
.009
.014
0
0
INCHES*
NOM
28
.050
.099
.091
.008
.407
.295
.704
.020
.033
4
.011
.017
12
12
MAX
.104
.094
.012
.420
.299
.712
.029
.050
8
.013
.020
15
15
MILLIMETERS
NOM
28
1.27
2.36
2.50
2.24
2.31
0.10
0.20
10.01
10.34
7.32
7.49
17.65
17.87
0.25
0.50
0.41
0.84
0
4
0.23
0.28
0.36
0.42
0
12
0
12
MIN
MAX
2.64
2.39
0.30
10.67
7.59
18.08
0.74
1.27
8
0.33
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
Preliminary
DS30453D-page 177
PIC16C5X
20-Lead Plastic Shrink Small Outline (SS) 209 mil, 5.30 mm (SSOP)
E
E1
p
2
1
A2
A1
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Foot Angle
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A2
A1
E
E1
D
L
c
MIN
.068
.064
.002
.299
.201
.278
.022
.004
0
.010
0
0
INCHES*
NOM
20
.026
.073
.068
.006
.309
.207
.284
.030
.007
4
.013
5
5
MAX
.078
.072
.010
.322
.212
.289
.037
.010
8
.015
10
10
MILLIMETERS
NOM
20
0.65
1.73
1.85
1.63
1.73
0.05
0.15
7.59
7.85
5.11
5.25
7.06
7.20
0.56
0.75
0.10
0.18
0.00
101.60
0.25
0.32
0
5
0
5
MIN
MAX
1.98
1.83
0.25
8.18
5.38
7.34
0.94
0.25
203.20
0.38
10
10
* Controlling Parameter
Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MO-150
Drawing No. C04-072
DS30453D-page 178
Preliminary
PIC16C5X
28-Lead Plastic Shrink Small Outline (SS) 209 mil, 5.30 mm (SSOP)
E
E1
p
B
2
1
A
c
A2
A1
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Foot Angle
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Significant Characteristic
A
A2
A1
E
E1
D
L
c
MIN
.068
.064
.002
.299
.201
.396
.022
.004
0
.010
0
0
INCHES
NOM
28
.026
.073
.068
.006
.309
.207
.402
.030
.007
4
.013
5
5
MAX
.078
.072
.010
.319
.212
.407
.037
.010
8
.015
10
10
MILLIMETERS*
NOM
MAX
28
0.65
1.73
1.85
1.98
1.63
1.73
1.83
0.05
0.15
0.25
7.59
7.85
8.10
5.11
5.25
5.38
10.06
10.20
10.34
0.56
0.75
0.94
0.10
0.18
0.25
0.00
101.60
203.20
0.25
0.32
0.38
0
5
10
0
5
10
MIN
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-150
Drawing No. C04-073
Preliminary
DS30453D-page 179
PIC16C5X
18-Lead Ceramic Dual In-line with Window (JW) 300 mil (CERDIP)
E1
W2
2
n
1
W1
E
A2
A
c
L
A1
eB
B1
p
B
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Ceramic Package Height
Standoff
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Window Width
Window Length
* Controlling Parameter
Significant Characteristic
JEDEC Equivalent: MO-036
Drawing No. C04-010
DS30453D-page 180
A
A2
A1
E
E1
D
L
c
B1
B
eB
W1
W2
MIN
.170
.155
.015
.300
.285
.880
.125
.008
.050
.016
.345
.130
.190
INCHES*
NOM
18
.100
.183
.160
.023
.313
.290
.900
.138
.010
.055
.019
.385
.140
.200
Preliminary
MAX
.195
.165
.030
.325
.295
.920
.150
.012
.060
.021
.425
.150
.210
MILLIMETERS
NOM
18
2.54
4.32
4.64
3.94
4.06
0.38
0.57
7.62
7.94
7.24
7.37
22.35
22.86
3.18
3.49
0.20
0.25
1.27
1.40
0.41
0.47
8.76
9.78
3.30
3.56
4.83
5.08
MIN
MAX
4.95
4.19
0.76
8.26
7.49
23.37
3.81
0.30
1.52
0.53
10.80
3.81
5.33
PIC16C5X
28-Lead Ceramic Dual In-line with Window (JW) 600 mil (CERDIP)
E1
2
n
A2
c
eB
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Ceramic Package Height
Standoff
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Window Diameter
* Controlling Parameter
Significant Characteristic
JEDEC Equivalent: MO-103
Drawing No. C04-013
B1
A1
A
A2
A1
E
E1
D
L
c
B1
B
eB
W
MIN
.195
.155
.015
.595
.514
1.430
.125
.008
.050
.016
.610
.270
INCHES*
NOM
28
.100
.210
.160
.038
.600
.520
1.460
.138
.010
.058
.020
.660
.280
Preliminary
MAX
.225
.165
.060
.625
.526
1.490
.150
.012
.065
.023
.710
.290
MILLIMETERS
NOM
28
2.54
4.95
5.33
3.94
4.06
0.38
0.95
15.11
15.24
13.06
13.21
36.32
37.08
3.18
3.49
0.20
0.25
1.27
1.46
0.41
0.51
15.49
16.76
6.86
7.11
MIN
MAX
5.72
4.19
1.52
15.88
13.36
37.85
3.81
0.30
1.65
0.58
18.03
7.37
DS30453D-page 181
PIC16C5X
NOTES:
DS30453D-page 182
Preliminary
PIC16C5X
APPENDIX A:
COMPATIBILITY
2.
3.
4.
5.
6.
7.
Preliminary
DS30453D-page 183
PIC16C5X
NOTES:
DS30453D-page 184
Preliminary
PIC16C5X
INDEX
A
Absolute Maximum Ratings
PIC16C54/55/56/57 .................................................... 67
PIC16C54A ............................................................... 103
PIC16C54C/CR54C/C55A/C56A/CR56A/C57C/CR57C/
C58B/CR58B ............................................................ 131
PIC16C54C/CR54C/C55A/C56A/CR56A/C57C/CR57C/
C58B/CR58B-40 ....................................................... 155
PIC16CR54A .............................................................. 79
ADDWF ............................................................................... 51
ALU ....................................................................................... 9
ANDLW ............................................................................... 51
ANDWF ............................................................................... 51
Applications........................................................................... 5
Architectural Overview .......................................................... 9
Assembler
MPASM Assembler ..................................................... 61
B
Block Diagram
On-Chip Reset Circuit ................................................. 20
PIC16C5X Series........................................................ 10
Timer0 ......................................................................... 37
TMR0/WDT Prescaler................................................. 41
Watchdog Timer .......................................................... 46
Brown-Out Protection Circuit .............................................. 23
BSF ..................................................................................... 52
BTFSC ................................................................................ 52
BTFSS ................................................................................ 52
C
CALL ............................................................................. 31, 53
Carry (C) bit .................................................................... 9, 29
Clocking Scheme ................................................................ 13
CLRF................................................................................... 53
CLRW ................................................................................. 53
CLRWDT............................................................................. 53
CMOS Technology................................................................ 1
Code Protection ............................................................ 43, 47
COMF ................................................................................. 54
Compatibility ..................................................................... 183
Configuration Bits................................................................ 44
PIC16CR54A
Commercial .................................................. 80, 83
Extended ...................................................... 82, 84
Industrial ....................................................... 80, 83
PIC16LV54A
Commercial .............................................. 108, 109
Industrial ................................................... 108, 109
DECF .................................................................................. 54
DECFSZ ............................................................................. 54
Development Support ......................................................... 61
Device Characterization
PIC16C54/55/56/57/CR54A ....................................... 91
PIC16C54A............................................................... 117
PIC16C54C/C55A/C56A/C57C/C58B-40 ................. 165
Device Reset Timer (DRT) ................................................. 23
Device Varieties.................................................................... 7
Digit Carry (DC) bit ......................................................... 9, 29
DRT .................................................................................... 23
E
Electrical Specifications
PIC16C54/55/56/57 .................................................... 67
PIC16C54A............................................................... 103
PIC16C54C/CR54C/C55A/C56A/CR56A/C57C/CR57C/
C58B/CR58B ............................................................ 131
PIC16C54C/CR54C/C55A/C56A/CR56A/C57C/CR57C/
C58B/CR58B-40....................................................... 155
PIC16CR54A .............................................................. 79
Errata .................................................................................... 3
External Power-On Reset Circuit........................................ 21
F
Family of Devices
PIC16C5X..................................................................... 6
FSR Register ...................................................................... 33
Value on reset............................................................. 20
G
General Purpose Registers
Value on reset............................................................. 20
GOTO ........................................................................... 31, 55
H
High-Performance RISC CPU .............................................. 1
K
KeeLoq Evaluation and Programming Tools ...................... 64
Preliminary
DS30453D-page 185
PIC16C5X
L
Loading of PC ..................................................................... 31
M
MCLR Reset
Register values on ...................................................... 20
Memory Map
PIC16C54/CR54/C55.................................................. 25
PIC16C56/CR56 ......................................................... 25
PIC16C57/CR57/C58/CR58 ....................................... 25
Memory Organization.......................................................... 25
MOVF.................................................................................. 56
MOVLW............................................................................... 56
MOVWF .............................................................................. 57
MPLAB C17 and MPLAB C18 C Compilers........................ 61
MPLAB ICD In-Circuit Debugger......................................... 63
MPLAB ICE High Performance Universal In-Circuit Emulator
with MPLAB IDE.................................................................. 62
MPLAB Integrated Development Environment Software .... 61
MPLINK Object Linker/MPLIB Object Librarian .................. 62
N
NOP .................................................................................... 57
O
One-Time-Programmable (OTP) Devices............................. 7
OPTION .............................................................................. 57
OPTION Register ................................................................ 30
Value on reset ............................................................. 20
Oscillator Configurations ..................................................... 15
Oscillator Types
HS ............................................................................... 15
LP................................................................................ 15
RC ............................................................................... 15
XT ............................................................................... 15
P
PA0 bit................................................................................. 29
PA1 bit................................................................................. 29
Paging ................................................................................. 31
PC ....................................................................................... 31
Value on reset ............................................................. 20
PD bit ............................................................................ 19, 29
Peripheral Features............................................................... 1
PICDEM 1 Low Cost PICmicro Demonstration Board ........ 63
PICDEM 17 Demonstration Board ...................................... 64
PICDEM 2 Low Cost PIC16CXX Demonstration Board...... 63
PICDEM 3 Low Cost PIC16CXXX Demonstration Board ... 64
PICSTART Plus Entry Level Development Programmer .... 63
Pin Configurations................................................................. 2
Pinout Description - PIC16C54, PIC16CR54, PIC16C56,
PIC16CR56, PIC16C58, PIC16CR58 ................................. 11
Pinout Description - PIC16C55, PIC16C57, PIC16CR57 ... 12
PORTA................................................................................ 35
Value on reset ............................................................. 20
PORTB................................................................................ 35
Value on reset ............................................................. 20
PORTC................................................................................ 35
Value on reset ............................................................. 20
Power-Down Mode.............................................................. 47
Power-On Reset (POR) ...................................................... 21
Register values on ...................................................... 20
Prescaler ............................................................................. 40
PRO MATE II Universal Device Programmer ..................... 63
Program Counter................................................................. 31
DS30453D-page 186
Q cycles .............................................................................. 13
Quick-Turnaround-Production (QTP) Devices...................... 7
R
RC Oscillator....................................................................... 17
Read Only Memory (ROM) Devices ..................................... 7
Read-Modify-Write.............................................................. 36
Register File Map
PIC16C54, PIC16CR54, PIC16C55, PIC16C56,
PIC16CR56 ................................................................ 26
PIC16C57/CR57 ......................................................... 27
PIC16C58/CR58 ......................................................... 27
Registers
Special Function ......................................................... 28
Value on reset............................................................. 20
Reset .................................................................................. 19
Reset on Brown-Out ........................................................... 23
RETLW ............................................................................... 57
RLF ..................................................................................... 58
RRF .................................................................................... 58
S
Serialized Quick-Turnaround-Production (SQTP) Devices... 7
SLEEP .................................................................... 43, 47, 58
Software Simulator (MPLAB SIM) ...................................... 62
Special Features of the CPU .............................................. 43
Special Function Registers ................................................. 28
Stack................................................................................... 32
STATUS Register ........................................................... 9, 29
Value on reset............................................................. 20
SUBWF............................................................................... 59
SWAPF ............................................................................... 59
T
Timer0
Switching Prescaler Assignment ................................ 40
Timer0 (TMR0) Module............................................... 37
TMR0 register - Value on reset................................... 20
TMR0 with External Clock .......................................... 39
Timing Diagrams and Specifications
PIC16C54/55/56/57 .................................................... 74
PIC16C54A............................................................... 111
PIC16C54C/CR54C/C55A/C56A/CR56A/C57C/CR57C/
C58B/CR58B ............................................................ 140
PIC16C54C/CR54C/C55A/C56A/CR56A/C57C/CR57C/
C58B/CR58B-40 ....................................................... 160
PIC16CR54A .............................................................. 86
Timing Parameter Symbology and Load Conditions
PIC16C54/55/56/57 .................................................... 73
PIC16C54A............................................................... 110
PIC16C54C/CR54C/C55A/C56A/CR56A/C57C/CR57C/
C58B/CR58B ............................................................ 139
PIC16C54C/CR54C/C55A/C56A/CR56A/C57C/CR57C/
C58B/CR58B-40 ....................................................... 159
PIC16CR54A .............................................................. 85
TO bit ............................................................................ 19, 29
TRIS.................................................................................... 59
TRIS Registers ................................................................... 35
Value on reset............................................................. 20
Preliminary
PIC16C5X
U
UV Erasable Devices ............................................................ 7
W
W Register
Value on reset ............................................................. 20
Wake-up from SLEEP ................................................... 19, 47
Watchdog Timer (WDT) ................................................ 43, 46
Period.......................................................................... 46
Programming Considerations ..................................... 46
Register values on reset ............................................. 20
WWW, On-Line Support ....................................................... 3
X
XORLW ............................................................................... 60
XORWF............................................................................... 60
Z
Zero (Z) bit ...................................................................... 9, 29
Preliminary
DS30453D-page 187
PIC16C5X
NOTES:
DS30453D-page 188
Preliminary
PIC16C5X
ON-LINE SUPPORT
013001
Preliminary
DS30453D-page189
PIC16C5X
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
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Device: PIC16C5X
N
Literature Number: DS30453D
Questions:
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DS30453D-page190
Preliminary
PIC16C5X
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
XX
Frequency
Range/OSC
Type
Temperature
Range
/XX
XXX
Package
Pattern
Examples:
a)
b)
Device
PIC16C54
PIC16C54A
PIC16CR54A
PIC16C54C
PIC16CR54C
PIC16C55
PIC16C55A
PIC16C56
PIC16C56A
PIC16CR56A
PIC16C57
PIC16C57C
PIC16CR57C
PIC16C58B
PIC16CR58B
PIC16C54T(2)
PIC16C54AT(2)
PIC16CR54AT(2)
PIC16C54CT(2)
PIC16CR54CT(2)
PIC16C55T(2)
PIC16C55AT(2)
PIC16C56T(2)
PIC16C56AT(2)
PIC16CR56AT(2)
PIC16C57T(2)
PIC16C57CT(2)
PIC16CR57CT(2)
PIC16C58BT(2)
PIC16CR58BT(2)
c)
d)
Note
1:
2:
Frequency Range/
Oscillator Type
RC
LP
XT
HS
02
04
10
20
40
b(4)
Resistor Capacitor
Low Power Crystal
Standard Crystal/Resonator
High Speed Crystal
200 KHz (LP) or 2 MHz (XT and RC)
200 KHz (LP) or 4 MHz (XT and RC)
10 MHz (HS only)
20 MHz (HS only)
40 MHz (HS only)
No oscillator type for JW packages(3)
3:
4:
Temperature Range
b(4) =
I
=
E
=
0C to
-40C to
-40C to
Package
S
=
JW =
P
SO
SS
SP
=
=
=
=
+70C
+85C
+125C
Pattern
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
Preliminary
DS30453D-page191
ASIA/PACIFIC
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03/01/02
DS30453D-page 192